JPH11354221A - Connecting structure between fpc and base board - Google Patents
Connecting structure between fpc and base boardInfo
- Publication number
- JPH11354221A JPH11354221A JP10174162A JP17416298A JPH11354221A JP H11354221 A JPH11354221 A JP H11354221A JP 10174162 A JP10174162 A JP 10174162A JP 17416298 A JP17416298 A JP 17416298A JP H11354221 A JPH11354221 A JP H11354221A
- Authority
- JP
- Japan
- Prior art keywords
- fpc
- solder balls
- electrodes
- plural
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＦＰＣ・基板間接続
構造に関し、特に電子回路基板表面の複数の電極とＦＰ
Ｃの複数のパターン配線とを対応接続するＦＰＣ・基板
間接続構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an FPC / substrate connection structure, and more particularly, to a plurality of electrodes and FPs on the surface of an electronic circuit board.
The present invention relates to an FPC / substrate connection structure for correspondingly connecting a plurality of C pattern wirings.
【０００２】[0002]
【従来の技術】プリント配線板などの電子回路基板の表
面に形成された複数の電極に、フレクシブル印刷配線基
板（ＦＰＣ）の複数のパターン配線を接続する場合、従
来は主に、ＦＰＣ接続用のコネクタを用いていた。ＦＰ
Ｃ接続用コネクタを用いた従来のＦＰＣ・基板間接続構
造の一例を説明するための部分断面側面図を図４（ａ）
〜（ｃ）に示す（但し、電子回路基板は省略）。2. Description of the Related Art When a plurality of pattern wirings of a flexible printed wiring board (FPC) are connected to a plurality of electrodes formed on the surface of an electronic circuit board such as a printed wiring board, conventionally, mainly a method for connecting an FPC is mainly used. Connector was used. FP
FIG. 4A is a partial cross-sectional side view illustrating an example of a conventional FPC-to-board connection structure using a C connection connector.
To (c) (however, the electronic circuit board is omitted).
【０００３】このＦＰＣ・基板間接続構造は、主にＦＰ
Ｃ接続用コネクタ３００を含んで構成され、このＦＰＣ
接続用コネクタ３００は、それぞれが端子部３１１，接
触アーム部３１２及び保持アーム部３１３を含んで一体
形成された複数のコンタクト３１０と、これら複数のコ
ンタクト３１０をその保持アーム部３１３で保持固定す
る一方、これら複数のコンタクト３１０の接触アーム部
３１２が露出してＦＰＣ２００ｂを受け入れるＦＰＣ嵌
合部３２１が形成されたインシュレータ３２０と、ＦＰ
Ｃ嵌合部３２１に挿入されてＦＰＣ２００ｂの複数のパ
ターン配線２２０ａと複数のコンタクト３１０の接触ア
ーム部３１２とを加圧接触させるためのスライダ３３０
とを含む構成となっている。[0003] The connection structure between the FPC and the board mainly includes an FP.
C connector 300, and the FPC
The connection connector 300 includes a plurality of contacts 310 integrally formed including a terminal portion 311, a contact arm portion 312, and a holding arm portion 313, and the plurality of contacts 310 held and fixed by the holding arm portion 313. An insulator 320 formed with an FPC fitting portion 321 for exposing the contact arm portions 312 of the plurality of contacts 310 to receive the FPC 200b;
A slider 330 that is inserted into the C fitting portion 321 to press the plurality of pattern wirings 220 a of the FPC 200 b and the contact arm portions 312 of the plurality of contacts 310 into pressure contact.
And a configuration including:
【０００４】そして、ＦＰＣ接続用コネクタ３００の複
数のコンタクト３１０の端子部３１１を電子回路基板
（図示省略）の複数の電極に、半田付け等により対応接
続し、ＦＰＣ２００ｂの端部をインシュレータ３２０の
ＦＰＣ嵌合部３２１に挿入し、かつスライダ３３０もＦ
ＰＣ嵌合部３２１に挿入（圧入）して、ＦＰＣ２００ｂ
の複数のパターン配線２２０ａを複数のコンタクト３１
０の接触アーム部３１２に対応して加圧接触させ、ＦＰ
Ｃ２００ｂの複数のパターン配線２２０ａと電子回路基
板の複数の電極とを対応接続する構造となっている。Then, the terminal portions 311 of the plurality of contacts 310 of the FPC connection connector 300 are connected to the plurality of electrodes of an electronic circuit board (not shown) by soldering or the like, and the end of the FPC 200b is connected to the FPC of the insulator 320 by the FPC. The slider 330 is inserted into the fitting portion 321 and
Inserting (press-fitting) into the PC fitting portion 321, the FPC 200b
Of the plurality of pattern wirings 220a to the plurality of contacts 31
Pressure contact corresponding to the contact arm 312 of the
The plurality of pattern wirings 220a of C200b and the plurality of electrodes of the electronic circuit board are connected to each other.
