JPH11335859A - Composite gold plating film, its production and electrical contact having the composite gold plating film - Google Patents
Composite gold plating film, its production and electrical contact having the composite gold plating filmInfo
- Publication number
- JPH11335859A JPH11335859A JP14407598A JP14407598A JPH11335859A JP H11335859 A JPH11335859 A JP H11335859A JP 14407598 A JP14407598 A JP 14407598A JP 14407598 A JP14407598 A JP 14407598A JP H11335859 A JPH11335859 A JP H11335859A
- Authority
- JP
- Japan
- Prior art keywords
- gold
- composite
- plating
- gold plating
- fluorine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は複合金めっき処理技
術に属し、例えば、電気接点表面のめっき処理等に特に
適した複合金めっき処理技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite gold plating technique, and more particularly to a composite gold plating technique particularly suitable for plating a surface of an electric contact.
【０００２】[0002]
【従来の技術】コネクタ、プリント回路基板、機器スリ
ップリング、スイッチ、バッテリその他の電流輸送デバ
イスには、電子機器の接続若しくは断続を可能にする電
気接点が用いられている。これら電気接点の接触面に
は、安定した接続若しくは断続を維持するための各種表
面処理がなされており、通常、接触電気抵抗が低く且つ
耐摩耗性に優れた貴金属めっきが用いられる。そして、
特に信頼性が要求される電気接点には、前記貴金属めっ
きの中でも汚染により酸化被膜等が生成する心配の少な
い金めっきが用いられる。2. Description of the Related Art Electrical contacts for connecting or disconnecting electronic equipment are used in connectors, printed circuit boards, equipment slip rings, switches, batteries and other current transport devices. The contact surfaces of these electric contacts are subjected to various surface treatments for maintaining stable connection or intermittent connection. Usually, noble metal plating having low contact electric resistance and excellent wear resistance is used. And
Particularly, for the electrical contact requiring reliability, gold plating, which is less likely to form an oxide film due to contamination among the noble metal plating, is used.
【０００３】このように前記接触面を金めっき処理する
場合は、まず素地金属をニッケルめっき処理又はコバル
トめっき処理することで下地層を作成し、その上から金
めっき処理することが一般的である。これら下地層は、
金めっきの密着性を向上させるとともに該金めっきに孔
が生じた場合にも素地金属の腐食を防止し、更にはその
高い硬度により金めっきの耐摩耗性を向上させる。When the contact surface is subjected to gold plating as described above, it is general that a base metal is first subjected to nickel plating or cobalt plating to form an underlayer, and then gold plating is performed thereon. . These underlayers
In addition to improving the adhesion of the gold plating, corrosion of the base metal is prevented even when holes are formed in the gold plating, and the high hardness improves the wear resistance of the gold plating.
【０００４】また、前記金めっき処理としては、近年、
無電解金めっき法が多く用いられている。該無電解金め
っき法は電流を使用しないため素地表面上の電流密度分
布を考慮する必要がなく、めっき浴を管理するだけで均
一な厚みで均質な金めっき皮膜が得られるといった特徴
がある。In recent years, the gold plating process has been
Electroless gold plating is often used. Since the electroless gold plating method does not use a current, there is no need to consider the current density distribution on the surface of the substrate, and a characteristic is that a uniform gold plating film having a uniform thickness can be obtained only by controlling the plating bath.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、以上の
如き優れた金めっき処理を施した電気接点も、水分、そ
の他の汚れが付着する可能性が高い環境下で使用される
場合には容易に電気瞬断等の接触不良が生じていた。However, the electrical contacts which have been subjected to the excellent gold plating as described above can easily be used in an environment where there is a high possibility that moisture or other dirt is likely to adhere. Poor contact such as instantaneous interruption has occurred.
【０００６】本発明はかかる現況に鑑みてなされたもの
で、汚れが付着し難く付着しても容易に除去できるとと
もに金本来の低い接触電気抵抗及び優れた耐摩耗性を維
持できる電気接点の金めっき処理技術を提供せんとする
ものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and it is difficult to adhere dirt, and it is possible to easily remove dirt and to maintain the original low contact electric resistance and excellent wear resistance of gold. It is intended to provide plating processing technology.
【０００７】[0007]
【課題を解決するための手段】本発明者は前述の課題を
解決するにあたり鋭意検討を進めた結果、ニッケルめっ
きに対して既に実績のあるフッ素系高分子化合物を金と
複合させることで金めっき皮膜表面上に撥水性をもたせ
ることができ、更に、最終的に熱処理を施すことによっ
て１４０度の水の接触角と１．０Ω以下の接触電気抵抗
を同時に実現にできるとの予測に基づき、本発明を完成
するに至った。Means for Solving the Problems As a result of diligent studies for solving the above-mentioned problems, the present inventor has developed a gold plating by combining a fluorine-based polymer compound that has already been used for nickel plating with gold. Based on the prediction that water repellency can be imparted to the surface of the film, and that the contact angle of water and the contact electric resistance of 1.0 Ω or less can be simultaneously realized by finally performing the heat treatment. The invention has been completed.
【０００８】すなわち本発明は、金又はフッ素系高分子
化合物との付着性が向上する下地層を上面に設けた素材
にめっき処理を施して金並びにフッ素系高分子化合物を
共析させた複合金めっき皮膜であって、２２０〜３６０
℃の熱処理を施したことを特徴とする複合金めっき皮膜
を提供することにある。ここに前記金との付着性が向上
する下地層とは通常金めっきの下地処理として用いられ
るニッケルストライク等の前処理以外に、例えば素材表
面をスパッタリングやエッチングしてなる表面層をも含
むものである。また、前記熱処理温度は使用するフッ素
系高分子化合物の溶融温度に密接に関連付けられたもの
であり、例えば該フッ素系高分子化合物としてＰＴＦＥ
を用いた場合には３３０〜３６０℃が好ましい範囲とな
る。このような複合金めっき皮膜にあっては、前記熱処
理によりフッ素系高分子化合物が溶融し表面上で網目状
に結合することで、該表面上に十分な撥水性及び低摩擦
性をもたらし、水分等の汚れが付着することを未然に防
止するとともに万一汚れが付着したとしても容易に剥離
させる。[0008] That is, the present invention provides a composite gold in which gold and a fluoropolymer are co-deposited by subjecting a material provided with an underlayer on the upper surface thereof having improved adhesion to gold or a fluoropolymer to a plating treatment. A plating film, 220 to 360
An object of the present invention is to provide a composite gold plating film characterized by having been subjected to a heat treatment at a temperature of ° C. Here, the underlayer improving the adhesion to gold includes a surface layer formed by, for example, sputtering or etching the surface of the material, in addition to a pretreatment such as nickel strike which is usually used as a base treatment for gold plating. Further, the heat treatment temperature is closely related to the melting temperature of the fluorine-based polymer used, and for example, PTFE is used as the fluorine-based polymer.
When (3) is used, the range is preferably 330 to 360 ° C. In such a composite gold-plated film, the heat treatment causes the fluorine-based polymer compound to melt and bond in a mesh on the surface, thereby providing sufficient water repellency and low friction on the surface, and In addition, it is possible to prevent the adhesion of dirt such as beforehand and to easily peel off even if dirt adheres.
