JPH11277781A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH11277781A JPH11277781A JP10085191A JP8519198A JPH11277781A JP H11277781 A JPH11277781 A JP H11277781A JP 10085191 A JP10085191 A JP 10085191A JP 8519198 A JP8519198 A JP 8519198A JP H11277781 A JPH11277781 A JP H11277781A
- Authority
- JP
- Japan
- Prior art keywords
- glaze layer
- film conductor
- thick film
- recording medium
- common electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はビデオプリンタやワ
ードプロセッサ，ファクシミリ等のプリンタ機構として
組み込まれるサーマルヘッドに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head incorporated as a printer mechanism for a video printer, word processor, facsimile or the like.
【０００２】[0002]
【従来の技術】従来、ビデオプリンタ等に組み込まれる
サーマルヘッドは、例えば図４に示す如く、アルミナセ
ラミックス等から成る絶縁基板２１の上面に、断面円弧
状のグレーズ層２２と厚膜導体２４とを略平行に形成す
るとともに、前記グレーズ層２２の頂部付近に複数個の
発熱抵抗体２３を被着・配列させ、該発熱抵抗体２３の
両端に個別電極２５及び共通電極２６を該共通電極２６
が前記厚膜導体２４上まで延在されるようにして電気的
に接続させたうえ、これらを保護膜２７によって被覆し
た構造を有している。2. Description of the Related Art Conventionally, a thermal head incorporated in a video printer or the like has, as shown in FIG. 4, a glaze layer 22 and a thick film conductor 24 having an arc-shaped cross section on an upper surface of an insulating substrate 21 made of alumina ceramic or the like. A plurality of heating resistors 23 are attached and arranged near the top of the glaze layer 22, and individual electrodes 25 and a common electrode 26 are provided at both ends of the heating resistor 23.
Are electrically connected so as to extend over the thick-film conductor 24, and are further covered with a protective film 27.
【０００３】そして上述のサーマルヘッドは、記録媒体
を発熱抵抗体２３上の保護膜表面に摺接させながら、前
記個別電極２５と前記共通電極２６との間に図示しない
ドライバーＩＣの駆動に伴って所定の電力を印加し、発
熱抵抗体２３を個々に選択的にジュール発熱させるとと
もに、該発熱した熱によって記録媒体に印画を形成する
ことによりサーマルヘッドとして機能する。The above-mentioned thermal head slides the recording medium on the surface of the protective film on the heating resistor 23 and drives a driver IC (not shown) between the individual electrode 25 and the common electrode 26 while driving the recording medium. A predetermined electric power is applied to cause the heating resistors 23 to individually and selectively generate Joule heat, and the generated heat forms a print on a recording medium to function as a thermal head.
【０００４】尚、前記厚膜導体２４は、印画時に大電流
が流れる共通電極２６を電気的に補強し、共通電極２６
で電圧降下が発生するのを有効に防止するためのもので
あり、このような厚膜導体２４は、例えば所定の導電ペ
ーストを従来周知のスクリーン印刷等によって絶縁基板
２１の上面に印刷・塗布し、これを高温で焼成すること
によって所定の厚みに形成される。The thick film conductor 24 electrically reinforces the common electrode 26 through which a large current flows during printing, and
The thick-film conductor 24 is formed by printing and applying a predetermined conductive paste on the upper surface of the insulating substrate 21 by, for example, conventionally known screen printing or the like. This is fired at a high temperature to form a predetermined thickness.
【０００５】また前記保護膜２７は、大気中に含まれて
いる水分等の接触による腐食や記録媒体の摺接による磨
耗などから発熱抵抗体２３や電極２５，２６を保護する
ためのものであり、例えば窒化珪素（Ｓｉ3 Ｎ4 ）等を
従来周知の薄膜手法、具体的にはスパッタリング法やプ
ラズマＣＶＤ法等を採用し、所定厚みに被着させること
によって形成される。The protective film 27 is for protecting the heating resistor 23 and the electrodes 25 and 26 from corrosion due to contact with moisture and the like contained in the air and abrasion due to sliding contact of the recording medium. For example, it is formed by applying silicon nitride (Si 3 N 4 ) or the like to a predetermined thickness by employing a conventionally known thin film method, specifically, a sputtering method or a plasma CVD method.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、このよ
うな従来のサーマルヘッドにおいては、厚膜導体２４が
スクリーン印刷等の厚膜手法によって形成されており、
このとき使用される導電ペースト中には粒径１μｍ〜５
μｍ程度の大きな金属粒子が多数含まれていることか
ら、この導電ペーストを焼成して厚膜導体２４を形成す
ると、その表面には金属粒子の形状に応じた凹凸が形成
される。そして、このような厚膜導体２４上に共通電極
２６や保護膜２７等を前述の薄膜手法によって形成した
場合、保護膜２７の表面にも厚膜導体２４と同様の凹凸
が多数形成されることとなり、保護膜２７の表面が中心
線平均粗さＲａで１．０μｍ〜３．０μｍ程度の粗面と
なる。このため、印画に際して記録媒体を保護膜２７に
摺接させると、凹凸を有した保護膜表面に記録媒体が強
く摺接されることによって記録媒体の表面が傷つき、印
画品質が著しく低下する欠点を有していた。特に、プラ
スチックカードや厚紙等の硬質の記録媒体に印画を行う
場合は、記録媒体をプラテンローラ等の外形に沿って湾
曲させることが困難であることから、記録媒体は絶縁基
板２１の上面と略平行に走行することとなり、この場
合、記録媒体に対する保護膜表面の摺接圧が一層強くな
り、その分、記録媒体の傷もひどくなっていた。However, in such a conventional thermal head, the thick film conductor 24 is formed by a thick film technique such as screen printing.
The conductive paste used at this time has a particle size of 1 μm to 5 μm.
