JPS51140484A - Method of etching wafer - Google Patents

Method of etching wafer

Info

Publication number
JPS51140484A
JPS51140484A JP6429875A JP6429875A JPS51140484A JP S51140484 A JPS51140484 A JP S51140484A JP 6429875 A JP6429875 A JP 6429875A JP 6429875 A JP6429875 A JP 6429875A JP S51140484 A JPS51140484 A JP S51140484A
Authority
JP
Japan
Prior art keywords
wafer
etching wafer
etching
backetching
irregularity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6429875A
Other languages
Japanese (ja)
Inventor
Hiroshi Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6429875A priority Critical patent/JPS51140484A/en
Publication of JPS51140484A publication Critical patent/JPS51140484A/en
Pending legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Weting (AREA)

Abstract

PURPOSE: To provide a method of backetching convenient wafer which can prevent the wafer from being broken by reducing the irregularity of thickness of the wafer after etching.
COPYRIGHT: (C)1976,JPO&Japio
JP6429875A 1975-05-30 1975-05-30 Method of etching wafer Pending JPS51140484A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6429875A JPS51140484A (en) 1975-05-30 1975-05-30 Method of etching wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6429875A JPS51140484A (en) 1975-05-30 1975-05-30 Method of etching wafer

Publications (1)

Publication Number Publication Date
JPS51140484A true JPS51140484A (en) 1976-12-03

Family

ID=13254190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6429875A Pending JPS51140484A (en) 1975-05-30 1975-05-30 Method of etching wafer

Country Status (1)

Country Link
JP (1) JPS51140484A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101275A (en) * 1978-01-27 1979-08-09 Hitachi Ltd One side masking method for plate material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54101275A (en) * 1978-01-27 1979-08-09 Hitachi Ltd One side masking method for plate material

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