JPS52138669A - Method of producing copper stacked board - Google Patents

Method of producing copper stacked board

Info

Publication number
JPS52138669A
JPS52138669A JP5571076A JP5571076A JPS52138669A JP S52138669 A JPS52138669 A JP S52138669A JP 5571076 A JP5571076 A JP 5571076A JP 5571076 A JP5571076 A JP 5571076A JP S52138669 A JPS52138669 A JP S52138669A
Authority
JP
Japan
Prior art keywords
producing copper
stacked board
copper stacked
board
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5571076A
Other languages
Japanese (ja)
Other versions
JPS5548473B2 (en
Inventor
Toshiharu Mikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP5571076A priority Critical patent/JPS52138669A/en
Publication of JPS52138669A publication Critical patent/JPS52138669A/en
Publication of JPS5548473B2 publication Critical patent/JPS5548473B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP5571076A 1976-05-15 1976-05-15 Method of producing copper stacked board Granted JPS52138669A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5571076A JPS52138669A (en) 1976-05-15 1976-05-15 Method of producing copper stacked board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5571076A JPS52138669A (en) 1976-05-15 1976-05-15 Method of producing copper stacked board

Publications (2)

Publication Number Publication Date
JPS52138669A true JPS52138669A (en) 1977-11-18
JPS5548473B2 JPS5548473B2 (en) 1980-12-05

Family

ID=13006426

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5571076A Granted JPS52138669A (en) 1976-05-15 1976-05-15 Method of producing copper stacked board

Country Status (1)

Country Link
JP (1) JPS52138669A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54155470A (en) * 1978-05-30 1979-12-07 Fujitsu Ltd Method of producing multiilayer printed circuit board
JPS58123797A (en) * 1982-01-18 1983-07-23 富士通株式会社 Multilayer printed circuit board
JP2015147912A (en) * 2014-02-10 2015-08-20 日立化成株式会社 Prepreg, metal-clad laminate, and printed wiring board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016108508A (en) 2014-12-10 2016-06-20 信越化学工業株式会社 Polymer, resist material, and pattern formation method
JP2016141796A (en) 2015-02-05 2016-08-08 信越化学工業株式会社 Polymer, resist material, and patterning process

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941857A (en) * 1972-08-30 1974-04-19
JPS50128785A (en) * 1974-03-30 1975-10-11
JPS50128786A (en) * 1974-03-30 1975-10-11

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941857A (en) * 1972-08-30 1974-04-19
JPS50128785A (en) * 1974-03-30 1975-10-11
JPS50128786A (en) * 1974-03-30 1975-10-11

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54155470A (en) * 1978-05-30 1979-12-07 Fujitsu Ltd Method of producing multiilayer printed circuit board
JPS58123797A (en) * 1982-01-18 1983-07-23 富士通株式会社 Multilayer printed circuit board
JP2015147912A (en) * 2014-02-10 2015-08-20 日立化成株式会社 Prepreg, metal-clad laminate, and printed wiring board

Also Published As

Publication number Publication date
JPS5548473B2 (en) 1980-12-05

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