Since a large number of metal particles having a size of about μm are included, when the conductive paste is fired to form the thick-film conductor 24, irregularities corresponding to the shape of the metal particles are formed on the surface thereof. When the common electrode 26, the protective film 27, and the like are formed on such a thick film conductor 24 by the above-described thin film method, many irregularities similar to those of the thick film conductor 24 are also formed on the surface of the protective film 27. Thus, the surface of the protective film 27 becomes a rough surface having a center line average roughness Ra of about 1.0 μm to 3.0 μm. Therefore, when the recording medium is slid into contact with the protective film 27 at the time of printing, the recording medium is strongly slid on the surface of the protective film having irregularities, thereby damaging the surface of the recording medium and significantly deteriorating the printing quality. Had. In particular, when printing on a hard recording medium such as a plastic card or cardboard, it is difficult to bend the recording medium along the outer shape of a platen roller or the like. In this case, the sliding contact pressure on the surface of the protective film with respect to the recording medium was further increased, and the damage to the recording medium was correspondingly increased.
【０００７】[0007]
【課題を解決しようとする課題】本発明は上記欠点に鑑
み案出されたもので、本発明のサーマルヘッドは、絶縁
基板の上面に、複数個の発熱抵抗体が被着されている帯
状の第１グレーズ層と、該第１グレーズ層よりも厚みの
薄い帯状の厚膜導体とを略平行に配置し、前記発熱抵抗
体の両端に個別電極及び共通電極を接続するとともに該
共通電極の一端を前記厚膜導体上まで延在させて厚膜導
体に電気的に接続し、更に前記第１グレーズ層、発熱抵
抗体、共通電極及び厚膜導体を略一定厚みの保護膜で被
覆して成り、前記第１グレーズ層上から厚膜導体上に向
かって搬送される記録媒体を前記保護膜表面に摺接させ
ながら前記発熱抵抗体を選択的にジュール発熱させるこ
とによって印画を形成するサーマルヘッドであって、前
記絶縁基板の上面で、かつ前記第１グレーズ層と前記厚
膜導体との間に、第１グレーズ層よりも厚みが薄く、厚
膜導体よりも厚みが厚い第２グレーズ層を配設したこと
を特徴とするものである。SUMMARY OF THE INVENTION The present invention has been devised in view of the above-mentioned drawbacks, and a thermal head according to the present invention has a belt-like shape in which a plurality of heating resistors are attached on an upper surface of an insulating substrate. A first glaze layer and a band-shaped thick film conductor thinner than the first glaze layer are arranged substantially in parallel, and an individual electrode and a common electrode are connected to both ends of the heating resistor, and one end of the common electrode is connected to the first glaze layer. Extending over the thick-film conductor to be electrically connected to the thick-film conductor, and further covering the first glaze layer, the heating resistor, the common electrode, and the thick-film conductor with a protective film having a substantially constant thickness. A thermal head that forms a print by selectively causing the heating resistor to generate Joule heat while a recording medium conveyed from above the first glaze layer onto the thick film conductor slides on the surface of the protective film. And the upper surface of the insulating substrate And a second glaze layer, which is thinner than the first glaze layer and thicker than the thick film conductor, is provided between the first glaze layer and the thick film conductor. is there.
【０００８】また本発明のサーマルヘッドは、前記絶縁
基板の上面で、かつ第１グレーズ層に対して記録媒体の
搬送方向上流側に、第１グレーズ層よりも厚みの薄い第
３グレーズ層が形成されていることを特徴とするもので
ある。In the thermal head according to the present invention, a third glaze layer having a thickness smaller than the first glaze layer is formed on the upper surface of the insulating substrate and on the upstream side of the first glaze layer in the recording medium conveyance direction. It is characterized by having been done.
【０００９】[0009]
【発明の実施の形態】以下、本発明の添付図面に基づい
て詳細に説明する。図１は本発明の一形態にかかるサー
マルヘッドの断面図、図２は図１のサーマルヘッドの要
部を示す平面図、図３は第１〜第３グレーズ層及び厚膜
導体の厚みの関係を示す断面図であり、１は絶縁基板、
２は第１グレーズ層、３は厚膜導体、４は第２グレーズ
層、５は第３グレーズ層、６は発熱抵抗体、７は個別電
極、８は共通電極、９は保護膜である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. 1 is a cross-sectional view of a thermal head according to an embodiment of the present invention, FIG. 2 is a plan view showing a main part of the thermal head of FIG. 1, and FIG. 3 is a relationship between the thicknesses of first to third glaze layers and a thick film conductor. FIG. 1 is a cross-sectional view showing an insulating substrate,
2 is a first glaze layer, 3 is a thick film conductor, 4 is a second glaze layer, 5 is a third glaze layer, 6 is a heating resistor, 7 is an individual electrode, 8 is a common electrode, and 9 is a protective film.
【００１０】前記絶縁基板１はアルミナセラミックス等
のセラミック材料から成り、その上面で第１〜第３グレ
ーズ層や厚膜導体４，発熱抵抗体６，個別電極７，共通
電極８，保護膜９等を支持するための支持母材としての
作用を為す。The insulating substrate 1 is made of a ceramic material such as alumina ceramic, and has on its upper surface first to third glaze layers, thick film conductors 4, heating resistors 6, individual electrodes 7, common electrodes 8, protective films 9, and the like. It acts as a supporting base material for supporting.
【００１１】前記絶縁基板１は矩形状を成すように形成
され、例えばアルミナセラミックスから成る場合、アル
ミナ、シリカ、マグネシア等のセラミックス原料粉末に
適当な有機溶剤、溶媒を添加混合して泥漿状に成すとと
もにこれを従来周知のドクターブレード法やカレンダー
ロール法等を採用することによってセラミックグリーン
シートを得、しかる後、前記セラミックグリーンシート
を所定形状に打ち抜いたうえ、これを高温で焼成するこ
とによって製作される。The insulating substrate 1 is formed to have a rectangular shape. When the insulating substrate 1 is made of, for example, alumina ceramics, an appropriate organic solvent and a solvent are added to a ceramic raw material powder such as alumina, silica, magnesia, etc. and mixed to form a slurry. Along with this, a ceramic green sheet is obtained by adopting a conventionally known doctor blade method, calender roll method, or the like, and thereafter, the ceramic green sheet is punched into a predetermined shape, and then fired at a high temperature. You.
