JPS52135667A - Dicing method of semiconductor wafer - Google Patents

Dicing method of semiconductor wafer

Info

Publication number
JPS52135667A
JPS52135667A JP5297776A JP5297776A JPS52135667A JP S52135667 A JPS52135667 A JP S52135667A JP 5297776 A JP5297776 A JP 5297776A JP 5297776 A JP5297776 A JP 5297776A JP S52135667 A JPS52135667 A JP S52135667A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
dicing method
wafer
dicing
stress
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5297776A
Other languages
Japanese (ja)
Inventor
Tomokazu Murayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5297776A priority Critical patent/JPS52135667A/en
Publication of JPS52135667A publication Critical patent/JPS52135667A/en
Pending legal-status Critical Current

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  • Dicing (AREA)

Abstract

PURPOSE: To obtain pellets stably without requiring skill by cooling the sheet affixed with a scribed wafer to cause thermal shrinkage and dicing the wafer with the stress of that time.
COPYRIGHT: (C)1977,JPO&Japio
JP5297776A 1976-05-10 1976-05-10 Dicing method of semiconductor wafer Pending JPS52135667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5297776A JPS52135667A (en) 1976-05-10 1976-05-10 Dicing method of semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5297776A JPS52135667A (en) 1976-05-10 1976-05-10 Dicing method of semiconductor wafer

Publications (1)

Publication Number Publication Date
JPS52135667A true JPS52135667A (en) 1977-11-12

Family

ID=12929946

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5297776A Pending JPS52135667A (en) 1976-05-10 1976-05-10 Dicing method of semiconductor wafer

Country Status (1)

Country Link
JP (1) JPS52135667A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10102315B4 (en) * 2001-01-18 2012-10-25 Aixtron Se Method of fabricating semiconductor devices and intermediate in these methods

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10102315B4 (en) * 2001-01-18 2012-10-25 Aixtron Se Method of fabricating semiconductor devices and intermediate in these methods

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