JPS52129292A - Semiconductor laser device - Google Patents

Semiconductor laser device

Info

Publication number
JPS52129292A
JPS52129292A JP4597576A JP4597576A JPS52129292A JP S52129292 A JPS52129292 A JP S52129292A JP 4597576 A JP4597576 A JP 4597576A JP 4597576 A JP4597576 A JP 4597576A JP S52129292 A JPS52129292 A JP S52129292A
Authority
JP
Japan
Prior art keywords
semiconductor laser
laser device
copper
strain
minimize
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4597576A
Other languages
Japanese (ja)
Other versions
JPS5628389B2 (en
Inventor
Takeshi Sakurai
Kazuhisa Murata
Hiroshi Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP4597576A priority Critical patent/JPS52129292A/en
Publication of JPS52129292A publication Critical patent/JPS52129292A/en
Publication of JPS5628389B2 publication Critical patent/JPS5628389B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Abstract

PURPOSE: To minimize the strain to be introduced into the inside of an element by mounting the element to a heat sink of copper through a copper oxide film by means of In as a brazing material.
COPYRIGHT: (C)1977,JPO&Japio
JP4597576A 1976-04-21 1976-04-21 Semiconductor laser device Granted JPS52129292A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4597576A JPS52129292A (en) 1976-04-21 1976-04-21 Semiconductor laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4597576A JPS52129292A (en) 1976-04-21 1976-04-21 Semiconductor laser device

Publications (2)

Publication Number Publication Date
JPS52129292A true JPS52129292A (en) 1977-10-29
JPS5628389B2 JPS5628389B2 (en) 1981-07-01

Family

ID=12734204

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4597576A Granted JPS52129292A (en) 1976-04-21 1976-04-21 Semiconductor laser device

Country Status (1)

Country Link
JP (1) JPS52129292A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50156888A (en) * 1974-06-06 1975-12-18
JPS5133988A (en) * 1974-09-18 1976-03-23 Fujitsu Ltd

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50156888A (en) * 1974-06-06 1975-12-18
JPS5133988A (en) * 1974-09-18 1976-03-23 Fujitsu Ltd

Also Published As

Publication number Publication date
JPS5628389B2 (en) 1981-07-01

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