JPH1155000A - Mounting device of chip-like circuit component - Google Patents
Mounting device of chip-like circuit componentInfo
- Publication number
- JPH1155000A JPH1155000A JP9208736A JP20873697A JPH1155000A JP H1155000 A JPH1155000 A JP H1155000A JP 9208736 A JP9208736 A JP 9208736A JP 20873697 A JP20873697 A JP 20873697A JP H1155000 A JPH1155000 A JP H1155000A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- circuit component
- shaped circuit
- mounting device
- template
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は複数個のチップ状回
路部品をプリント基板にマウントするチップ状回路部品
のマウント装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for mounting a plurality of chip-shaped circuit components on a printed circuit board.
【０００２】[0002]
【従来の技術】従来のチップ状回路部品のマウント装置
は、図８〜図１３に示すように、チップ状回路部品Ｔを
収納する容器２１とプレート２２との間に、チップ状回
路部品Ｔを搬送するチューブ状の搬送部２３が設けられ
ている。また、プレート２２の下部には、複数個のチッ
プ状回路部品Ｔを収容するための凹部２４ａを有するテ
ンプレート２４が配設され、このテンプレート２４は、
吸着ヘッド２５を有する移送部材２６の位置まで移動可
能となっている。また、テンプレート２４から離れた位
置には、傾斜面を備えた孔２７ａを有するチップ状回路
部品Ｔの位置決めプレート２７と、プリント基板２８と
が並列して配置され、位置決めプレート２７の孔２７ａ
に対向するプリント基板２８上には、図１３に示すよう
に、クリーム半田２９が塗布された状態となっている。2. Description of the Related Art As shown in FIGS. 8 to 13, a conventional mounting device for a chip-shaped circuit component mounts the chip-shaped circuit component T between a container 21 for accommodating the chip-shaped circuit component T and a plate 22. A tube-shaped transfer section 23 for transferring is provided. A template 24 having a concave portion 24a for accommodating a plurality of chip-shaped circuit components T is provided below the plate 22.
It can be moved to the position of the transfer member 26 having the suction head 25. Further, at a position away from the template 24, a positioning plate 27 of the chip-shaped circuit component T having a hole 27a having an inclined surface and a printed board 28 are arranged in parallel, and the hole 27a of the positioning plate 27 is formed.
As shown in FIG. 13, cream solder 29 is applied on the printed circuit board 28 facing the substrate.
【０００３】次に、このマウント装置の動作を説明する
と、先ず、図８に示すように、容器２１に収納したチッ
プ状回路部品Ｔを、搬送部２３を通してテンプレート２
４の凹部２４ａに落下して、テンプレート２４上に所望
のチップ状回路部品Ｔの配列を行う。次に、このテンプ
レート２４を、図９に示すように、移送部材２６の位置
まで移動した後、吸着ヘッド２５を下方に移動させて、
テンプレート２４に配列されたチップ状回路部品Ｔを、
この配列状態を維持した状態で吸着ヘッド２５で吸着す
る。次に、図１０、図１３に示すように、移送部材２６
を、位置決めプレート２７に対向する状態まで移動さ
せ、そして、吸着ヘッド２５からチップ状回路部品Ｔを
離すと、チップ状回路部品Ｔは、位置決めプレート２７
の孔２７ａの傾斜面に沿って、チップ状回路部品Ｔの位
置が補正された状態で、クリーム半田２９上に落下し
て、クリーム半田２９に接着した状態となる。そして、
このようなプリント基板２８を加熱炉（図示せず）に通
すと、チップ状回路部品Ｔがプリント基板２８の導電パ
ターン（図示せず）に半田付けされるようになってい
る。Next, the operation of this mounting device will be described. First, as shown in FIG.