【００１２】また前記絶縁基板１の上面には、所定の厚
みをもった帯状の第１グレーズ層２と、該第１グレーズ
層２よりも厚みの薄い帯状の厚膜導体３とが、絶縁基板
１の長さ方向に略平行（±５°以内）に形成される。On the upper surface of the insulating substrate 1, a strip-shaped first glaze layer 2 having a predetermined thickness and a strip-shaped thick film conductor 3 thinner than the first glaze layer 2 are provided. 1 are formed substantially parallel (within ± 5 °) to the length direction.
【００１３】前記第１グレーズ層２は、低熱伝導性（熱
伝導率：2.0 ×10-3〜2.5 ×10-3cal/cm・sec ・℃）の
ガラスによって４０μｍ〜８０μｍの厚みＡに形成され
ており、その頂部付近に被着される発熱抵抗体６の発す
る熱をその内部で蓄積及び放散しサーマルヘッドの熱応
答特性を良好な状態に維持するとともに、発熱抵抗体６
を上方に突出させて記録媒体に対する押圧力（印圧）を
有効に高める作用を為す。The first glaze layer 2 is formed of glass having a low thermal conductivity (thermal conductivity: 2.0 × 10 −3 to 2.5 × 10 −3 cal / cm · sec · ° C.) to a thickness A of 40 μm to 80 μm. The heat generated by the heating resistor 6 attached to the vicinity of the top is accumulated and dissipated inside the heating resistor, thereby maintaining the thermal response characteristics of the thermal head in a good state.
Are projected upward to effectively increase the pressing force (printing pressure) on the recording medium.
【００１４】このような第１グレーズ層２は、所定のガ
ラス粉末に適当な有機溶媒、有機溶剤を添加・混合して
得たガラスペーストを従来周知のスクリーン印刷等によ
って絶縁基板１の上面所定領域に５０μｍ〜１５０μｍ
の厚みで帯状に印刷・塗布し、これをガラスの軟化点以
上の温度、例えばガラスの軟化点が８５０℃の場合、１
２００℃の温度で焼き付けることによって絶縁基板１の
上面に部分的に被着・形成される。尚、このようにして
形成される第１グレーズ層２の表面は中心線平均粗さＲ
ａで５０Å〜１５０Å程度の平滑面となる。The first glaze layer 2 is formed on a predetermined region of the upper surface of the insulating substrate 1 by screen printing or the like using a glass paste obtained by adding and mixing an appropriate organic solvent and an organic solvent to predetermined glass powder. 50 μm to 150 μm
Is printed and applied in a strip shape with a thickness of not more than the softening point of the glass, for example, when the softening point of the glass is 850 ° C., 1
By baking at a temperature of 200 ° C., it is partially adhered and formed on the upper surface of the insulating substrate 1. The surface of the first glaze layer 2 thus formed has a center line average roughness R
a gives a smooth surface of about 50 ° to 150 °.
【００１５】また、前記第１グレーズ層２と略平行に配
置される厚膜導体３は、第１グレーズ層２のエッジから
記録媒体の搬送方向下流側（図１の右側）に１．０ｍｍ
〜５．０ｍｍだけ離れた位置に配置され、ＣｕやＡｇ等
の金属粒子を含む導電材料によって１５μｍ〜２０μｍ
の厚みＣに形成される。The thick film conductor 3 disposed substantially parallel to the first glaze layer 2 has a thickness of 1.0 mm downstream from the edge of the first glaze layer 2 in the direction of conveyance of the recording medium (right side in FIG. 1).
15 μm to 20 μm depending on the conductive material including metal particles such as Cu and Ag.
Of a thickness C.
【００１６】前記厚膜導体３は、その上に後述する共通
電極８の一端を延在させてこれを電気的に接続させるこ
とにより、印画時に大電流が流れる共通電極８を電気的
に補強し、共通電極８における電圧降下の発生を有効に
防止する作用を為す。The thick film conductor 3 extends one end of a common electrode 8 to be described later thereon and electrically connects the common electrode 8 to electrically reinforce the common electrode 8 through which a large current flows during printing. , Which effectively prevents a voltage drop in the common electrode 8.
【００１７】この厚膜導体３は、例えば、ＣｕやＡｇ等
から成る粒径１μｍ〜１５μｍ程度の金属粉末に適当な
有機溶媒、有機溶剤、ガラス等を添加・混合して得た所
定の導電ペーストを従来周知のスクリーン印刷等を採用
することによって絶縁基板１の上面所定領域に１５μｍ
〜２０μｍの厚みで帯状に印刷・塗布し、これを高温
（約６５０℃）で焼成することによって被着・形成され
る。尚、このように形成される厚膜導体３の表面は、導
電ペースト中に含まれる金属粒子の影響を受けて、中心
線平均粗さＲａで１．０μｍ〜３．０μｍの粗面とな
る。The thick-film conductor 3 is made of, for example, a predetermined conductive paste obtained by adding and mixing an appropriate organic solvent, an organic solvent, glass and the like to a metal powder having a particle size of about 1 μm to 15 μm, such as Cu or Ag. 15 μm in a predetermined area on the upper surface of the insulating substrate 1 by employing a conventionally known screen printing or the like.
It is applied and formed by printing and applying in a band shape with a thickness of ２０20 μm and firing it at a high temperature (about 650 ° C.). Incidentally, the surface of the thick film conductor 3 thus formed is roughened with a center line average roughness Ra of 1.0 μm to 3.0 μm under the influence of metal particles contained in the conductive paste.
