JPS5210683A - Method of manufacturing semiconductor device - Google Patents
Method of manufacturing semiconductor deviceInfo
- Publication number
- JPS5210683A JPS5210683A JP8684275A JP8684275A JPS5210683A JP S5210683 A JPS5210683 A JP S5210683A JP 8684275 A JP8684275 A JP 8684275A JP 8684275 A JP8684275 A JP 8684275A JP S5210683 A JPS5210683 A JP S5210683A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- manufacturing semiconductor
- film
- pellets
- simplify
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
PURPOSE: To simplify a mutual wiring process of pellets with the use of such construction that a part of an insulated film on a semiconductor film and a part of a conductor wiring protective insulation film are extended to the outside.
COPYRIGHT: (C)1977,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8684275A JPS5814745B2 (en) | 1975-07-15 | 1975-07-15 | hand tai souchi no seizou houhou |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8684275A JPS5814745B2 (en) | 1975-07-15 | 1975-07-15 | hand tai souchi no seizou houhou |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5210683A true JPS5210683A (en) | 1977-01-27 |
JPS5814745B2 JPS5814745B2 (en) | 1983-03-22 |
Family
ID=13898058
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8684275A Expired JPS5814745B2 (en) | 1975-07-15 | 1975-07-15 | hand tai souchi no seizou houhou |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5814745B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54108266A (en) * | 1978-02-10 | 1979-08-24 | Suwa Seikosha Kk | Method of packaging electronic component |
-
1975
- 1975-07-15 JP JP8684275A patent/JPS5814745B2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54108266A (en) * | 1978-02-10 | 1979-08-24 | Suwa Seikosha Kk | Method of packaging electronic component |
JPS5950238B2 (en) * | 1978-02-10 | 1984-12-07 | セイコーエプソン株式会社 | How to mount electronic components |
Also Published As
Publication number | Publication date |
---|---|
JPS5814745B2 (en) | 1983-03-22 |
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