JPS5261981A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5261981A
JPS5261981A JP13845875A JP13845875A JPS5261981A JP S5261981 A JPS5261981 A JP S5261981A JP 13845875 A JP13845875 A JP 13845875A JP 13845875 A JP13845875 A JP 13845875A JP S5261981 A JPS5261981 A JP S5261981A
Authority
JP
Japan
Prior art keywords
wiring layer
production
semiconductor device
forming
sio2 film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13845875A
Other languages
Japanese (ja)
Other versions
JPS5910580B2 (en
Inventor
Shigeo Kotani
Masatoshi Motojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13845875A priority Critical patent/JPS5910580B2/en
Publication of JPS5261981A publication Critical patent/JPS5261981A/en
Publication of JPS5910580B2 publication Critical patent/JPS5910580B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To facilitate the formation of multilayer wirings by opening holes in the SiO2 film formed on a semiconductor substrate, forming a first wiring layer therein, then depositing an SiO2 film of nearly the same thickness as that of a silica film and wiring layer on the entire surface and forming thereon a second wiring layer after removing the raised portions.
JP13845875A 1975-11-18 1975-11-18 hand tai souchi no seizou houhou Expired JPS5910580B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13845875A JPS5910580B2 (en) 1975-11-18 1975-11-18 hand tai souchi no seizou houhou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13845875A JPS5910580B2 (en) 1975-11-18 1975-11-18 hand tai souchi no seizou houhou

Publications (2)

Publication Number Publication Date
JPS5261981A true JPS5261981A (en) 1977-05-21
JPS5910580B2 JPS5910580B2 (en) 1984-03-09

Family

ID=15222479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13845875A Expired JPS5910580B2 (en) 1975-11-18 1975-11-18 hand tai souchi no seizou houhou

Country Status (1)

Country Link
JP (1) JPS5910580B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181029A (en) * 1983-03-31 1984-10-15 Toshiba Corp Manufacture of semiconductor device
JPS6151848A (en) * 1984-08-21 1986-03-14 Matsushita Electronics Corp Manufacture of semiconductor device
JP2013062473A (en) * 2011-09-15 2013-04-04 Toppan Printing Co Ltd Wiring board and manufacturing method therefor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0429847Y2 (en) * 1986-12-29 1992-07-20
JPH04118116U (en) * 1991-04-01 1992-10-22 三菱農機株式会社 filter in tractor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59181029A (en) * 1983-03-31 1984-10-15 Toshiba Corp Manufacture of semiconductor device
JPH0324780B2 (en) * 1983-03-31 1991-04-04 Tokyo Shibaura Electric Co
JPS6151848A (en) * 1984-08-21 1986-03-14 Matsushita Electronics Corp Manufacture of semiconductor device
JP2013062473A (en) * 2011-09-15 2013-04-04 Toppan Printing Co Ltd Wiring board and manufacturing method therefor

Also Published As

Publication number Publication date
JPS5910580B2 (en) 1984-03-09

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