【００１８】そしてこのような絶縁基板１の上面には更
に、第１グレーズ層２と厚膜導体３との間の領域に、第
１グレーズ層２よりも薄く、厚膜導体３よりも厚い帯状
の第２グレーズ層４が厚膜導体３に沿って配設される。Further, on the upper surface of the insulating substrate 1, a belt-shaped thinner than the first glaze layer 2 and thicker than the thick-film conductor 3 is formed in a region between the first glaze layer 2 and the thick-film conductor 3. Is disposed along the thick film conductor 3.
【００１９】前記第２グレーズ層４は、例えば、第１グ
レーズ層２を形成するガラスと同質（同一組成）のガラ
スによって、第１グレーズ層２の厚みＡの６０％〜９０
％に相当する２４μｍ〜７２μｍの厚みＢ1 をもって断
面円弧状に形成され、その表面は前述した第１グレーズ
層２と同様の平滑面（中心線平均粗さＲａ：５０Å〜１
５０Å）と成る。The second glaze layer 4 is made of, for example, glass of the same quality (the same composition) as the glass forming the first glaze layer 2, and is 60% to 90% of the thickness A of the first glaze layer 2.
% To be formed into an arc-shaped cross section with a thickness B 1 of the corresponding 24Myuemu～72myuemu, its surface is similar to the smooth surface and the first glaze layer 2 described above (center line average roughness Ra: 50Å~1
50 °).
【００２０】前記第２グレーズ層４は、前述した如く、
第１グレーズ層２と厚膜導体３との間に、厚膜導体３に
沿って、第１グレーズ層２よりも薄く、かつ厚膜導体３
よりも厚く形成されるため、印画の際、第１グレーズ層
２上から厚膜導体３上に向かって走行する記録媒体を、
厚膜導体３上を通過する前に、第２グレーズ層４上の保
護膜表面で良好に支持する作用を為す。これにより、記
録媒体と厚膜導体３上の保護膜９との摺接圧が緩和さ
れ、厚膜導体３上の保護膜９との摺接によって記録媒体
に傷が付くのを有効に防止することができる。As mentioned above, the second glaze layer 4
Between the first glaze layer 2 and the thick film conductor 3, along the thick film conductor 3, the thin film conductor 3 is thinner than the first glaze layer 2.
Since the recording medium is formed thicker, the printing medium that runs from the first glaze layer 2 toward the thick film conductor 3 during printing is
Before passing over the thick-film conductor 3, the protective film on the second glaze layer 4 functions to favorably support the surface. Thereby, the sliding contact pressure between the recording medium and the protective film 9 on the thick film conductor 3 is reduced, and the recording medium is effectively prevented from being damaged by the sliding contact with the protective film 9 on the thick film conductor 3. be able to.
【００２１】ここで前記第２グレーズ層４の厚みＢ1 を
第１グレーズ層２の厚みＡの６０％〜９０％に設定して
おけば、前述の作用効果に加えて、記録媒体が発熱抵抗
体６上を通過した後も第２グレーズ層４によって良好に
支持されるため、記録媒体の排出角度をほぼ一定に保持
することができ、記録媒体をより安定的に搬送すること
が可能となる利点がある。従って、前記第２グレーズ層
４の厚みＢ1 は第１グレーズ層２の厚みＡの６０％〜９
０％に設定しておくことが好ましい。Here, if the thickness B 1 of the second glaze layer 4 is set to 60% to 90% of the thickness A of the first glaze layer 2, the recording medium has a heating resistance in addition to the above-mentioned effects. Since the recording medium is favorably supported by the second glaze layer 4 even after passing over the body 6, the discharge angle of the recording medium can be kept substantially constant, and the recording medium can be transported more stably. There are advantages. Therefore, the thickness B 1 of the second glaze layer 4 is 60% to 9% of the thickness A of the first glaze layer 2.
Preferably, it is set to 0%.
【００２２】尚、第２グレーズ層４の厚みＢ1 を第１グ
レーズ層２よりも薄く成しておくのは、印画の際、記録
媒体が第２グレーズ層４上の保護膜９と過度に強く当た
ることで記録媒体に傷が付くのを有効に防止するためで
あり、また第２グレーズ層４の厚みＢ1 を厚膜導体３よ
りも厚く成しておくのは、第２グレーズ層４上の保護膜
９を厚膜導体３の手前で記録媒体と確実に接触させるよ
うになすことで第２グレーズ層４に支持部材としての機
能を良好に発揮させるためである。The reason why the thickness B 1 of the second glaze layer 4 is made smaller than that of the first glaze layer 2 is that the recording medium is not excessively adhered to the protective film 9 on the second glaze layer 4 during printing. This is to effectively prevent the recording medium from being damaged by strong contact. The reason why the thickness B 1 of the second glaze layer 4 is made thicker than the thick film conductor 3 is that the second glaze layer 4 This is because the function of the second glaze layer 4 as a support member is favorably exhibited by ensuring that the upper protective film 9 comes into contact with the recording medium before the thick film conductor 3.
【００２３】また一方、前記絶縁基板１の上面で、かつ
第１グレーズ層２に対して記録媒体の搬送方向上流側
（図１の左側）には、第１グレーズ層２よりも厚みの薄
い第３グレーズ層５が第１グレーズ層２と略平行に形成
される。On the other hand, on the upper surface of the insulating substrate 1 and on the upstream side of the first glaze layer 2 in the direction of transport of the recording medium (left side in FIG. 1), the first glaze layer 2 is thinner than the first glaze layer 2. A three glaze layer 5 is formed substantially parallel to the first glaze layer 2.
