JPH11792A - High grade gold solder material - Google Patents
High grade gold solder materialInfo
- Publication number
- JPH11792A JPH11792A JP15272597A JP15272597A JPH11792A JP H11792 A JPH11792 A JP H11792A JP 15272597 A JP15272597 A JP 15272597A JP 15272597 A JP15272597 A JP 15272597A JP H11792 A JPH11792 A JP H11792A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- weight
- less
- melting point
- filler metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Adornments (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、指輪、ネックレ
ス、時計等の装飾品や、歯科材料、医療器具、電子機
器、測定機器等に用いられる金合金用の高品位金ろう材
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-grade gold brazing material for a gold alloy used for decorative articles such as rings, necklaces, watches and the like, dental materials, medical instruments, electronic instruments, measuring instruments and the like.
【0002】[0002]
【従来の技術】近年、純金の高級感、色調を兼ね備え、
かつ硬質化された23K、24Kなどの高品位金合金が
開発されている。これら高品位金合金用のろう材には銀
(Ag)、銅(Cu)などが25〜50重量%添加され
た18K、14K、12Kなどが用いられていた。2. Description of the Related Art In recent years, it has the luxury and color tone of pure gold,
Also, hardened high-grade gold alloys such as 23K and 24K have been developed. 18K, 14K, 12K or the like to which 25 to 50% by weight of silver (Ag), copper (Cu), or the like is added has been used as a brazing material for these high-grade gold alloys.
【0003】[0003]
【発明が解決しようとする課題】しかし、従来のろう材
で用いられる18K、14K、12Kなどは純金と比べ
るとその光沢、金属色、美しさ、重量感、高級感等が劣
っている。高品位金合金をろう付けする際、これら低品
位のろう材を用いると素材との色差が生じるだけでな
く、製品全体の品位が低下する。このため、純金のもつ
色調、高級感を兼ね備えた高品位金ろう材が求められて
いた。However, 18K, 14K, 12K, etc. used in conventional brazing materials are inferior in their luster, metal color, beauty, weight, luxury, etc. as compared with pure gold. When brazing a high-grade gold alloy, the use of these low-grade brazing materials not only causes a color difference from the material but also lowers the quality of the entire product. For this reason, there has been a demand for a high-grade gold brazing material having the color tone and luxury of pure gold.
【0004】そこで、本発明は、純金と同等の高級感、
色調等をもつ高品位金ろう材を提供することを目的とす
る。[0004] Therefore, the present invention provides a sense of quality equivalent to pure gold,
An object of the present invention is to provide a high-grade brazing material having a color tone or the like.
【0005】[0005]
【課題を解決するための手段】上記課題を解決するため
の本発明の高品位金ろう材は、Coが0.5重量%以
上、Geが0.5重量%以上含まれ、残部が95重量%
以上のAuであることを特徴とする。A high-grade brazing filler metal of the present invention for solving the above-mentioned problems contains 0.5% by weight or more of Co, 0.5% by weight or more of Ge, and the remaining 95% by weight. %
It is characterized by the above Au.
【0006】[0006]
【発明の実施の形態】本発明の高品位金ろう材における
CoとGeは、純金の融点1063℃を低下させ、ま
た、ろう材自体の強度を高めるために添加される。これ
らいずれの効果も、CoとGeの複合添加により得られ
る。Co、Geの添加量は、いずれも0.5重量%以上
であることが必要である。Coが0.5重量%未満、ま
たは、Geが0.5重量%未満ではろう材の融点が高
く、また、ろう材自体の強度が低くなるため、ろう材と
して用いることができない。一方、Auの含有量は95
重量%以上であることが必要である。95重量%未満で
は金の品位が低下するからである。BEST MODE FOR CARRYING OUT THE INVENTION Co and Ge in the high-grade gold brazing material of the present invention are added to lower the melting point of pure gold of 1063 ° C. and to increase the strength of the brazing material itself. Both of these effects can be obtained by adding Co and Ge in combination. Both Co and Ge need to be added in an amount of 0.5% by weight or more. If Co is less than 0.5% by weight or Ge is less than 0.5% by weight, the melting point of the brazing material is high and the strength of the brazing material itself is low, so that it cannot be used as a brazing material. On the other hand, the content of Au is 95
It is necessary that the content be at least% by weight. If the content is less than 95% by weight, the quality of gold is reduced.
【0007】[0007]
【実施例】以下に、本発明を代表的な実施例により具体
的に説明する。The present invention will be described below in more detail with reference to typical examples.
【0008】まず、高周波真空溶解炉でCoまたはGe
の各元素を1重量%含有したAu−Co系合金及びAu
−Ge系合金を母合金として製造した。次に、これら母
合金と純度99.99%の純金とを所定の組成となるよ
うに配合した原料を、高周波真空溶解炉で溶解鋳造し、
表1に示す組成の金合金とした。次に、各金合金の融点
とろう付け部の強度測定をした。ろう付け部の強度測定
は、5×25×0.3mmの純金(純度5N)2枚を表
1の各金合金10mgをろう材としてろう付けし、オー
トグラフを用いて測定した。First, Co or Ge is used in a high frequency vacuum melting furnace.
