JPH1154367A - Composite electronic component, its manufacture and chip-like electronic component - Google Patents
Composite electronic component, its manufacture and chip-like electronic componentInfo
- Publication number
- JPH1154367A JPH1154367A JP9204708A JP20470897A JPH1154367A JP H1154367 A JPH1154367 A JP H1154367A JP 9204708 A JP9204708 A JP 9204708A JP 20470897 A JP20470897 A JP 20470897A JP H1154367 A JPH1154367 A JP H1154367A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- chip
- shaped electronic
- electrode
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 95
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 239000003990 capacitor Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000003825 pressing Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000004070 electrodeposition Methods 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000001151 other effect Effects 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、複数の積層コンデ
ンサ等のチップ状電子部品からなる複合電子部品及びそ
の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component comprising a plurality of chip-like electronic components such as multilayer capacitors and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】従来、例えば積層コンデンサ等のチップ
状電子部品は、端子電極をその両端部に設けており、こ
のチップ状電子部品を回路基板上に実装する際には、端
子電極を回路基板表面に設けられたランド上に搭載し半
田リフローすることにより実装していた。2. Description of the Related Art Conventionally, for example, a chip-shaped electronic component such as a multilayer capacitor has terminal electrodes provided at both ends thereof. When mounting the chip-shaped electronic component on a circuit board, the terminal electrodes are connected to the circuit board. They were mounted on lands provided on the surface and mounted by reflow soldering.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、このチ
ップ状電子部品を回路基板上に実装する際には、端子電
極の周囲に半田フィレットが形成されるため、複数のチ
ップ状電子部品を実装する場合には、半田による端子電
極間のショートを防止するために、各電子部品の間隔を
大きくとる必要があり実装密度を向上させることが困難
であった。However, when this chip-shaped electronic component is mounted on a circuit board, a solder fillet is formed around the terminal electrode. In order to prevent short-circuiting between terminal electrodes due to soldering, it is necessary to increase the interval between electronic components, and it has been difficult to improve the mounting density.
【０００４】また、実装密度を向上させるために、電子
部品内部の電極パターン等を抵抗，コンデンサ，インダ
クタ等複数の機能を備えるように構成することにより、
電子部品についての実装密度を向上させたコンデンサア
レイ，チップ抵抗器ネットワーク等の複合電子部品が考
えられている。しかし、この複合電子部品は、内蔵する
部品種別やその性能等に応じて電極パターンを印刷した
グリーンシートを乾燥，積層，圧着，脱バインダ，焼成
させるという工程を経て製造されているため、各種市場
の要求に対応するには、その要求ごとに設計製造する必
要があることからコストが高いものとなり、さらに、設
計変更に対応するのも困難であった。Further, in order to improve the mounting density, an electrode pattern or the like inside an electronic component is configured to have a plurality of functions such as a resistor, a capacitor, and an inductor.
Composite electronic components, such as a capacitor array and a chip resistor network, in which the mounting density of electronic components has been improved have been considered. However, this composite electronic component is manufactured through a process of drying, laminating, pressing, debinding, and firing a green sheet on which an electrode pattern is printed in accordance with the type of component to be incorporated and its performance. In order to meet the demands, it is necessary to design and manufacture each of the demands, so that the cost is high, and it is also difficult to respond to design changes.
【０００５】本発明は、上記事情に鑑みてなされたもの
であり、その目的とするところは、実装密度が向上する
とともに多様な製品を安価に製造することができる複合
電子部品及びその製造方法並びにチップ状電子部品を提
供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a composite electronic component capable of increasing the mounting density and manufacturing various products at low cost, a method of manufacturing the same, and a method of manufacturing the same. It is to provide a chip-shaped electronic component.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するため
に、請求項１の発明は、端子電極を備える複数のチップ
状電子部品と、これらチップ状電子部品を一体に保持す
る保持部材からなり、その底面を回路基板に対向して搭
載する複合電子部品において、前記チップ状電子部品
は、その一表面のみに端子電極を備え、前記保持部材
は、複合電子部品の底面における所定間隔の格子の交点
上に前記端子電極が配置されるようにチップ状電子部品
を一体に保持していることを特徴とする。According to a first aspect of the present invention, there is provided a semiconductor device comprising: a plurality of chip-shaped electronic components having terminal electrodes; and a holding member for integrally holding the chip-shaped electronic components. A composite electronic component having a bottom surface opposed to a circuit board, wherein the chip-shaped electronic component includes a terminal electrode only on one surface thereof, and the holding member has a grid formed at a predetermined interval on the bottom surface of the composite electronic component. A chip-shaped electronic component is integrally held so that the terminal electrode is arranged on the intersection.
【０００７】この発明によれば、複合電子部品の底面
は、チップ状電子部品の端子電極が所定間隔の格子の交
点上に配置されたものとなる。According to the present invention, on the bottom surface of the composite electronic component, the terminal electrodes of the chip-shaped electronic component are arranged on the intersections of the lattice at predetermined intervals.
【０００８】また、請求項２の発明は、端子電極を備え
る複数のチップ状電子部品と、これらチップ状電子部品
を一体に保持する保持部材からなり、その底面を回路基
板に対向して搭載する複合電子部品において、前記チッ
プ状電子部品は、その一表面のみに端子電極を備え、前
記保持部材は、表面に第１の電極を所定間隔の格子の交
点上に配置されるように設けるとともに裏面に第１の電
極と導通接続する第２の電極を設けた基板からなり、チ
ップ状電子部品の端子電極と該端子電極に対応する第１
の電極とを導通接続して該チップ状電子部品を一体に保
持していることを特徴とする。According to a second aspect of the present invention, there are provided a plurality of chip-shaped electronic components having terminal electrodes, and a holding member for integrally holding the chip-shaped electronic components. In the composite electronic component, the chip-shaped electronic component has a terminal electrode only on one surface thereof, and the holding member has a first electrode provided on the front surface so as to be arranged on an intersection of a grid at a predetermined interval, and a back surface. And a substrate provided with a second electrode electrically connected to the first electrode, and a terminal electrode of the chip-shaped electronic component and a first electrode corresponding to the terminal electrode.
And the chip-shaped electronic component is integrally held by electrically connecting the electrodes.
【０００９】この発明によれば、複合電子部品の底面
に、所定間隔の格子の交点上に保持部材の第２の電極が
配置され、さらに、この第２の電極と導通接続する第１
の電極に、チップ状電子部品の端子電極が導通接続して
一体に保持される。According to the present invention, the second electrode of the holding member is arranged on the bottom surface of the composite electronic component at the intersection of the grid at a predetermined interval, and further, the first electrode electrically connected to the second electrode.
The terminal electrodes of the chip-shaped electronic component are conductively connected to these electrodes and are integrally held.
【００１０】さらに、請求項３の発明は、請求項１又は
請求項２記載の複合電子部品において、直方体形状のチ
ップ状電子部品の底面に前記所定間隔の整数倍の間隔を
もって端子電極を備え、前記保持部材は、該チップ状電
子部品を互いに側面又は端面を密着して一体に保持して
いることを特徴とする。Further, according to a third aspect of the present invention, in the composite electronic component according to the first or second aspect, terminal electrodes are provided on the bottom surface of the rectangular parallelepiped chip-shaped electronic component at an integer multiple of the predetermined interval. The holding member is characterized in that the chip-shaped electronic components are integrally held by closely contacting the side surfaces or end surfaces thereof.