【００２４】前記第３グレーズ層５は、その上に被着さ
れる保護膜９の表面を上方に突出させることにより、印
画の際、記録媒体を第３グレーズ層５上の保護膜表面で
受けてこれを良好に支持するとともに、該記録媒体を発
熱抵抗体６が設けられる第１グレーズ層２上にスムーズ
に案内する案内部材としての作用を為す。The third glaze layer 5 has a surface of a protective film 9 deposited thereon projecting upward to receive a recording medium on the surface of the protective film on the third glaze layer 5 during printing. In addition to supporting the recording medium well, the recording medium acts as a guide member for smoothly guiding the recording medium onto the first glaze layer 2 on which the heating resistor 6 is provided.
【００２５】この第３グレーズ層５も、第２グレーズ層
４と同様に、第１グレーズ層２と同質（同一組成）のガ
ラスによって形成され、第１グレーズ層２のエッジから
１．０μｍ〜５．０μｍだけ上流側に、前述の第２グレ
ーズ層４と略等しい厚み（２４μｍ〜７２μｍ）でもっ
て形成される。このような第３グレーズ層５の表面もま
た、第１グレーズ層２や第２グレーズ層４と同様の平滑
面（中心線平均粗さＲａ：５０〜１５０Å）を成すよう
に形成される。The third glaze layer 5 is also made of glass of the same quality (same composition) as the first glaze layer 2 like the second glaze layer 4 and is 1.0 μm to 5 μm from the edge of the first glaze layer 2. The second glaze layer 4 has a thickness (24 μm to 72 μm) substantially equal to that of the second glaze layer 4 on the upstream side by 0.0 μm. The surface of the third glaze layer 5 is also formed to have a smooth surface (center line average roughness Ra: 50 to 150 °) similar to the first glaze layer 2 and the second glaze layer 4.
【００２６】尚、前記第２グレーズ層４や第３グレーズ
層５は、第１グレーズ層２と同様の形成方法、即ち、ガ
ラスペーストのスクリーン印刷及び焼成の工程を経て形
成される。この場合、第２グレーズ層４及び第３グレー
ズ層５は第１グレーズ層２と同一の工程で同時に形成す
ることができるため、これらのグレーズ層４，５を形成
するにあたってサーマルヘッドの生産性が低下すること
はない。The second glaze layer 4 and the third glaze layer 5 are formed through the same forming method as the first glaze layer 2, that is, through the steps of screen printing and firing of a glass paste. In this case, since the second glaze layer 4 and the third glaze layer 5 can be formed simultaneously in the same step as the first glaze layer 2, the productivity of the thermal head in forming these glaze layers 4 and 5 is reduced. It does not decline.
【００２７】そして前述した第１グレーズ層２の頂部付
近には複数個の発熱抵抗体６が一列に並んで被着・形成
されており、更にこれら発熱抵抗体６の両端には個別電
極７及び共通電極８が電気的に接続される。In the vicinity of the top of the first glaze layer 2, a plurality of heating resistors 6 are attached and formed in a line, and individual electrodes 7 and The common electrode 8 is electrically connected.
【００２８】前記発熱抵抗体６は、例えば、ＴａＳｉＯ
やＴａＳｉＮＯ，ＴｉＳｉＯ，ＴｉＳｉＣＯ，ＮｂＳｉ
Ｏ系の電気抵抗材料を０．０１μｍ〜０．５μｍの厚み
に被着して成り、それ自体が所定の電気抵抗率を有して
いるため、個別電極７及び共通電極８を介して外部電源
からの電力が印加されるとジュール発熱を起こし、印画
を形成するのに必要な温度、例えば１５０〜３００℃の
温度にジュール発熱する。The heating resistor 6 is made of, for example, TaSiO.
And TaSiNO, TiSiO, TiSiCO, NbSi
Since an O-based electric resistance material is applied to a thickness of 0.01 μm to 0.5 μm and has a predetermined electric resistivity, an external power supply is provided via the individual electrodes 7 and the common electrode 8. When the electric power is applied, Joule heat is generated, and the Joule heat is generated to a temperature necessary for forming a print, for example, a temperature of 150 to 300 ° C.
【００２９】また前記個別電極７は発熱抵抗体６の各一
端に個々に接続され、共通電極８は発熱抵抗体６の各他
端に共通接続される。The individual electrodes 7 are individually connected to one end of the heating resistor 6, and the common electrode 8 is commonly connected to the other end of the heating resistor 6.
【００３０】これら個別電極７及び共通電極８は、Ａｌ
やＣｕ等の金属を０．５μｍ〜２．０μｍの厚みに被着
して成り、前記発熱抵抗体６にジュール発熱を起こさせ
るのに必要な所定の電力を印加する作用を為す。尚、発
熱抵抗体６に印加される電力のオン・オフは図示しない
ドライバーＩＣ等によって制御されることとなる。The individual electrode 7 and the common electrode 8 are made of Al
And a metal such as Cu or the like having a thickness of 0.5 μm to 2.0 μm, and has a function of applying a predetermined electric power necessary for causing the heating resistor 6 to generate Joule heat. The turning on / off of the power applied to the heating resistor 6 is controlled by a driver IC (not shown) or the like.
【００３１】また前記共通電極８は、その一端が厚膜導
体３上まで延在されて厚膜導体３と電気的に接続されて
いるため、印画時に大電流が流れる共通電極８を厚膜導
体３でもって電気的に補強し、共通電極８における電圧
降下の発生を有効に防止するようになっている。Since one end of the common electrode 8 extends over the thick film conductor 3 and is electrically connected to the thick film conductor 3, the common electrode 8 through which a large current flows during printing is connected to the thick film conductor 3. 3 to electrically reinforce and effectively prevent a voltage drop at the common electrode 8.
