JPH114052A - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
JPH114052A
JPH114052A JP15416897A JP15416897A JPH114052A JP H114052 A JPH114052 A JP H114052A JP 15416897 A JP15416897 A JP 15416897A JP 15416897 A JP15416897 A JP 15416897A JP H114052 A JPH114052 A JP H114052A
Authority
JP
Japan
Prior art keywords
electric circuit
substrate
printed wiring
blocks
divided
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15416897A
Other languages
Japanese (ja)
Inventor
Masaaki Kobayashi
林 正 明 小
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15416897A priority Critical patent/JPH114052A/en
Publication of JPH114052A publication Critical patent/JPH114052A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board whose cost is reduced by sharing of components. SOLUTION: A substrate 11 is divided into a plurality of blocks 11a, 11b by perforations 12, electrical circuits A, B having different functions are made in the blocks, and a connecting section 13 for connecting one electric circuit to the other electric circuit is shaped into a land having the same diameter and pitch for sharing components. When the substrate 11 is used as an integrated body, it is connected by a multi-lead jumper 14, and when it is used separately, it is connected by a wired connector 15.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、1枚の基板上に複
数の異なる電気回路を有し、電気回路毎に分割可能なプ
リント配線板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having a plurality of different electric circuits on a single substrate and capable of being divided for each electric circuit.

【0002】[0002]

【従来の技術】従来、例えば2つの電気回路をそれぞれ
別の商品に適用する場合、2つの電気回路を1枚のプリ
ント配線板上に形成する場合と、2つの電気回路をそれ
ぞれ別のプリント配線板に形成する場合とがある。図2
は前者の一体型の場合の例を示し、1枚の基板1の上に
機能の異なる電気回路AとBとが形成され、AとBとは
結線パターン2で接続されている。また、図3は後者の
セパレート型の場合の例を示し、電気回路Aは1枚の基
板3上に形成されており、他の電気回路との接続にはワ
イヤー付きコネクタ4が用いられている。同様に、電気
回路Bは別の1枚の基板5上に形成されており、他の電
気回路との接続にはワイヤー付きコネクタ6が用いられ
ている。
2. Description of the Related Art Conventionally, for example, when two electric circuits are applied to different products, respectively, two electric circuits are formed on one printed wiring board, and two electric circuits are respectively formed on different printed wiring boards. It may be formed on a plate. FIG.
Shows an example of the former integrated type, in which electric circuits A and B having different functions are formed on one substrate 1, and A and B are connected by a connection pattern 2. FIG. 3 shows an example of the latter type, in which an electric circuit A is formed on one substrate 3 and a connector 4 with a wire is used for connection with another electric circuit. . Similarly, the electric circuit B is formed on another substrate 5, and a connector 6 with a wire is used for connection with another electric circuit.

【0003】このように、従来は、形成する電気回路が
同じであっても適用する商品等の形状が違う場合には、
それぞれ2種類のプリント配線板を用意していた。
As described above, conventionally, even if the electric circuit to be formed is the same, if the shape of a product to be applied is different,
Two types of printed wiring boards were prepared for each.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、形成す
る電気回路が同じ場合に2種類のプリント配線板を用意
することは、設計時間および製造工数が2倍かかること
になり、コストも2倍になるという問題があった。
However, preparing two types of printed wiring boards in the case where the electric circuit to be formed is the same requires twice as much design time and man-hours, and doubles the cost. There was a problem.

【0005】本発明は、このような従来の問題を解決す
るものであり、部品の共通化を図ってコストを低減した
プリント配線板を提供することを目的とする。
An object of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a printed wiring board in which components are shared and cost is reduced.

【0006】[0006]

【課題を解決するための手段】本発明は、上記目的を達
成するために、1枚の基板をミシン目等によって複数の
ブロックに区画し、各ブロック毎に機能の異なる電気回
路を形成するとともに、各電気回路を他の電気回路に接
続するための接続部を共通化したものである。これによ
り、設計時間、製造工数、コストを大幅に削減すること
ができる。
According to the present invention, in order to achieve the above object, one substrate is divided into a plurality of blocks by perforations or the like, and an electric circuit having a different function is formed for each block. In addition, a connection portion for connecting each electric circuit to another electric circuit is shared. As a result, the design time, the number of manufacturing steps, and the cost can be significantly reduced.