【０００５】複数のコンタクト３１０それぞれは弾性材
料で形成され、ＦＰＣ２００ｂが挿入されたインシュレ
ータ３２０のＦＰＣ嵌合部３２１に、更にスライダ３３
０を圧入し、コンタクト３１０、特にその接触アーム部
３１２を変形させてその復元力を利用してパターン配線
２２０ａと接触アーム部３１２とを予め設定された圧力
で接触接続するようになっている。[0005] Each of the plurality of contacts 310 is formed of an elastic material, and the slider 33 is further attached to the FPC fitting portion 321 of the insulator 320 into which the FPC 200b is inserted.
0 is press-fitted, and the contact 310, particularly its contact arm 312 is deformed, and the restoring force is used to connect the pattern wiring 220a and the contact arm 312 with a predetermined pressure.
【０００６】[0006]
【発明が解決しようとする課題】この従来のＦＰＣ・基
板間接続構造は、それぞれが端子部３１１，接触アーム
部３１２及び保持アーム部３１３を含んで弾性材料で一
体形成された複数のコンタクト３１０と、これら複数の
コンタクト３１０をその保持アーム部３１３で保持固定
する一方、これら複数のコンタクト３１０の接触アーム
部３１２が露出するＦＰＣ嵌合部３２１が形成されたイ
ンシュレータ３２０と、ＦＰＣ嵌合部３２１に圧入され
るスライダ３３０とを備えたＦＰＣ接続用コネクタ３０
０を用い、このＦＰＣ接続用コネクタ３００の複数コン
タクト３１０の端子部３１１を電子回路基板の複数の電
極に半田付け等により対応接続し、インシュレータ３２
０のＦＰＣ嵌合部３２１にＦＰＣ２００ｂの一端を挿入
すると共にスライダ３３０を圧入し、コンタクト３１０
の接触アーム部３１２の復元力を利用してＦＰＣ２００
ｂの複数のパターン配線２２０ａと複数のコンタクト３
１０の接触アーム部３１２とを対応して加圧接触させる
構造となっているので、コンタクト３１０の接触アーム
部３１２を変形させて復元力を得るためには、電子回路
基板の表面に対する高さ方向に、接触アーム部３１２自
身の寸法、接触アーム部３１２の変形量、スライダ３３
０の厚さ寸法、スライダ３３０の厚さ方向の一方の面を
ガイドすると共にコンタクト３１０を保持するための寸
法等が必要となり、コンタクト３１０及びインシュレー
タ３２０の高さ方向の寸法が大きくなるという問題点
や、上述のようなコンタクト３１０及びインシュレータ
３２０の構造，形状であるため、コンタクト３１０の小
型化には限界があり、電極配列の狭ピッチ化が困難であ
るという問題点があり、また、コンタクト数が増大する
とスライダの圧入力が大きくなってその圧入が困難にな
るという問題点や、ＦＰＣの端部でしか接続できず、適
用範囲が狭いという問題点がある。This conventional FPC / substrate connection structure has a plurality of contacts 310 integrally formed of an elastic material, each including a terminal portion 311, a contact arm portion 312 and a holding arm portion 313. The plurality of contacts 310 are held and fixed by their holding arms 313, while the FPC fitting portion 321 in which the contact arm portions 312 of the plurality of contacts 310 are exposed is formed on the insulator 320 and the FPC fitting portion 321. FPC connection connector 30 having press-fit slider 330
And the terminals 311 of the plurality of contacts 310 of the FPC connector 300 are connected to the plurality of electrodes of the electronic circuit board by soldering or the like.
0, and one end of the FPC 200b is inserted into the FPC fitting portion 321 and the slider 330 is pressed into the FPC 200b.
Using the restoring force of the contact arm 312 of the FPC 200
b, a plurality of pattern wirings 220a and a plurality of contacts 3
Since the contact arm portions 312 of the contacts 310 are configured to be in pressure contact with each other, in order to obtain a restoring force by deforming the contact arm portions 312 of the contacts 310, a height direction with respect to the surface of the electronic circuit board is required. The dimensions of the contact arm 312 itself, the amount of deformation of the contact arm 312, the slider 33
A thickness dimension of 0, a dimension for guiding one surface in the thickness direction of the slider 330 and holding the contact 310, and the like are required, and the size of the contact 310 and the insulator 320 in the height direction becomes large. Also, because of the structure and shape of the contacts 310 and the insulators 320 as described above, there is a limit in reducing the size of the contacts 310, and it is difficult to reduce the pitch of the electrode array. When the FPC increases, there is a problem that the press-fitting of the slider becomes large and the press-fitting becomes difficult, and there is a problem that the connection can be made only at the end of the FPC and the applicable range is narrow.