【００３２】尚、前記発熱抵抗体６や個別電極７，共通
電極８は、従来周知の薄膜手法によってそれぞれ所定形
状にパターニングされる。具体的には、まず、上面に第
１〜第３グレーズ層や厚膜導体３が被着されている絶縁
基板１を準備し、該絶縁基板の上面全域にＴａＳｉＯ等
の抵抗材料とＡｌ等の金属材料を従来周知のスパッタリ
ングにより順次被着させて抵抗層と金属層とを積層す
る。次に従来周知のフォトリソグラフィー技術及びエッ
チング技術を採用して金属層及び抵抗層を櫛歯状にパタ
ーニングするとともに、抵抗層を部分的に露出させて発
熱抵抗体６を形成することにより発熱抵抗体６や個別電
極７，共通電極８等から成るサーマルヘッドパターンを
形成する。この場合、前記厚膜導体３と前記共通電極８
との間には抵抗層が介在されるものの、この抵抗層の厚
みは0.01〜0.5 μｍと極めて薄いため、その界面抵抗は
極めて小さく（１×10-7Ω〜４×10-7Ω程度）、共通電
極８と厚膜導体３との電気的接続には何ら支障を来さな
いものである。The heating resistor 6, the individual electrodes 7, and the common electrode 8 are each patterned into a predetermined shape by a conventionally known thin film method. Specifically, first, an insulating substrate 1 on which the first to third glaze layers and the thick film conductor 3 are adhered on the upper surface is prepared, and a resistive material such as TaSiO and a material such as Al are formed on the entire upper surface of the insulating substrate. A resistance layer and a metal layer are laminated by sequentially applying a metal material by a conventionally known sputtering method. Then, the metal layer and the resistive layer are patterned in a comb-tooth shape by employing a conventionally known photolithography technique and etching technique, and the heat generating resistor 6 is formed by partially exposing the resistive layer to form the heat generating resistor 6. 6, a thermal head pattern including the individual electrodes 7, the common electrode 8, and the like is formed. In this case, the thick film conductor 3 and the common electrode 8
Although the resistance layer is interposed between, for this thickness of the resistive layer is extremely thin, 0.01 to 0.5 [mu] m, the interface resistance is extremely small (1 × 10 -7 Ω~4 × about 10 -7 Omega) The electrical connection between the common electrode 8 and the thick film conductor 3 does not cause any trouble.
【００３３】そして更に、このような第１〜第３グレー
ズ層や厚膜導体３，発熱抵抗体６，個別電極７，共通電
極８等が設けられている絶縁基板１の上面には略一定の
厚みを有した保護膜９が被着される。Further, on the upper surface of the insulating substrate 1 on which the first to third glaze layers, the thick film conductors 3, the heating resistors 6, the individual electrodes 7, the common electrodes 8 and the like are provided, a substantially uniform surface is provided. A protective film 9 having a thickness is applied.
【００３４】前記保護膜９は、Ｓｉ3 Ｎ4 やＳｉＯＮ等
の耐磨耗性を備えた電気絶縁材料から成り、その全体に
わたって略一定の厚みに、具体的には発熱抵抗体６上の
保護膜９の厚みを基準として、各部位の厚みが基準値か
ら±１０％の範囲内となるように形成される。The protective film 9 is made of an electrically insulating material having abrasion resistance, such as Si 3 N 4 or SiON, and has a substantially constant thickness over its entirety, specifically, a protective film on the heating resistor 6. Based on the thickness of the film 9, the thickness of each part is formed so as to be within ± 10% of the reference value.
【００３５】前記保護膜９は、前述の発熱抵抗体６や個
別電極７，共通電極８等を被覆しておくことにより、こ
れらを大気中に含まれている水分等の接触による腐食や
記録媒体の摺接による磨耗等から保護する作用を為し、
例えばＳｉ3 Ｎ4 から成る場合、Ｓｉ3 Ｎ4 を従来周知
の薄膜手法、具体的にはスパッタリング法やプラズマＣ
ＶＤ法等によって第１〜第３グレーズ層や厚膜導体３，
発熱抵抗体６，個別電極７，共通電極８等の上面に４μ
ｍ〜１５μｍの厚みをもって被着される。The protective film 9 covers the heating resistor 6, the individual electrode 7, the common electrode 8 and the like so as to protect the recording medium from corrosion due to contact with moisture and the like contained in the atmosphere. Acts to protect against wear due to sliding contact of
For example Si 3 when composed of N 4, Si 3 N 4 and conventionally known thin film techniques, specifically a sputtering method or a plasma C
First to third glaze layers and thick film conductors 3 by VD method or the like.
4 μm on the upper surface of the heating resistor 6, individual electrode 7, common electrode 8, etc.
It is applied with a thickness of m to 15 μm.
【００３６】かくして上述した本形態のサーマルヘッド
は、例えばインクリボンを用いて記録紙に印画を行う場
合、インクリボンと記録紙を重ね合わせた状態で第３グ
レーズ層２上から厚膜導体３上に向かって搬送し、これ
らを保護膜表面に摺接させながら、前記個別電極７と前
記共通電極８との間に図示しないドライバーＩＣの駆動
に伴って所定の電力を印加し、第１グレーズ層２上の発
熱抵抗体６を個々に選択的にジュール発熱させるととも
に、該発熱した熱によってインクリボンのインクを加熱
・溶融させ、これを記録紙に押圧・転写して所定の印画
を形成することによりサーマルヘッドとして機能する。Thus, when printing on recording paper using an ink ribbon, for example, the above-described thermal head according to the present embodiment, from the third glaze layer 2 to the thick film conductor 3 with the ink ribbon and the recording paper superimposed on each other And a predetermined electric power is applied between the individual electrode 7 and the common electrode 8 in accordance with the driving of a driver IC (not shown) while sliding them on the surface of the protective film. 2 to selectively generate Joule heat on each of the heating resistors 6 above, and heat and melt the ink of the ink ribbon by the generated heat, and press and transfer the ink to recording paper to form a predetermined print. Functions as a thermal head.
