JPS5093775A - - Google Patents

Info

Publication number
JPS5093775A
JPS5093775A JP14552574A JP14552574A JPS5093775A JP S5093775 A JPS5093775 A JP S5093775A JP 14552574 A JP14552574 A JP 14552574A JP 14552574 A JP14552574 A JP 14552574A JP S5093775 A JPS5093775 A JP S5093775A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14552574A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5093775A publication Critical patent/JPS5093775A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • ing And Chemical Polishing (AREA)
JP14552574A 1973-12-19 1974-12-18 Pending JPS5093775A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US42638773A 1973-12-19 1973-12-19

Publications (1)

Publication Number Publication Date
JPS5093775A true JPS5093775A (ja) 1975-07-26

Family

ID=23690593

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14552574A Pending JPS5093775A (ja) 1973-12-19 1974-12-18

Country Status (5)

Country Link
JP (1) JPS5093775A (ja)
BE (1) BE823525A (ja)
CA (1) CA1027465A (ja)
DE (1) DE2459892A1 (ja)
GB (1) GB1483746A (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5288968U (ja) * 1975-12-26 1977-07-02
JPS5288967U (ja) * 1975-12-26 1977-07-02
JPS54105799U (ja) * 1978-01-10 1979-07-25
JPS5617021A (en) * 1979-07-20 1981-02-18 Fujitsu Ltd Surface treatment of substrate
JPS5729140U (ja) * 1980-07-24 1982-02-16
JPS5758435U (ja) * 1980-09-19 1982-04-06
JP2011521442A (ja) * 2008-03-31 2011-07-21 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド シリコンウェハの端部をエッチングするための方法
JP2012509599A (ja) * 2008-11-19 2012-04-19 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 半導体ウェーハのエッジを剥離する方法及びシステム

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2326479A1 (fr) * 1975-10-03 1977-04-29 Radiotechnique Compelec Procede de decapage de plaquettes semi-conductrices, notamment pour cellules solaires et appareillage de mise en oeuvre du procede
US4482425A (en) * 1983-06-27 1984-11-13 Psi Star, Inc. Liquid etching reactor and method
US5278104A (en) * 1989-07-25 1994-01-11 Kabushiki Kaisha Toshiba Semiconductor wafer carrier having a dust cover
JPH0770505B2 (ja) * 1989-07-25 1995-07-31 株式会社東芝 半導体装置支持キャリヤ
US5054519A (en) * 1990-12-26 1991-10-08 Imtec Products, Inc. Recirculating chemical bath with inflow and self balancing outflow
KR100232998B1 (ko) * 1996-06-05 1999-12-01 윤종용 식각량 조절수단을 갖는 케미컬 배스 유니트
CN113793819B (zh) * 2021-09-16 2024-06-18 长江存储科技有限责任公司 化学槽及其温度控制方法
CN115241330B (zh) * 2022-09-19 2022-12-27 英利能源发展(天津)有限公司 一种氢氟酸刻蚀太阳能电池用半导体硅片装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DESIGN BULLTEIN=1966 *

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5288968U (ja) * 1975-12-26 1977-07-02
JPS5288967U (ja) * 1975-12-26 1977-07-02
JPS5721321Y2 (ja) * 1975-12-26 1982-05-08
JPS54105799U (ja) * 1978-01-10 1979-07-25
JPS5619933Y2 (ja) * 1978-01-10 1981-05-12
JPS5617021A (en) * 1979-07-20 1981-02-18 Fujitsu Ltd Surface treatment of substrate
JPS6325498B2 (ja) * 1979-07-20 1988-05-25 Fujitsu Ltd
JPS5729140U (ja) * 1980-07-24 1982-02-16
JPS5758435U (ja) * 1980-09-19 1982-04-06
JPS6327784Y2 (ja) * 1980-09-19 1988-07-27
JP2011521442A (ja) * 2008-03-31 2011-07-21 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド シリコンウェハの端部をエッチングするための方法
JP2012509599A (ja) * 2008-11-19 2012-04-19 エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド 半導体ウェーハのエッジを剥離する方法及びシステム

Also Published As

Publication number Publication date
DE2459892A1 (de) 1975-09-04
BE823525A (fr) 1975-06-18
CA1027465A (en) 1978-03-07
GB1483746A (en) 1977-08-24

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