【０００７】本発明の目的は、上記従来技術の問題点に
鑑みて、電子回路基板の表面からの高さ寸法を小さくす
ると同時に、電極配列の狭ピッチ化が容易となり、かつ
ＦＰＣの接続作業が容易な上、適用範囲を広くすること
ができるＦＰＣ・基板間接続構造を提供することにあ
る。An object of the present invention is to reduce the height from the surface of an electronic circuit board, to make it easy to narrow the pitch of an electrode array, and to reduce the connection work of an FPC. An object of the present invention is to provide an FPC / substrate connection structure that is easy and can be applied to a wider range.
【０００８】[0008]
【課題を解決するための手段】本発明のＦＰＣ・基板間
接続構造は、電子回路基板表面の複数の電極とＦＰＣの
複数のパターン配線とを対応接続するＦＰＣ・基板間接
続構造であって、上記の目的を達成するために次の各構
成を有することを特徴とする。 （イ）前記電子回路基板表面の複数の電極と対応接続す
る複数の半田ボール （ロ）前記電子回路基板表面の、前記複数の電極と対応
接続する複数の半田ボールの周囲に、これら複数の半田
ボールそれぞれの直径寸法より小さい厚さ寸法を有し、
前記複数の半田ボールの頂点部分がその表面から突出す
るように貼り付けられた絶縁フィルム （ハ）前記ＦＰＣの複数のパターン配線の、前記複数の
半田ボールと対応する部位に、多数の突起を表面に分布
させて付着形成された複数の突起分布型電極 （ニ）前記ＦＰＣ表面の、前記複数のパターン配線に付
着形成された複数の突起分布型電極の周囲と、前記絶縁
フィルムの表面とを貼り合わせて前記複数の半田ボール
と前記複数の突起分布型電極とを対応接続する粘着部材The FPC / substrate connection structure of the present invention is an FPC / substrate connection structure for correspondingly connecting a plurality of electrodes on the surface of an electronic circuit board and a plurality of pattern wirings of the FPC. In order to achieve the above object, the present invention has the following features. (B) a plurality of solder balls correspondingly connected to the plurality of electrodes on the surface of the electronic circuit board; and (b) a plurality of solder balls on the surface of the electronic circuit board around the plurality of solder balls correspondingly connected to the plurality of electrodes. Has a thickness smaller than the diameter of each ball,
An insulating film attached so that the apexes of the plurality of solder balls protrude from the surface thereof; (c) a plurality of projections are formed on the surface of the plurality of pattern wirings of the FPC at positions corresponding to the plurality of solder balls; (D) Affixing the periphery of the plurality of projection distribution electrodes attached to the plurality of pattern wirings on the surface of the FPC to the surface of the insulating film. An adhesive member for connecting the plurality of solder balls and the plurality of projection distribution electrodes together.
【０００９】また、前記複数の突起分布型電極それぞれ
が、前記ＦＰＣのパターン配線表面に付着する予め定め
られた大きさの多数の粒子と、これらパターン配線表面
の多数の粒子付着部分を、これら多数の粒子を含んで覆
うめっき層とから成る構造を有している。Further, each of the plurality of projection distribution type electrodes is configured to form a number of particles of a predetermined size adhering to the pattern wiring surface of the FPC and a number of particles adhering portions of the pattern wiring surface to the number of particles. And a plating layer including and covering the particles.
【００１０】[0010]
【発明の実施の形態】本発明の一実施の形態は、電子回
路基板表面の複数の電極と対応接続する複数の半田ボー
ルと、上記電子回路基板表面の、上記複数の電極と対応
接続する複数の半田ボールの周囲に、これら複数の半田
ボールそれぞれの直径寸法より小さい厚さ寸法を有し、
これら複数の半田ボールの頂点部分がその表面から突出
するように貼り付けられた絶縁フィルムと、ＦＰＣの複
数のパターン配線の、上記複数の半田ボールと対応する
部位に、多数の突起を表面に分布させて付着形成された
複数の突起分布型電極と、上記ＦＰＣ表面の、上記複数
のパターン配線に付着形成された複数の突起分布型電極
の周囲と上記絶縁フィルムの表面とを貼り合わせて上記
複数の半田ボールと上記複数の突起分布型電極とを対応
接続する粘着部材とを有する構成、構造となっている。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention comprises a plurality of solder balls correspondingly connected to a plurality of electrodes on the surface of an electronic circuit board and a plurality of solder balls correspondingly connected to the plurality of electrodes on the surface of the electronic circuit board. Around the solder ball, having a thickness dimension smaller than the diameter dimension of each of the plurality of solder balls,
A large number of protrusions are distributed on the surface of the insulating film attached such that the apexes of the plurality of solder balls protrude from the surface thereof, and the portions of the plurality of pattern wirings of the FPC corresponding to the plurality of solder balls. The plurality of protrusion distribution type electrodes adhered and formed, and the periphery of the plurality of protrusion distribution type electrodes adhered to the plurality of pattern wirings on the FPC surface and the surface of the insulating film are bonded to each other. And a pressure-sensitive adhesive member for correspondingly connecting the plurality of projection distribution electrodes to the solder balls.
