JPS52135667A - Dicing method of semiconductor wafer - Google Patents
Dicing method of semiconductor waferInfo
- Publication number
- JPS52135667A JPS52135667A JP5297776A JP5297776A JPS52135667A JP S52135667 A JPS52135667 A JP S52135667A JP 5297776 A JP5297776 A JP 5297776A JP 5297776 A JP5297776 A JP 5297776A JP S52135667 A JPS52135667 A JP S52135667A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- dicing method
- wafer
- dicing
- stress
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Dicing (AREA)
Abstract
PURPOSE: To obtain pellets stably without requiring skill by cooling the sheet affixed with a scribed wafer to cause thermal shrinkage and dicing the wafer with the stress of that time.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5297776A JPS52135667A (en) | 1976-05-10 | 1976-05-10 | Dicing method of semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5297776A JPS52135667A (en) | 1976-05-10 | 1976-05-10 | Dicing method of semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS52135667A true JPS52135667A (en) | 1977-11-12 |
Family
ID=12929946
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5297776A Pending JPS52135667A (en) | 1976-05-10 | 1976-05-10 | Dicing method of semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS52135667A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10102315B4 (en) * | 2001-01-18 | 2012-10-25 | Aixtron Se | Method of fabricating semiconductor devices and intermediate in these methods |
-
1976
- 1976-05-10 JP JP5297776A patent/JPS52135667A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10102315B4 (en) * | 2001-01-18 | 2012-10-25 | Aixtron Se | Method of fabricating semiconductor devices and intermediate in these methods |
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