【００１１】この発明によれば、チップ状電子部品同士
の間隔を最小限なものとすることができる。According to the present invention, the interval between the chip-shaped electronic components can be minimized.
【００１２】さらに、請求項４の発明は、端子電極を備
える複数のチップ状電子部品と、これらチップ状電子部
品を一体に保持する保持部材からなり、その底面を回路
基板に対向して搭載する複合電子部品の製造方法におい
て、一表面のみに端子電極を備えたチップ状電子部品
を、その端子電極が所定間隔の格子の交点上に配置され
るように集合させ、チップ状電子部品の上面に亘って保
持部材を付設してチップ状電子部品を一体に保持したこ
とを特徴とする。Further, the invention according to claim 4 comprises a plurality of chip-shaped electronic components having terminal electrodes and a holding member for integrally holding these chip-shaped electronic components, and the bottom surface thereof is mounted facing the circuit board. In the method of manufacturing a composite electronic component, chip-like electronic components having terminal electrodes only on one surface are assembled such that the terminal electrodes are arranged on intersections of lattices at predetermined intervals, and the chip-like electronic components are arranged on the upper surface of the chip-like electronic component. The chip-shaped electronic component is integrally held by attaching a holding member throughout.
【００１３】この発明によれば、一表面のみに端子電極
を備えたチップ状電子部品が、所定間隔の格子の交点上
に配置されるように集合され、上面に設けられた保持部
材によって一体に保持される。これにより、複合電子部
品の底面は、チップ状電子部品の端子電極が所定間隔の
格子の交点上に配置されたものとなる。According to the present invention, chip-like electronic components having terminal electrodes only on one surface are assembled so as to be arranged on intersections of grids at predetermined intervals, and are integrally formed by holding members provided on the upper surface. Will be retained. Thus, the bottom surface of the composite electronic component has the terminal electrodes of the chip-like electronic component arranged on the intersections of the lattice at predetermined intervals.
【００１４】さらに、請求項５の発明は、端子電極を備
える複数のチップ状電子部品と、これらチップ状電子部
品を一体に保持する保持部材からなり、その底面を回路
基板に対向して搭載する複合電子部品の製造方法におい
て、一表面のみに端子電極を備えたチップ状電子部品
を、その端子電極が所定間隔の格子の交点上に配置され
るように集合させ、その表面であって所定間隔の格子の
交点上に第１の電極を設けるとともに、裏面に第１の電
極と導通接続する第２の電極を設けた基板からなる保持
部材により、第１の電極と前記チップ状電子部品の端子
電極とが導通接続してチップ状電子部品を一体に保持し
たことを特徴とする。Further, the invention according to claim 5 comprises a plurality of chip-shaped electronic components having terminal electrodes, and a holding member for integrally holding these chip-shaped electronic components, and the bottom surface thereof is mounted facing the circuit board. In the method of manufacturing a composite electronic component, chip-shaped electronic components each having a terminal electrode only on one surface are assembled such that the terminal electrodes are arranged on intersections of lattices having a predetermined interval, and the surface is arranged at a predetermined interval. The first electrode and the terminal of the chip-shaped electronic component are provided by a holding member composed of a substrate having a first electrode provided on the intersection of the lattices of the first and second electrodes provided on the back surface with a second electrode electrically connected to the first electrode. The chip-shaped electronic component is integrally held by being electrically connected to the electrode.
【００１５】この発明によれば、一表面のみに端子電極
を備えたチップ状電子部品が、所定間隔の格子の交点上
に配置されるように集合される。さらに、表面に第１の
電極を所定間隔の格子の交点上に設けるとともに、裏面
に第１の電極と導通接続する第２の電極を設けた基板か
らなる保持部材により、第１の電極と前記チップ状電子
部品の端子電極とが導通接続してチップ状電子部品が一
体に保持される。これにより、複合電子部品の底面に、
所定間隔の格子の交点上に保持部材の第２の電極が配置
され、さらに、この第２の電極と導通接続する第１の電
極に、チップ状電子部品の端子電極が導通接続して一体
に保持される。According to the present invention, the chip-like electronic components having the terminal electrodes only on one surface are assembled so as to be arranged on the intersections of the lattice at predetermined intervals. Further, the first electrode and the first electrode are provided by a holding member formed of a substrate having a first electrode provided on the intersection of the grid at a predetermined interval on the front surface and a second electrode provided on the back surface to be electrically connected to the first electrode. The terminal electrodes of the chip-shaped electronic component are conductively connected, and the chip-shaped electronic component is held integrally. Thereby, on the bottom of the composite electronic component,
The second electrode of the holding member is arranged on the intersection of the lattice at a predetermined interval, and further, the terminal electrode of the chip-shaped electronic component is conductively connected to the first electrode conductively connected to the second electrode. Will be retained.
【００１６】さらに、請求項６の発明は、請求項４又は
請求項５記載の複合電子部品の製造方法において、直方
体形状のチップ状電子部品の底面に前記所定間隔の整数
倍の間隔をもって端子電極を設け、該チップ状電子部品
を互いに側面又は端面を密着して集合させたことを特徴
とする。According to a sixth aspect of the present invention, in the method for manufacturing a composite electronic component according to the fourth or fifth aspect, the terminal electrode is provided on the bottom surface of the rectangular parallelepiped chip-shaped electronic component at an interval which is an integral multiple of the predetermined interval. And the chip-shaped electronic components are assembled with their side surfaces or end surfaces in close contact with each other.
【００１７】この発明によれば、チップ状電子部品同士
の間隔を最小限にした複合電子部品を製造することがで
きる。According to the present invention, it is possible to manufacture a composite electronic component in which the interval between chip-shaped electronic components is minimized.
【００１８】さらに、請求項７の発明は、前記請求項１
乃至請求項６記載の複合電子部品を構成するチップ状電
子部品において、直方体形状のチップ状電子部品の底面
が前記所定間隔の整数倍の幅及び長さを備え、該底面を
前記所定間隔と同一長さを一辺とする複数の正方形領域
に分割した際の該正方形領域の中心位置に端子電極を設
けたことを特徴とする。Further, the invention of claim 7 is the invention according to claim 1.
7. The chip-shaped electronic component constituting the composite electronic component according to claim 6, wherein the bottom surface of the rectangular parallelepiped chip-shaped electronic component has an integral multiple of the width and the length of the predetermined interval, and the bottom surface is the same as the predetermined interval. A terminal electrode is provided at a center position of the square area when divided into a plurality of square areas each having a length of one side.
【００１９】この発明によれば、互いに側面及び端面を
密着するように集合させることにより、複合電子部品の
底面に、前記所定間隔の格子の交点上に端子電極が確実
に配置される。According to the present invention, by assembling the side and end surfaces so as to be in close contact with each other, the terminal electrodes are reliably arranged at the intersections of the lattices at the predetermined intervals on the bottom surface of the composite electronic component.