【0007】[0007]

【発明の実施の形態】本発明の請求項1に記載の発明
は、1枚の基板を分割可能な継ぎ目によって複数のブロ
ックに区画し、各ブロック毎に機能の異なる電気回路を
形成するとともに、各電気回路を他の電気回路に接続す
るための接続部を共通化したことを特徴とするプリント
配線板であり、接続部の共通化により、基板を分割して
使用する場合でも、分割しないで使用する場合でも、同
様な接続部品を使用することができ、設計時間、製造工
数、コストを大幅に削減できるという作用を有する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS According to the first aspect of the present invention, a single board is divided into a plurality of blocks by dividable seams, and an electric circuit having a different function is formed for each block. A printed wiring board characterized in that a connection portion for connecting each electric circuit to another electric circuit is shared, and by using a common connection portion, even when a substrate is divided and used, do not divide. Even when used, similar connecting parts can be used, which has the effect of greatly reducing design time, man-hours and cost.

【0008】本発明の請求項2に記載の発明は、接続部
を同じ(または実質的に同じ)ピッチと穴径のランドで
形成したことを特徴とする請求項1記載のプリント配線
板であり、電気回路どうしを多連ジャンパーやコネクタ
等の市販の電子部品を利用して接続できるという作用を
有する。
According to a second aspect of the present invention, there is provided the printed wiring board according to the first aspect, wherein the connecting portions are formed of lands having the same (or substantially the same) pitch and hole diameter. It has the effect that electric circuits can be connected using commercially available electronic components such as multiple jumpers and connectors.

【0009】(実施の形態)図1は本発明の実施の形態
を示している。図1(a)において、11は基板であ
り、中央部にミシン目12が形成されて2つのブロック
11aと11bに区画されている。ブロック11aには
電気回路Aが形成され、ブロック11bには電気回路B
が形成されている。電気回路AとBのそれぞれの接続部
13には、穴径とピッチが同じランドが形成されてい
る。このような基板11を一体で使用する場合は、電気
回路AとBの接続部13に、図1(b)に示すように、
多連リードジャンパー14のピン14aを挿入すること
により、電気回路AとBを電気的に接続する。
(Embodiment) FIG. 1 shows an embodiment of the present invention. In FIG. 1A, reference numeral 11 denotes a substrate, and a perforation 12 is formed at a central portion to be divided into two blocks 11a and 11b. An electric circuit A is formed in the block 11a, and an electric circuit B is formed in the block 11b.
Are formed. Lands having the same hole diameter and pitch are formed in the connection portions 13 of the electric circuits A and B, respectively. When such a substrate 11 is used integrally, a connecting portion 13 between the electric circuits A and B is provided as shown in FIG.
The electrical circuits A and B are electrically connected by inserting the pins 14a of the multiple lead jumper 14.

【0010】一方、基板11を分割して使用する場合
は、ミシン目13からブロック11aと11bとを分割
し、電気回路Aの接続部13には、他の電気回路に導通
するワイヤー付きコネクタ15を接続し、電気回路Bの
接続部13にも同様に、他の電気回路に導通するワイヤ
ー付きコネクタ15を接続する。
On the other hand, when the substrate 11 is divided and used, the blocks 11a and 11b are divided from the perforation 13, and the connecting portion 13 of the electric circuit A is provided with a connector 15 with a wire for conducting to another electric circuit. , And a connector 15 with a wire that conducts to another electric circuit is similarly connected to the connection portion 13 of the electric circuit B.

【0011】このように、本実施の形態によれば、1枚
の基板11にミシン目12を形成して2つのブロック1
1aと11bに区画し、それぞれのブロック11a、1
1bに電気回路A、Bを形成するとともに、各電気回路
の接続部13に穴径とピッチが同じランドを設けて、市
販の多連リードジャンパー14やワイヤー付きコネクタ
15で接続できるようにしたので、形成する電気回路が
同じであって適用商品が異なる場合に、プリント配線板
を別々に設計する必要がなく、コストを大幅に低減する
ことができる。
As described above, according to the present embodiment, the perforations 12 are formed on one substrate 11 and the two blocks 1 are formed.
1a and 11b, and each block 11a, 1b
1b, the electric circuits A and B are formed, and the land 13 having the same hole diameter and pitch is provided at the connection portion 13 of each electric circuit, so that the connection can be made by a commercially available multiple lead jumper 14 or a connector 15 with a wire. In the case where the electric circuit to be formed is the same and the applied product is different, it is not necessary to separately design the printed wiring board, and the cost can be greatly reduced.

