JPS5232234B2 - - Google Patents

Info

Publication number
JPS5232234B2
JPS5232234B2 JP46080047A JP8004771A JPS5232234B2 JP S5232234 B2 JPS5232234 B2 JP S5232234B2 JP 46080047 A JP46080047 A JP 46080047A JP 8004771 A JP8004771 A JP 8004771A JP S5232234 B2 JPS5232234 B2 JP S5232234B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP46080047A
Other languages
Japanese (ja)
Other versions
JPS4845185A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP46080047A priority Critical patent/JPS5232234B2/ja
Priority to GB4564772A priority patent/GB1413161A/en
Priority to US00295795A priority patent/US3849270A/en
Priority to DE2265257A priority patent/DE2265257C2/en
Priority to DE2249832A priority patent/DE2249832C3/en
Publication of JPS4845185A publication Critical patent/JPS4845185A/ja
Publication of JPS5232234B2 publication Critical patent/JPS5232234B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76Making of isolation regions between components
    • H01L21/762Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/76294Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using selective deposition of single crystal silicon, i.e. SEG techniques
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/52Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00Semiconductor device manufacturing: process
    • Y10S438/969Simultaneous formation of monocrystalline and polycrystalline regions

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • Element Separation (AREA)
  • Bipolar Transistors (AREA)
JP46080047A 1971-10-11 1971-10-11 Expired JPS5232234B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP46080047A JPS5232234B2 (en) 1971-10-11 1971-10-11
GB4564772A GB1413161A (en) 1971-10-11 1972-10-04 Process for manufacturing semiconductor devices
US00295795A US3849270A (en) 1971-10-11 1972-10-10 Process of manufacturing semiconductor devices
DE2265257A DE2265257C2 (en) 1971-10-11 1972-10-11 Method for manufacturing an integrated semiconductor circuit
DE2249832A DE2249832C3 (en) 1971-10-11 1972-10-11 Method for producing a wiring layer and application of the method for producing multilayer wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP46080047A JPS5232234B2 (en) 1971-10-11 1971-10-11

Publications (2)

Publication Number Publication Date
JPS4845185A JPS4845185A (en) 1973-06-28
JPS5232234B2 true JPS5232234B2 (en) 1977-08-19

Family

ID=13707313

Family Applications (1)

Application Number Title Priority Date Filing Date
JP46080047A Expired JPS5232234B2 (en) 1971-10-11 1971-10-11

Country Status (4)

Country Link
US (1) US3849270A (en)
JP (1) JPS5232234B2 (en)
DE (2) DE2265257C2 (en)
GB (1) GB1413161A (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583380B2 (en) * 1977-03-04 1983-01-21 株式会社日立製作所 Semiconductor device and its manufacturing method
JPS5893261A (en) * 1981-11-30 1983-06-02 Toshiba Corp Manufacture of semiconductor device
WO1990000476A1 (en) * 1988-07-12 1990-01-25 The Regents Of The University Of California Planarized interconnect etchback
US5256565A (en) * 1989-05-08 1993-10-26 The United States Of America As Represented By The United States Department Of Energy Electrochemical planarization
US5096550A (en) * 1990-10-15 1992-03-17 The United States Of America As Represented By The United States Department Of Energy Method and apparatus for spatially uniform electropolishing and electrolytic etching
US7449098B1 (en) 1999-10-05 2008-11-11 Novellus Systems, Inc. Method for planar electroplating
US7531079B1 (en) 1998-10-26 2009-05-12 Novellus Systems, Inc. Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation
US6315883B1 (en) 1998-10-26 2001-11-13 Novellus Systems, Inc. Electroplanarization of large and small damascene features using diffusion barriers and electropolishing
US6709565B2 (en) 1998-10-26 2004-03-23 Novellus Systems, Inc. Method and apparatus for uniform electropolishing of damascene ic structures by selective agitation
US6495442B1 (en) * 2000-10-18 2002-12-17 Magic Corporation Post passivation interconnection schemes on top of the IC chips
US6653226B1 (en) 2001-01-09 2003-11-25 Novellus Systems, Inc. Method for electrochemical planarization of metal surfaces
WO2003088352A1 (en) * 2002-04-09 2003-10-23 Rensselaer Polytechnic Institute Electrochemical planarization of metal feature surfaces
US7799200B1 (en) 2002-07-29 2010-09-21 Novellus Systems, Inc. Selective electrochemical accelerator removal
US8530359B2 (en) 2003-10-20 2013-09-10 Novellus Systems, Inc. Modulated metal removal using localized wet etching
US8158532B2 (en) 2003-10-20 2012-04-17 Novellus Systems, Inc. Topography reduction and control by selective accelerator removal
US8168540B1 (en) 2009-12-29 2012-05-01 Novellus Systems, Inc. Methods and apparatus for depositing copper on tungsten

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169892A (en) * 1959-04-08 1965-02-16 Jerome H Lemelson Method of making a multi-layer electrical circuit
GB1048424A (en) * 1963-08-28 1966-11-16 Int Standard Electric Corp Improvements in or relating to semiconductor devices
US3372063A (en) * 1964-12-22 1968-03-05 Hitachi Ltd Method for manufacturing at least one electrically isolated region of a semiconductive material
US3409523A (en) * 1966-03-10 1968-11-05 Bell Telephone Labor Inc Electroetching an aluminum plated semiconductor in a tetraalkylammonium hydroxide electrolyte
FR96113E (en) * 1967-12-06 1972-05-19 Ibm Semiconductor device.
NL7101307A (en) 1970-02-03 1971-08-05

Also Published As

Publication number Publication date
US3849270A (en) 1974-11-19
DE2249832C3 (en) 1982-02-18
DE2249832A1 (en) 1973-04-19
JPS4845185A (en) 1973-06-28
DE2265257A1 (en) 1977-02-10
GB1413161A (en) 1975-11-05
DE2249832B2 (en) 1977-06-02
DE2265257C2 (en) 1983-10-27

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