【０００９】ここで、前記下地層は、無電解めっき処理
によりニッケル並びにフッ素系高分子化合物が共析した
複合ニッケルめっき層であることが好ましい。このよう
な下地層を有する複合金めっき皮膜にあっては、前記下
地層内のフッ素系高分子化合物がその表面移行性によっ
て複合金めっき皮膜に拡散移行し、結果として該複合金
めっき皮膜の撥水性を増大させる。そして前記下地層の
ニッケルが前記複合金めっき皮膜の密着性を向上させる
とともに、熱処理によって前記複合ニッケルめっき層の
硬度が増大することで前記複合金めっき皮膜の機械的強
度が増大し耐久性が向上する。Here, it is preferable that the underlayer is a composite nickel plating layer in which nickel and a fluorine-containing polymer compound are eutectoid by electroless plating. In a composite gold plating film having such an underlayer, the fluorine-based polymer compound in the underlayer diffuses and transfers to the composite gold plating film due to its surface migration, and as a result, the repellency of the composite gold plating film is increased. Increase aqueous. The nickel of the underlayer improves the adhesion of the composite gold plating film, and the heat treatment increases the hardness of the composite nickel plating layer, thereby increasing the mechanical strength of the composite gold plating film and improving the durability. I do.
【００１０】このような複合金めっき皮膜は、前記下地
層を置換金めっき処理してなる第１金系めっき層と、該
第１金系めっき層表面をめっき処理して金とフッ素系高
分子化合物を共析させた第２金系めっき層とからなるこ
とが好ましい。ここに置換金めっき処理とは、めっき浴
中に浸漬したイオン化傾向の大きい金属が溶出する際に
遊離する電子によって浴中の金イオンを還元析出させる
成膜技術であって、金によって下地層が完全に被覆され
た時点で反応が停止する。したがって、前記置換金めっ
き処理のみでは厚い皮膜を得ることができないが、本発
明の場合には該第１金系めっき層の上に第２金系めっき
層を形成しているので、複合金めっき皮膜全体の厚みが
調整され、下地層の露出度を減少させている。ここで、
前記下地層がニッケル並びにフッ素系高分子化合物を共
析してなる複合ニッケルめっき層である場合には、該下
地層を置換金めっき処理した前記第１金系めっき層には
該下地層のフッ素系高分子化合物が析出することとな
り、結果的に前記複合金めっき皮膜の表面上に析出する
フッ素系高分子化合物の量が増大して撥水性が向上す
る。[0010] Such a composite gold plating film comprises a first gold-based plating layer obtained by subjecting the underlayer to displacement gold plating, and gold and a fluorine-based polymer obtained by plating the surface of the first gold-based plating layer. It preferably comprises a second gold-based plating layer on which a compound is eutectoid. Here, the displacement gold plating treatment is a film formation technique in which gold ions in the bath are reduced and precipitated by electrons released when a metal having a high ionization tendency immersed in the plating bath elutes, and the underlying layer is made of gold. The reaction stops when it is completely covered. Therefore, a thick film cannot be obtained only by the displacement gold plating treatment, but in the case of the present invention, since the second gold plating layer is formed on the first gold plating layer, the composite gold plating The thickness of the entire coating is adjusted to reduce the degree of exposure of the underlayer. here,
In the case where the underlayer is a composite nickel plating layer obtained by eutectoidizing nickel and a fluorine-based polymer compound, the first gold-based plating layer obtained by subjecting the underlayer to displacement gold plating has a fluorine content of the underlayer. As a result, the amount of the fluorine-based polymer compound deposited on the surface of the composite gold plating film is increased, and the water repellency is improved.
【００１１】以上の複合金めっき皮膜は、水の接触角に
して１００〜１４０度の撥水性を有していることが好ま
しい。ここに、水の接触角は、図３に示す如く、複合金
めっき皮膜２１の表面２１ｅにおける水滴２２の接線２
２ｆが前記表面２１ｅとの間でなす角αで定義され、該
接触角αが１００度より小さいと表面上に汚れ等が付着
しやすく付着した汚れは容易に落とすことができない。
この水の接触角が大きいほど撥水性に優れていることに
なるが、該撥水性は複合金めっき皮膜表面及びその近傍
に位置する絶縁性のフッ素系高分子化合物によるもので
あり、本発明においては１００〜１４０度が好ましい範
囲である。The above-described composite gold plating film preferably has a water repellency of 100 to 140 degrees in terms of a contact angle of water. Here, the contact angle of water is, as shown in FIG. 3, the tangential line 2 of the water droplet 22 on the surface 21e of the composite gold plating film 21.
2f is defined by an angle α formed between the surface 21e and the surface 21e. If the contact angle α is smaller than 100 degrees, dirt or the like easily adheres to the surface and the adhered dirt cannot be easily removed.
The greater the contact angle of water, the better the water repellency, but the water repellency is due to the insulating fluorine-based polymer compound located on the surface of the composite gold plating film and in the vicinity thereof. Is a preferable range of 100 to 140 degrees.
【００１２】このような複合金めっき皮膜は、製造方法
的には、素材表面上の不純物を除去する洗浄工程と、前
記洗浄した素材に表面処理を施して金又はフッ素系高分
子化合物の付着性が向上する下地層を形成する下地処理
工程と、前記下地処理した素材にめっき処理を施して金
並びにフッ素系高分子化合物を共析させた複合金めっき
皮膜を形成する複合金めっき処理工程と、前記複合金め
っき皮膜を２２０〜３６０℃で熱処理する熱処理工程と
からなる。ここに、前記洗浄工程は、通常の金めっき処
理で行われる脱脂、酸洗い、水洗い等を必要に応じて行
うものであり、また、前記洗浄工程以外の各工程間でも
必要に応じて水洗い等簡単な洗浄を行う。更に、前記下
地処理工程は前述の複合金めっき皮膜の場合と同様に、
ニッケルストライク等の通常行われる前処理以外に、例
えば素材表面をスパッタリングやエッチングすることも
含まれる。このような製造方法にあっては、表面に十分
な撥水性及び低摩擦性を有する複合金めっき皮膜が実現
できる。In terms of the production method, such a composite gold plating film has a cleaning step of removing impurities on the surface of the material, and a surface treatment of the cleaned material to adhere gold or fluorine-based polymer compound. An undercoat treatment step of forming an undercoat layer to be improved, and a composite gold plating treatment step of applying a plating treatment to the undertreated material to form a composite gold plating film in which gold and a fluorine-based polymer compound are codeposited, A heat treatment step of heat treating the composite gold plating film at 220 to 360 ° C. Here, the washing step is to perform degreasing, pickling, washing with water and the like performed in a normal gold plating process as needed, and also washing with water between steps other than the washing step as necessary. Perform a simple wash. Further, the undercoating step is performed in the same manner as in the case of the composite gold plating film described above.
In addition to the usual pretreatment such as nickel strike, for example, sputtering or etching of the material surface is also included. According to such a manufacturing method, a composite gold plating film having sufficient water repellency and low friction on the surface can be realized.
【００１３】ここで、前記下地処理工程が、洗浄した素
材に無電解めっき処理を施してニッケル並びにフッ素系
高分子化合物を共析させた複合ニッケルめっき層を形成
する工程であることが好ましい。このような下地処理工
程により形成された前記複合ニッケルめっき層には十分
量のフッ素系高分子化合物が共析しており、該フッ素系
高分子化合物は前記複合ニッケルめっき層上に形成され
る複合金めっき皮膜内に拡散浸透してその表面に十分な
撥水性を齎す。また該複合ニッケルめっき層は前記熱処
理により極度に硬化するため、該複合ニッケルめっき層
上に形成される複合金めっき皮膜の機械的強度が増大す
る。そしてニッケルは金との密着性に優れており、前記
複合金めっき皮膜の剥離を未然に防止する。Here, it is preferable that the undercoating step is a step of subjecting the washed material to electroless plating to form a composite nickel plating layer in which nickel and a fluorine-based polymer compound are codeposited. A sufficient amount of a fluorine-based polymer compound is eutectoid in the composite nickel plating layer formed by such a base treatment step, and the fluorine-based polymer compound is formed on the composite nickel plating layer. It diffuses and penetrates into the gold plating film to bring sufficient water repellency to its surface. Further, since the composite nickel plating layer is extremely hardened by the heat treatment, the mechanical strength of the composite gold plating film formed on the composite nickel plating layer increases. Nickel has excellent adhesion to gold, and prevents peeling of the composite gold plating film.
【００１４】また、前記複合金めっき処理工程が、下地
処理した素材に置換金めっき処理を施して金を析出させ
た第１金系めっき層を形成する置換金めっき処理ステッ
プと、前記第１金系めっき層表面にめっき処理を施して
金並びにフッ素系高分子化合物を共析させた第２金系め
っき層を形成する複合金めっき処理ステップとからなる
工程であることが好ましい。このような複合金めっき処
理工程により形成された複合金めっき皮膜は下地層の金
属を金に置き換えた前記第１金系めっき層が該下地層と
強固に密着しており、さらに該第１金系めっき層上に形
成される第２金系めっき層も金の上に成膜することとな
るため、全体として密着性が向上する。また前記第１金
系めっき層は下地層を完全に被覆した時点で成膜を終了
するので厚い層を得ることができないが、前記第２金系
めっき層により複合金めっき皮膜全体の厚みが調整さ
れ、下地層の露出度を減少させている。ここで、前記下
地層がニッケル並びにフッ素系高分子化合物を共析して
なる複合ニッケルめっき層である場合には、該下地層を
置換金めっき処理した前記第１金系めっき層には該下地
層のフッ素系高分子化合物が析出することとなり、結果
的に複合金めっき皮膜の表面に析出するフッ素系高分子
化合物の量が増大して撥水性が向上する。The composite gold plating step may include a displacement gold plating step of forming a first gold-based plating layer by depositing gold by subjecting the base-treated material to displacement gold plating; Preferably, the process comprises a composite gold plating step of forming a second gold-based plating layer by subjecting the surface of the system-based plating layer to plating to form a second gold-based plating layer in which gold and a fluorine-based polymer compound are co-deposited. In the composite gold plating film formed by such a composite gold plating process, the first gold-based plating layer in which the metal of the underlying layer is replaced with gold is firmly adhered to the underlying layer, and Since the second gold-based plating layer formed on the system-based plating layer is also formed on gold, the adhesion is improved as a whole. The first gold-based plating layer cannot be formed as a thick layer because the film formation is completed when the underlying layer is completely covered, but the thickness of the entire composite gold plating film is adjusted by the second gold-based plating layer. Thus, the degree of exposure of the underlayer is reduced. Here, when the underlayer is a composite nickel plating layer obtained by codepositing nickel and a fluorine-based polymer compound, the first gold plating layer obtained by subjecting the underlayer to displacement gold plating has The fluorine-based polymer compound of the formation layer is deposited, and as a result, the amount of the fluorine-based polymer compound deposited on the surface of the composite gold plating film is increased, and the water repellency is improved.
【００１５】以上の製造方法によると、複合金めっき皮
膜の表面に水の接触角にして１００〜１４０度の撥水性
が得られ、更に該撥水性に加えて、固有抵抗が２．５〜
３．０×１０-6Ω・ｃｍ且つ接触電気抵抗が０．０５〜
１．０Ωの低い電気抵抗率が実現できる。ここに前記接
触電気抵抗とは、接触針により前記複合金めっき皮膜に
加える荷重を２〜８ｇまで変化させた際の接触抵抗をミ
リオームメータで読み取ったものである。According to the above-described production method, water repellency of 100 to 140 degrees in terms of the contact angle of water is obtained on the surface of the composite gold plating film.
3.0 × 10 −6 Ω · cm and contact electric resistance is 0.05-
A low electrical resistivity of 1.0Ω can be realized. Here, the contact electric resistance is obtained by reading a contact resistance with a milliohm meter when a load applied to the composite gold plating film by a contact needle is changed from 2 to 8 g.
【００１６】そして、以上にしてなる複合金めっき皮膜
を電気接点の表面皮膜として用いた場合には、該電気接
点の表面上には金本来の低い接触電気抵抗に加えて優れ
た撥水性、耐摩耗性及び耐食性が齎される。具体的に
は、水の接触角にして１００〜１４０度の撥水性と２．
５〜３．０×１０-6Ω・ｃｍの固有抵抗、０．０５〜
１．０Ωの接触電気抵抗を同時に達成した電気接点が実
現され、汚れ等が付着しやすい環境下において微弱な電
流を扱う場合にも、電気瞬断を未然に防止し安定した通
電性を確保できる。When the composite gold plating film formed as described above is used as a surface film of an electric contact, the surface of the electric contact has excellent water repellency and resistance in addition to the low contact electric resistance inherent to gold. Abrasion and corrosion resistance are provided. Specifically, the water repellency of 100 to 140 degrees as the contact angle of water and 2.
Specific resistance of 5 to 3.0 × 10 −6 Ω · cm, 0.05 to
An electrical contact that simultaneously achieves a contact electrical resistance of 1.0 Ω is realized, and even when handling a weak current in an environment where dirt or the like is likely to adhere, electrical momentary interruption can be prevented and stable electrical conductivity can be secured. .
【００１７】[0017]
【発明の実施の形態】次に本発明の詳細を図示した実施
例に基づき説明する。図１に示す如く、複合金めっき皮
膜１は金又はフッ素系高分子化合物との付着性が向上す
る下地層３を上面に設けた電気接点２にめっき処理を施
して、金６ａ並びにフッ素系高分子化合物微粒子６ｃを
共析して形成され、本実施例における前記下地層３は、
ニッケルめっき液中にフッ素系高分子化合物微粒子を界
面活性剤で分散させためっき液を用いて電気接点２表面
に無電解めっき処理を施しニッケル４ｂとフッ素系高分
子化合物微粒子４ｃを共析させて形成した複合ニッケル
めっき層４であり、前記複合金めっき皮膜１は、該複合
ニッケルめっき層４を置換金めっき処理してなる第１金
系めっき層５と、金めっき液中にフッ素系高分子化合物
微粒子を界面活性剤で分散させためっき液を用いて前記
第１金系めっき層５表面に無電解めっき処理を施し金６
ａとフッ素系高分子化合物微粒子６ｃを共析させて形成
した第２金系めっき層６とから構成されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The details of the present invention will now be described with reference to the illustrated embodiments. As shown in FIG. 1, a composite gold plating film 1 is subjected to a plating process on an electric contact 2 provided with an underlayer 3 on the upper surface thereof, which improves the adhesion to gold or a fluorine-based polymer compound, to form a gold layer 6a and a fluorine-based high layer. The underlayer 3 in the present embodiment is formed by eutecting molecular compound fine particles 6c.
Electroless plating is performed on the surface of the electrical contact 2 using a plating solution in which fluorine-based polymer compound fine particles are dispersed in a nickel plating solution with a surfactant, and nickel 4b and fluorine-based polymer compound fine particles 4c are co-deposited. The composite nickel plating layer 1 is formed, and the composite gold plating film 1 includes a first gold plating layer 5 obtained by subjecting the composite nickel plating layer 4 to displacement gold plating, and a fluoropolymer in a gold plating solution. Electroless plating is performed on the surface of the first gold-based plating layer 5 using a plating solution in which compound fine particles are dispersed with a surfactant, and gold 6
a and the second gold-based plating layer 6 formed by co-depositing the fluorine-based polymer compound fine particles 6c.
【００１８】前記フッ素系高分子化合物としては、炭化
水素基の水素部分を全て若しくはその一部をフッ素に置
換したパーフルオロアルキル基若しくはポリフルオロア
ルキル基を有する高分子化合物が好ましく、その中でも
ポリテトラフルオロエチレン、ポリクロロトリフルオロ
エチレン、ポリフッ化ビニリデン、テトラフルオロエチ
レン−ヘキサフルオロプロピレン共重合体の１種若しく
は２種以上を用いることが好ましい。特に、前記ポリテ
トラフルオロエチレン（以下、単に「ＰＴＦＥ」と称
す。）を用いることが入手しやすい点で好ましい。As the fluorine-based polymer compound, a polymer compound having a perfluoroalkyl group or a polyfluoroalkyl group in which all or part of the hydrogen portion of a hydrocarbon group is substituted with fluorine is preferable. It is preferable to use one or more of fluoroethylene, polychlorotrifluoroethylene, polyvinylidene fluoride, and tetrafluoroethylene-hexafluoropropylene copolymer. In particular, it is preferable to use the polytetrafluoroethylene (hereinafter, simply referred to as “PTFE”) because it is easily available.
【００１９】また、前記ニッケルめっき液は、還元剤と
しての次亜リン酸塩及び錯化剤を添加することで前記複
合ニッケルめっき層４中にリンを均一に析出するものが
好ましい。このようにリンを均一に析出することで複合
ニッケルめっき層４の耐食性が著しく向上する。It is preferable that the nickel plating solution uniformly precipitates phosphorus in the composite nickel plating layer 4 by adding hypophosphite and a complexing agent as a reducing agent. By thus uniformly depositing phosphorus, the corrosion resistance of the composite nickel plating layer 4 is significantly improved.
【００２０】前記複合金めっき皮膜１の構成要素である
第１金系めっき層５は、置換金めっき処理により前記複
合ニッケルめっき層４表面及びその近傍のニッケル４ｂ
を金５ａに置換して形成されるため、その主成分は金５
ａ及びフッ素系高分子化合物微粒子５ｃとなり、金とフ
ッ素系高分子化合物の複合皮膜を実現している。The first gold-based plating layer 5, which is a component of the composite gold plating film 1, is subjected to displacement gold plating to form a nickel 4b on the surface of the composite nickel plating layer 4 and in the vicinity thereof.
Is replaced with gold 5a, and its main component is gold 5a.
a and the fluorine-based polymer compound fine particles 5c to realize a composite film of gold and a fluorine-based polymer compound.
【００２１】しかし、前記置換金めっき処理は、めっき
液中に浸漬した複合ニッケルめっき層４のニッケル４ｂ
が溶出する際に遊離する電子によって溶液中の金イオン
を還元析出するものであり、前記複合ニッケルめっき層
４表面が完全に金５ａで被覆された時点で反応が停止す
るため達成される層の厚みには限界がある。そこで、本
実施例においては前記第１金系めっき層５表面に更に無
電解金めっき処理を施した第２金系めっき層６が形成さ
れる。前記無電解金めっき処理において金めっき液中の
フッ素系高分子化合物微粒子を分散させる界面活性剤と
しては、カチオン系活性剤１Ｆ若しくはノニオン・カチ
オン混合系活性剤を使用することが好ましい。このよう
な活性剤は金めっき浴中でのフッ素系高分子化合物の凝
集を最小限に抑え、結果として前記第２金系めっき層６
に略３０体積％のフッ素系高分子化合物を共析させるこ
とが可能となる。However, the displacement gold plating is performed by the nickel 4b of the composite nickel plating layer 4 immersed in a plating solution.
Is used for reducing and precipitating gold ions in the solution by the electrons released when eluting. The reaction is stopped when the surface of the composite nickel plating layer 4 is completely covered with gold 5a. There is a limit to the thickness. Therefore, in this embodiment, a second gold-based plating layer 6 is further formed on the surface of the first gold-based plating layer 5 by electroless gold plating. As the surfactant for dispersing the fluorine-containing polymer compound fine particles in the gold plating solution in the electroless gold plating treatment, it is preferable to use a cationic surfactant 1F or a nonionic / cation mixed surfactant. Such an activator minimizes aggregation of the fluorine-based polymer compound in the gold plating bath, and as a result, the second gold-based plating layer 6
Approximately 30% by volume of a fluorine-based polymer compound can be co-deposited.
【００２２】以上にしてなる複合金めっき皮膜１を有す
る電気接点２は、２２０〜３６０℃の熱処理を施すこと
で該表面に水の接触角で１００〜１４０度の撥水性、
２．５〜３．０×１０-6Ω・ｃｍの固有抵抗及び０．０
５〜１．０Ωの接触電気抵抗を実現しており、表面に水
分その他の汚れが付着することを防止しつつ、金めっき
本来の低接触電気抵抗を達成し、電気瞬断を未然に防止
して安定した通電性を確保できる。また、前記熱処理に
よって複合金めっき皮膜１の下地層３である複合ニッケ
ルめっき層４の機械的強度が著しく向上するため、該複
合金めっき皮膜１の耐摩耗性及び耐久性が向上する。The electrical contact 2 having the composite gold plating film 1 formed as described above is subjected to a heat treatment at 220 to 360 ° C. so that the surface has a water repellency of 100 to 140 degrees in terms of a contact angle of water.
2.5-3.0 × 10 −6 Ω · cm specific resistance and 0.0
Achieving a contact electric resistance of 5 to 1.0 Ω, preventing the adhesion of moisture and other dirt to the surface, achieving the original low contact electric resistance of gold plating, and preventing electrical momentary interruption. As a result, stable electric conductivity can be secured. Moreover, the mechanical strength of the composite nickel plating layer 4 which is the underlayer 3 of the composite gold plating film 1 is significantly improved by the heat treatment, so that the wear resistance and durability of the composite gold plating film 1 are improved.
【００２３】尚、本発明における下地層は複合ニッケル
めっき層４に限定されるものではなく、例えばニッケル
合金めっき層やコバルト合金めっき層も金との付着性が
向上する点で好ましい実施例である。また、前記第２金
系めっき層６に関しても、無電解めっき処理に限らず電
解金めっき処理を施してなるものも好ましい。The underlayer in the present invention is not limited to the composite nickel plating layer 4. For example, a nickel alloy plating layer or a cobalt alloy plating layer is a preferred embodiment in that the adhesion to gold is improved. . Also, the second gold-based plating layer 6 is not limited to the electroless plating process, but may preferably be one that has been subjected to an electrolytic gold plating process.
【００２４】次に、本発明の複合金めっき皮膜の製造方
法を図２に基づいて説明する。Next, a method for producing a composite gold plating film of the present invention will be described with reference to FIG.
【００２５】本実施例においては、先ず洗浄工程７にお
いて電気接点１２表面上の不純物１２ｄを除去する。具
体的には、浸漬脱脂剤を使用したアルカリ浸漬脱脂を
常温で５分間行ない、水酸化ナトリウムを加えた電解
脱脂剤を使用して陰極電解脱脂を常温で５分間行ない、
１０重量％の塩酸を使用した酸洗を常温で１分間行な
い、塩化ニッケルと塩酸を使用したニッケルストライ
クを常温で１分間行なう。尚、これら各処理を終了する
毎に水洗を行なう。In this embodiment, first, in the cleaning step 7, the impurities 12d on the surface of the electrical contact 12 are removed. Specifically, alkali immersion degreasing using an immersion degreasing agent is performed at room temperature for 5 minutes, and cathodic electrolytic degreasing is performed at room temperature for 5 minutes using an electrolytic degreasing agent to which sodium hydroxide is added,
Pickling using 10% by weight of hydrochloric acid is performed at room temperature for 1 minute, and nickel strike using nickel chloride and hydrochloric acid is performed at room temperature for 1 minute. Note that washing is performed each time these processes are completed.
【００２６】次に、ＰＴＦＥ微粒子を界面活性剤で分散
させた無電解Ｎｉ−Ｐめっき浴を用いて複合ニッケルめ
っき層１４を形成する下地処理工程８を行なう。めっき
処理時の浴条件は、浴温が８８〜９２℃、好ましくは
９０〜９１℃、浴比が０．５〜１．５ｄｍ2 ／Ｌ、好
ましくは略０．８ｄｍ2 ／Ｌ、ニッケル濃度が４．６
〜５．１ｇ／Ｌ、好ましくは４．９〜５．０ｇ／Ｌ、
ｐＨが４．８〜５．２、好ましくは４．９〜５．１であ
る。この下地処理工程８によって略２．０μｍ厚の複合
ニッケルめっき層１４が形成され、該複合ニッケルめっ
き層１４には略３２体積％のＰＴＦＥ微粒子１４ｃが含
有する。Next, a base treatment step 8 of forming a composite nickel plating layer 14 using an electroless Ni-P plating bath in which PTFE fine particles are dispersed with a surfactant is performed. The bath conditions during the plating treatment are as follows: a bath temperature of 88 to 92 ° C, preferably 90 to 91 ° C, a bath ratio of 0.5 to 1.5 dm 2 / L, preferably about 0.8 dm 2 / L, and a nickel concentration of 4.6
To 5.1 g / L, preferably 4.9 to 5.0 g / L,
pH is 4.8-5.2, preferably 4.9-5.1. The composite nickel plating layer 14 having a thickness of approximately 2.0 μm is formed by the undercoating process 8, and the composite nickel plating layer 14 contains approximately 32% by volume of PTFE fine particles 14c.
【００２７】次に、下地層である前記複合ニッケルめっ
き層１４表面に金並びにフッ素系高分子化合物を共析さ
せる複合金めっき処理工程９Ａ，９Ｂを行なう。該複合
金めっき処理工程は、第１金系めっき層１５を形成する
置換金めっき処理ステップ９Ａと、ＰＴＦＥ微粒子をカ
チオン系活性剤１Ｆで分散させた無電解金めっき浴を用
いて第２金系めっき層１６を形成する複合金めっき処理
ステップ９Ｂの２つのステップからなる。具体的には、
前記置換金めっき処理ステップ９Ａは、有機酸金を含有
した置換型金めっき浴を使用する。浴条件は、浴温が
略８０℃、浴比が略１．０ｄｍ 2 ／Ｌ、金濃度が
２．０ｇ／Ｌ、ｐＨが６〜８である。この置換金めっ
き処理ステップ９Ａによって前記複合ニッケルめっき層
１４表面及びその近傍のニッケルが金に置換し、略０．
２５μｍ厚の第１金系めっき層１５が作成されると同時
に、前記複合ニッケルめっき層１４の厚みは減少する。
この第１金系めっき層１５には当然のことながら略３２
体積％のＰＴＦＥ微粒子１５ｃが含有している。Next, the composite nickel plating as an underlayer is formed.
Gold and fluorine-based polymer compound on the surface of
Composite gold plating processing steps 9A and 9B to be performed. The composite
In the gold plating process, the first gold-based plating layer 15 is formed.
Step 9A for displacement gold plating and
Uses electroless gold plating bath dispersed with thione-based activator 1F
Gold plating process to form the second gold-based plating layer 16
It consists of two steps, Step 9B. In particular,
The replacement gold plating step 9A contains an organic acid gold.
Use the replacement-type gold plating bath. The bath conditions depend on the bath temperature.
Approximately 80 ° C, bath ratio is approximately 1.0dm Two/ L, gold concentration
2.0 g / L, pH 6-8. This replacement gold
By the processing step 9A.
14 nickel on the surface and in the vicinity thereof is replaced by gold,
Simultaneously with the formation of the first gold-based plating layer 15 having a thickness of 25 μm
In addition, the thickness of the composite nickel plating layer 14 decreases.
The first gold-based plating layer 15 naturally has approximately 32
It contains the PTFE fine particles 15c by volume.
【００２８】また、前記複合金めっき処理ステップ９Ｂ
は、ＰＴＦＥ微粒子を含有した自己触媒型ノンシアン無
電解金めっき浴を使用する。浴条件は、浴温が７０〜
９０℃、浴比が略１．０ｄｍ2 ／Ｌ、金濃度が１．
０〜３．０ｇ／Ｌ、ｐＨが６．５〜１０である。この
複合金めっき処理ステップ９Ｂによって略０．７５μｍ
の第２金系めっき層１６が作成される。The composite gold plating step 9B
Uses an autocatalytic non-cyanide electroless gold plating bath containing PTFE fine particles. The bath conditions are as follows:
90 ° C., bath ratio of about 1.0 dm 2 / L, gold concentration of 1.
0-3.0 g / L, pH is 6.5-10. Approximately 0.75 μm by this composite gold plating step 9B.
Is formed.
【００２９】そして、本発明の最大の特徴である熱処理
工程１０としては、電気接点１２、複合ニッケルめっき
層１４（下地層）及び複合金めっき皮膜１１を２２０〜
３６０℃でベーキングして複合金めっき皮膜１１中のＰ
ＴＦＥ微粒子を溶融、拡散、更には表面上で網目状に結
合させた後、冷却固化する。これにより、複合金めっき
皮膜１１の表面上に水の接触角で略１４０度の十分な撥
水性が生じる。本発明者はＳＥＭ写真により前記表面上
に直径約０．２μｍのＰＴＦＥ微粒子１６ｃが多数存在
していることを確認している。In the heat treatment step 10 which is the most important feature of the present invention, the electric contact 12, the composite nickel plating layer 14 (underlayer) and the composite gold plating film 11
Baking at 360 ° C., P in composite gold plating film 11
The TFE fine particles are melted, diffused, further bonded in a network on the surface, and then cooled and solidified. As a result, a sufficient water repellency of approximately 140 degrees at a contact angle of water occurs on the surface of the composite gold plating film 11. The present inventor has confirmed from the SEM photograph that a large number of PTFE fine particles 16c having a diameter of about 0.2 μm exist on the surface.
【００３０】本発明の複合金めっき皮膜はフッ素系高分
子化合物を表面上に被覆するのではなく内部から表面に
移行析出させているため、該表面は金本来の輝きを維持
しており、特に汗等の汚れが付着し易い時計、眼鏡等の
装飾金めっきとして使用することも好ましい。In the composite gold plating film of the present invention, the fluoropolymer compound is not coated on the surface but migrates and precipitates from the inside to the surface. Therefore, the surface maintains the original brightness of gold. It is also preferable to use it as decorative gold plating for watches, glasses and the like to which dirt such as sweat easily adheres.
【００３１】次に、複合金めっき皮膜の撥水性を実験に
基づいて説明する。Next, the water repellency of the composite gold plating film will be described based on experiments.
【００３２】（実験１）実施例１として、Ｎｉ／Ｐ−Ｐ
ＴＦＥ複合めっき層からなる下地層上に置換金めっき処
理ステップ及びＰＴＦＥ微粒子を分散させた電解金めっ
き浴を用いた複合金めっき処理ステップからなる複合金
めっき処理を施した複合金めっき皮膜、及び実施例２〜
１０として、Ｎｉ／Ｐめっき層からなる下地層上に置換
金めっき処理ステップ及びＰＴＦＥ微粒子を分散させた
無電解金めっき浴を用いた複合金めっき処理ステップか
らなる複合金めっき処理を施した複合金めっき皮膜を用
いて、ＰＴＦＥ微粒子の共析量を調べる実験を行なっ
た。前記実施例１における複合金めっき処理は、シアン
化第一金カリウム、クエン酸カリウム及びクエン酸を含
有した厚付け純金めっき浴を使用した。浴条件は、金板
又はチタン上白金めっき板を陽極として、浴温が６５
〜７５℃、電流密度が０．５〜２Ａ／ｄｍ2 、好まし
くは略１Ａ／ｄｍ2 、金濃度が略８．２ｇ／Ｌ、ｐ
Ｈが５．６〜６．２である。前記ＰＴＦＥ微粒子の分散
に用いる界面活性剤としては、実施例１〜４にカチオン
系活性剤Ｆを使用し、実施例５〜７にカチオン系活性剤
１Ｆを使用し、実施例８〜１０にはノニオン・カチオン
混合系活性剤を使用した。洗浄工程としては、浸漬脱
脂剤３０ｇ／Ｌを用いたアルカリ浸漬脱脂を常温で５分
間、水酸化ナトリウム５０ｇ／Ｌ及び電解脱脂剤５０
ｇ／Ｌを用いた陰極電解脱脂を常温で５分間、ニッケ
ルストライクを常温で１分間を行なった。熱処理工程に
おける温度はいずれも３５０℃とした。(Experiment 1) As Example 1, Ni / PP
A composite gold plating film that has been subjected to a composite gold plating process comprising a displacement gold plating process step on a base layer composed of a TFE composite plating layer and a composite gold plating process step using an electrolytic gold plating bath in which PTFE fine particles are dispersed, and Example 2
10 is a composite gold plate that has been subjected to a composite gold plating process including a displacement gold plating process step and a composite gold plating process step using an electroless gold plating bath in which PTFE fine particles are dispersed on a base layer made of a Ni / P plating layer. An experiment was conducted to examine the amount of eutectoid of the PTFE fine particles using the plating film. In the composite gold plating treatment in Example 1, a thick pure gold plating bath containing potassium gold (I) cyanide, potassium citrate, and citric acid was used. The bath conditions were as follows. The bath temperature was 65
７５75 ° C., current density 0.5-2 A / dm 2 , preferably about 1 A / dm 2 , gold concentration about 8.2 g / L, p
H is 5.6 to 6.2. As the surfactant used for dispersion of the PTFE fine particles, a cationic surfactant F was used in Examples 1 to 4, a cationic surfactant 1F was used in Examples 5 to 7, and Examples 8 to 10 were used. A nonionic / cation mixed activator was used. As a washing step, alkali immersion degreasing using 30 g / L of immersion degreaser was performed at room temperature for 5 minutes, and sodium hydroxide 50 g / L and electrolytic degreaser 50 were used.
Cathodic electrolytic degreasing using g / L was performed at room temperature for 5 minutes, and nickel strike was performed at room temperature for 1 minute. The temperature in each of the heat treatment steps was 350 ° C.
【００３３】実験結果は、実施例１については膜厚が
１．０μｍ、水の接触角が１４０度となり、実施例２〜
１０については表１に示している。The experimental results show that in Example 1, the film thickness was 1.0 μm and the contact angle of water was 140 °.
10 is shown in Table 1.
【００３４】[0034]
【表１】 [Table 1]
【００３５】表１より、無電解金めっき浴に界面活性剤
としてカチオン系活性剤Ｆを使用した場合、ＰＴＦＥ分
散量が１ｇ／Ｌの実施例２においては１．１μｍ以上の
膜厚が得られたが、水の接触角は８５度であり、ＰＴＦ
Ｅ分量が５ｇ／Ｌの実施例４においては水の接触角が１
２８度と十分な撥水性を示したが、膜厚は０．５４３μ
ｍであった。一方、カチオン系活性剤１Ｆを使用した場
合には、実施例５〜７の何れにおいても１．１μｍ以上
の膜厚と１３０度以上の水の接触角を同時に達成した。
更に、ノニオン・カチオン混合系活性剤を使用した場合
には、実施例８〜１０の何れにおいても１．１μｍ以上
の十分な膜厚を達成しているが、ＰＴＦＥの分散量が１
５ｍＬ以上である実施例９及び１０においてはＰＴＦＥ
共析量が２０体積％より少なくなり、水の接触角も１０
０度より小さくなった。As shown in Table 1, when the cationic surfactant F was used as the surfactant in the electroless gold plating bath, a film thickness of 1.1 μm or more was obtained in Example 2 in which the PTFE dispersion amount was 1 g / L. However, the contact angle of water is 85 degrees and PTF
In Example 4 in which the E content was 5 g / L, the contact angle of water was 1
Although it showed sufficient water repellency of 28 degrees, the film thickness was 0.543 μm.
m. On the other hand, when the cationic activator 1F was used, in all of Examples 5 to 7, a film thickness of 1.1 μm or more and a contact angle of water of 130 ° or more were simultaneously achieved.
Further, when a nonionic / cation mixed activator was used, a sufficient film thickness of 1.1 μm or more was achieved in any of Examples 8 to 10, but the dispersion amount of PTFE was 1
In Examples 9 and 10 where the volume is 5 mL or more, PTFE is used.
The eutectoid content is less than 20% by volume and the contact angle of water is 10
It became smaller than 0 degrees.
【００３６】[0036]
【発明の効果】以上にしてなる本発明の複合金めっき皮
膜は、２２０〜３６０℃の熱処理によってフッ素系高分
子化合物が溶融し表面上で網目状に結合するため、該表
面上に十分な撥水性及び低摩擦性をもたらし、水分等の
汚れが付着することを未然に防止できるとともに万一汚
れが付着したとしても容易に剥離できる。According to the composite gold plating film of the present invention thus constituted, the fluorine-based polymer compound is melted by heat treatment at 220 to 360 ° C. and is bonded in a mesh on the surface. Water and low friction properties are provided, so that contamination such as moisture can be prevented from adhering, and even if dirt adheres, it can be easily peeled off.
【００３７】ここで、下地層が無電解めっき処理により
ニッケル並びにフッ素系高分子化合物が共析した複合ニ
ッケルめっき層であると、前記下地層内のフッ素系高分
子化合物がその表面移行性によって複合金めっき皮膜に
拡散移行し、結果として該複合金めっき皮膜の撥水性を
増大できる。そして、ニッケルにより前記複合金めっき
皮膜の密着性が向上するとともに、熱処理により前記複
合ニッケルめっき層の硬度が増大し、複合金めっき皮膜
の機械的強度が増大して耐久性を向上できる。Here, if the underlayer is a composite nickel plating layer in which nickel and a fluorine-based polymer compound are eutectoid by electroless plating, the fluorine-based polymer compound in the underlayer is composited due to its surface migration. Diffusion shifts to the gold plating film, and as a result, the water repellency of the composite gold plating film can be increased. Then, the adhesion of the composite gold plating film is improved by nickel, and the hardness of the composite nickel plating layer is increased by the heat treatment, and the mechanical strength of the composite gold plating film is increased to improve the durability.
【００３８】更に、複合金めっき皮膜が、下地層を置換
金めっき処理してなる第１金系めき層と、該第１金系め
っき層表面をめっき処理して金とフッ素系高分子化合物
を共析させた第２金系めっき層とからなることで、複合
金めっき皮膜の密着性が増し剥離を未然に防止できる。
また、ここで前記下地層がニッケル並びにフッ素系高分
子化合物を共析してなる複合ニッケルめっき層である場
合には、該下地層を置換金めっき処理した前記第１金系
めっき層には該下地層のフッ素系高分子化合物が析出す
ることとなり、結果的に前記複合金めっき皮膜の表面上
に析出するフッ素系高分子化合物の量が増大して撥水性
を向上できる。Further, the composite gold plating film is composed of a first gold-based plating layer obtained by subjecting a base layer to displacement gold plating, and gold and a fluorine-based polymer compound obtained by plating the surface of the first gold-based plating layer. By comprising the second gold-based plating layer that has been eutectoid, the adhesion of the composite gold plating film is increased, and peeling can be prevented beforehand.
Further, when the underlayer is a composite nickel plating layer obtained by eutectoidizing nickel and a fluorine-based polymer compound, the first gold-based plating layer in which the underlayer is subjected to displacement gold plating is applied to the undercoat layer. The fluorine-based polymer compound of the underlayer is deposited, and as a result, the amount of the fluorine-based polymer compound deposited on the surface of the composite gold plating film is increased, and the water repellency can be improved.
【００３９】そして、以上の複合金めっき皮膜は水の接
触角にして１００〜１４０度の撥水性が得られ、更に、
２．５〜３．０×１０-6Ω・ｃｍの固有抵抗及び０．０
５〜１．０Ωの接触電気抵抗が実現できる。The above-mentioned composite gold plating film has a water repellency of 100 to 140 degrees in terms of a contact angle of water.
2.5-3.0 × 10 −6 Ω · cm specific resistance and 0.0
A contact electric resistance of 5 to 1.0Ω can be realized.
【００４０】したがって、前記複合金めっき皮膜を電気
接点の表面皮膜として用いると、該電気接点は耐食性、
密着性及び耐摩耗性に優れるとともに、汚れ等が付着し
やすい環境下で微弱な電流を扱う場合にも電気瞬断を未
然に防止して安定した通電性を確保できる。Therefore, when the composite gold plating film is used as a surface film of an electric contact, the electric contact has corrosion resistance,
In addition to excellent adhesion and abrasion resistance, even when a weak current is handled in an environment where dirt or the like is likely to adhere, electrical momentary interruption can be prevented beforehand and stable electrical conductivity can be secured.
【図１】本発明に係る複合金めっき皮膜を示す簡略断面
説明図。FIG. 1 is a simplified sectional explanatory view showing a composite gold plating film according to the present invention.
【図２】本発明に係る複合金めっき皮膜の製造方法を示
す簡略説明図。FIG. 2 is a simplified explanatory view showing a method for producing a composite gold plating film according to the present invention.
【図３】水の接触角の定義を示す説明図。FIG. 3 is an explanatory view showing a definition of a contact angle of water.
１、１１ 複合金めっき皮膜 ２、１２ 電気接点 ３ 下地層 ４、１４ 複合ニッケルめっき層 ５、１５ 第１金系めっき層 ６、１６ 第２金系めっき層 ７ 洗浄工程 ８ 下地処理工程 ９Ａ 置換金めっき処理ステップ ９Ｂ 複合金めっき処理ステップ １０ 熱処理工程 ２１ 複合金めっき皮膜 ２２ 水滴 ４ｂ ニッケル ４ｃ、５ｃ、６ｃ フッ素系高分子微粒子 １４ｃ、１５ｃ、１６ｃ ＰＴＦＥ微粒子 １２ｄ 汚れ ２１ｅ 表面 ２２ｆ 接線 DESCRIPTION OF SYMBOLS 1, 11 Composite gold plating film 2, 12 Electrical contact 3 Underlayer 4, 14 Composite nickel plating layer 5, 15 First gold-based plating layer 6, 16 Second gold-based plating layer 7 Cleaning process 8 Base treatment process 9A Substituted gold Plating Step 9B Composite Gold Plating Step 10 Heat Treatment Step 21 Composite Gold Plating Film 22 Water Drop 4b Nickel 4c, 5c, 6c Fluoropolymer Fine Particles 14c, 15c, 16c PTFE Fine Particles 12d Soil 21e Surface 22f Tangential Line
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０１Ｒ 13/03 Ｈ０１Ｒ 13/03 Ａ ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification code FI H01R 13/03 H01R 13/03 A
Claims (11)
が向上する下地層を上面に設けた素材にめっき処理を施
して金並びにフッ素系高分子化合物を共析させた複合金
めっき皮膜であって、２２０〜３６０℃の熱処理を施し
たことを特徴とする複合金めっき皮膜。1. A composite gold-plated film obtained by subjecting a material provided with an underlayer on the upper surface thereof having improved adhesion to gold or a fluorine-based polymer compound to a plating treatment to co-deposit gold and a fluorine-based polymer compound. And a heat treatment at 220 to 360 ° C.
ッケル並びにフッ素系高分子化合物が共析した複合ニッ
ケルめっき層である請求項１記載の複合金めっき皮膜。2. The composite gold plating film according to claim 1, wherein the underlayer is a composite nickel plating layer in which nickel and a fluorine-based polymer compound are codeposited by electroless plating.
第１金系めっき層と、該第１金系めっき層表面をめっき
処理して金とフッ素系高分子化合物を共析させた第２金
系めっき層とからなる請求項１又は２記載の複合金めっ
き皮膜。3. A first gold-based plating layer obtained by subjecting the base layer to displacement gold plating, and a first gold-based plating layer obtained by plating the surface of the first gold-based plating layer to co-deposit gold and a fluorine-based polymer compound. 3. The composite gold plating film according to claim 1, comprising a two-gold plating layer.
あることを特徴とする請求項１〜３の何れか１項に記載
の複合金めっき皮膜。4. The composite gold plating film according to claim 1, wherein a contact angle of water on the surface is 100 to 140 degrees.
と、 前記洗浄した素材に表面処理を施して金又はフッ素系高
分子化合物の付着性が向上する下地層を形成する下地処
理工程と、 前記下地処理した素材にめっき処理を施して金並びにフ
ッ素系高分子化合物を共析させた複合金めっき皮膜を形
成する複合金めっき処理工程と、 前記複合金めっき皮膜を２２０〜３６０℃で熱処理する
熱処理工程と、 からなる複合金めっき皮膜の製造方法。5. A cleaning step of removing impurities on the surface of the material, and a surface treatment step of performing a surface treatment on the cleaned material to form an underlayer for improving the adhesion of gold or a fluorine-based polymer compound. Performing a plating treatment on the base-treated material to form a composite gold plating film in which gold and a fluorine-based polymer compound are eutectoid; and heat treating the composite gold plating film at 220 to 360 ° C. A method for producing a composite gold plating film comprising: a heat treatment step;
電解めっき処理を施してニッケル並びにフッ素系高分子
化合物を共析させた複合ニッケルめっき層を形成する工
程であることを特徴とする請求項５記載の複合金めっき
皮膜の製造方法。6. The method according to claim 1, wherein the undercoating step is a step of performing electroless plating on the washed material to form a composite nickel plating layer in which nickel and a fluorine-based polymer compound are co-deposited. Item 6. The method for producing a composite gold plating film according to Item 5.
させた第１金系めっき層を形成する置換金めっき処理ス
テップと、 前記第１金系めっき層表面にめっき処理を施して金並び
にフッ素系高分子化合物を共析させた第２金系めっき層
を形成する複合金めっき処理ステップと、 からなる請求項５又は６記載の複合金めっき皮膜の製造
方法。7. The replacement gold plating step of performing a replacement gold plating process on a base-treated material to form a first gold-based plating layer on which gold is deposited, the composite gold plating process step; The composite gold plating according to claim 5, comprising: performing a plating treatment on the surface of the system-based plating layer to form a second gold-based plating layer in which gold and a fluorine-based polymer compound are co-deposited. Manufacturing method of the film.
なる請求項５〜７の何れかに記載の複合金めっき皮膜の
製造方法。8. The method for producing a composite gold plating film according to claim 5, wherein the contact angle of water on the surface is 100 to 140 degrees.
ｃｍとなり且つ接触電気抵抗が０．０５〜１．０Ωとな
る請求項８記載の複合金めっき皮膜の製造方法。9. A specific resistance of 2.5 to 3.0 × 10 −6 Ω ·
The method for producing a composite gold plating film according to claim 8, wherein the contact electric resistance is 0.05 to 1.0 Ω.
金めっき皮膜を表面に有する電気接点。10. An electric contact having a composite gold plating film according to claim 1 on its surface.
・ｃｍであり且つ接触電気抵抗が０．０５〜１．０Ωで
あることを特徴とする請求項１０記載の電気接点。11. A specific resistance of 2.5 to 3.0 × 10 −6 Ω.
11. The electrical contact according to claim 10, wherein the electrical contact is in the range of 0.05 to 1.0 Ω.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14407598A JP3322211B2 (en) | 1998-05-26 | 1998-05-26 | Composite gold plating film, method for producing the same, and electrical contact having the composite gold plating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14407598A JP3322211B2 (en) | 1998-05-26 | 1998-05-26 | Composite gold plating film, method for producing the same, and electrical contact having the composite gold plating film |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001385853A Division JP2002241954A (en) | 2001-12-19 | 2001-12-19 | Composite gold plating film, production method therefor and electric contact having the composite gold plating film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11335859A true JPH11335859A (en) | 1999-12-07 |
| JP3322211B2 JP3322211B2 (en) | 2002-09-09 |
Family
ID=15353703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14407598A Expired - Lifetime JP3322211B2 (en) | 1998-05-26 | 1998-05-26 | Composite gold plating film, method for producing the same, and electrical contact having the composite gold plating film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3322211B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002060999A (en) * | 2000-08-23 | 2002-02-28 | Ebara Udylite Kk | Plating method and plating product |
| JP2003305743A (en) * | 2002-04-12 | 2003-10-28 | Sumitomo Rubber Ind Ltd | Mold for golf ball, manufacturing method therefor, and golf ball manufacturing method |
| JP2007009333A (en) * | 2006-10-23 | 2007-01-18 | Shinshu Univ | Plated structure and method of manufacturing the same |
| US7867230B2 (en) | 2005-04-05 | 2011-01-11 | Johnson & Johnson Kabushiki Kaisha | Bipolar forceps |
| WO2013045264A1 (en) * | 2011-09-27 | 2013-04-04 | Robert Bosch Gmbh | Battery module comprising a plurality of battery cells, and motor vehicle |
-
1998
- 1998-05-26 JP JP14407598A patent/JP3322211B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002060999A (en) * | 2000-08-23 | 2002-02-28 | Ebara Udylite Kk | Plating method and plating product |
| JP4627848B2 (en) * | 2000-08-23 | 2011-02-09 | 荏原ユージライト株式会社 | Plating method and plated product |
| JP2003305743A (en) * | 2002-04-12 | 2003-10-28 | Sumitomo Rubber Ind Ltd | Mold for golf ball, manufacturing method therefor, and golf ball manufacturing method |
| US7867230B2 (en) | 2005-04-05 | 2011-01-11 | Johnson & Johnson Kabushiki Kaisha | Bipolar forceps |
| JP2007009333A (en) * | 2006-10-23 | 2007-01-18 | Shinshu Univ | Plated structure and method of manufacturing the same |
| JP4599565B2 (en) * | 2006-10-23 | 2010-12-15 | 国立大学法人信州大学 | Electrolytic plating method and electrolytic plating solution |
| WO2013045264A1 (en) * | 2011-09-27 | 2013-04-04 | Robert Bosch Gmbh | Battery module comprising a plurality of battery cells, and motor vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3322211B2 (en) | 2002-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI436884B (en) | Metal layer accumulating an imide substrate and a method for producing the same | |
| TWI225322B (en) | Terminal having ruthenium layer and a connector with the terminal | |
| JP4279285B2 (en) | Silver-coated stainless steel strip for movable contact and method for producing the same | |
| JP2010265542A (en) | Conductive member and manufacturing method thereof | |
| JPS6113688A (en) | Copper foil for printed circuit and method of producing same | |
| JP5570285B2 (en) | Catalyst aqueous solution used in electroless plating method, method for preparing the catalyst aqueous solution, electroless plating method using the catalyst aqueous solution, and metal object to be plated provided with a metal film formed using the electroless plating method | |
| JP2010168598A (en) | Conductive member and method for manufacturing the same | |
| JP2009135097A (en) | Metal material for electric and electronic equipment, method of manufacturing metal material for electric and electronic equipment | |
| JPH0441696A (en) | Surface treatment of copper foil for printed circuit | |
| JP3322211B2 (en) | Composite gold plating film, method for producing the same, and electrical contact having the composite gold plating film | |
| JP3442764B1 (en) | Connector terminals and connectors | |
| JP5621570B2 (en) | Conductive material with Sn plating and manufacturing method thereof | |
| JP2010090400A (en) | Electroconductive material and method for manufacturing the same | |
| JP2002241954A (en) | Composite gold plating film, production method therefor and electric contact having the composite gold plating film | |
| JP2006104504A (en) | Electroless plating pre-treatment method and surface metallizing method for polyimide resin, and flexible printed circuit board and manufacturing method for the same | |
| JP3454232B2 (en) | Composite plating film | |
| EP1172463A1 (en) | Corrosion-resistant conductive member | |
| JP3709142B2 (en) | Copper foil for printed wiring board and method for producing the same | |
| JP2003171781A (en) | Copper foil for printed circuit board, and production method therefor | |
| JP2987556B2 (en) | Method for forming metal conductive layer on fluororesin body surface | |
| JP3909035B2 (en) | Plating pretreatment liquid and plating pretreatment method | |
| KR20070005332A (en) | Electroless plating method and plating film obtained by the electroless plating method | |
| US20140308538A1 (en) | Surface treated aluminum foil for electronic circuits | |
| CA2327801A1 (en) | Copper on polymer component having improved adhesion | |
| JP6878752B2 (en) | Method for manufacturing flexible thermoelectric conversion member |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080628 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100628 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110628 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110628 Year of fee payment: 9 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120628 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120628 Year of fee payment: 10 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130628 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130628 Year of fee payment: 11 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140628 Year of fee payment: 12 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |