JPS5247548B1 - - Google Patents
Info
- Publication number
- JPS5247548B1 JPS5247548B1 JP46035441A JP3544171A JPS5247548B1 JP S5247548 B1 JPS5247548 B1 JP S5247548B1 JP 46035441 A JP46035441 A JP 46035441A JP 3544171 A JP3544171 A JP 3544171A JP S5247548 B1 JPS5247548 B1 JP S5247548B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1554—Rotating or turning the PCB in a continuous manner
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Coating Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US4068270A | 1970-05-26 | 1970-05-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5247548B1 true JPS5247548B1 (ja) | 1977-12-03 |
Family
ID=21912343
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP46035441A Pending JPS5247548B1 (ja) | 1970-05-26 | 1971-05-24 | |
JP7541677A Granted JPS5335169A (en) | 1970-05-26 | 1977-06-22 | Device for uniformly coating conductive material on through hole of printed circuit board and removing excessive conductive material therefrom |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7541677A Granted JPS5335169A (en) | 1970-05-26 | 1977-06-22 | Device for uniformly coating conductive material on through hole of printed circuit board and removing excessive conductive material therefrom |
Country Status (10)
Country | Link |
---|---|
US (1) | US3661638A (ja) |
JP (2) | JPS5247548B1 (ja) |
AT (1) | AT317335B (ja) |
CA (1) | CA927524A (ja) |
CH (1) | CH535627A (ja) |
DE (1) | DE2126799B2 (ja) |
ES (1) | ES396839A1 (ja) |
FR (1) | FR2112893A5 (ja) |
GB (1) | GB1326285A (ja) |
NL (1) | NL7107282A (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3862856A (en) * | 1972-06-29 | 1975-01-28 | Headway Research Inc | Method for achieving thin films on substrates |
US3904788A (en) * | 1972-07-18 | 1975-09-09 | Selas Corp Of America | Method of placing membrane on support |
US3893409A (en) * | 1972-12-01 | 1975-07-08 | Xerox Corp | Apparatus for solder coating printed circuit boards |
US3999004A (en) * | 1974-09-27 | 1976-12-21 | International Business Machines Corporation | Multilayer ceramic substrate structure |
US4083323A (en) * | 1975-08-07 | 1978-04-11 | Xerox Corporation | Pneumatic system for solder leveling apparatus |
US4898117A (en) * | 1988-04-15 | 1990-02-06 | International Business Machines Corporation | Solder deposition system |
US4934309A (en) * | 1988-04-15 | 1990-06-19 | International Business Machines Corporation | Solder deposition system |
US5061216A (en) * | 1990-04-16 | 1991-10-29 | The United States Of America As Represented By The United States Department Of Energy | Ionization chamber dosimeter |
US5104689A (en) * | 1990-09-24 | 1992-04-14 | International Business Machines Corporation | Method and apparatus for automated solder deposition at multiple sites |
GB2265101B (en) * | 1992-03-17 | 1995-05-10 | Sun Ind Coatings | Soldering apparatus and method |
GB2265325A (en) * | 1992-03-18 | 1993-09-29 | Ibm | Solder application to a circuit board |
US5909012A (en) * | 1996-10-21 | 1999-06-01 | Ford Motor Company | Method of making a three-dimensional part with buried conductors |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3046157A (en) * | 1958-05-07 | 1962-07-24 | Philips Corp | Method for coating the inner wall of a tube intended for electric discharge lamps with a uniform liquid layer as well as an arrangement for the application of the method |
US3031339A (en) * | 1959-08-10 | 1962-04-24 | Regan Ind Inc | Coating machine and method |
US3200788A (en) * | 1963-10-30 | 1965-08-17 | Electrovert Mfg Co Ltd | Centrifugal pre-tinning apparatus for printed circuit boards |
US3483616A (en) * | 1964-01-23 | 1969-12-16 | Sanders Associates Inc | Method for producing a printed circuit board |
US3359132A (en) * | 1964-07-10 | 1967-12-19 | Albin E Wittmann | Method of coating circuit paths on printed circuit boards with solder |
US3393659A (en) * | 1966-02-07 | 1968-07-23 | Varo Inc Electrokinetics Div | Solder coating apparatus |
US3416958A (en) * | 1966-02-25 | 1968-12-17 | Lear Siegler Inc | Alloy coating for electrical conductors |
US3491779A (en) * | 1967-07-06 | 1970-01-27 | Brown Eng Co Inc | Solder leveling apparatus |
-
1970
- 1970-05-26 US US40682A patent/US3661638A/en not_active Expired - Lifetime
-
1971
- 1971-03-05 CA CA107019A patent/CA927524A/en not_active Expired
- 1971-05-24 JP JP46035441A patent/JPS5247548B1/ja active Pending
- 1971-05-26 AT AT455571A patent/AT317335B/de not_active IP Right Cessation
- 1971-05-26 GB GB1711171A patent/GB1326285A/en not_active Expired
- 1971-05-26 NL NL7107282A patent/NL7107282A/xx unknown
- 1971-05-26 CH CH777971A patent/CH535627A/de not_active IP Right Cessation
- 1971-05-26 DE DE19712126799 patent/DE2126799B2/de active Granted
- 1971-05-26 FR FR7119111A patent/FR2112893A5/fr not_active Expired
- 1971-11-09 ES ES396839A patent/ES396839A1/es not_active Expired
-
1977
- 1977-06-22 JP JP7541677A patent/JPS5335169A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
AT317335B (de) | 1974-08-26 |
ES396839A1 (es) | 1974-06-16 |
US3661638A (en) | 1972-05-09 |
CA927524A (en) | 1973-05-29 |
JPS5335169A (en) | 1978-04-01 |
CH535627A (de) | 1973-04-15 |
DE2126799B2 (de) | 1972-11-23 |
DE2126799A1 (de) | 1972-01-20 |
GB1326285A (en) | 1973-08-08 |
FR2112893A5 (ja) | 1972-06-23 |
NL7107282A (ja) | 1971-11-30 |
JPS5432699B2 (ja) | 1979-10-16 |