JPS52156582A - Production of multilayer wirings - Google Patents

Production of multilayer wirings

Info

Publication number
JPS52156582A
JPS52156582A JP7318476A JP7318476A JPS52156582A JP S52156582 A JPS52156582 A JP S52156582A JP 7318476 A JP7318476 A JP 7318476A JP 7318476 A JP7318476 A JP 7318476A JP S52156582 A JPS52156582 A JP S52156582A
Authority
JP
Japan
Prior art keywords
production
multilayer wirings
wiring
multilayer
flattening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7318476A
Other languages
Japanese (ja)
Other versions
JPS5849026B2 (en
Inventor
Masao Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7318476A priority Critical patent/JPS5849026B2/en
Publication of JPS52156582A publication Critical patent/JPS52156582A/en
Publication of JPS5849026B2 publication Critical patent/JPS5849026B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE:To prevent disconnection of wiring layers and interlayer shorting by providing a pedestal for multilayer wiring leaving a part of underlayer wiring patterns at the time of their formation and flattening the surface through filling with a glass film.
JP7318476A 1976-06-23 1976-06-23 Multilayer wiring manufacturing method Expired JPS5849026B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7318476A JPS5849026B2 (en) 1976-06-23 1976-06-23 Multilayer wiring manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7318476A JPS5849026B2 (en) 1976-06-23 1976-06-23 Multilayer wiring manufacturing method

Publications (2)

Publication Number Publication Date
JPS52156582A true JPS52156582A (en) 1977-12-27
JPS5849026B2 JPS5849026B2 (en) 1983-11-01

Family

ID=13510786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7318476A Expired JPS5849026B2 (en) 1976-06-23 1976-06-23 Multilayer wiring manufacturing method

Country Status (1)

Country Link
JP (1) JPS5849026B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56170396U (en) * 1980-05-20 1981-12-16
JPS62176147A (en) * 1985-10-03 1987-08-01 ビュル　エス．アー． Method for forming multilayer metal wiring network for mutual connection between components ofhigh density integrated circuit and integrated circuit formed by the method
JPS62199036A (en) * 1986-02-27 1987-09-02 Nec Corp Semiconductor device
JPH02504575A (en) * 1988-05-31 1990-12-20 ユニシス・コーポレーション Integrated circuits that use dummy conductors for flatness

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0547560U (en) * 1991-11-27 1993-06-25 日信工業株式会社 Friction pads for vehicle disc brakes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56170396U (en) * 1980-05-20 1981-12-16
JPS62176147A (en) * 1985-10-03 1987-08-01 ビュル　エス．アー． Method for forming multilayer metal wiring network for mutual connection between components ofhigh density integrated circuit and integrated circuit formed by the method
JPS62199036A (en) * 1986-02-27 1987-09-02 Nec Corp Semiconductor device
JPH02504575A (en) * 1988-05-31 1990-12-20 ユニシス・コーポレーション Integrated circuits that use dummy conductors for flatness

Also Published As

Publication number Publication date
JPS5849026B2 (en) 1983-11-01

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