JPS52116168A - Apparatus for wireebonding - Google Patents

Apparatus for wireebonding

Info

Publication number
JPS52116168A
JPS52116168A JP3332376A JP3332376A JPS52116168A JP S52116168 A JPS52116168 A JP S52116168A JP 3332376 A JP3332376 A JP 3332376A JP 3332376 A JP3332376 A JP 3332376A JP S52116168 A JPS52116168 A JP S52116168A
Authority
JP
Japan
Prior art keywords
wireebonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3332376A
Other languages
Japanese (ja)
Other versions
JPS616541B2 (en
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Seisakusho Co Ltd
Priority to JP3332376A priority Critical patent/JPS52116168A/en
Publication of JPS52116168A publication Critical patent/JPS52116168A/en
Publication of JPS616541B2 publication Critical patent/JPS616541B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10162—Shape being a cuboid with a square active surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Numerical Control (AREA)
  • Wire Bonding (AREA)
JP3332376A 1976-03-26 1976-03-26 Apparatus for wireebonding Granted JPS52116168A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3332376A JPS52116168A (en) 1976-03-26 1976-03-26 Apparatus for wireebonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3332376A JPS52116168A (en) 1976-03-26 1976-03-26 Apparatus for wireebonding

Publications (2)

Publication Number Publication Date
JPS52116168A true JPS52116168A (en) 1977-09-29
JPS616541B2 JPS616541B2 (en) 1986-02-27

Family

ID=12383340

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3332376A Granted JPS52116168A (en) 1976-03-26 1976-03-26 Apparatus for wireebonding

Country Status (1)

Country Link
JP (1) JPS52116168A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59172731A (en) * 1983-03-22 1984-09-29 Toshiba Corp Lead frame transfer apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5080763A (en) * 1973-11-14 1975-07-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5080763A (en) * 1973-11-14 1975-07-01

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59172731A (en) * 1983-03-22 1984-09-29 Toshiba Corp Lead frame transfer apparatus
JPH0439227B2 (en) * 1983-03-22 1992-06-26

Also Published As

Publication number Publication date
JPS616541B2 (en) 1986-02-27

Similar Documents

Publication Publication Date Title
JPS52138430A (en) Electroomagnetic apparatus
JPS52119555A (en) Hottwater apparatus
JPS53102567A (en) Apparatus for carrying
AU2521677A (en) Apparatus
JPS5351361A (en) Deflectionncompensating apparatus
JPS5367683A (en) Ultraafiltration apparatus
JPS5366672A (en) Apparatus for carrying
IE45498L (en) Slab-gripping apparatus
JPS52124557A (en) Clutchhreleasing apparatus
GB1548026A (en) Ultrafultration apparatus
GB1544568A (en) Pump-calibrating apparatus
JPS5357348A (en) Overloadproof apparatus
GB1553666A (en) Sequence-control apparatus
JPS5330543A (en) Apparatus for preventing waterrsplashing
JPS5295420A (en) Doubleelock apparatus
JPS5354177A (en) Apparatus for eliminating mixeddinnoil
JPS5345070A (en) Cremating apparatus
JPS52135377A (en) Apparatus for presssadhesion
JPS5353196A (en) Hypnotherapeutic apparatus
JPS52147256A (en) Overloaddproof apparatus
JPS52107399A (en) Multiifolding apparatus
JPS52115520A (en) Grounting apparatus
JPS52125761A (en) Apparatus for taking out parts
JPS5374147A (en) Apparatus for falseetwisting
JPS52116168A (en) Apparatus for wireebonding