【００１１】このような構成、構造とすることにより、
複数の半田ボールでＦＰＣの突起分布型電極部分がやや
盛り上がるようになって半田ボール・突起分布型電極間
に接触圧力を与え、突起分布型電極の突起が半田ボール
の酸化被膜を突き破ってその接続を確実にした上で、電
子回路基板の電極とＦＰＣのパターン配線との間を、接
続に直接関与する半田ボール及び突起分布型電極のみと
して、その加圧接触手段はその周囲に分散させることが
できるので、ＦＰＣ・基板間接続構造の高さ寸法を、コ
ネクタを使用した従来例より大幅に小さくすることがで
き、かつ、接続に直接関与する部分の大きさが半田ボー
ル及び突起分布型電極の寸法で決まるので、これら寸法
を従来例のコネクタにおけるコンタクトより大幅に小さ
くすることができて、電極配列の狭ピッチ化をはかるこ
とができる。With such a configuration and structure,
The projection distribution type electrode portion of the FPC slightly rises with a plurality of solder balls, and a contact pressure is applied between the solder ball and the projection distribution type electrode, and the projection of the projection distribution type electrode breaks through the oxide film of the solder ball and connects. After ensuring the above, only the solder ball and the projection distribution type electrode directly involved in the connection between the electrode of the electronic circuit board and the pattern wiring of the FPC, and the pressure contact means can be dispersed around the electrode. Therefore, the height dimension of the FPC / substrate connection structure can be significantly reduced as compared with the conventional example using a connector, and the size of the portion directly involved in the connection is smaller than that of the solder ball and the projection distribution type electrode. Since these dimensions are determined by the dimensions, these dimensions can be made much smaller than the contacts in the conventional connector, and the pitch of the electrode arrangement can be reduced.
【００１２】また、接続作業も、電極数が多くなっても
ＦＰＣと電子回路基板上の絶縁フィルムとを粘着部材で
貼り合わせる、という単純な作業で済み、更に、ＦＰＣ
の電子回路基板への接続部分が、その端部のみでなく、
突起分布型電極が形成できてその周囲を絶縁フィルムに
粘着できる位置であればどこでもよいので、適用範囲を
拡大することができる。Also, the connection operation is a simple operation of bonding the FPC and the insulating film on the electronic circuit board with an adhesive member even if the number of electrodes is large.
The connection to the electronic circuit board is not only at its end,
Any location can be used as long as the projection distribution type electrode can be formed and its periphery can be adhered to the insulating film, so that the applicable range can be expanded.
【００１３】[0013]
【実施例】次に本発明の実施例について図面を参照して
説明する。図１（ａ），（ｂ）は本発明の第１の実施例
を示す接続前の部分断面斜視図及び断面側面図、図２は
この実施例における半田ボール及び突起分布型電極の接
続部分の詳細構造を示す拡大断面図である。Next, an embodiment of the present invention will be described with reference to the drawings. 1A and 1B are a partial perspective view and a sectional side view showing a first embodiment of the present invention before connection, and FIG. 2 is a view showing a connection portion between a solder ball and a projection distribution type electrode in this embodiment. It is an expanded sectional view which shows a detailed structure.