【0012】なお、上記実施の形態では、基板11にミ
シン目12を設けて分割可能としたが、他の分割可能な
継ぎ目を形成してもよい。また、基板11を2つのブロ
ック11aと11bに分割可能としたが、3つ以上に分
割可能としてもよい。さらに接続部品として多連ジャン
パー14やワイヤー付きコネクタ15を用いたが、他の
同様な接続部品を用いてもよい。
In the above-described embodiment, the substrate 11 is provided with the perforations 12 so as to be dividable. However, another dividable seam may be formed. Further, although the substrate 11 can be divided into two blocks 11a and 11b, the substrate 11 may be divided into three or more blocks. Furthermore, although the multiple jumpers 14 and the connectors 15 with wires are used as the connection parts, other similar connection parts may be used.

【0013】[0013]

【発明の効果】本発明は、上記実施の形態から明らかな
ように、1枚の基板を分割可能な継ぎ目によって複数の
ブロックに区画し、各ブロック毎に機能の異なる電気回
路を形成するとともに、各電気回路を他の電気回路に接
続するための接続部を共通化したので、設計時間、製造
工数、コストを大幅に削減できるという効果を有する。
According to the present invention, as is apparent from the above embodiment, a single substrate is divided into a plurality of blocks by dividable seams, and an electric circuit having a different function is formed for each block. Since the connection portion for connecting each electric circuit to another electric circuit is shared, there is an effect that the design time, the number of manufacturing steps, and the cost can be significantly reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a)本発明の実施の形態におけるプリント配
線板の正面図 (b)同プリント配線板における多連リードジャンパー
の取り付け図 (c)同プリント配線板の分割状態における一方の正面
図 (d)同プリント配線板の分割状態における他方の正面
FIG. 1A is a front view of a printed wiring board according to an embodiment of the present invention. FIG. 1B is a view showing how multiple lead jumpers are mounted on the printed wiring board. FIG. (D) Front view of the other side of the printed wiring board in a divided state

【図2】従来のプリント配線板の正面図FIG. 2 is a front view of a conventional printed wiring board.

【図3】(a)従来のプリント配線板の分割状態におけ
る一方の正面図 (b)従来のプリント配線板の分割状態における他方の
正面図
FIG. 3A is a front view of one side of a conventional printed wiring board in a divided state. FIG. 3B is a front view of the other side of a conventional printed wiring board in a divided state.

【符号の説明】[Explanation of symbols]

11 基板 11a、11b ブロック 12 ミシン目 13 接続部 14 多連リードジャンパー 15 ワイヤー付きコネクタ DESCRIPTION OF SYMBOLS 11 Substrate 11a, 11b block 12 Perforation 13 Connection part 14 Multiple lead jumper 15 Connector with a wire

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 1枚の基板を分割可能な継ぎ目によって
複数のブロックに区画し、各ブロック毎に機能の異なる
電気回路を形成するとともに、各電気回路を他の電気回
路に接続するための接続部を共通化したことを特徴とす
るプリント配線板。
1. A single substrate is divided into a plurality of blocks by a dividable seam, an electric circuit having a different function is formed for each block, and a connection for connecting each electric circuit to another electric circuit is provided. Printed wiring board characterized by common parts.
【請求項2】 接続部を同じピッチと穴径のランドで形
成したことを特徴とする請求項1記載のプリント配線
板。
2. The printed wiring board according to claim 1, wherein the connection portions are formed by lands having the same pitch and hole diameter.
JP15416897A 1997-06-11 1997-06-11 Printed circuit board Pending JPH114052A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15416897A JPH114052A (en) 1997-06-11 1997-06-11 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15416897A JPH114052A (en) 1997-06-11 1997-06-11 Printed circuit board

Publications (1)

Publication Number Publication Date
JPH114052A true JPH114052A (en) 1999-01-06

Family

ID=15578326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15416897A Pending JPH114052A (en) 1997-06-11 1997-06-11 Printed circuit board

Country Status (1)

Country Link
JP (1) JPH114052A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009152267A (en) * 2007-12-19 2009-07-09 Funai Electric Co Ltd Electronic equipment
JP2017022183A (en) * 2015-07-07 2017-01-26 矢崎総業株式会社 Electronic component unit substrate, and electronic component unit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009152267A (en) * 2007-12-19 2009-07-09 Funai Electric Co Ltd Electronic equipment
JP2017022183A (en) * 2015-07-07 2017-01-26 矢崎総業株式会社 Electronic component unit substrate, and electronic component unit

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