Au-Co-based alloy containing 1% by weight of each element of Au and Au
A Ge-based alloy was manufactured as a master alloy. Next, a raw material obtained by mixing these mother alloys and pure gold having a purity of 99.99% to have a predetermined composition is melt-cast in a high-frequency vacuum melting furnace.
A gold alloy having the composition shown in Table 1 was used. Next, the melting point of each gold alloy and the strength of the brazed portion were measured. The strength of the brazed portion was measured by brazing two pieces of 5 × 25 × 0.3 mm pure gold (purity: 5N) using 10 mg of each gold alloy shown in Table 1 as a brazing material and using an autograph.
【0009】[0009]
【表1】 −−−−−−−−−−−−−−−−−−−−−−−−−−−−−− Co含有量(重量%) Ge含有量(重量%) 合金の融点(℃) −−−−−−−−−−−−−−−−−−−−−−−−−−−−−− 実施例1 0.95 0.93 750 実施例2 1.54 1.49 700 実施例3 1.54 1.49 675 実施例4 2.45 2.42 659 −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−Table 1------------------------Co content (% by weight) Ge content (% by weight) Melting point (° C.) ------------------------------------------------------------------------------------- Example 1 0.95 0.93 750 Example 2 1.54 1.49 700 Example 3 1.54 1.49 675 Example 4 2.45 2.42 659 −−−−−−−−−−−−−−−−−−−−−−−−−−−− −−−−−
【0010】表1に示したように、本発明の金合金は、
高品位にもかかわらず、純金(純度5N、融点1063
℃)やK18(組成が重量%で、Au−12.5Ag−
12.5Cu、融点885℃)よりも融点が低い。ま
た、ろう付け部強度測定の結果、実施例1〜4のいずれ
の資料もろう付け部分でなく素材部分が破断し、十分な
剥離強度を有していた。[0010] As shown in Table 1, the gold alloy of the present invention comprises:
Despite high quality, pure gold (purity 5N, melting point 1063)
° C) and K18 (composition by weight%, Au-12.5Ag-
12.5 Cu, melting point 885 ° C.). Further, as a result of the measurement of the brazing portion strength, not only the brazing portion but also the material portion of all the materials of Examples 1 to 4 were broken, and the material had a sufficient peel strength.
【0011】なお、本発明の金合金は、光沢、金属色、
美しさ、重量感、高級感等は純金と全く変わらないもの
である。The gold alloy of the present invention has a luster, a metallic color,
Beauty, weight, luxury, etc. are no different from pure gold.
【0012】[0012]
【発明の効果】本発明の高品位金ろう材は、金に添加す
る元素の量が少量であるため、純金のもつ高級感、色調
等を損なわずにろう付けが可能である。The high-grade gold brazing material of the present invention can be brazed without impairing the high-grade appearance and color tone of pure gold because the amount of elements added to gold is small.
Claims (1)
重量%以上含まれ、残部が95重量%以上のAuである
高品位金ろう材。1. Co is 0.5% by weight or more and Ge is 0.5% by weight.
A high-grade gold brazing filler metal containing at least 95% by weight of Au and at least 95% by weight of Au.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15272597A JPH11792A (en) | 1997-06-11 | 1997-06-11 | High grade gold solder material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15272597A JPH11792A (en) | 1997-06-11 | 1997-06-11 | High grade gold solder material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11792A true JPH11792A (en) | 1999-01-06 |
Family
ID=15546799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15272597A Pending JPH11792A (en) | 1997-06-11 | 1997-06-11 | High grade gold solder material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11792A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1266974A1 (en) * | 2001-05-30 | 2002-12-18 | Leg.Or S.r.l | Gold alloys and master alloys for obtaining them |
JP2005177161A (en) * | 2003-12-19 | 2005-07-07 | Toshio Harima | Orthodontic wire retainer and its attaching method |
US7351177B2 (en) | 2001-08-23 | 2008-04-01 | Sew-Eurodrive Gmbh & Co. Kg. | Series of gearboxes |
JP2012200788A (en) * | 2011-03-28 | 2012-10-22 | Sumitomo Metal Mining Co Ltd | Au-Sn ALLOY SOLDER |
-
1997
- 1997-06-11 JP JP15272597A patent/JPH11792A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1266974A1 (en) * | 2001-05-30 | 2002-12-18 | Leg.Or S.r.l | Gold alloys and master alloys for obtaining them |
US7351177B2 (en) | 2001-08-23 | 2008-04-01 | Sew-Eurodrive Gmbh & Co. Kg. | Series of gearboxes |
JP2005177161A (en) * | 2003-12-19 | 2005-07-07 | Toshio Harima | Orthodontic wire retainer and its attaching method |
JP2012200788A (en) * | 2011-03-28 | 2012-10-22 | Sumitomo Metal Mining Co Ltd | Au-Sn ALLOY SOLDER |
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