JPS5013471B1 - - Google Patents
Info
- Publication number
- JPS5013471B1 JPS5013471B1 JP11884370A JP11884370A JPS5013471B1 JP S5013471 B1 JPS5013471 B1 JP S5013471B1 JP 11884370 A JP11884370 A JP 11884370A JP 11884370 A JP11884370 A JP 11884370A JP S5013471 B1 JPS5013471 B1 JP S5013471B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11884370A JPS5013471B1 (ja) | 1970-12-26 | 1970-12-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11884370A JPS5013471B1 (ja) | 1970-12-26 | 1970-12-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5013471B1 true JPS5013471B1 (ja) | 1975-05-20 |
Family
ID=14746514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11884370A Pending JPS5013471B1 (ja) | 1970-12-26 | 1970-12-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5013471B1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017170389A1 (ja) * | 2016-03-30 | 2017-10-05 | 京セラ株式会社 | 高周波基板、高周波パッケージおよび高周波モジュール |
-
1970
- 1970-12-26 JP JP11884370A patent/JPS5013471B1/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017170389A1 (ja) * | 2016-03-30 | 2017-10-05 | 京セラ株式会社 | 高周波基板、高周波パッケージおよび高周波モジュール |
| CN108781512A (zh) * | 2016-03-30 | 2018-11-09 | 京瓷株式会社 | 高频基板、高频封装件以及高频模块 |
| JPWO2017170389A1 (ja) * | 2016-03-30 | 2019-01-17 | 京セラ株式会社 | 高周波基板、高周波パッケージおよび高周波モジュール |
| US11102880B2 (en) | 2016-03-30 | 2021-08-24 | Kyocera Corporation | High-frequency board, high-frequency package, and high-frequency module |
| US11758648B2 (en) | 2016-03-30 | 2023-09-12 | Kyocera Corporation | High-frequency board, high-frequency package, and high-frequency module |