JPS5210683A - Method of manufacturing semiconductor device - Google Patents

Method of manufacturing semiconductor device

Info

Publication number
JPS5210683A
JPS5210683A JP8684275A JP8684275A JPS5210683A JP S5210683 A JPS5210683 A JP S5210683A JP 8684275 A JP8684275 A JP 8684275A JP 8684275 A JP8684275 A JP 8684275A JP S5210683 A JPS5210683 A JP S5210683A
Authority
JP
Japan
Prior art keywords
semiconductor device
manufacturing semiconductor
film
pellets
simplify
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8684275A
Other languages
Japanese (ja)
Other versions
JPS5814745B2 (en
Inventor
Isamu Kitahiro
Masaharu Noyori
Hiroaki Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8684275A priority Critical patent/JPS5814745B2/en
Publication of JPS5210683A publication Critical patent/JPS5210683A/en
Publication of JPS5814745B2 publication Critical patent/JPS5814745B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To simplify a mutual wiring process of pellets with the use of such construction that a part of an insulated film on a semiconductor film and a part of a conductor wiring protective insulation film are extended to the outside.
COPYRIGHT: (C)1977,JPO&Japio
JP8684275A 1975-07-15 1975-07-15 hand tai souchi no seizou houhou Expired JPS5814745B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8684275A JPS5814745B2 (en) 1975-07-15 1975-07-15 hand tai souchi no seizou houhou

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8684275A JPS5814745B2 (en) 1975-07-15 1975-07-15 hand tai souchi no seizou houhou

Publications (2)

Publication Number Publication Date
JPS5210683A true JPS5210683A (en) 1977-01-27
JPS5814745B2 JPS5814745B2 (en) 1983-03-22

Family

ID=13898058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8684275A Expired JPS5814745B2 (en) 1975-07-15 1975-07-15 hand tai souchi no seizou houhou

Country Status (1)

Country Link
JP (1) JPS5814745B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108266A (en) * 1978-02-10 1979-08-24 Suwa Seikosha Kk Method of packaging electronic component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54108266A (en) * 1978-02-10 1979-08-24 Suwa Seikosha Kk Method of packaging electronic component
JPS5950238B2 (en) * 1978-02-10 1984-12-07 セイコーエプソン株式会社 How to mount electronic components

Also Published As

Publication number Publication date
JPS5814745B2 (en) 1983-03-22

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