【００１４】この実施例は、基板１１０の表面に複数の
電極配線１２０が形成された電子回路基板１００の複数
の電極配線１２０に、半田付け（半田２０）により対応
接続する複数の半田ボール１０と、電子回路基板１００
の、複数の電極配線１２０と対応接続する複数の半田ボ
ール１０の周囲に、これら半田ボール１０の直径寸法よ
り小さい厚さ寸法を有し、これら半田ボール１０の頂点
部分がその表面から突出するように貼り付けられた絶縁
フィルム３０と、フィルム基板２１１の表面に複数のパ
ターン配線２２０が形成されたＦＰＣ２００の複数のパ
ターン配線２２０の、複数の半田ボール１０と対応する
部位に、多数の突起を表面に分布させて付着形成された
複数の突起分布型電極４０と、ＦＰＣ２００の複数の突
起分布型電極４０形成部分以外を覆うフィルム基板２１
２の表面の、複数の突起分布型電極４０の周囲と絶縁フ
ィルム３０とを貼り合わせて複数の半田ボール１０と複
数の突起分布型電極４０とを対応接続する粘着剤５０と
を有する構成、構造となっている。In this embodiment, a plurality of solder balls 10 correspondingly connected by soldering (solder 20) to a plurality of electrode wires 120 of an electronic circuit board 100 having a plurality of electrode wires 120 formed on the surface of a substrate 110 are described. , Electronic circuit board 100
Around the plurality of solder balls 10 correspondingly connected to the plurality of electrode wirings 120, the thickness of the solder balls 10 is smaller than the diameter of the solder balls 10, and the apexes of the solder balls 10 protrude from the surface. A large number of protrusions are formed on portions of the insulating film 30 attached to the FPC 200 and the plurality of pattern wirings 220 on the surface of the film substrate 211 corresponding to the plurality of solder balls 10. And a film substrate 21 that covers portions of the FPC 200 other than the portions where the plurality of projection distribution electrodes 40 are formed.
2. Structure and structure having a plurality of solder balls 10 and an adhesive 50 for bonding the plurality of solder balls 10 and the plurality of protrusion distribution electrodes 40 together by bonding the periphery of the plurality of protrusion distribution electrodes 40 and the insulating film 30 on the surface of the second. It has become.
【００１５】この実施例において、突起分布型電極４０
は、図２に示すようにＦＰＣ２００のパターン配線２２
０表面に付着する（直接付着、間接付着（他の金属粒子
の上に付着）を含む）予め定められた大きさの多数の金
属粒子４１と、パターン配線２２０表面の多数の金属粒
子４１付着部分を、これら多数の金属粒子４１を含んで
覆うめっき層４２とから成り、表面の多数の突起は、そ
の先端が鋭利に尖って突出している。In this embodiment, the projection distribution type electrode 40
Is the pattern wiring 22 of the FPC 200 as shown in FIG.
A large number of metal particles 41 of a predetermined size attached to the surface (including direct attachment and indirect attachment (adhesion on other metal particles)) and a portion of the surface of the pattern wiring 220 where many metal particles 41 are attached And a plating layer 42 covering these metal particles 41. The protrusions on the surface are sharply pointed and protrude.
【００１６】また、半田ボール１０は、その頂点部分が
絶縁フィルム３０の表面から突出しているので、ＦＰＣ
２００と絶縁フィルム３０とを粘着剤５０で貼り合わせ
たとき、ＦＰＣ２００の突起分布型電極４０形成部分が
半田ボール１０によりや、盛り上がるようになり（図
１，図２では平坦になっているが）、その変形、復元力
等により半田ボール１０・突起分布型電極４０間に接触
圧力を与えることになる。その結果、突起分布型電極４
０の突起が半田ボール１０の酸化被膜１１を破ってその
内部に突きささり、半田ボール１０・突起分布型電極４
０間は確実に接続される。Since the apex of the solder ball 10 protrudes from the surface of the insulating film 30, the FPC
When the insulating film 30 and the insulating film 30 are bonded together with the adhesive 50, the portion of the FPC 200 where the projection distribution type electrode 40 is formed slightly rises due to the solder ball 10 (although it is flat in FIGS. 1 and 2). The contact pressure is applied between the solder ball 10 and the projection distribution type electrode 40 by the deformation, the restoring force, and the like. As a result, the projection distribution type electrode 4
No. 0 protrusion breaks through the oxide film 11 of the solder ball 10 and penetrates into the inside thereof, and the solder ball 10 and the protrusion distribution type electrode 4
Connections between 0 are securely connected.
【００１７】そして、電子回路基板１００の電極配線１
２０とＦＰＣ２００のパターン配線２２０との間は、接
続に直接関与する半田ボール１０及び突起分布型電極４
０のみから成り、これらを加圧接触させるための絶縁フ
ィルム３０、粘着剤５０、及びＦＰＣ２００の粘着剤５
０塗布部分は半田ボール１０及び突起分布型電極４０の
周囲に分散された形となるので、ＦＰＣ・基板間接続構
造の高さ寸法を、コネクタを使用した従来例に比べ、大
幅に小さくすることができ、かつ、接続に直接関与する
部分の大きさが半田ボール１０及び突起分布型電極４０
の寸法で決まるので、これら寸法を従来例におけるコネ
クタのコンタクトの寸法より大幅に小さくすることがで
きて、狭ピッチ化をはかることができる。The electrode wiring 1 of the electronic circuit board 100
20 and the pattern wiring 220 of the FPC 200, the solder ball 10 and the projection distribution type electrode 4 directly involved in the connection.
