JPS5290069A - Method of producing printed circuit board - Google Patents

Method of producing printed circuit board

Info

Publication number
JPS5290069A
JPS5290069A JP15103776A JP15103776A JPS5290069A JP S5290069 A JPS5290069 A JP S5290069A JP 15103776 A JP15103776 A JP 15103776A JP 15103776 A JP15103776 A JP 15103776A JP S5290069 A JPS5290069 A JP S5290069A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
producing printed
producing
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15103776A
Other languages
Japanese (ja)
Inventor
Jiyooji Kuteiro Jiyosefu
Jieemusu Baakaa Kenesu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5290069A publication Critical patent/JPS5290069A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0353—Making conductive layer thin, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
JP15103776A 1976-01-21 1976-12-17 Method of producing printed circuit board Pending JPS5290069A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US65109276A 1976-01-21 1976-01-21

Publications (1)

Publication Number Publication Date
JPS5290069A true JPS5290069A (en) 1977-07-28

Family

ID=24611547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15103776A Pending JPS5290069A (en) 1976-01-21 1976-12-17 Method of producing printed circuit board

Country Status (2)

Country Link
JP (1) JPS5290069A (en)
DE (1) DE2655997A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1988005990A1 (en) * 1987-02-05 1988-08-11 Hughes Aircraft Company Cladding of substrates with thick metal circuit patterns
EP0342669B1 (en) * 1988-05-20 1995-08-23 Mitsubishi Gas Chemical Company, Inc. Method for preparing thin copper foil-clad substrate for circuit boards
US5294291A (en) * 1991-09-20 1994-03-15 Hitachi, Ltd. Process for the formation of a conductive circuit pattern

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835357A (en) * 1971-08-30 1973-05-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4835357A (en) * 1971-08-30 1973-05-24

Also Published As

Publication number Publication date
DE2655997A1 (en) 1977-07-28

Similar Documents

Publication Publication Date Title
JPS5288772A (en) Method of producing printed circuit board
JPS5362175A (en) Method of producing printed circuit board
JPS5330777A (en) Method of producing printed circuit board
JPS5286160A (en) Method of producing printed circuit board
JPS5324565A (en) Method of producing printed circuit board
JPS52140871A (en) Method of producing printed circuit board
JPS5353768A (en) Method of producing printed circuit board
JPS531865A (en) Method of producing printed circuit board
JPS52100175A (en) Method of producing printed circuit board
JPS5290069A (en) Method of producing printed circuit board
JPS52140872A (en) Method of producing printed circuit board
JPS5371272A (en) Method of producing printed circuit board
JPS5344877A (en) Method of producing printed circuit board
JPS5337859A (en) Method of producing printed circuit board
JPS5353774A (en) Method of producing printed board
JPS5344879A (en) Method of producing printed circuit board
JPS5362174A (en) Method of producing printed circuit board
JPS5333365A (en) Method of producing printed circuit board
JPS5364767A (en) Method of producing printed circuit board
JPS5321775A (en) Method of producing printed circuit board
JPS5298974A (en) Method of producing printed circuit board
JPS52149361A (en) Method of producing flexible printed circuit board
JPS5361065A (en) Method of producing printed circuit board conductor circuit
JPS5383079A (en) Method of producing printed board
JPS5376367A (en) Method of producing printed board