4 and fall into the concave portion 24 a, and the desired chip-shaped circuit components T are arranged on the template 24. Next, as shown in FIG. 9, after moving the template 24 to the position of the transfer member 26, the suction head 25 is moved downward,
The chip-shaped circuit components T arranged on the template 24 are
The suction is performed by the suction head 25 while the arrangement state is maintained. Next, as shown in FIG. 10 and FIG.
Is moved to a state where it faces the positioning plate 27, and the chip-shaped circuit component T is separated from the suction head 25.
With the position of the chip-shaped circuit component T corrected along the inclined surface of the hole 27a, the chip-shaped circuit component T falls onto the cream solder 29 and is in a state of being adhered to the cream solder 29. And
When such a printed board 28 is passed through a heating furnace (not shown), the chip-shaped circuit component T is soldered to a conductive pattern (not shown) of the printed board 28.
【０００４】そして、従来のマウント装置に使用される
テンプレート２４は、図１１、図１２に示すように、凹
部２４ａが矩形状で、チップ状回路部品Ｔに比して大き
く、凹部２４ａ内でチップ状回路部品Ｔが移動できる程
度の大きさで形成されている。従って、チップ状回路部
品Ｔがこの凹部２４ａに落下した際は、凹部２４ａ内に
チップ状回路部品Ｔが確実に収まるが、凹部２４ａ内の
チップ状回路部品Ｔの位置がまちまちとなる。このた
め、移送部材２６の吸着ヘッド２５でチップ状回路部品
Ｔを吸着した際、このまちまちの状態で吸着されるた
め、図１３に示すように、プリント基板２８へのチップ
状回路部品Ｔの位置決めのために、位置決めプレート２
７が必要となる。As shown in FIGS. 11 and 12, a template 24 used in a conventional mounting device has a rectangular recess 24a, which is larger than a chip-shaped circuit component T. The circuit component T is formed in such a size that it can move. Therefore, when the chip-shaped circuit component T falls into the concave portion 24a, the chip-shaped circuit component T is securely settled in the concave portion 24a, but the position of the chip-shaped circuit component T in the concave portion 24a varies. For this reason, when the chip-shaped circuit component T is sucked by the suction head 25 of the transfer member 26, the chip-shaped circuit component T is sucked in a different state, so that the positioning of the chip-shaped circuit component T on the printed circuit board 28 is performed as shown in FIG. For positioning plate 2
7 is required.
【０００５】[0005]
【発明が解決しようとする課題】従来のチップ状回路部
品のマウント装置は、テンプレート２４に設けられた凹
部２４ａが、チップ状回路部品Ｔに比して大きく、凹部
２４ａ内でチップ状回路部品Ｔが移動できる程度の大き
さで形成されているため、位置決めプレート２７を必要
とし、装置が高価となるばかりか複雑で、操作性が悪い
という問題がある。また、チップ状回路部品Ｔは、位置
決めプレート２７の孔２７ａから落下した状態でクリー
ム半田２９に接着するため、その接着力が弱く、しか
も、孔２７ａからチップ状回路部品Ｔが抜け出る際、一
端側、或いは他端側が早く抜け出たりして、プリント基
板２８に対して平行な一定の状態で落下することが難し
く、落下姿勢の状態がまちまちとなり、従って、一定の
姿勢でクリーム半田２９に接着することが難しく、精度
の良いマウント装置が得られないという問題がある。In a conventional mounting device for a chip-shaped circuit component, the recess 24a provided in the template 24 is larger than the chip-shaped circuit component T, and the chip-shaped circuit component T is provided in the recess 24a. Is formed in such a size that it can be moved, so that the positioning plate 27 is required, and the apparatus is not only expensive but also complicated and has poor operability. Further, since the chip-shaped circuit component T adheres to the cream solder 29 in a state where it is dropped from the hole 27a of the positioning plate 27, its adhesive force is weak. Alternatively, it is difficult to drop in a constant state parallel to the printed circuit board 28 because the other end side comes out quickly, and the state of the falling posture varies, and therefore, it adheres to the cream solder 29 in a constant posture. However, there is a problem that a precise mounting device cannot be obtained.
【０００６】[0006]
【課題を解決するための手段】上記課題を解決するため
の第１の解決手段として、複数個のチップ状回路部品を
受容するための複数個の凹部を有するテンプレートを備
え、前記チップ状回路部品の側部側と当接する前記凹部
の少なくとも一方の側壁を、上部から下部に行くに従っ
て狭くなるような傾斜面とした構成とした。また、第２
の解決手段として、前記チップ状回路部品の側部側と当
接する前記凹部の対向する一対の側壁を、上部から下部
に行くに従って狭くなるような傾斜面とした構成とし
た。更に、第３の解決手段として、前記チップ状回路部
品の端面側と対向する前記凹部の一対の端壁を、上部か
ら下部に行くに従って狭くなるような傾斜面とし、前記
凹部をすり鉢状とした構成とした。According to a first aspect of the present invention, there is provided a template having a plurality of recesses for receiving a plurality of chip-like circuit components, the template comprising: At least one side wall of the concave portion which is in contact with the side portion is formed as an inclined surface that becomes narrower from the upper portion to the lower portion. Also, the second
As a means for solving the problems, a pair of side walls of the concave portion which is in contact with the side of the chip-shaped circuit component are formed as inclined surfaces that become narrower from the upper part to the lower part. Further, as a third solution, a pair of end walls of the concave portion facing the end surface side of the chip-shaped circuit component are formed as inclined surfaces that become narrower from an upper portion to a lower portion, and the concave portion has a mortar shape. The configuration was adopted.
【０００７】[0007]
【発明の実施の形態】本発明のチップ状回路部品のマウ
ント装置を、図１〜図７に基づいて説明すると、図１は
本発明のチップ状回路部品のマウント装置の概要を説明
するための説明図、図２は本発明のチップ状回路部品の
マウント装置の動作を説明するための説明図、図３は本
発明のチップ状回路部品のマウント装置の動作を説明す
るための説明図、図４は本発明のチップ状回路部品のマ
ウント装置に係るテンプレートの要部の拡大平面図、図
５は本発明のチップ状回路部品のマウント装置に係るテ
ンプレートの要部の拡大断面図、図６は本発明のチップ
状回路部品のマウント装置に係る移送部材とプリント基
板との関係を示す説明図、図７は本発明のチップ状回路
部品のマウント装置に使用されるチップ状回路部品の斜
視図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS A mounting device for a chip-shaped circuit component according to the present invention will be described with reference to FIGS. 1 to 7. FIG. 1 is a diagram for explaining an outline of a mounting device for a chip-shaped circuit component according to the present invention. FIG. 2 is an explanatory diagram for explaining the operation of the chip-shaped circuit component mounting device of the present invention, and FIG. 3 is an explanatory diagram for explaining the operation of the chip-shaped circuit component mounting device of the present invention. 4 is an enlarged plan view of a main part of a template according to the chip-shaped circuit component mounting apparatus of the present invention, FIG. 5 is an enlarged cross-sectional view of a main part of the template according to the chip-shaped circuit component mounting apparatus of the present invention, and FIG. FIG. 7 is an explanatory view showing the relationship between a transfer member and a printed circuit board according to the chip-shaped circuit component mounting device of the present invention. FIG. 7 is a perspective view of the chip-shaped circuit component used in the chip-shaped circuit component mounting device of the present invention. is there.
【０００８】本発明のマウント装置に使用されるチップ
状回路部品Ｔは、図７に示すように、本体１１の側部１
１ａの両端面１１ｂに電極部１２を形成した構成を有
し、図７のような円柱状、或いは矩形状で形成されてお
り、そして、本発明のチップ状回路部品のマウント装置
は、図１〜図６に示すように、種々のチップ状回路部品
Ｔを収納する容器１とプレート２との間に、チップ状回
路部品Ｔを搬送するチューブ状の搬送部３が設けられて
いる。また、プレート２の下部には、複数個のチップ状
回路部品Ｔを収容するための凹部４ａを有するテンプレ
ート４が配設され、このテンプレート４の凹部４ａは、
後述するプリント基板７上に配設されるチップ状回路部
品Ｔの状態と同じ状態で設けられていると共に、このテ
ンプレート４は、吸着ヘッド５を有する移送部材６の位
置まで移動可能となっている。また、テンプレート４か
ら離れた位置には、プリント基板７が配置され、このプ
リント基板７上には、図６に示すように、クリーム半田
８が塗布された状態となっている。As shown in FIG. 7, a chip-shaped circuit component T used in the mounting device of the present invention is provided on a side portion 1 of a main body 11.
1a has a configuration in which electrode portions 12 are formed on both end surfaces 11b, and is formed in a columnar or rectangular shape as shown in FIG. 7, and a mounting device for a chip-shaped circuit component of the present invention is shown in FIG. As shown in FIG. 6 to FIG. 6, a tube-shaped transfer section 3 for transferring the chip-shaped circuit components T is provided between the container 1 and the plate 2 for storing various chip-shaped circuit components T. A template 4 having a concave portion 4a for accommodating a plurality of chip-shaped circuit components T is provided below the plate 2, and the concave portion 4a of the template 4
The template 4 is provided in the same state as a chip-shaped circuit component T disposed on a printed board 7 described later, and the template 4 can be moved to the position of the transfer member 6 having the suction head 5. . A printed circuit board 7 is arranged at a position distant from the template 4, and a cream solder 8 is applied on the printed circuit board 7, as shown in FIG.
【０００９】次に、このマウント装置の動作を説明する
と、先ず、図１に示すように、容器１に収納したチップ
状回路部品Ｔを、搬送部３を通してテンプレート４の凹
部４ａに落下して、テンプレート４上に所望のチップ状
回路部品Ｔの配列を行った後、テンプレート４を横方向
に振動する。次に、このテンプレート４を、図２に示す
ように、移送部材６の位置まで移動した後、吸着ヘッド
５を下方に移動させて、テンプレート４に配列されたチ
ップ状回路部品Ｔを、この配列状態を維持した状態で吸
着ヘッド５で吸着する。次に、図３、図６に示すよう
に、移送部材６をプリント基板７上まで移動した後、移
送部材６を下方に移動させて、クリーム半田８上にチッ
プ状回路部品Ｔを押し付けて、クリーム半田８にチップ
状回路部品Ｔを接着する。しかる後、吸着ヘッド５によ
るチップ状回路部品Ｔの吸引を解除し、移送部材６、及
びテンプレート４を元の位置に戻す。そして、このよう
に、チップ状回路部品Ｔをクリーム半田８に接着したプ
リント基板７を加熱炉（図示せず）に通すと、チップ状
回路部品Ｔがプリント基板７の導電パターン（図示せ
ず）に半田付けされるようになっている。Next, the operation of the mounting device will be described. First, as shown in FIG. 1, a chip-shaped circuit component T stored in a container 1 is dropped into a concave portion 4a of a template 4 through a transport portion 3 and After arranging the desired chip-shaped circuit components T on the template 4, the template 4 is vibrated in the lateral direction. Next, as shown in FIG. 2, after moving the template 4 to the position of the transfer member 6, the suction head 5 is moved downward, and the chip-shaped circuit components T arranged on the template 4 are arranged in this arrangement. The suction is performed by the suction head 5 while maintaining the state. Next, as shown in FIGS. 3 and 6, after moving the transfer member 6 onto the printed circuit board 7, the transfer member 6 is moved downward, and the chip-shaped circuit component T is pressed onto the cream solder 8. The chip-shaped circuit component T is bonded to the cream solder 8. Thereafter, the suction of the chip-shaped circuit component T by the suction head 5 is released, and the transfer member 6 and the template 4 are returned to their original positions. Then, when the printed circuit board 7 in which the chip-shaped circuit components T are bonded to the cream solder 8 is passed through a heating furnace (not shown), the chip-shaped circuit components T become conductive patterns (not shown) of the printed circuit board 7. To be soldered.
【００１０】そして、本発明のマウント装置に使用され
るテンプレート４の凹部４ａは、図４、図５に示すよう
に、チップ状回路部品Ｔの側部１１ａに対向する一対の
側壁４ｂと、チップ状回路部品Ｔの端面１１ｂに対向す
る一対の端壁４ｃとが、上部から下部に行くに従って、
漸次狭くなるような傾斜面となし、すり鉢状とした構成
となっている。そして、チップ状回路部品Ｔがこの凹部
４ａに落下した際は、チップ状回路部品Ｔの側部１１ａ
が一対の側壁４ｂの傾斜面で、また、端面１１ｂが一対
の端壁４ｃの傾斜面でガイドされて、チップ状回路部品
Ｔが傾斜面の側壁４ｂの途中で係止させたり、或いはチ
ップ状回路部品Ｔの側部１１ａを側壁４ｂで支持した状
態で、凹部４ａの底壁４ｄにチップ状回路部品Ｔを当接
させて、チップ状回路部品Ｔの正確な位置決めを行って
いる。また、テンプレート４を振動させることにより、
凹部４ａ内のチップ状回路部品Ｔの安定した位置を採る
ことが出来ると共に、正確に配列されたチップ状回路部
品Ｔは、移送部材６の吸着ヘッド５で吸着された際、こ
の正確な配列状態で吸着されて移送されるものである。As shown in FIGS. 4 and 5, the concave portion 4a of the template 4 used in the mounting device of the present invention has a pair of side walls 4b facing the side portion 11a of the chip-shaped circuit component T, and a chip. As the pair of end walls 4c facing the end face 11b of the circuit component T goes from top to bottom,
It has an inclined surface that gradually narrows, and has a mortar-shaped configuration. When the chip-shaped circuit component T falls into the recess 4a, the side portion 11a of the chip-shaped circuit component T
Are guided by the inclined surfaces of the pair of side walls 4b, and the end surfaces 11b are guided by the inclined surfaces of the pair of end walls 4c, so that the chip-shaped circuit component T is locked in the middle of the inclined side walls 4b, or In a state where the side portion 11a of the circuit component T is supported by the side wall 4b, the chip-shaped circuit component T is brought into contact with the bottom wall 4d of the concave portion 4a to perform accurate positioning of the chip-shaped circuit component T. Also, by vibrating the template 4,
It is possible to take a stable position of the chip-shaped circuit components T in the concave portion 4a, and when the chip-shaped circuit components T arranged correctly are sucked by the suction head 5 of the transfer member 6, this accurate arrangement state is obtained. It is adsorbed by and transferred.
【００１１】なお、上述の実施形態では、一対の側壁４
ｂを傾斜面としたもので説明したが、一方の側壁４ｂを
傾斜面とし、他方の側壁４ｂを直立面としても良く、更
に、端壁４ｃは、必要に応じて傾斜面を設けるようにし
ても良い。In the above embodiment, the pair of side walls 4
Although the description has been made on the assumption that b is an inclined surface, one side wall 4b may be an inclined surface and the other side wall 4b may be an upright surface, and the end wall 4c may be provided with an inclined surface if necessary. Is also good.
【００１２】[0012]
【発明の効果】本発明のチップ状回路部品のマウント装
置は、テンプレート４の凹部４ａの側壁４ｂを、上部か
ら下部に行くに従って狭くなるような傾斜面としたた
め、凹部４ａ内のチップ状回路部品Ｔの位置決めを正確
に出来、プリント基板７へのチップ状回路部品Ｔの正確
なマウントが出来る装置を提供できる。また、従来の位
置決めプレートが不要となり、安価で、操作性の良好な
装置が提供できる。また、チップ状回路部品Ｔが正確な
位置を移送部材６で維持した状態で、チップ状回路部品
Ｔをクリーム半田８に接着できるようになり、チップ状
回路部品Ｔの姿勢が一定した状態で、且つ、クリーム半
田８への接着力の強い状態で、チップ状回路部品Ｔのプ
リント基板７へのマウントが出来、精度の良い装置が提
供できる。また、一対の側壁４ｂを傾斜面とすることに
よって、円柱状のチップ状回路部品Ｔの位置決めの良好
な装置を提供できる。更に、端壁４ｃを傾斜面とするこ
とによって、長手方向でのチップ状回路部品Ｔの位置を
正確に出来、より正確な位置決めの出来る装置を提供で
きる。According to the mounting device for a chip-shaped circuit component of the present invention, the side wall 4b of the recess 4a of the template 4 has an inclined surface that becomes narrower from the upper portion to the lower portion. It is possible to provide a device capable of accurately positioning the T and mounting the chip-shaped circuit component T on the printed circuit board 7 accurately. Further, a conventional positioning plate is not required, and an inexpensive device with good operability can be provided. Further, the chip-shaped circuit component T can be adhered to the cream solder 8 with the accurate position of the chip-shaped circuit component T maintained by the transfer member 6, and the posture of the chip-shaped circuit component T is kept constant. In addition, the chip-shaped circuit component T can be mounted on the printed circuit board 7 with a strong adhesive force to the cream solder 8, and a highly accurate device can be provided. In addition, by forming the pair of side walls 4b as inclined surfaces, it is possible to provide a device that can position the cylindrical chip-shaped circuit component T with good positioning. Further, by making the end wall 4c an inclined surface, the position of the chip-shaped circuit component T in the longitudinal direction can be accurately determined, and a device capable of more accurate positioning can be provided.
【図１】本発明のチップ状回路部品のマウント装置の概
要を説明するための説明図。FIG. 1 is an explanatory diagram for explaining an outline of a chip-shaped circuit component mounting device of the present invention.
【図２】本発明のチップ状回路部品のマウント装置の動
作を説明するための説明図。FIG. 2 is an explanatory diagram for explaining the operation of the chip-shaped circuit component mounting device of the present invention.
【図３】本発明のチップ状回路部品のマウント装置の動
作を説明するための説明図。FIG. 3 is an explanatory diagram for explaining the operation of the chip-shaped circuit component mounting device of the present invention.
【図４】本発明のチップ状回路部品のマウント装置に係
るテンプレートの要部の拡大平面図。FIG. 4 is an enlarged plan view of a main part of a template according to the chip-shaped circuit component mounting device of the present invention.
【図５】本発明のチップ状回路部品のマウント装置に係
るテンプレートの要部の拡大断面図。FIG. 5 is an enlarged sectional view of a main part of a template according to the chip-shaped circuit component mounting device of the present invention.
【図６】本発明のチップ状回路部品のマウント装置に係
る移送部材とプリント基板との関係を示す説明図。FIG. 6 is an explanatory view showing a relationship between a transfer member and a printed circuit board according to the chip-shaped circuit component mounting device of the present invention.
【図７】本発明のチップ状回路部品のマウント装置に使
用されるチップ状回路部品の斜視図。FIG. 7 is a perspective view of a chip-shaped circuit component used in the chip-shaped circuit component mounting device of the present invention.
【図８】従来のチップ状回路部品のマウント装置の概要
を説明するための説明図。FIG. 8 is an explanatory diagram for explaining an outline of a conventional mounting device for chip-shaped circuit components.
【図９】従来のチップ状回路部品のマウント装置の動作
を説明するための説明図。FIG. 9 is an explanatory diagram for explaining the operation of a conventional mounting device for chip-shaped circuit components.
【図１０】従来のチップ状回路部品のマウント装置の動
作を説明するための説明図。FIG. 10 is an explanatory diagram for explaining the operation of a conventional mounting device for chip-shaped circuit components.
【図１１】従来のチップ状回路部品のマウント装置に係
るテンプレートの要部の拡大平面図。FIG. 11 is an enlarged plan view of a main part of a template according to a conventional chip-shaped circuit component mounting apparatus.
【図１２】従来のチップ状回路部品のマウント装置に係
るテンプレートの要部の拡大断面図。FIG. 12 is an enlarged cross-sectional view of a main part of a template according to a conventional chip-shaped circuit component mounting device.
【図１３】従来のチップ状回路部品のマウント装置に係
る移送部材と位置決めプレートとプリント基板との関係
を示す説明図。FIG. 13 is an explanatory diagram showing a relationship among a transfer member, a positioning plate, and a printed circuit board according to a conventional chip-shaped circuit component mounting apparatus.
１ 容器 ２ プレート ３ 搬送部 ４ テンプレート ４ａ 凹部 ４ｂ 側壁 ４ｃ 端壁 ４ｄ 底壁 ５ 吸着ヘッド ６ 移送部材 ７ プリント基板 ８ クリーム半田 Ｔ チップ状回路部品 １１ 本体 １１ａ 側部 １１ｂ 端面 １２ 電極部 DESCRIPTION OF SYMBOLS 1 Container 2 Plate 3 Conveying part 4 Template 4a Depression 4b Side wall 4c End wall 4d Bottom wall 5 Suction head 6 Transfer member 7 Printed circuit board 8 Cream solder T Chip-shaped circuit component 11 Main body 11a Side part 11b End face 12 Electrode part
Claims (3)
めの複数個の凹部を有するテンプレートを備え、前記チ
ップ状回路部品の側部側と当接する前記凹部の少なくと
も一方の側壁を、上部から下部に行くに従って狭くなる
ような傾斜面としたことを特徴とするチップ状回路部品
のマウント装置。1. A template having a plurality of recesses for receiving a plurality of chip-shaped circuit components, wherein at least one side wall of the recess in contact with a side of the chip-shaped circuit components is formed from above. A mounting device for a chip-shaped circuit component, wherein the inclined surface becomes narrower toward a lower portion.
る前記凹部の対向する一対の側壁を、上部から下部に行
くに従って狭くなるような傾斜面としたことを特徴とす
る請求項１記載のチップ状回路部品のマウント装置。2. The device according to claim 1, wherein a pair of side walls of the concave portion, which are in contact with the side portions of the chip-shaped circuit component, have inclined surfaces that become narrower from an upper portion to a lower portion. For mounting chip-shaped circuit components.
る前記凹部の一対の端壁を、上部から下部に行くに従っ
て狭くなるような傾斜面とし、前記凹部をすり鉢状とし
たことを特徴とする請求項２記載のチップ状回路部品の
マウント装置。3. A pair of end walls of the concave portion facing the end surface side of the chip-shaped circuit component have inclined surfaces that become narrower from an upper portion to a lower portion, and the concave portion has a mortar shape. The mounting device for a chip-shaped circuit component according to claim 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9208736A JPH1155000A (en) | 1997-08-04 | 1997-08-04 | Mounting device of chip-like circuit component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9208736A JPH1155000A (en) | 1997-08-04 | 1997-08-04 | Mounting device of chip-like circuit component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1155000A true JPH1155000A (en) | 1999-02-26 |
Family
ID=16561238
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9208736A Withdrawn JPH1155000A (en) | 1997-08-04 | 1997-08-04 | Mounting device of chip-like circuit component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1155000A (en) |
-
1997
- 1997-08-04 JP JP9208736A patent/JPH1155000A/en not_active Withdrawn
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20041214 |
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