AT317335B - Verfahren und Vorrichtung zum gleichmäßigen Verteilen von warmfließfähigem Material - Google Patents

Verfahren und Vorrichtung zum gleichmäßigen Verteilen von warmfließfähigem Material

Info

Publication number
AT317335B
AT317335B AT455571A AT455571A AT317335B AT 317335 B AT317335 B AT 317335B AT 455571 A AT455571 A AT 455571A AT 455571 A AT455571 A AT 455571A AT 317335 B AT317335 B AT 317335B
Authority
AT
Austria
Prior art keywords
flowable material
evenly distributing
distributing warm
warm
evenly
Prior art date
Application number
AT455571A
Other languages
English (en)
Original Assignee
Kollmorgen Photocircuits
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Photocircuits filed Critical Kollmorgen Photocircuits
Application granted granted Critical
Publication of AT317335B publication Critical patent/AT317335B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1554—Rotating or turning the PCB in a continuous manner
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Apparatus (AREA)
AT455571A 1970-05-26 1971-05-26 Verfahren und Vorrichtung zum gleichmäßigen Verteilen von warmfließfähigem Material AT317335B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US4068270A 1970-05-26 1970-05-26

Publications (1)

Publication Number Publication Date
AT317335B true AT317335B (de) 1974-08-26

Family

ID=21912343

Family Applications (1)

Application Number Title Priority Date Filing Date
AT455571A AT317335B (de) 1970-05-26 1971-05-26 Verfahren und Vorrichtung zum gleichmäßigen Verteilen von warmfließfähigem Material

Country Status (10)

Country Link
US (1) US3661638A (de)
JP (2) JPS5247548B1 (de)
AT (1) AT317335B (de)
CA (1) CA927524A (de)
CH (1) CH535627A (de)
DE (1) DE2126799B2 (de)
ES (1) ES396839A1 (de)
FR (1) FR2112893A5 (de)
GB (1) GB1326285A (de)
NL (1) NL7107282A (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3862856A (en) * 1972-06-29 1975-01-28 Headway Research Inc Method for achieving thin films on substrates
US3904788A (en) * 1972-07-18 1975-09-09 Selas Corp Of America Method of placing membrane on support
US3893409A (en) * 1972-12-01 1975-07-08 Xerox Corp Apparatus for solder coating printed circuit boards
US3999004A (en) * 1974-09-27 1976-12-21 International Business Machines Corporation Multilayer ceramic substrate structure
US4083323A (en) * 1975-08-07 1978-04-11 Xerox Corporation Pneumatic system for solder leveling apparatus
US4934309A (en) * 1988-04-15 1990-06-19 International Business Machines Corporation Solder deposition system
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
US5061216A (en) * 1990-04-16 1991-10-29 The United States Of America As Represented By The United States Department Of Energy Ionization chamber dosimeter
US5104689A (en) * 1990-09-24 1992-04-14 International Business Machines Corporation Method and apparatus for automated solder deposition at multiple sites
GB2265101B (en) * 1992-03-17 1995-05-10 Sun Ind Coatings Soldering apparatus and method
GB2265325A (en) * 1992-03-18 1993-09-29 Ibm Solder application to a circuit board
US5909012A (en) * 1996-10-21 1999-06-01 Ford Motor Company Method of making a three-dimensional part with buried conductors

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3046157A (en) * 1958-05-07 1962-07-24 Philips Corp Method for coating the inner wall of a tube intended for electric discharge lamps with a uniform liquid layer as well as an arrangement for the application of the method
US3031339A (en) * 1959-08-10 1962-04-24 Regan Ind Inc Coating machine and method
US3200788A (en) * 1963-10-30 1965-08-17 Electrovert Mfg Co Ltd Centrifugal pre-tinning apparatus for printed circuit boards
US3483616A (en) * 1964-01-23 1969-12-16 Sanders Associates Inc Method for producing a printed circuit board
US3359132A (en) * 1964-07-10 1967-12-19 Albin E Wittmann Method of coating circuit paths on printed circuit boards with solder
US3393659A (en) * 1966-02-07 1968-07-23 Varo Inc Electrokinetics Div Solder coating apparatus
US3416958A (en) * 1966-02-25 1968-12-17 Lear Siegler Inc Alloy coating for electrical conductors
US3491779A (en) * 1967-07-06 1970-01-27 Brown Eng Co Inc Solder leveling apparatus

Also Published As

Publication number Publication date
DE2126799A1 (de) 1972-01-20
JPS5432699B2 (de) 1979-10-16
DE2126799B2 (de) 1972-11-23
ES396839A1 (es) 1974-06-16
CH535627A (de) 1973-04-15
JPS5335169A (en) 1978-04-01
FR2112893A5 (de) 1972-06-23
GB1326285A (en) 1973-08-08
NL7107282A (de) 1971-11-30
JPS5247548B1 (de) 1977-12-03
US3661638A (en) 1972-05-09
CA927524A (en) 1973-05-29

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee