JPH11340588A - Flexible printed board - Google Patents
Flexible printed boardInfo
- Publication number
- JPH11340588A JPH11340588A JP14247298A JP14247298A JPH11340588A JP H11340588 A JPH11340588 A JP H11340588A JP 14247298 A JP14247298 A JP 14247298A JP 14247298 A JP14247298 A JP 14247298A JP H11340588 A JPH11340588 A JP H11340588A
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- circuit element
- flexible printed
- board
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の技術分野】本発明は、ＩＣ等の回路素子が実装
されたフレキシブルプリント基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible printed circuit board on which circuit elements such as an IC are mounted.
【０００２】[0002]
【従来の技術】プリント基板にＩＣやＬＳＩその他の回
路素子を実装したときに、それらの回路素子が正常に機
能するか否かの検査が行われる。この検査は、図３に示
すように、プリント基板３１の回路素子の実装面に回路
素子３２の端子３２ａと導通可能な検査ランド３３を設
け、この検査ランドにプローブ３４を接触させることに
より行われている。具体的には、プリント基板１の位置
決めをするために、支持台３５によって下からプリント
基板の検査ランド３３の背面を支持し、プローブによる
接触圧を一定にするようにしてある。2. Description of the Related Art When ICs, LSIs and other circuit elements are mounted on a printed circuit board, an inspection is performed to determine whether these circuit elements function properly. As shown in FIG. 3, this inspection is performed by providing an inspection land 33 that can conduct with the terminal 32a of the circuit element 32 on the mounting surface of the circuit element of the printed circuit board 31, and bringing the probe 34 into contact with the inspection land. ing. Specifically, in order to position the printed circuit board 1, the back surface of the inspection land 33 of the printed circuit board is supported by the support 35 from below, and the contact pressure by the probe is made constant.
【０００３】[0003]
【発明が解決しようとする課題】上記従来技術は、プリ
ント基板の面積に余裕があれば問題はないが、例えばカ
メラのプリント基板のように、面積を極端に小さくする
ことが求められているものについては、検査ランドの設
置スペースをとる余裕がなくなることが問題となってい
る。In the above prior art, there is no problem as long as the printed circuit board has a sufficient area, but it is required to make the area extremely small, for example, a printed circuit board of a camera. With regard to the above, there is a problem that there is no room for taking up the installation space for the inspection land.
【０００４】[0004]
【課題を解決するための手段】上記の問題を解決するた
めに、本発明は、プリント基板の回路素子の実装面の反
対側の面に回路素子の端子と導通可能に検査ランドを設
け、実装面側のスペースを節減してプリント基板の面積
の狭小化を図ってある。検査の際にはプリント基板を裏
返しに検査治具上に載置し、回路素子の実装面の反対側
の面に設けられた検査ランドにプローブを接触させるこ
とによって行われる。このとき、プリント基板を水平に
維持した状態でプローブが接触可能とするように検査治
具の載置面に回路素子の高さに対応する段差を設けるよ
うにしてある。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides an inspection land provided on a surface of a printed circuit board opposite to a surface on which a circuit element is mounted so as to be electrically connected to a terminal of the circuit element. The space on the surface side is reduced, and the area of the printed circuit board is reduced. The inspection is performed by placing the printed board upside down on an inspection jig and bringing a probe into contact with an inspection land provided on the surface opposite to the mounting surface of the circuit element. At this time, a step corresponding to the height of the circuit element is provided on the mounting surface of the inspection jig so that the probe can be contacted with the printed board kept horizontal.
【０００５】とくにフレキシブルプリント基板の場合に
は、回路素子の背面側をプローブで押圧するので、プロ
ーブの接触圧が所定値になるように回路素子の高さに合
わせて、プリント基板を水平に支持する段差を設けてあ
ることが重要である。Particularly, in the case of a flexible printed circuit board, since the back side of the circuit element is pressed by a probe, the printed circuit board is horizontally supported according to the height of the circuit element so that the contact pressure of the probe becomes a predetermined value. It is important that a step is provided.
【０００６】回路素子の実装面を下にして検査治具台上
に載置すると、検査ランドがプリント基板の上面に位置
するので、これに対してプローブを降下させて接触させ
ることにより回路素子の検査が可能となる。When the circuit element is placed on the inspection jig table with the mounting surface of the circuit element facing down, the inspection land is located on the upper surface of the printed circuit board. Inspection becomes possible.
【０００７】[0007]
【発明の実施の形態】本発明のフレキシブルプリント基
板は、プローブと接触可能な検査ランドが、回路素子の
実装面の反対側の面であって回路素子が位置する部分に
対応して設けてあるところに特徴がある。BEST MODE FOR CARRYING OUT THE INVENTION In a flexible printed board according to the present invention, an inspection land which can be brought into contact with a probe is provided on a surface opposite to a mounting surface of a circuit element and corresponding to a portion where the circuit element is located. There is a characteristic.
【０００８】[0008]
【実施例】以下本発明の一実施例について図面を参照し
て説明する。図１，２に示すように、フレキシブルプリ
ント基板１の一方の面にはＬＳＩやＩＣ等の回路素子
２，３が実装してある。回路素子の実装面１ａの反対側
の面の回路素子が位置する部分には検査ランド４，５が
設けてある。検査ランド４，５は、検査用プローブ６と
接触することにより回路素子の動作をチェックするため
のものであり、実装面側に位置する回路素子の端子部２
ａと導通可能としてある。検査ランド４，５が回路素子
の裏面側に設けられているため、フレキシブルプリント
基板１に設けられているにもかかわらず検査ランド４，
５の部分は回路素子により剛性が高くなっており、検査
用プローブ６との接触性をより確実にできる。An embodiment of the present invention will be described below with reference to the drawings. As shown in FIGS. 1 and 2, circuit elements 2 and 3 such as an LSI and an IC are mounted on one surface of the flexible printed circuit board 1. Inspection lands 4 and 5 are provided on a portion of the surface opposite to the mounting surface 1a of the circuit element where the circuit element is located. The inspection lands 4 and 5 are for checking the operation of the circuit element by contacting with the inspection probe 6, and the terminal portions 2 of the circuit element located on the mounting surface side.
a can be conducted. Since the inspection lands 4 and 5 are provided on the back surface side of the circuit element, the inspection lands 4 and 5 are provided although they are provided on the flexible printed circuit board 1.
The rigidity of the portion 5 is increased by the circuit element, so that the contact property with the inspection probe 6 can be further ensured.
【０００９】フレキシブルプリント基板１の検査は、図
示してあるように、回路素子の実装面１ａを下にして検
査治具７上にセットして行われる。検査治具７の上面
は、フレキシブルプリント基板１に実装されている回路
素子間の高さ（厚さ）に差がある場合には、それに対応
した段差７ａを設けて基板１が水平になるように配慮し
てある。図２は大きく描かれている方の回路素子（ＬＳ
Ｉ）２が小さく描かれている方の回路素子（ＩＣ）３よ
りも高さが高くなっているため、その差の分だけ検査治
具の上面の高さが異なるように段差７ａを設けてあるこ
とを示している。検査治具７は、フレキシブルプリント
基板の検査装置（図示略）内に交換可能に取り付けられ
ており、被検査フレキシブルプリント基板の種類が変わ
るごとに対応するものと交換するようにしてある。Inspection of the flexible printed circuit board 1 is performed by setting the circuit element mounting surface 1a on an inspection jig 7 as shown in the figure. If there is a difference in the height (thickness) between the circuit elements mounted on the flexible printed board 1, the upper surface of the inspection jig 7 is provided with a step 7 a corresponding to the difference so that the board 1 is horizontal. Is considered. FIG. 2 shows the circuit element (LS
I) Since the height of the circuit element (IC) 3 is smaller than that of the circuit element (IC) 3, the step 7a is provided so that the height of the upper surface of the inspection jig differs by the difference. It indicates that there is. The inspection jig 7 is exchangeably mounted in an inspection apparatus (not shown) for a flexible printed board, and is replaced with a corresponding one every time the type of the flexible printed board to be inspected changes.
【００１０】フレキシブルプリント基板１の検査は、検
査治具７上にフレキシブルプリント基板１の回路素子実
装面１ａ側を検査治具７上に当接するように載置した状
態で行われる。フレキシブルプリントケーブル１が所定
位置にセットされると、検査用プローブ６が降下して、
各先端部を検査ランド４，５に接触することにより回路
素子と検査装置との導通が可能となる。これらの両者間
の導通により検査装置の計器が反応してフレキシブルプ
リント基板１に実装された回路素子のチェックが行われ
る。なお、被検査用回路素子の数が増加して、これらの
高さに幾通りもの差があるような場合には、これに対応
する段差を有する検査治具を用いればよい。また、検査
ランドが回路素子の裏面側に設けられていて剛性がある
ため、検査治具７は必ずしも必要ではない。The inspection of the flexible printed circuit board 1 is performed in a state where the circuit element mounting surface 1a side of the flexible printed circuit board 1 is placed on the inspection jig 7 so as to be in contact with the inspection jig 7. When the flexible printed cable 1 is set at a predetermined position, the inspection probe 6 descends,
By contacting each tip with the inspection lands 4 and 5, conduction between the circuit element and the inspection device becomes possible. The meter of the inspection apparatus reacts due to the conduction between the two, and the circuit element mounted on the flexible printed circuit board 1 is checked. In the case where the number of circuit elements to be inspected increases and the heights of the circuit elements are variously different, an inspection jig having a step corresponding to the difference may be used. In addition, since the inspection land is provided on the back side of the circuit element and has rigidity, the inspection jig 7 is not necessarily required.
【００１１】[0011]
【発明の効果】本発明によれば、検査ランドがフレキシ
ブルプリント基板の回路素子の実装面の反対側でかつ回
路素子が位置する部分に対応するように設けてあるの
で、回路素子の実装面側における検査ランドやそれへの
接続回路のスペースが節減可能となる。これによりフレ
キシブルプリント基板を小さくでき、カメラなど小形機
器への組み込み容易なフレキシブルプリント基板を提供
可能となる。また、回路素子の裏面側に検査ランドが設
けられているために検査ランドの部分の剛性が高くな
り、検査プローブの接触性が良くなる。According to the present invention, the inspection land is provided on the opposite side of the mounting surface of the circuit element of the flexible printed circuit board so as to correspond to the portion where the circuit element is located. In this case, the space for the inspection land and the connection circuit for the inspection land can be saved. As a result, the size of the flexible printed circuit board can be reduced, and a flexible printed circuit board that can be easily incorporated into a small device such as a camera can be provided. In addition, since the inspection land is provided on the back surface side of the circuit element, the rigidity of the inspection land is increased, and the contact property of the inspection probe is improved.
【図１】回路素子の実装面を下側にして検査治具上に載
置されている状態を示す平面図である。FIG. 1 is a plan view showing a state where a circuit element is mounted on an inspection jig with a mounting surface of the circuit element facing down.
【図２】高さを異にする回路素子を実装したフレキシブ
ルプリント基板が回路素子実装面を下側にして検査治具
上に載置した状態を示す断面図である。FIG. 2 is a cross-sectional view showing a state in which a flexible printed circuit board on which circuit elements having different heights are mounted is placed on an inspection jig with the circuit element mounting surface facing down.
【図３】従来技術における基板の検査例を示す斜視図で
ある。FIG. 3 is a perspective view showing an example of inspection of a substrate in a conventional technique.
１ フレキシブルプリント基板 １ａ 実装面 ２，３ 回路素子 ４，５ 検査ランド ６ プローブ DESCRIPTION OF SYMBOLS 1 Flexible printed circuit board 1a Mounting surface 2, 3 Circuit element 4, 5 Inspection land 6 Probe
Claims (1)
が、回路素子の実装面の反対側の面であって上記回路素
子が位置する部分に対応して設けてあることを特徴とす
るフレキシブルプリント基板。1. A flexible print, wherein an inspection land capable of contacting an inspection probe is provided on a surface opposite to a mounting surface of a circuit element and corresponding to a portion where the circuit element is located. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14247298A JPH11340588A (en) | 1998-05-25 | 1998-05-25 | Flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14247298A JPH11340588A (en) | 1998-05-25 | 1998-05-25 | Flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11340588A true JPH11340588A (en) | 1999-12-10 |
Family
ID=15316125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14247298A Withdrawn JPH11340588A (en) | 1998-05-25 | 1998-05-25 | Flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11340588A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7145351B2 (en) | 2003-01-23 | 2006-12-05 | Yamaha Fine Technologies Co., Ltd | Electrical inspection apparatus |
| US7358750B2 (en) | 2003-01-17 | 2008-04-15 | Yamaha Fine Technologies Co., Ltd. | Inspection apparatus for printed board |
-
1998
- 1998-05-25 JP JP14247298A patent/JPH11340588A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7358750B2 (en) | 2003-01-17 | 2008-04-15 | Yamaha Fine Technologies Co., Ltd. | Inspection apparatus for printed board |
| US7145351B2 (en) | 2003-01-23 | 2006-12-05 | Yamaha Fine Technologies Co., Ltd | Electrical inspection apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040512 |
|
| A761 | Written withdrawal of application |
Effective date: 20060224 Free format text: JAPANESE INTERMEDIATE CODE: A761 |