0, and an insulating film 30, an adhesive 50, and an adhesive 5 of the FPC 200 for bringing them into pressure contact.
Since the 0-applied portion is distributed around the solder ball 10 and the projection distribution type electrode 40, the height of the connection structure between the FPC and the substrate should be significantly reduced as compared with the conventional example using a connector. And the size of the part directly involved in the connection is the solder ball 10 and the projection distribution type electrode 40.
Therefore, these dimensions can be made significantly smaller than the dimensions of the contacts of the connector in the conventional example, and the pitch can be reduced.
【００１８】また、半田ボール１０と突起分布型電極４
０とを加圧接触接続させる接続作業も、電極数が多くな
ってもＦＰＣ２００と電子回路基板１００上の絶縁フィ
ルム３０とを、粘着剤５０により貼り合わせるという単
純作業にすることができ（当然、位置合せは必要である
が、一般的な位置合せ手段により容易にできる）、更
に、ＦＰＣ２００の電子回路基板１００への接続部分
が、その端部のみに限定されることなく、突起分布型電
極４０が形成できてその周囲を絶縁フィルム３０に貼り
付けることができる位置であればどこでもよいので、適
用範囲を拡大することができる。The solder ball 10 and the projection distribution type electrode 4
0 can be a simple operation of bonding the FPC 200 and the insulating film 30 on the electronic circuit board 100 with the adhesive 50 even if the number of electrodes increases (of course, Positioning is necessary, but can be easily performed by general positioning means.) Further, the connection portion of the FPC 200 to the electronic circuit board 100 is not limited to only its end, and the projection distribution type electrode 40 is not limited. Can be formed at any position where its periphery can be attached to the insulating film 30, so that the applicable range can be expanded.
【００１９】なお、突起分布型電極４０は、前述したよ
うに複合めっき法により形成することができるが、その
ほかに、セラミック等の、ある程度導電性を有する粒子
を直接パターン配線２２０の表面に吹き付けて埋め込む
溶射という方法を用い、そのセラミック粒子吹き付け部
分に、これらセラミック粒子を覆って金属めっきする方
法もある。また、半田ボール１０を電極配線１２０に半
田付けして安定した構造としたが、半田付けしなくても
これらの間の加圧接触接続が保てるので、ＦＰＣ２００
の着脱の際に半田ボール１０が落下しないようにすれば
よい。The projection distribution type electrode 40 can be formed by the composite plating method as described above. In addition, particles having a certain degree of conductivity, such as ceramics, are directly sprayed onto the surface of the pattern wiring 220. There is also a method in which the ceramic particles are sprayed and metal plating is performed by covering the ceramic particles by using a method called thermal spraying. Although the solder ball 10 is soldered to the electrode wiring 120 to provide a stable structure, the pressure contact connection between them can be maintained without soldering.
In this case, the solder ball 10 may be prevented from dropping at the time of attachment and detachment.
【００２０】図３は本発明の第２の実施例を示す断面側
面図である。この第２の実施例は、１枚のＦＰＣ２００
ａの複数のパターン配線２２０と、電子回路基板１００
ａに設けられた異なる複数の回路（図３の例では３つの
回路）それぞれの複数の電極配線１２０ａ，１２０ｂ，
１２０ｃとを対応接続（所謂、デイジーチェーン接続）
するようにしたものである。電子回路基板１００ａの複
数の回路それぞれとＦＰＣ２００ａとの間のＦＰＣ・基
板間接続構造は、前述の第１の実施例と同様である。前
述したように、ＦＰＣの電子回路基板への接続部分が、
その端部に限定されないので、このような接続構造とす
ることができる。FIG. 3 is a sectional side view showing a second embodiment of the present invention. In the second embodiment, one FPC 200
a plurality of pattern wirings 220 and the electronic circuit board 100
3, a plurality of electrode wirings 120a, 120b, and a plurality of different circuits (three circuits in the example of FIG. 3) provided in
120c connection (so-called daisy chain connection)
It is something to do. The connection structure between the FPC and the board between each of the plurality of circuits of the electronic circuit board 100a and the FPC 200a is the same as that of the first embodiment. As described above, the connection part of the FPC to the electronic circuit board is
Since the connection is not limited to the end, such a connection structure can be obtained.
【００２１】[0021]
【発明の効果】以上説明したように本発明は、電子回路
基板側に、その複数の電極と対応接続する複数の半田ボ
ールと、これら複数の半田ボールの周囲に、これら半田
ボールの直径寸法より小さい厚さ寸法を有し、これら半
田ボールの頂点部分がその表面から突出するように貼り
付けられた絶縁フィルムとを設け、ＦＰＣ側に、その複
数のパターン配線の上記複数の半田ボールと対応する部
位に被着し、多数の突起を表面に分布させて形成された
複数の突起分布型電極を設け、このＦＰＣの複数の突起
分布型電極の周囲を、絶縁フィルムの表面に粘着部材に
より貼り付けて複数の半田ボールと複数の突起分布型電
極とを対応接続する構成、構造とすることにより、半田
ボール・突起分布型電極間の接続を確実に保ちつつ、電
子回路基板の電極とＦＰＣのパターン配線との間を、接
続に直接関与する半田ボール及び突起分布型電極のみと
してその加圧接触手段をその周囲に分散することができ
るので、全体の高さ寸法を小さくすることができ、かつ
電極配列の狭ピッチ化をはかることができ、また、接続
作業も電極数が多くなっても、ＦＰＣを電子回路基板上
の絶縁フィルムに、粘着部材により貼り合わせるという
単純作業で済み、更に、ＦＰＣの電子回路基板への接続
部分が端部に限定されないので、その適用範囲を拡大す
ることができる、という効果がある。As described above, according to the present invention, a plurality of solder balls corresponding to the plurality of electrodes are provided on the electronic circuit board side, and a plurality of solder balls are provided around the plurality of solder balls in accordance with the diameter of the solder balls. An insulating film having a small thickness dimension and affixed such that the apexes of these solder balls protrude from the surface thereof, and correspond to the plurality of solder balls of the plurality of pattern wirings on the FPC side. A plurality of protrusion distribution type electrodes formed by distributing a large number of protrusions on the surface are provided on the portion, and the periphery of the plurality of protrusion distribution type electrodes of the FPC is adhered to the surface of the insulating film with an adhesive member. The structure and structure of connecting a plurality of solder balls and a plurality of protrusion distribution type electrodes in correspondence with each other ensures that the connection between the solder balls and the protrusion distribution type electrodes is maintained, and the electrodes of the electronic circuit board are maintained. Since only the solder balls and the projection distribution electrodes directly involved in the connection between the FPC pattern wiring and the pressure contact means can be dispersed around the FPC pattern wiring, the overall height can be reduced. In addition, the pitch of the electrode array can be reduced, and even if the number of electrodes is large, the connection work is a simple operation of bonding the FPC to the insulating film on the electronic circuit board with an adhesive member. Since the connection portion of the FPC to the electronic circuit board is not limited to the end portion, there is an effect that the applicable range can be expanded.
【図１】本発明の第１の実施例を示す接続前の部分断面
斜視図及び断面側面図である。FIG. 1 is a partial sectional perspective view and a sectional side view before connection showing a first embodiment of the present invention.
【図２】図１に示された実施例の半田ボール・突起分布
型電極間の詳細な接続構造を示す拡大断面図である。FIG. 2 is an enlarged sectional view showing a detailed connection structure between the solder ball / projection distribution type electrode of the embodiment shown in FIG. 1;
【図３】本発明の第２の実施例を示す断面側面図であ
る。FIG. 3 is a sectional side view showing a second embodiment of the present invention.
【図４】従来のＦＰＣ・基板間接続構造を説明するため
の部分断面側面図である。FIG. 4 is a partial cross-sectional side view for explaining a conventional FPC / substrate connection structure.
１０，１０ａ〜１０ｃ 半田ボール ２０ 半田 ３０，３０ａ〜３０ｃ 絶縁フィルム ４０，４０ａ〜４０ｃ 突起分布型電極 ４１ 金属粒子 ４２ めっき層 ５０，５０ａ〜５０ｃ 粘着剤 １００，１００ａ 電子回路基板 １１０，１１０ａ 基板 １２０，１２０ａ〜１２０ｃ 電極配線 ２００，２００ａ，２００ｂ ＦＰＣ ２１０，２１１，２１２ フィルム基板 ２２０，２２０ａ パターン配線 ３００ ＦＰＣ接続用コネクタ ３１０ コンタクト ３１１ 端子部 ３１２ 接触アーム部 ３１３ 保持アーム部 ３２０ インシュレータ ３２１ ＦＰＣ嵌合部 ３３０ スライダ 10, 10a to 10c Solder ball 20 Solder 30, 30a to 30c Insulating film 40, 40a to 40c Projection distribution type electrode 41 Metal particle 42 Plating layer 50, 50a to 50c Adhesive 100, 100a Electronic circuit board 110, 110a substrate 120, 120a to 120c Electrode wiring 200, 200a, 200b FPC 210, 211, 212 Film substrate 220, 220a Pattern wiring 300 FPC connection connector 310 Contact 311 Terminal 312 Contact arm 313 Holding arm 320 Insulator 321 FPC fitting 330 Slider
Claims (2)
の複数のパターン配線とを対応接続するＦＰＣ・基板間
接続構造であって、次の各構成を有することを特徴とす
るＦＰＣ・基板間接続構造。 （イ）前記電子回路基板表面の複数の電極と対応接続す
る複数の半田ボール （ロ）前記電子回路基板表面の、前記複数の電極と対応
接続する複数の半田ボールの周囲に、これら複数の半田
ボールそれぞれの直径寸法より小さい厚さ寸法を有し、
前記複数の半田ボールの頂点部分がその表面から突出す
るように貼り付けられた絶縁フィルム （ハ）前記ＦＰＣの複数のパターン配線の、前記複数の
半田ボールと対応する部位に、多数の突起を表面に分布
させて付着形成された複数の突起分布型電極 （ニ）前記ＦＰＣ表面の、前記複数のパターン配線に付
着形成された複数の突起分布型電極の周囲と、前記絶縁
フィルムの表面とを貼り合わせて前記複数の半田ボール
と前記複数の突起分布型電極とを対応接続する粘着部材A plurality of electrodes on an electronic circuit board surface and an FPC
An FPC / substrate connection structure for correspondingly connecting a plurality of pattern wirings, wherein the FPC / substrate connection structure has the following configurations. (B) A plurality of solder balls correspondingly connected to a plurality of electrodes on the surface of the electronic circuit board. (B) A plurality of solder balls around the plurality of solder balls correspondingly connected to the plurality of electrodes on the surface of the electronic circuit board. Has a thickness smaller than the diameter of each ball,
An insulating film attached so that the apexes of the plurality of solder balls protrude from the surface thereof. (C) A plurality of protrusions are formed on the plurality of pattern wirings of the FPC at portions corresponding to the plurality of solder balls. (D) Affixing the periphery of the plurality of projection distribution electrodes attached to the plurality of pattern wirings on the surface of the FPC to the surface of the insulating film. An adhesive member for connecting the plurality of solder balls and the plurality of projection distribution electrodes together.
前記ＦＰＣのパターン配線表面に付着する予め定められ
た大きさの多数の粒子と、これらパターン配線表面の多
数の粒子付着部分を、これら多数の粒子を含んで覆うめ
っき層とから成る請求項１記載のＦＰＣ・基板間接続構
造。2. The method according to claim 1, wherein each of the plurality of projection distribution electrodes is
2. A method according to claim 1, further comprising a plurality of particles of a predetermined size adhering to the surface of the pattern wiring of the FPC, and a plating layer covering the particle attachment surface of the pattern wiring including the plurality of particles. FPC / substrate connection structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10174162A JPH11354221A (en) | 1998-06-05 | 1998-06-05 | Connecting structure between fpc and base board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10174162A JPH11354221A (en) | 1998-06-05 | 1998-06-05 | Connecting structure between fpc and base board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11354221A true JPH11354221A (en) | 1999-12-24 |
Family
ID=15973792
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10174162A Pending JPH11354221A (en) | 1998-06-05 | 1998-06-05 | Connecting structure between fpc and base board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11354221A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009139469A1 (en) * | 2008-05-16 | 2009-11-19 | 矢崎総業株式会社 | Crimp-type terminal for aluminum electric wire |
| JP2010153729A (en) * | 2008-12-26 | 2010-07-08 | Fujikura Ltd | Printed circuit board and method for manufacturing the same, and method of connecting the same |
-
1998
- 1998-06-05 JP JP10174162A patent/JPH11354221A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009139469A1 (en) * | 2008-05-16 | 2009-11-19 | 矢崎総業株式会社 | Crimp-type terminal for aluminum electric wire |
| JP2009277572A (en) * | 2008-05-16 | 2009-11-26 | Yazaki Corp | Crimp terminal for aluminum wire |
| JP2010153729A (en) * | 2008-12-26 | 2010-07-08 | Fujikura Ltd | Printed circuit board and method for manufacturing the same, and method of connecting the same |
| US8604354B2 (en) | 2008-12-26 | 2013-12-10 | Fujikura Ltd. | Printed wiring board, method of manufacturing printed wiring board, and method of connecting printed wiring board |
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