JPS49114884U - - Google Patents
Info
- Publication number
- JPS49114884U JPS49114884U JP1280073U JP1280073U JPS49114884U JP S49114884 U JPS49114884 U JP S49114884U JP 1280073 U JP1280073 U JP 1280073U JP 1280073 U JP1280073 U JP 1280073U JP S49114884 U JPS49114884 U JP S49114884U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1280073U JPS5349341Y2 (ja) | 1973-01-31 | 1973-01-31 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1280073U JPS5349341Y2 (ja) | 1973-01-31 | 1973-01-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS49114884U true JPS49114884U (ja) | 1974-10-01 |
JPS5349341Y2 JPS5349341Y2 (ja) | 1978-11-27 |
Family
ID=28088529
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1280073U Expired JPS5349341Y2 (ja) | 1973-01-31 | 1973-01-31 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5349341Y2 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53124099A (en) * | 1977-04-05 | 1978-10-30 | Sanyo Electric Co Ltd | Luminous display unit |
JP2005019688A (ja) * | 2003-06-26 | 2005-01-20 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2009164648A (ja) * | 2002-08-30 | 2009-07-23 | Nichia Corp | 発光素子搭載用パッケージおよび発光装置 |
-
1973
- 1973-01-31 JP JP1280073U patent/JPS5349341Y2/ja not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53124099A (en) * | 1977-04-05 | 1978-10-30 | Sanyo Electric Co Ltd | Luminous display unit |
JP2009164648A (ja) * | 2002-08-30 | 2009-07-23 | Nichia Corp | 発光素子搭載用パッケージおよび発光装置 |
JP2005019688A (ja) * | 2003-06-26 | 2005-01-20 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS5349341Y2 (ja) | 1978-11-27 |