JPS5368870A - Multilayer board - Google Patents

Multilayer board

Info

Publication number
JPS5368870A
JPS5368870A JP14347076A JP14347076A JPS5368870A JP S5368870 A JPS5368870 A JP S5368870A JP 14347076 A JP14347076 A JP 14347076A JP 14347076 A JP14347076 A JP 14347076A JP S5368870 A JPS5368870 A JP S5368870A
Authority
JP
Japan
Prior art keywords
multilayer board
multilayer
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14347076A
Other languages
Japanese (ja)
Inventor
Naoharu Horino
Yoshiki Aida
Fumio Kon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP14347076A priority Critical patent/JPS5368870A/en
Publication of JPS5368870A publication Critical patent/JPS5368870A/en
Pending legal-status Critical Current

Links

JP14347076A 1976-12-01 1976-12-01 Multilayer board Pending JPS5368870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14347076A JPS5368870A (en) 1976-12-01 1976-12-01 Multilayer board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14347076A JPS5368870A (en) 1976-12-01 1976-12-01 Multilayer board

Publications (1)

Publication Number Publication Date
JPS5368870A true JPS5368870A (en) 1978-06-19

Family

ID=15339443

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14347076A Pending JPS5368870A (en) 1976-12-01 1976-12-01 Multilayer board

Country Status (1)

Country Link
JP (1) JPS5368870A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146986U (en) * 1983-03-22 1984-10-01 日本電気株式会社 multilayer printed board
JPS60177696A (en) * 1984-02-23 1985-09-11 日本電気株式会社 Composite ceramic board
JPS6333898A (en) * 1986-07-28 1988-02-13 新神戸電機株式会社 Manufacture of electromagnetic shielded double-sided printed circuit board
JPH0262776U (en) * 1988-10-31 1990-05-10
JPH033299A (en) * 1989-05-30 1991-01-09 Nippon Cement Co Ltd Ceramic circuit board containing capacitor
JPH0434997A (en) * 1990-05-30 1992-02-05 Matsushita Electric Works Ltd Printed wiring board
JPH04225594A (en) * 1990-04-09 1992-08-14 Internatl Business Mach Corp <Ibm> Multilayer circuit package and its making method
JPH05500136A (en) * 1989-08-23 1993-01-14 ザイコン　コーポレーション Capacitor laminate for printed wiring board
JPH06291520A (en) * 1992-04-03 1994-10-18 Matsushita Electric Ind Co Ltd High frequency multi-layer integrated circuit
US5926377A (en) * 1997-03-31 1999-07-20 Fujitsu Limited Multilayer printed board
JP2005307156A (en) * 2004-03-24 2005-11-04 Sumitomo Bakelite Co Ltd Resin composition, multilayer printed circuit board and method for producing the same
JP2006104302A (en) * 2004-10-04 2006-04-20 Sumitomo Bakelite Co Ltd Resin composition and application thereof
JP2018021914A (en) * 2017-08-04 2018-02-08 スリーエム イノベイティブ プロパティズ カンパニー Socket for ic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4422042Y1 (en) * 1965-12-29 1969-09-18

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4422042Y1 (en) * 1965-12-29 1969-09-18

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59146986U (en) * 1983-03-22 1984-10-01 日本電気株式会社 multilayer printed board
JPH0231800Y2 (en) * 1983-03-22 1990-08-28
JPS60177696A (en) * 1984-02-23 1985-09-11 日本電気株式会社 Composite ceramic board
JPS6333898A (en) * 1986-07-28 1988-02-13 新神戸電機株式会社 Manufacture of electromagnetic shielded double-sided printed circuit board
JPH0249039B2 (en) * 1986-07-28 1990-10-26 Shin Kobe Electric Machinery
JPH0262776U (en) * 1988-10-31 1990-05-10
JPH033299A (en) * 1989-05-30 1991-01-09 Nippon Cement Co Ltd Ceramic circuit board containing capacitor
JPH05500136A (en) * 1989-08-23 1993-01-14 ザイコン　コーポレーション Capacitor laminate for printed wiring board
JPH04225594A (en) * 1990-04-09 1992-08-14 Internatl Business Mach Corp <Ibm> Multilayer circuit package and its making method
JPH0434997A (en) * 1990-05-30 1992-02-05 Matsushita Electric Works Ltd Printed wiring board
JPH06291520A (en) * 1992-04-03 1994-10-18 Matsushita Electric Ind Co Ltd High frequency multi-layer integrated circuit
US5926377A (en) * 1997-03-31 1999-07-20 Fujitsu Limited Multilayer printed board
JP2005307156A (en) * 2004-03-24 2005-11-04 Sumitomo Bakelite Co Ltd Resin composition, multilayer printed circuit board and method for producing the same
JP2006104302A (en) * 2004-10-04 2006-04-20 Sumitomo Bakelite Co Ltd Resin composition and application thereof
JP2018021914A (en) * 2017-08-04 2018-02-08 スリーエム イノベイティブ プロパティズ カンパニー Socket for ic device

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