【００２０】[0020]
【発明の実施の形態】本発明の第１の実施の形態に係る
複合電子部品及びその製造方法について図１乃至図３を
参照して説明する。図１は複合電子部品の斜視図、図２
は複合電子部品を構成するチップ状電子部品の側面図、
図３は複合電子部品を構成するチップ状電子部品の底面
図であり、図において、１は複合電子部品、２はチップ
状電子部品、２ａは端子電極、３は保持基板、１０は回
路基板、１１は回路基板表面に付設されたランドであ
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A composite electronic component and a method of manufacturing the same according to a first embodiment of the present invention will be described with reference to FIGS. 1 is a perspective view of a composite electronic component, FIG.
Is a side view of a chip-shaped electronic component constituting a composite electronic component,
FIG. 3 is a bottom view of the chip-shaped electronic component constituting the composite electronic component. In the figure, reference numeral 1 denotes a composite electronic component, 2 denotes a chip-shaped electronic component, 2a denotes a terminal electrode, 3 denotes a holding substrate, 10 denotes a circuit board, Reference numeral 11 denotes a land provided on the surface of the circuit board.
【００２１】複合電子部品１は、一対の端子電極２ａを
底面に備えた１５個のチップ状電子部品２を、図１に示
すように互いに側面又は端面を密着させるように集合さ
せ、各チップ状電子部品２の上面を保持基板３によって
係る集合状態を保持したものであり、複合電子部品１の
底面には５ｘ６＝３０個の端子電極２ａが長さＬの間隔
を有する格子の交点上に配置される。端子電極２ａは、
回路基板１０への複合電子部品１の実装の際に、回路基
板１０のランド１１上に搭載可能に、端子電極２ａの先
端部が同一平面上に配置されている。ここで、長さＬ
は、例えば０．５ｍｍである。The composite electronic component 1 is formed by assembling fifteen chip-shaped electronic components 2 having a pair of terminal electrodes 2a on the bottom surface so that the side surfaces or end surfaces are in close contact with each other as shown in FIG. The upper surface of the electronic component 2 is held by the holding substrate 3 in such an assembled state, and 5 × 6 = 30 terminal electrodes 2 a are arranged on the intersection of a grid having a length L interval on the bottom surface of the composite electronic component 1. Is done. The terminal electrode 2a
At the time of mounting the composite electronic component 1 on the circuit board 10, the distal ends of the terminal electrodes 2a are arranged on the same plane so that they can be mounted on the lands 11 of the circuit board 10. Where the length L
Is 0.5 mm, for example.
【００２２】チップ状電子部品２は、図２及び図３に示
すように、例えば、高さ０．５ｍｍ、長さ１．０ｍｍ、
幅０．５ｍｍというように、幅と長さが前記長さＬの整
数倍であって、幅と長さの比が１：２となる直方体形状
をなしており、チップ状電子部品２に内蔵する抵抗素子
や内部電極等と導通する一対の外部電極２ｂを底面に備
えるとともに、この外部電極２ｂの下部に回路基板１０
のランド１１と導通接続可能な一対の端子電極２ａを備
えている。また、チップ状電子部品２を側面又は端面で
密着させても互いに導通接続しないように、前記端子電
極２ａは側面及び端面に露出しないように形成されてい
る。As shown in FIGS. 2 and 3, the chip-shaped electronic component 2 has, for example, a height of 0.5 mm, a length of 1.0 mm,
It has a rectangular parallelepiped shape having a width and length of an integral multiple of the length L and a width-to-length ratio of 1: 2, such as a width of 0.5 mm, and is embedded in the chip-shaped electronic component 2. A pair of external electrodes 2b, which are electrically connected to a resistive element, an internal electrode, and the like, provided on the bottom surface, and a circuit board 10
And a pair of terminal electrodes 2a that can be electrically connected to the land 11. Also, the terminal electrodes 2a are formed so as not to be exposed on the side surfaces and the end surfaces so that even if the chip-shaped electronic components 2 are brought into close contact with the side surfaces or the end surfaces, they are not electrically connected to each other.
【００２３】一対の端子電極２ａは、チップ状電子部品
２の長さ方向の軸上で、長さ方向を１：２：１に区切
り、両端子電極２ａの間隔が前記長さＬとなる位置に形
成された０．３ｍｍ径のバンプからなり、その材質は銀
・パラジウム合金，銅，ニッケル，金，半田あるいはこ
れらにニッケル，半田等のメッキを施したものである。The pair of terminal electrodes 2a are divided on the longitudinal axis of the chip-shaped electronic component 2 in a lengthwise direction of 1: 2: 1, and the distance between the two terminal electrodes 2a is equal to the length L. The bumps are formed of 0.3 mm diameter, and are made of silver / palladium alloy, copper, nickel, gold, solder, or plated with nickel, solder, or the like.
【００２４】保持基板３は、複数のチップ状電子部品を
一体に集合保持させるためのもので、複合電子部品１と
同じ長さ及び幅を有する厚さ０．０５〜０．３ｍｍ程度
のガラスエポキシ，ＢＴレジン，金属，セラミック等の
板状部材であり、チップ状電子部品２を集合させた状態
で接着剤３ａを用いてその上面に亘って接着固定したも
のである。この接着剤３ａとしては、例えば、粘度３０
０〜４００Ｐａ・ｓ程度の熱硬化性エポキシ接着剤や、
アクリル系，シリコーン系の高粘度接着剤が用いられ
る。尚、保持基板３として金属を用いた場合、チップ状
電子部品２に熱を放熱する放熱板としての機能を有する
ものになるため、チップ状電子部品２の発熱量が多い場
合に有効である。The holding substrate 3 is for collectively holding a plurality of chip-shaped electronic components, and has the same length and width as the composite electronic component 1 and has a thickness of about 0.05 to 0.3 mm. , BT resin, metal, ceramic, or the like, which is bonded and fixed over the upper surface of the chip-shaped electronic components 2 using an adhesive 3a in a state of being assembled. The adhesive 3a has, for example, a viscosity of 30.
A thermosetting epoxy adhesive of about 0 to 400 Pa · s,
Acrylic or silicone high viscosity adhesives are used. When a metal is used as the holding substrate 3, it has a function as a heat radiating plate for radiating heat to the chip-shaped electronic component 2, and is effective when the chip-shaped electronic component 2 generates a large amount of heat.
【００２５】ここで、本実施の形態の複合電子部品１を
構成するチップ状電子部品２としてのチップ状抵抗器２
−Ｒ，チップ状積層コンデンサ２−Ｃ，チップ状積層イ
ンダクタ２−Ｌの例を図４乃至図６の側面断面図を参照
して説明する。Here, a chip-shaped resistor 2 as a chip-shaped electronic component 2 constituting the composite electronic component 1 of the present embodiment.
-R, the chip-shaped multilayer capacitor 2-C, and the chip-shaped multilayer inductor 2-L will be described with reference to the side sectional views of FIGS.
【００２６】チップ状抵抗器２−Ｒの例としては、上面
に抵抗素子Ｒとその端部に電極２ｃ−Ｒを備え、この電
極２ｃ−ＲをスルーホールＨで底面の外部電極２ｂ−Ｒ
と接続するもの（図４（ａ）参照）、上面に抵抗素子Ｒ
を備えるとともに、この抵抗素子Ｒの端部からチップ状
抵抗器２−Ｒの端面及び底面に亘って外部電極２ｂ−Ｒ
を形成したのちに、端面における外部電極２ｂ−Ｒを絶
縁層Ｚ−Ｒで覆ったもの（図４（ｂ）参照）、底面に設
けた絶縁層Ｚ−Ｒの上側に抵抗素子Ｒを設け、この抵抗
素子Ｒの端部から絶縁層Ｚ−Ｒの底面に亘って外部電極
２ｂ−Ｒを設けたもの（図４（ｃ）参照）等が挙げられ
る。As an example of the chip-shaped resistor 2-R, a resistance element R is provided on the upper surface and an electrode 2c-R is provided at an end thereof, and this electrode 2c-R is connected to the external electrode 2b-R on the bottom by a through hole H.
(See FIG. 4A), and a resistor R
And external electrodes 2b-R extending from the end of the resistance element R to the end face and the bottom face of the chip resistor 2-R.
Is formed, the external electrodes 2b-R on the end faces are covered with an insulating layer ZR (see FIG. 4B), and a resistance element R is provided above the insulating layer ZR provided on the bottom surface. One in which an external electrode 2b-R is provided from the end of the resistance element R to the bottom surface of the insulating layer ZR (see FIG. 4C) is exemplified.
【００２７】また、チップ状積層コンデンサ２−Ｃの例
としては、底面にその引出部Ｐａ−Ｃが露出するような
内部電極Ｐ−Ｃを横方向に積層し、底面に内部電極Ｐ−
Ｃの引出部Ｐａ−Ｃと導通接続する外部電極２ｂ−Ｃを
形成したもの（図５（ａ）参照）、端面にその引出部Ｐ
ａ−Ｃが露出するような内部電極Ｐ−Ｃを横方向に積層
し、このチップ状積層コンデンサ２−Ｃの端面に引出部
Ｐａ−Ｃと導通接続する外部電極２ｂ−Ｃを設けたのち
に、端面における外部電極２ｂ−Ｃを絶縁層Ｚ−Ｃで覆
ったもの（図５（ｂ）参照）等が挙げられる。Further, as an example of the chip-shaped multilayer capacitor 2-C, an internal electrode PC such that the lead-out portion Pa-C is exposed is laterally laminated on the bottom surface, and the internal electrode PC-
An external electrode 2b-C electrically connected to the lead-out portion Pa-C of C is formed (see FIG. 5A), and the lead-out portion P is formed on the end face.
After laminating the internal electrodes PC such that aC is exposed in the lateral direction, and providing the external electrodes 2b-C that are electrically connected to the lead portions Pa-C on the end faces of the chip-shaped multilayer capacitor 2-C. And an external electrode 2b-C on the end face covered with an insulating layer ZC (see FIG. 5B).
【００２８】さらに、チップ状積層インダクタ２−Ｌの
例としては、チップ状積層コンデンサ２−Ｃの例と同様
に、底面にその引出部Ｐａ−Ｌが露出するような内部電
極ＰーＬを横方向に積層し、その引出部Ｐａ−Ｌと導通
接続する外部電極２ｂを形成したもの（図６（ａ）参
照）、端面にその引出部Ｐａ−Ｃが露出するような内部
電極Ｐ−Ｌを横方向に積層し、このチップ状積層インダ
クタ２−Ｌの端面に引出部Ｐａ−Ｌと導通接続する外部
電極２ｂ−Ｌを設けたのちに、端面における外部電極２
ｂ−Ｃを絶縁層Ｚ−Ｃで覆ったもの（図６（ｂ）参照）
等が挙げられる。Further, as an example of the chip-shaped multilayer inductor 2-L, similar to the example of the chip-shaped multilayer capacitor 2-C, the internal electrode PL whose lateral portion Pa-L is exposed on the bottom surface is horizontally arranged. (See FIG. 6 (a)), and an internal electrode PL such that the lead Pa-C is exposed on the end face. After the external electrodes 2b-L that are stacked in the lateral direction and are electrically connected to the lead portions Pa-L on the end faces of the chip-shaped laminated inductor 2-L, the external electrodes 2b on the end faces are provided.
bC covered with an insulating layer ZC (see FIG. 6B)
And the like.
【００２９】次に、本実施の形態の複合電子部品１の製
造方法について図７乃至図８を参照して説明する。Next, a method of manufacturing the composite electronic component 1 according to the present embodiment will be described with reference to FIGS.
【００３０】まず、チップ状電子部品２よりわずかに高
いＬ字状の固定支持部材３０であって、Ｌ字の内側面の
長さが少なくとも複合電子部品１の幅及び長さ以上であ
るものを平面上に配置し、この固定支持部材３０のＬ字
の内側に１５個のチップ状電子部品２を端子電極２ａを
下にして配置する。ここで、チップ状電子部品２は、そ
の長さ方向又は幅方向を固定支持部材３０のＬ字の内側
面に対して平行となるとともに、複合電子部品１の底面
に端子電極２ａが５ｘ６の格子状になるように配置する
（図７（ａ））。First, an L-shaped fixed support member 30 slightly higher than the chip-shaped electronic component 2 and having an L-shaped inner surface having a length at least equal to or greater than the width and length of the composite electronic component 1 is assumed. The fifteen chip-shaped electronic components 2 are arranged on a flat surface inside the L-shape of the fixed support member 30 with the terminal electrodes 2a facing down. Here, the chip-shaped electronic component 2 has its length direction or width direction parallel to the L-shaped inner surface of the fixed support member 30, and the terminal electrode 2 a has a 5 × 6 grid on the bottom surface of the composite electronic component 1. (FIG. 7A).
【００３１】次に、複合電子部品１の幅及び長さと同程
度の長さを有するとともに固定支持部材３０と同じ高さ
を有する直方体形状の可動押圧部材３１ａ及び３１ｂ
を、チップ状電子部品２を挟んで固定支持部材３０のＬ
字の内側面に対向するように配置し、この可動押圧部材
３１ａ及び３１ｂを固定支持部材３０方向に移動させて
チップ状電子部品２を互いに側面及び端面で密着して集
合させる（図７（ｂ）参照）。ここでチップ状電子部品
２は複合電子部品１の幅及び長さが５：６の比となるよ
うに密着集合させる。Next, rectangular parallelepiped movable pressing members 31a and 31b having a length substantially equal to the width and length of the composite electronic component 1 and having the same height as the fixed support member 30.
Of the fixed support member 30 with the chip-shaped electronic component 2 interposed therebetween.
The movable pressing members 31a and 31b are moved in the direction of the fixed support member 30 so that the chip-shaped electronic components 2 are brought into close contact with each other at the side surfaces and the end surfaces to be assembled (FIG. 7 (b)). )reference). Here, the chip-shaped electronic components 2 are closely assembled so that the width and the length of the composite electronic component 1 have a ratio of 5: 6.
【００３２】最後に、図８に示すように、固定支持部材
３０と可動押圧部材３１ａ及び３１ｂによってチップ状
電子部品２を密着集合した状態で、その表面に接着剤３
ａを塗布した保持基板３をチップ状電子部品２の上面に
貼り付けて複合電子部品１が製造される。Finally, as shown in FIG. 8, the chip-like electronic component 2 is tightly assembled by the fixed support member 30 and the movable pressing members 31a and 31b, and the adhesive 3
The composite electronic component 1 is manufactured by attaching the holding substrate 3 coated with a to the upper surface of the chip-shaped electronic component 2.
