JPS4940065A - - Google Patents
Info
- Publication number
- JPS4940065A JPS4940065A JP8229572A JP8229572A JPS4940065A JP S4940065 A JPS4940065 A JP S4940065A JP 8229572 A JP8229572 A JP 8229572A JP 8229572 A JP8229572 A JP 8229572A JP S4940065 A JPS4940065 A JP S4940065A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8229572A JPS4940065A (en) | 1972-08-17 | 1972-08-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8229572A JPS4940065A (en) | 1972-08-17 | 1972-08-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4940065A true JPS4940065A (en) | 1974-04-15 |
Family
ID=13770544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8229572A Pending JPS4940065A (en) | 1972-08-17 | 1972-08-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS4940065A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52107773A (en) * | 1976-03-07 | 1977-09-09 | Toyo Dengu Seisakushiyo Kk | Semiconductor device |
| JPS5447569A (en) * | 1977-09-22 | 1979-04-14 | Nippon Telegr & Teleph Corp <Ntt> | Packaging method of semiconductor device |
| JPS556839A (en) * | 1978-06-28 | 1980-01-18 | Nec Corp | Semiconductor device |
| JPS5541762A (en) * | 1978-09-19 | 1980-03-24 | Nec Corp | Semiconductor device |
| JPS5768040A (en) * | 1980-10-15 | 1982-04-26 | Hitachi Ltd | Electrode structure for semiconductor device |
| JPS59101878A (en) * | 1982-12-01 | 1984-06-12 | Nec Corp | Semiconductor device |
| JPS60170550A (en) * | 1984-02-13 | 1985-09-04 | Musashi Seimitsu Kogyo Kk | Upper die presser device for rotary forging machine |
| JPS63110751A (en) * | 1986-10-29 | 1988-05-16 | Sony Corp | Formation of solder pad |
| JPH02288240A (en) * | 1989-04-06 | 1990-11-28 | Motorola Inc | Metal covering formed on rear of semiconductor device and method of forming the same |
-
1972
- 1972-08-17 JP JP8229572A patent/JPS4940065A/ja active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52107773A (en) * | 1976-03-07 | 1977-09-09 | Toyo Dengu Seisakushiyo Kk | Semiconductor device |
| JPS5447569A (en) * | 1977-09-22 | 1979-04-14 | Nippon Telegr & Teleph Corp <Ntt> | Packaging method of semiconductor device |
| JPS5716739B2 (en) * | 1977-09-22 | 1982-04-07 | ||
| JPS556839A (en) * | 1978-06-28 | 1980-01-18 | Nec Corp | Semiconductor device |
| JPS5541762A (en) * | 1978-09-19 | 1980-03-24 | Nec Corp | Semiconductor device |
| JPS5768040A (en) * | 1980-10-15 | 1982-04-26 | Hitachi Ltd | Electrode structure for semiconductor device |
| JPH028459B2 (en) * | 1980-10-15 | 1990-02-23 | Hitachi Ltd | |
| JPS59101878A (en) * | 1982-12-01 | 1984-06-12 | Nec Corp | Semiconductor device |
| JPS60170550A (en) * | 1984-02-13 | 1985-09-04 | Musashi Seimitsu Kogyo Kk | Upper die presser device for rotary forging machine |
| JPS63110751A (en) * | 1986-10-29 | 1988-05-16 | Sony Corp | Formation of solder pad |
| JP2508432B2 (en) * | 1986-10-29 | 1996-06-19 | ソニー株式会社 | Solder electrode formation method |
| JPH02288240A (en) * | 1989-04-06 | 1990-11-28 | Motorola Inc | Metal covering formed on rear of semiconductor device and method of forming the same |