JPS5230381A - Semiconductor integrating circuit - Google Patents

Semiconductor integrating circuit

Info

Publication number
JPS5230381A
JPS5230381A JP50105956A JP10595675A JPS5230381A JP S5230381 A JPS5230381 A JP S5230381A JP 50105956 A JP50105956 A JP 50105956A JP 10595675 A JP10595675 A JP 10595675A JP S5230381 A JPS5230381 A JP S5230381A
Authority
JP
Japan
Prior art keywords
integrating circuit
semiconductor integrating
semiconductor
inferiority
prevention
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP50105956A
Other languages
Japanese (ja)
Inventor
Ryosaku Kanzawa
Shigeru Kawamata
Hideyuki Yagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50105956A priority Critical patent/JPS5230381A/en
Publication of JPS5230381A publication Critical patent/JPS5230381A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE: To obtain a semiconductor integrating circuit with a structure of electrodes for the prevention of occurrence of inferiority at the intermediate checking in a process semiconductor integrating circuit.
COPYRIGHT: (C)1977,JPO&Japio
JP50105956A 1975-09-03 1975-09-03 Semiconductor integrating circuit Pending JPS5230381A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50105956A JPS5230381A (en) 1975-09-03 1975-09-03 Semiconductor integrating circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50105956A JPS5230381A (en) 1975-09-03 1975-09-03 Semiconductor integrating circuit

Publications (1)

Publication Number Publication Date
JPS5230381A true JPS5230381A (en) 1977-03-08

Family

ID=14421260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50105956A Pending JPS5230381A (en) 1975-09-03 1975-09-03 Semiconductor integrating circuit

Country Status (1)

Country Link
JP (1) JPS5230381A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56124240A (en) * 1980-03-04 1981-09-29 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor integrated circuit device
JPS57122542A (en) * 1981-01-23 1982-07-30 Hitachi Ltd Electrode structure for semiconductor element
JPS59127852A (en) * 1983-01-12 1984-07-23 Matsushita Electronics Corp Semiconductor device
JPS59117149U (en) * 1983-01-28 1984-08-07 三洋電機株式会社 Beam lead type semiconductor device
JPS63175459A (en) * 1987-01-16 1988-07-19 Hitachi Ltd High density multilayer interconnection substrate mounting structure
JPH0382129A (en) * 1989-08-25 1991-04-08 Agency Of Ind Science & Technol Semiconductor chip
US6445001B2 (en) * 1996-06-12 2002-09-03 Kabushiki Kaisha Toshiba Semiconductor device with flip-chip structure and method of manufacturing the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56124240A (en) * 1980-03-04 1981-09-29 Chiyou Lsi Gijutsu Kenkyu Kumiai Semiconductor integrated circuit device
JPS57122542A (en) * 1981-01-23 1982-07-30 Hitachi Ltd Electrode structure for semiconductor element
JPS59127852A (en) * 1983-01-12 1984-07-23 Matsushita Electronics Corp Semiconductor device
JPS59117149U (en) * 1983-01-28 1984-08-07 三洋電機株式会社 Beam lead type semiconductor device
JPS63175459A (en) * 1987-01-16 1988-07-19 Hitachi Ltd High density multilayer interconnection substrate mounting structure
JPH0382129A (en) * 1989-08-25 1991-04-08 Agency Of Ind Science & Technol Semiconductor chip
US6445001B2 (en) * 1996-06-12 2002-09-03 Kabushiki Kaisha Toshiba Semiconductor device with flip-chip structure and method of manufacturing the same

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