【００３３】この複合電子部品１によれば、各チップ状
電子部品２が互いに間隙なく密着して一体に保持されて
いるので、実装密度の高いものとなり、また、複数のチ
ップ状電子部品を一度に回路基板１０に搭載することが
できるので実装コストを低減することができる。また、
端子電極２ａが複合電子部品１の底面に所定間隔で格子
状に露出しているので、ＣＳＰやＢＧＡ等の半導体パッ
ケージと同様に取扱いが可能となり、回路基板１０の設
計等が容易となり、また、実装コストを低減することが
できる。さらに、チップ状電子部品２として種々の定数
の抵抗，コンデンサ，インダクタ等を混在させることが
できるので、複合電子部品１及び回路基板１０の設計が
容易であり、かつ、設計変更にも容易かつ安価に対応す
ることができる。According to the composite electronic component 1, the chip-shaped electronic components 2 are held in close contact with each other without any gap, so that the mounting density is high, and a plurality of chip-shaped electronic components can be used once. Since it can be mounted on the circuit board 10, the mounting cost can be reduced. Also,
Since the terminal electrodes 2a are exposed in a lattice pattern at predetermined intervals on the bottom surface of the composite electronic component 1, it can be handled in the same manner as a semiconductor package such as a CSP or a BGA, and the design of the circuit board 10 becomes easy. The mounting cost can be reduced. Further, since various constant resistors, capacitors, inductors, and the like can be mixed as the chip-shaped electronic component 2, the design of the composite electronic component 1 and the circuit board 10 is easy, and the design change is easy and inexpensive. Can be handled.
【００３４】尚、本実施の形態では、複合電子部品１と
回路基板１０とをバンプからなる端子電極２ａを用いる
ことにより導通接続したが、図９に示すように、これを
用いず外部電極２ｂのみを用いても良い。In the present embodiment, the composite electronic component 1 and the circuit board 10 are electrically connected by using the terminal electrodes 2a made of bumps. However, as shown in FIG. Only one may be used.
【００３５】また、本実施の形態では、チップ状電子部
品２は全て同一寸法のものを用いたが、いろいろな寸法
のチップ状電子部品が混在しても、そのバラツキが幅方
向又は長さ方向である場合は、図１０に示すように、チ
ップ状電子部品２とスペーサー４を混在させて密着集合
させ、高さが異なるチップ状電子部品が混在する場合
は、図１１に示すように、保持基板３に塗布する接着剤
３ａの量を多めにして隙間を充填させることによって、
種々の寸法のチップ状電子部品２を用いることができ
る。また、図１０に示すように、スペーサー４によって
複合電子部品１のチップ状電子部品２の個数を調整する
こともできる。In this embodiment, the chip-shaped electronic components 2 all have the same dimensions. However, even if the chip-shaped electronic components of various dimensions are mixed, the variation is in the width direction or the length direction. In the case of, as shown in FIG. 10, the chip-shaped electronic components 2 and the spacers 4 are mixed and closely assembled, and when the chip-shaped electronic components with different heights are mixed, as shown in FIG. By increasing the amount of the adhesive 3a applied to the substrate 3 to fill the gap,
Chip-shaped electronic components 2 of various dimensions can be used. Further, as shown in FIG. 10, the number of chip-shaped electronic components 2 of the composite electronic component 1 can be adjusted by the spacer 4.
【００３６】さらに、保持基板３をチップ状電子部品２
に接着する接着剤３ａとして、発泡剥離性の接着剤を用
いることにより、複合電子部品１を回路基板１０に搭載
しボンディング等によって実装する際の熱を用いて、回
路基板１０への実装後に保持基板３をチップ状電子部品
２から剥離しても良い。この場合、回路基板１０に実装
する部品高さに制限があるときに特に有効である。Further, the holding substrate 3 is connected to the chip-like electronic component 2.
The composite electronic component 1 is held on the circuit board 10 after mounting on the circuit board 10 by using heat generated when the composite electronic component 1 is mounted on the circuit board 10 and mounted by bonding, etc. The substrate 3 may be peeled from the chip-shaped electronic component 2. This is particularly effective when there is a limit on the height of components mounted on the circuit board 10.
【００３７】さらに、本実施の形態では、チップ状電子
部品２を保持基板３により保持しているが、図１２
（ａ）に示すように、この保持基板３を用いず、前述し
た高粘度の接着剤３ａをチップ状電子部品２の上にのせ
スキージ３２によって余分な接着剤３ａを除去し、これ
を乾燥硬化させることによって図１２（ｂ）に示す複合
電子部品１を製造することもできる。Further, in the present embodiment, the chip-shaped electronic component 2 is held by the holding substrate 3, but FIG.
As shown in FIG. 3A, the above-mentioned high-viscosity adhesive 3a is placed on the chip-shaped electronic component 2 without using the holding substrate 3, and the excess adhesive 3a is removed by a squeegee 32, and this is dried and cured. By doing so, the composite electronic component 1 shown in FIG. 12B can also be manufactured.
【００３８】さらに、本実施の形態では、チップ状電子
部品２を端面及び側面で密着集合させる方法として、固
定支持部材３０並びに可動押圧部材３１ａ及び３１ｂを
用いたが（図７参照）、以下に示す方法によってもチッ
プ状電子部品２を端子電極２ａが格子状に配置されるよ
うに集合させることができる。すなわち、図１３に示す
ように、格子状に配置された電極位置規制孔４１を設け
た電極位置規制部材４０を用いて、該電極位置規制孔４
１にチップ状電子部品２の端子電極２ａが保持されるよ
うにチップ状電子部品２を配置し、その後に、上面に保
持基板３を付設するものである。この方法によれば、チ
ップ状電子部品２の寸法にバラツキがある場合であって
も、端子電極２ａを精度良く格子状に配置することがで
きる。Further, in the present embodiment, the fixed support member 30 and the movable pressing members 31a and 31b are used as a method of bringing the chip-shaped electronic component 2 into close contact at the end face and side face (see FIG. 7). The chip-shaped electronic components 2 can also be assembled such that the terminal electrodes 2a are arranged in a lattice by the method shown. That is, as shown in FIG. 13, the electrode position regulating holes 4 are formed by using an electrode position regulating member 40 having electrode position regulating holes 41 arranged in a lattice.
1, the chip-shaped electronic component 2 is arranged so that the terminal electrodes 2a of the chip-shaped electronic component 2 are held, and thereafter, a holding substrate 3 is attached to the upper surface. According to this method, even when the dimensions of the chip-shaped electronic component 2 vary, the terminal electrodes 2a can be accurately arranged in a lattice.
【００３９】次に、第２の実施の形態に係る複合電子部
品及びその製造方法について図１４及び図１５を参照し
て説明する。図において、２１は複合電子部品、２２は
チップ状電子部品、２２ａは端子電極、２２ｂは外部電
極、２３は保持基板、２３ａは第１の電極、２３ｂは第
２の電極、２３ｃは接続用電極である。Next, a composite electronic component and a method of manufacturing the same according to the second embodiment will be described with reference to FIGS. In the figure, 21 is a composite electronic component, 22 is a chip-shaped electronic component, 22a is a terminal electrode, 22b is an external electrode, 23 is a holding substrate, 23a is a first electrode, 23b is a second electrode, and 23c is a connection electrode. It is.
【００４０】本実施の形態に係る複合電子部品２１が第
１の実施の形態に係る複合電子部品１と相違するところ
は、チップ状電子部品２２の端子電極２２ａがある側に
保持基板２３を設け、この保持基板２３によってチップ
状電子部品２２を密着集合させた状態で一体に保持する
とともに、保持基板３０の裏面に設けられた第２の電極
２３ｂを複合電子部品１の電極としたことにある。The composite electronic component 21 according to the present embodiment is different from the composite electronic component 1 according to the first embodiment in that a holding substrate 23 is provided on the side of the chip-shaped electronic component 22 where the terminal electrode 22a is located. That is, the chip-shaped electronic component 22 is integrally held by the holding substrate 23 in a state where the chip-shaped electronic component 22 is brought into close contact with each other, and the second electrode 23 b provided on the back surface of the holding substrate 30 is used as an electrode of the composite electronic component 1. .
【００４１】この複合電子部品２１について、その製造
方法をもって説明すると、まず、第１の実施の形態と同
様に固定支持部材３０並びに可動押圧部材３１ａ及び３
１ｂを用いてチップ状電子部品２２を密着集合させる
が、ここでは端子電極２２ａを上に向けて密着集合させ
る。尚、ここでチップ状電子部品２２は第１の実施の形
態で用いられるものと同様である。The composite electronic component 21 will be described in terms of its manufacturing method. First, similarly to the first embodiment, the fixed support member 30 and the movable pressing members 31a and 31a are used.
The chip-shaped electronic components 22 are tightly assembled using 1b, but here, the terminal electrodes 22a are closely assembled with the terminal electrodes 22a facing upward. Here, the chip-shaped electronic component 22 is the same as that used in the first embodiment.
【００４２】次に、片面に０．５ｍｍ間隔で第１の電極
２３ａを設けるとともに、接続用電極２３ｃ及びスルー
ホールを介して第１の電極２３ａと導通接続する第２の
電極２３ｂを反対面に設けた保持基板２３を、チップ状
電子部品２２の端子電極２２ａと保持基板２３の第１の
電極２３ａが導通するように圧着接続させる。この接続
によりチップ状電子部品２２と保持基板２３は端子電極
２２ａ′で導通接続されることになる。Next, the first electrodes 23a are provided on one surface at an interval of 0.5 mm, and the second electrodes 23b electrically connected to the first electrodes 23a through the connection electrodes 23c and the through holes are provided on the opposite surface. The provided holding substrate 23 is crimp-connected so that the terminal electrode 22a of the chip-shaped electronic component 22 and the first electrode 23a of the holding substrate 23 conduct. With this connection, the chip-shaped electronic component 22 and the holding substrate 23 are electrically connected by the terminal electrode 22a '.
【００４３】これにより、図１５に示すように、チップ
状電子部品２２は保持基板２３の第１の端子電極２３ａ
と端子電極２２ａ′を介して導通接続しながら一体に保
持され、保持基板２３の第１の電極２３ａと導通接続す
る第２の電極２３ｂがこの複合電子部品２１の底面であ
って所定間隔の格子の交点上に露出することになる。Thus, as shown in FIG. 15, the chip-shaped electronic component 22 is connected to the first terminal electrode 23a of the holding substrate 23.
The second electrode 23b, which is conductively connected to the first electrode 23a of the holding substrate 23 via the terminal electrode 22a 'and is electrically connected to the first electrode 23a of the holding substrate 23, is a bottom surface of the composite electronic component 21 and has a predetermined spacing. Will be exposed on the intersection of
【００４４】この複合電子部品２１によれば、チップ状
電子部品２２の寸法にバラツキがあっても、このバラツ
キを保持基板２３によって吸収され、複合電子部品２１
の底面に露出する第２の電極２３ｂを精度良く同一平面
上であって所定間隔の格子の交点上に配置することがで
きる。その他の作用，効果は第１の実施の形態に係る複
合電子部品１と同様である。According to the composite electronic component 21, even if the dimensions of the chip-shaped electronic component 22 vary, the variation is absorbed by the holding substrate 23 and the composite electronic component 21
Of the second electrode 23b exposed on the bottom surface can be accurately arranged on the same plane and at the intersections of grids at predetermined intervals. Other operations and effects are the same as those of the composite electronic component 1 according to the first embodiment.
【００４５】尚、図１６に示すように、第１の実施の形
態に係る複合電子部品１と同様にして、チップ状電子部
品２２の上面に保持部材を設けたものに、本実施の形態
で用いた保持基板２３を付設しても良い。この場合、複
合電子部品２１は密着強度がさらに向上したものとな
る。As shown in FIG. 16, in the same manner as the composite electronic component 1 according to the first embodiment, in the present embodiment, a chip-shaped electronic component 22 provided with a holding member on the upper surface is provided. The used holding substrate 23 may be provided. In this case, the composite electronic component 21 has further improved adhesion strength.
【００４６】[0046]
【発明の効果】以上詳述したように、請求項１の発明に
よれば、チップ状電子部品の端子電極が一表面のみに設
けられており、その端子電極が複合電子部品の底面に配
置されるように一体に保持されているので、これらチッ
プ状電子部品同士の間隔を小さくして実装密度を向上す
ることができる。また、複数のチップ状電子部品を一度
に回路基板に搭載することができるので実装コストを低
減することができる。さらに、端子電極が複合電子部品
の底面における所定間隔の格子の交点上に配置されるこ
とから、ＣＳＰやＢＧＡ等の半導体パッケージと同様に
取扱いが可能となり、回路基板の設計等が容易となり、
また、実装コストを低減することができる。さらに、チ
ップ状電子部品として種々の定数の抵抗，コンデンサ，
インダクタ等を混在させることができるので、複合電子
部品及び回路基板の設計が容易であり、かつ、設計変更
にも容易かつ安価に対応することができる。As described above in detail, according to the first aspect of the present invention, the terminal electrodes of the chip-shaped electronic component are provided only on one surface, and the terminal electrodes are arranged on the bottom surface of the composite electronic component. As a result, the space between these chip-shaped electronic components can be reduced, and the mounting density can be improved. Further, since a plurality of chip-shaped electronic components can be mounted on the circuit board at one time, the mounting cost can be reduced. Further, since the terminal electrodes are arranged on the intersections of the grids at predetermined intervals on the bottom surface of the composite electronic component, it can be handled in the same manner as a semiconductor package such as CSP or BGA, and the design of the circuit board becomes easy,
Further, mounting cost can be reduced. Furthermore, various constant resistors, capacitors,
Since the inductors and the like can be mixed, the design of the composite electronic component and the circuit board is easy, and the design change can be easily and inexpensively dealt with.
【００４７】また、請求項２の発明によれば、チップ状
電子部品の端子電極が、保持部材表面に設けられた第１
の電極と導通接続して一体に保持され、さらに第１の電
極と導通接続する第２の電極が保持部材の裏面であって
所定間隔の格子の交点上に設けられているので、チップ
状電子部品の寸法に影響を受けず、複合電子部品の底面
に第２の電極を精度良く配置することができる。その他
の効果は請求項１記載の発明と同様である。According to the second aspect of the present invention, the terminal electrodes of the chip-shaped electronic component are provided on the first surface of the holding member.
