JPS52131471A - Surface treatment of substrate - Google Patents

Surface treatment of substrate

Info

Publication number
JPS52131471A
JPS52131471A JP4771576A JP4771576A JPS52131471A JP S52131471 A JPS52131471 A JP S52131471A JP 4771576 A JP4771576 A JP 4771576A JP 4771576 A JP4771576 A JP 4771576A JP S52131471 A JPS52131471 A JP S52131471A
Authority
JP
Japan
Prior art keywords
substrate
surface treatment
spattering
bromine
chlorine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4771576A
Other languages
Japanese (ja)
Inventor
Yoshio Honma
Hisao Nozawa
Yukiyoshi Harada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4771576A priority Critical patent/JPS52131471A/en
Publication of JPS52131471A publication Critical patent/JPS52131471A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To make flat the surface of the semiconductor substrate by having spattering using an organic carbon chemical compound containing at least one of these elements such as chlorine, bromine or fluorine.
COPYRIGHT: (C)1977,JPO&Japio
JP4771576A 1976-04-28 1976-04-28 Surface treatment of substrate Pending JPS52131471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4771576A JPS52131471A (en) 1976-04-28 1976-04-28 Surface treatment of substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4771576A JPS52131471A (en) 1976-04-28 1976-04-28 Surface treatment of substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP10370885A Division JPS6122632A (en) 1985-05-17 1985-05-17 Surface processing of substrate

Publications (1)

Publication Number Publication Date
JPS52131471A true JPS52131471A (en) 1977-11-04

Family

ID=12782993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4771576A Pending JPS52131471A (en) 1976-04-28 1976-04-28 Surface treatment of substrate

Country Status (1)

Country Link
JP (1) JPS52131471A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54105476A (en) * 1978-02-06 1979-08-18 Sony Corp Manufacture of semiconductor device
JPS5618426A (en) * 1979-07-24 1981-02-21 Fujitsu Ltd Manufacture of semiconductor device
JPS5893235A (en) * 1981-11-30 1983-06-02 Toshiba Corp Preparation of semiconductor device
JPS59123234A (en) * 1982-12-28 1984-07-17 Tohoku Metal Ind Ltd Microscopic processing method
JPS6122631A (en) * 1984-02-03 1986-01-31 フエアチアイルド　カメラ　アンド　インストルメント　コ−ポレ−シヨン Method of flattening semiconductor and structure produced thereby
WO1998006128A1 (en) * 1996-08-07 1998-02-12 Hitachi, Ltd. Dry etching method and device used for the same
US6979632B1 (en) 1995-07-13 2005-12-27 Semiconductor Energy Laboratory Co., Ltd. Fabrication method for thin-film semiconductor
WO2009031270A1 (en) * 2007-09-03 2009-03-12 Panasonic Corporation Wafer reclamation method and wafer reclamation apparatus

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS633453B2 (en) * 1978-02-06 1988-01-23 Sony Corp
JPS54105476A (en) * 1978-02-06 1979-08-18 Sony Corp Manufacture of semiconductor device
JPS5618426A (en) * 1979-07-24 1981-02-21 Fujitsu Ltd Manufacture of semiconductor device
JPS5893235A (en) * 1981-11-30 1983-06-02 Toshiba Corp Preparation of semiconductor device
JPH0479130B2 (en) * 1982-12-28 1992-12-15 Tokin Corp
JPS59123234A (en) * 1982-12-28 1984-07-17 Tohoku Metal Ind Ltd Microscopic processing method
JPS6122631A (en) * 1984-02-03 1986-01-31 フエアチアイルド　カメラ　アンド　インストルメント　コ−ポレ−シヨン Method of flattening semiconductor and structure produced thereby
US6979632B1 (en) 1995-07-13 2005-12-27 Semiconductor Energy Laboratory Co., Ltd. Fabrication method for thin-film semiconductor
WO1998006128A1 (en) * 1996-08-07 1998-02-12 Hitachi, Ltd. Dry etching method and device used for the same
WO2009031270A1 (en) * 2007-09-03 2009-03-12 Panasonic Corporation Wafer reclamation method and wafer reclamation apparatus
JP4519199B2 (en) * 2007-09-03 2010-08-04 パナソニック株式会社 Wafer recycling method and wafer recycling apparatus
JPWO2009031270A1 (en) * 2007-09-03 2010-12-09 パナソニック株式会社 Wafer recycling method and wafer recycling apparatus
US8563332B2 (en) 2007-09-03 2013-10-22 Panasonic Corporation Wafer reclamation method and wafer reclamation apparatus

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