JPS51116676A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS51116676A
JPS51116676A JP4169575A JP4169575A JPS51116676A JP S51116676 A JPS51116676 A JP S51116676A JP 4169575 A JP4169575 A JP 4169575A JP 4169575 A JP4169575 A JP 4169575A JP S51116676 A JPS51116676 A JP S51116676A
Authority
JP
Japan
Prior art keywords
semiconductor device
amalgamated
cadmium
gallium
zinc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4169575A
Other languages
Japanese (ja)
Inventor
Yasuhiro Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Japan Radio Co Ltd
Japan Radio Co Ltd
Original Assignee
New Japan Radio Co Ltd
Japan Radio Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Japan Radio Co Ltd, Japan Radio Co Ltd filed Critical New Japan Radio Co Ltd
Priority to JP4169575A priority Critical patent/JPS51116676A/en
Publication of JPS51116676A publication Critical patent/JPS51116676A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To realize a good ohmic contact by performing a zinc (or cadmium) and aluminium evaporation to the surface of a gallium P element and by forming an amalgamated electrode through a heat treatment to keep a mirror surface condition.
COPYRIGHT: (C)1976,JPO&Japio
JP4169575A 1975-04-04 1975-04-04 Semiconductor device Pending JPS51116676A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4169575A JPS51116676A (en) 1975-04-04 1975-04-04 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4169575A JPS51116676A (en) 1975-04-04 1975-04-04 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS51116676A true JPS51116676A (en) 1976-10-14

Family

ID=12615551

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4169575A Pending JPS51116676A (en) 1975-04-04 1975-04-04 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS51116676A (en)

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