Since the second electrode electrically connected to the first electrode is electrically connected to the first electrode and the second electrode electrically connected to the first electrode, the second electrode is provided on the back surface of the holding member at the intersection of the grid at a predetermined interval. The second electrode can be accurately arranged on the bottom surface of the composite electronic component without being affected by the dimensions of the component. Other effects are the same as those of the first aspect.
【００４８】さらに、請求項３記載の発明によれば、チ
ップ状電子部品が底面に所定間隔をもって配置された端
子電極を備えた直方体形状のもので、その側面又は端面
を密着して一体に保持されているので、複合電子部品は
実装密度が向上したものとなる。その他の効果は、請求
項１及び請求項２の発明と同様である。Further, according to the third aspect of the present invention, the chip-shaped electronic component has a rectangular parallelepiped shape having terminal electrodes arranged at predetermined intervals on the bottom surface, and the side surface or the end surface of the chip-shaped electronic component is held tightly together. Therefore, the composite electronic component has an improved mounting density. Other effects are the same as those of the first and second aspects of the invention.
【００４９】さらに、請求項４乃至請求項６の発明によ
れば、請求項１乃至請求項３記載の発明に係る複合電子
部品を容易かつ確実に製造することができる。Further, according to the invention of claims 4 to 6, the composite electronic component according to the invention of claims 1 to 3 can be easily and reliably manufactured.
【００５０】さらに、請求項７の発明によれば、互いに
側面及び端面を密着するように集合させることにより、
複合電子部品の底面における前記所定間隔の格子の交点
上に端子電極が確実に配置される。これにより請求項１
乃至請求項６記載の複合電子部品を容易に製造すること
ができる。Further, according to the invention of claim 7, by assembling such that the side surfaces and the end surfaces are in close contact with each other,
Terminal electrodes are reliably arranged on intersections of the grids at the predetermined intervals on the bottom surface of the composite electronic component. Thereby, claim 1
Further, the composite electronic component according to the sixth aspect can be easily manufactured.
【図１】第１の実施の形態に係る複合電子部品の斜視図FIG. 1 is a perspective view of a composite electronic component according to a first embodiment.
【図２】複合電子部品を構成するチップ状電子部品の外
観側面図FIG. 2 is an external side view of a chip-shaped electronic component constituting the composite electronic component.
【図３】複合電子部品を構成するチップ状電子部品の外
観底面図FIG. 3 is an external bottom view of a chip-shaped electronic component constituting the composite electronic component.
【図４】複合電子部品を構成するチップ状抵抗器の側面
断面図FIG. 4 is a side cross-sectional view of a chip-shaped resistor constituting a composite electronic component.
【図５】複合電子部品を構成するチップ状積層コンデン
サの側面断面図FIG. 5 is a side cross-sectional view of a chip-shaped multilayer capacitor constituting a composite electronic component.
【図６】複合電子部品を構成するチップ状積層インダク
タの側面断面図FIG. 6 is a side cross-sectional view of a chip-shaped multilayer inductor constituting a composite electronic component.
【図７】第１の実施の形態に係る複合電子部品の製造手
順を説明する図FIG. 7 is a view for explaining a manufacturing procedure of the composite electronic component according to the first embodiment;
【図８】第１の実施の形態に係る複合電子部品の製造手
順を説明する図FIG. 8 is a view for explaining a manufacturing procedure of the composite electronic component according to the first embodiment;
【図９】複合電子部品構成するチップ状電子部品の外観
側面図及び底面図FIG. 9 is a side view and a bottom view of an external appearance of a chip-shaped electronic component constituting a composite electronic component.
【図１０】第１の実施の形態に係る複合電子部品の他の
製造手順を説明する図FIG. 10 is a view for explaining another manufacturing procedure of the composite electronic component according to the first embodiment.
【図１１】第１の実施の形態に係る他の複合電子部品FIG. 11 is another composite electronic component according to the first embodiment.
【図１２】第１の実施の形態に係る複合電子部品の他の
製造手順を説明する図FIG. 12 is a view for explaining another manufacturing procedure of the composite electronic component according to the first embodiment.
【図１３】第１の実施の形態に係る複合電子部品の他の
製造手順を説明する図FIG. 13 is a view for explaining another manufacturing procedure of the composite electronic component according to the first embodiment.
【図１４】第２の実施の形態に係る複合電子部品の製造
手順を説明する図FIG. 14 is a view for explaining a manufacturing procedure of the composite electronic component according to the second embodiment.
【図１５】第２の実施の形態に係る複合電子部品の側面
断面図FIG. 15 is a side sectional view of the composite electronic component according to the second embodiment;
【図１６】第２の実施の形態に係る他の複合電子部品の
側面断面図FIG. 16 is a side sectional view of another composite electronic component according to the second embodiment.
１…複合電子部品、２…チップ状電子部品、２ａ…端子
電極、３…保持基板、３ａ…接着剤、１０…回路基板、
１１…ランド、２１…複合電子部品、２２…チップ状電
子部品、２２ａ…端子電極、２３…保持基板、２３ａ…
第１の電極、２３ｂ…第２の電極、３０…固定支持部
材、３１…可動押圧部材、４０…電極位置規制部材。DESCRIPTION OF SYMBOLS 1 ... Composite electronic component, 2 ... Chip-shaped electronic component, 2a ... Terminal electrode, 3 ... Holding board, 3a ... Adhesive, 10 ... Circuit board,
11 land, 21 composite electronic component, 22 chip electronic component, 22a terminal electrode, 23 holding substrate, 23a
1st electrode, 23b ... 2nd electrode, 30 ... fixed support member, 31 ... movable pressing member, 40 ... electrode position regulating member.
Claims (7)
品と、これらチップ状電子部品を一体に保持する保持部
材からなり、その底面を回路基板に対向して搭載する複
合電子部品において、 前記チップ状電子部品は、その一表面のみに端子電極を
備え、 前記保持部材は、複合電子部品の底面における所定間隔
の格子の交点上に前記端子電極が配置されるようにチッ
プ状電子部品を一体に保持していることを特徴とする複
合電子部品。1. A composite electronic component comprising a plurality of chip-shaped electronic components provided with terminal electrodes and a holding member for integrally holding these chip-shaped electronic components, wherein a bottom surface thereof is mounted to face a circuit board. The electronic component is provided with terminal electrodes only on one surface thereof, and the holding member integrally integrates the chip-shaped electronic component such that the terminal electrodes are arranged on intersections of grids at predetermined intervals on the bottom surface of the composite electronic component. A composite electronic component characterized by being held.
品と、これらチップ状電子部品を一体に保持する保持部
材からなり、その底面を回路基板に対向して搭載する複
合電子部品において、 前記チップ状電子部品は、その一表面のみに端子電極を
備え、 前記保持部材は、表面に第１の電極を所定間隔の格子の
交点上に配置されるように設けるとともに裏面に第１の
電極と導通接続する第２の電極を設けた基板からなり、
チップ状電子部品の端子電極と該端子電極に対応する第
１の電極とを導通接続して該チップ状電子部品を一体に
保持していることを特徴とする複合電子部品。2. A composite electronic component comprising: a plurality of chip-shaped electronic components having terminal electrodes; and a holding member for integrally holding the chip-shaped electronic components, wherein a bottom surface thereof is mounted to face a circuit board. The electronic component is provided with terminal electrodes only on one surface thereof, and the holding member is provided with first electrodes on the front surface so as to be arranged on intersections of lattices at predetermined intervals, and is electrically connected to the first electrodes on the back surface. A substrate provided with a second electrode to be connected;
A composite electronic component, wherein a terminal electrode of the chip-shaped electronic component and a first electrode corresponding to the terminal electrode are electrically connected to hold the chip-shaped electronic component integrally.
前記所定間隔の整数倍の間隔をもって端子電極を備え、 前記保持部材は、該チップ状電子部品を互いに側面又は
端面を密着して一体に保持していることを特徴とする請
求項１又は請求項２記載の複合電子部品。3. A chip-shaped electronic component having a rectangular parallelepiped shape and terminal electrodes provided on the bottom surface at an integer multiple of the predetermined interval, wherein the holding member integrally contacts the chip-shaped electronic component with its side surfaces or end surfaces in close contact with each other. The composite electronic component according to claim 1, wherein the composite electronic component is held.
品と、これらチップ状電子部品を一体に保持する保持部
材からなり、その底面を回路基板に対向して搭載する複
合電子部品の製造方法において、 一表面のみに端子電極を備えたチップ状電子部品を、そ
の端子電極が所定間隔の格子の交点上に配置されるよう
に集合させ、 チップ状電子部品の上面に亘って保持部材を付設してチ
ップ状電子部品を一体に保持したことを特徴とする複合
電子部品の製造方法。4. A composite electronic component manufacturing method comprising: a plurality of chip-shaped electronic components having terminal electrodes; and a holding member for integrally holding the chip-shaped electronic components, wherein a bottom surface thereof is mounted to face a circuit board. A chip-like electronic component having terminal electrodes only on one surface is assembled so that the terminal electrodes are arranged on intersections of a grid at predetermined intervals, and a holding member is provided over the upper surface of the chip-like electronic component. A method of manufacturing a composite electronic component, wherein a chip-shaped electronic component is integrally held by using the same.
品と、これらチップ状電子部品を一体に保持する保持部
材からなり、その底面を回路基板に対向して搭載する複
合電子部品の製造方法において、 一表面のみに端子電極を備えたチップ状電子部品を、そ
の端子電極が所定間隔の格子の交点上に配置されるよう
に集合させ、 その表面であって所定間隔の格子の交点上に第１の電極
を設けるとともに、裏面に第１の電極と導通接続する第
２の電極を設けた基板からなる保持部材により、第１の
電極と前記チップ状電子部品の端子電極とが導通接続し
てチップ状電子部品を一体に保持したことを特徴とする
複合電子部品の製造方法。5. A method of manufacturing a composite electronic component, comprising: a plurality of chip-shaped electronic components having terminal electrodes; and a holding member for holding the chip-shaped electronic components integrally, the bottom surface of which is mounted to face a circuit board. A chip-shaped electronic component provided with terminal electrodes only on one surface is assembled so that the terminal electrodes are arranged on intersections of grids at a predetermined interval, and a chip-like electronic component is placed on the intersection of grids at a predetermined interval on the surface. A first electrode and a terminal electrode of the chip-shaped electronic component are electrically connected by a holding member formed of a substrate provided with a first electrode and a second electrode provided on the back surface and electrically connected to the first electrode. A method for manufacturing a composite electronic component, wherein a chip-shaped electronic component is integrally held.
前記所定間隔の整数倍の間隔をもって端子電極を設け、 該チップ状電子部品を互いに側面又は端面を密着して集
合させたことを特徴とする請求項４又は請求項５記載の
複合電子部品の製造方法。6. A chip-shaped electronic component having a rectangular parallelepiped shape, wherein terminal electrodes are provided on the bottom surface of the chip-shaped electronic component at intervals of an integral multiple of the predetermined interval, and the chip-shaped electronic components are assembled with their side faces or end faces in close contact with each other. The method for manufacturing a composite electronic component according to claim 4.
子部品を構成するチップ状電子部品において、 直方体形状のチップ状電子部品の底面が前記所定間隔の
整数倍の幅及び長さを備え、 該底面を前記所定間隔と同一長さを一辺とする複数の正
方形領域に分割した際の該正方形領域の中心位置に端子
電極を設けたことを特徴とするチップ状電子部品。7. The chip-shaped electronic component constituting the composite electronic component according to claim 1, wherein a bottom surface of the rectangular parallelepiped chip-shaped electronic component has a width and a length that are integral multiples of the predetermined interval. A chip-shaped electronic component, wherein a terminal electrode is provided at a center position of the square area when the bottom surface is divided into a plurality of square areas each having the same length as the predetermined interval.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20470897A JP3406482B2 (en) | 1997-07-30 | 1997-07-30 | Composite electronic component, method of manufacturing the same, and chip-shaped electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20470897A JP3406482B2 (en) | 1997-07-30 | 1997-07-30 | Composite electronic component, method of manufacturing the same, and chip-shaped electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1154367A true JPH1154367A (en) | 1999-02-26 |
| JP3406482B2 JP3406482B2 (en) | 2003-05-12 |
Family
ID=16495007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20470897A Expired - Fee Related JP3406482B2 (en) | 1997-07-30 | 1997-07-30 | Composite electronic component, method of manufacturing the same, and chip-shaped electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3406482B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002057066A (en) * | 2000-08-10 | 2002-02-22 | Taiyo Yuden Co Ltd | Chip array and its manufacturing method |
| JP2003283285A (en) * | 2002-03-26 | 2003-10-03 | Murata Mfg Co Ltd | Noise filter and its mounting structure |
| JP2009026958A (en) * | 2007-07-19 | 2009-02-05 | Nippon Soken Inc | Arrangement structure of capacitor |
| JP2009535842A (en) * | 2006-05-01 | 2009-10-01 | ヴィシャイ インターテクノロジー，インコーポレイテッド | High precision capacitor with stand-off |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102139760B1 (en) * | 2015-01-22 | 2020-07-31 | 삼성전기주식회사 | Electronic part and board for mouting the same |
-
1997
- 1997-07-30 JP JP20470897A patent/JP3406482B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002057066A (en) * | 2000-08-10 | 2002-02-22 | Taiyo Yuden Co Ltd | Chip array and its manufacturing method |
| JP2003283285A (en) * | 2002-03-26 | 2003-10-03 | Murata Mfg Co Ltd | Noise filter and its mounting structure |
| JP2009535842A (en) * | 2006-05-01 | 2009-10-01 | ヴィシャイ インターテクノロジー，インコーポレイテッド | High precision capacitor with stand-off |
| JP2012028800A (en) * | 2006-05-01 | 2012-02-09 | Vishay Intertechnology Inc | High-precision capacitor having standoff |
| JP2009026958A (en) * | 2007-07-19 | 2009-02-05 | Nippon Soken Inc | Arrangement structure of capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3406482B2 (en) | 2003-05-12 |
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