【００３７】このとき、サーマルヘッド上には外部のプ
ラテンローラＰが配置され、このプラテンローラＰの回
転によってインクリボンや記録紙等の記録媒体がサーマ
ルヘッドとプラテンローラＰの間に順次、送り込まれ
る。ここでプラテンローラＰを全てのグレーズ層上の保
護膜９、即ち、第１〜第３グレーズ層上の保護膜９と接
するように配置させておけば、記録媒体に異物が付着し
た状態で搬送されてきても、異物は第３グレーズ層５と
プラテンローラＰとの間で擦り潰されるため、発熱抵抗
体６が形成されている第１グレーズ層２上まで運ばれて
くることは少なく、異物の押圧による発熱抵抗体６の破
損や印画不良等が未然に防がれる利点がある。従ってプ
ラテンローラＰを第１〜第３グレーズ層上の保護膜９と
接するように配置させておくことが好ましい。At this time, an external platen roller P is disposed on the thermal head, and a recording medium such as an ink ribbon or recording paper is sequentially fed between the thermal head and the platen roller P by the rotation of the platen roller P. . Here, if the platen roller P is disposed so as to be in contact with the protective film 9 on all glaze layers, that is, the protective films 9 on the first to third glaze layers, the recording medium is conveyed in a state where foreign matter adheres to the recording medium. However, since the foreign matter is rubbed between the third glaze layer 5 and the platen roller P, the foreign matter is rarely carried onto the first glaze layer 2 on which the heating resistor 6 is formed. There is an advantage that damage to the heating resistor 6 due to the pressing of the sheet or defective printing can be prevented. Therefore, it is preferable to arrange the platen roller P so as to be in contact with the protective film 9 on the first to third glaze layers.
【００３８】以上のような本形態のサーマルヘッドにお
いては、絶縁基板上面の第１グレーズ層２と厚膜導体３
との間に、第１グレーズ層２よりも厚みが薄く、厚膜導
体３よりも厚みが厚い第２グレーズ層４を厚膜導体３に
沿って配設したことから、印画の際、第１グレーズ層２
上から厚膜導体３上に向かって走行する記録媒体を、厚
膜導体３上を通過する前に、第２グレーズ層４上の保護
膜表面で良好に支持し、記録媒体と厚膜導体３上の保護
膜９との摺接圧を緩和することができる。従って、プラ
スチックカードや厚紙等の硬質の記録媒体に印画を行う
場合であっても、記録媒体に傷が付くのを有効に防止し
て印画品質を大幅に向上させることが可能となる。In the thermal head of the present embodiment as described above, the first glaze layer 2 on the upper surface of the insulating substrate and the thick film conductor 3
Since the second glaze layer 4 having a smaller thickness than the first glaze layer 2 and a larger thickness than the thick film conductor 3 is disposed along the thick film conductor 3, the first Glaze layer 2
Before passing over the thick film conductor 3, the recording medium traveling from above is favorably supported on the surface of the protective film on the second glaze layer 4 before passing over the thick film conductor 3. The sliding contact pressure with the upper protective film 9 can be reduced. Therefore, even when printing is performed on a hard recording medium such as a plastic card or cardboard, it is possible to effectively prevent the recording medium from being damaged and to greatly improve the printing quality.
【００３９】また本形態のサーマルヘッドにおいては、
第２グレーズ層４や第３グレーズ層５が第１グレーズ層
２と同質のガラスによって形成されることから、これら
のグレーズ層は同一の工程で同時に形成することがで
き、第２グレーズ層４や第３グレーズ層５を形成するに
あたってサーマルヘッドの生産性が低下することはな
い。In the thermal head of the present embodiment,
Since the second glaze layer 4 and the third glaze layer 5 are formed of glass of the same quality as the first glaze layer 2, these glaze layers can be formed simultaneously in the same process. In forming the third glaze layer 5, the productivity of the thermal head does not decrease.
【００４０】更に本形態のサーマルヘッドにおいては、
第２グレーズ層４の厚みＢ1 を第１グレーズ層２の厚み
Ａの６０％〜９０％に設定することにより、記録媒体が
発熱抵抗体６上を通過した後、第２グレーズ層４によっ
て記録媒体の走行を良好に支持して記録媒体の排出角度
をほぼ一定に保持することができ、記録媒体をより安定
的に搬送することが可能となる。Further, in the thermal head of this embodiment,
By setting the thickness B 1 of the second glaze layer 4 to 60% to 90% of the first glaze layer 2 thickness A, after the recording medium passes over the heating resistor 6, the recording by the second glaze layer 4 The running of the medium can be favorably supported and the discharge angle of the recording medium can be kept substantially constant, so that the recording medium can be transported more stably.
【００４１】また更に本形態のサーマルヘッドにおいて
は、絶縁基板１の上面で、かつ第１グレーズ層２に対し
て記録媒体の搬送方向上流側に、第１グレーズ層２より
も厚みの薄い第３グレーズ層５を第１グレーズ層２と略
平行に形成することにより、印画の際、記録媒体を第３
グレーズ層５上の保護膜表面でもって良好に支持し、こ
れを発熱抵抗体６が設けられている第１グレーズ層２上
にスムーズに案内することができる。Further, in the thermal head according to the present embodiment, a third thinner layer than the first glaze layer 2 is provided on the upper surface of the insulating substrate 1 and on the upstream side of the first glaze layer 2 in the recording medium conveyance direction. By forming the glaze layer 5 substantially in parallel with the first glaze layer 2, the printing medium can be used for printing on the third glaze layer 2.
The surface of the protective film on the glaze layer 5 is favorably supported by the surface, and can be smoothly guided on the first glaze layer 2 on which the heating resistor 6 is provided.
【００４２】尚、本発明は上述の形態に限定されるもの
ではなく、本発明の要旨を逸脱しない範囲において種々
の変更、改良等が可能である。It should be noted that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be made without departing from the gist of the present invention.
【００４３】例えば、上述の形態においては厚膜導体を
形成するにあたって導電ペーストを従来周知のスクリー
ン印刷等によって絶縁基板１上に印刷・塗布するように
したが、これに代えて導電ペーストをディスペンサー等
で絶縁基板上に塗布するようにしても構わない。For example, in the above-described embodiment, the conductive paste is printed and applied on the insulating substrate 1 by a conventionally known screen printing or the like in forming the thick film conductor. May be applied on the insulating substrate.
【００４４】また上述の形態においては厚膜導体３と共
通電極８との間に抵抗層を介在させるようにしたが、こ
のような抵抗層を介在させずに厚膜導体３を共通電極８
上に直に被着させても良いことは勿論である。In the above-described embodiment, the resistive layer is interposed between the thick film conductor 3 and the common electrode 8, but the thick film conductor 3 is connected to the common electrode 8 without such a resistive layer.
Of course, it may be directly attached on the top.
【００４５】[0045]
【発明の効果】本発明のサーマルヘッドによれば、絶縁
基板上面の第１グレーズ層と厚膜導体との間に、第１グ
レーズ層よりも厚みが薄く、厚膜導体よりも厚みが厚い
第２グレーズ層を配設したことから、印画の際、第１グ
レーズ層上から厚膜導体上に向かって走行する記録媒体
を、厚膜導体上を通過する前に、第２グレーズ層上の保
護膜表面で良好に支持し、記録媒体と厚膜導体上の保護
膜との摺接圧を緩和することができる。従って、プラス
チックカードや厚紙等の硬質の記録媒体に印画を行う場
合であっても、記録媒体に傷が付くのを有効に防止して
印画品質を大幅に向上させることが可能となる。According to the thermal head of the present invention, between the first glaze layer and the thick film conductor on the upper surface of the insulating substrate, the thickness is smaller than the first glaze layer and larger than the thick film conductor. Since the two glaze layers are provided, during printing, the recording medium traveling from the first glaze layer toward the thick film conductor is protected on the second glaze layer before passing over the thick film conductor. The film can be favorably supported on the film surface and the sliding contact pressure between the recording medium and the protective film on the thick conductor can be reduced. Therefore, even when printing is performed on a hard recording medium such as a plastic card or cardboard, it is possible to effectively prevent the recording medium from being damaged and to greatly improve the printing quality.
【００４６】また本発明のサーマルヘッドによれば、絶
縁基板の上面で、かつ第１グレーズ層に対して記録媒体
の搬送方向上流側に、第１グレーズ層よりも厚みの薄い
第３グレーズ層を第１グレーズ層と略平行に形成するこ
とにより、印画の際、記録媒体を第３グレーズ層上の保
護膜表面でもって良好に支持し、これを発熱抵抗体が設
けられている第１グレーズ層上にスムーズに案内するこ
とができるようになる。According to the thermal head of the present invention, the third glaze layer thinner than the first glaze layer is provided on the upper surface of the insulating substrate and on the upstream side of the first glaze layer in the recording medium conveyance direction. By forming the recording medium substantially in parallel with the first glaze layer, the printing medium is favorably supported by the surface of the protective film on the third glaze layer during printing, and the recording medium is supported by the first glaze layer on which the heating resistor is provided. You will be able to guide up smoothly.
【図１】本発明の一形態にかかるサーマルヘッドの断面
図である。FIG. 1 is a cross-sectional view of a thermal head according to one embodiment of the present invention.
【図２】図１のサーマルヘッドの要部を示す平面図であ
る。FIG. 2 is a plan view showing a main part of the thermal head of FIG.
【図３】第１〜第３グレーズ層及び厚膜導体の厚みの関
係を示す断面図である。FIG. 3 is a cross-sectional view showing a relationship between thicknesses of first to third glaze layers and a thick film conductor.
【図４】従来のサーマルヘッドの断面図である。FIG. 4 is a sectional view of a conventional thermal head.
【符号の説明】 １・・・絶縁基板 ２・・・第１グレーズ層 ３・・・厚膜導体 ４・・・第２グレーズ層 ５・・・第３グレーズ層 ６・・・発熱抵抗体 ７・・・個別電極 ８・・・共通電極 ９・・・保護膜 Ａ・・・第１グレーズ層の厚み Ｂ1 ・・第２グレーズ層の厚み Ｂ2 ・・第３グレーズ層の厚み Ｃ・・・厚膜導体の厚み[Description of Signs] 1 ... Insulating substrate 2 ... First glaze layer 3 ... Thick film conductor 4 ... Second glaze layer 5 ... Third glaze layer 6 ... Heating resistor 7 ... individual electrodes 8 ... common electrodes 9 ... protective film A ... thickness of the first glaze layer B 1 ... thickness of the second glaze layer B 2 ... thickness of the third glaze layer C ...・ Thickness of thick film conductor
Claims (2)
被着されている帯状の第１グレーズ層と、該第１グレー
ズ層よりも厚みの薄い帯状の厚膜導体とを略平行に配置
し、前記発熱抵抗体の両端に個別電極及び共通電極を接
続するとともに該共通電極の一端を前記厚膜導体上まで
延在させて厚膜導体に電気的に接続し、更に前記第１グ
レーズ層、発熱抵抗体、共通電極及び厚膜導体を略一定
厚みの保護膜で被覆して成り、前記第１グレーズ層上か
ら厚膜導体上に向かって搬送される記録媒体を前記保護
膜表面に摺接させながら前記発熱抵抗体を選択的にジュ
ール発熱させることによって印画を形成するサーマルヘ
ッドであって、 前記絶縁基板の上面で、かつ前記第１グレーズ層と前記
厚膜導体との間に、第１グレーズ層よりも厚みが薄く、
厚膜導体よりも厚みが厚い第２グレーズ層を配設したこ
とを特徴とするサーマルヘッド。1. A belt-like first glaze layer on which a plurality of heating resistors are attached on an upper surface of an insulating substrate, and a belt-like thick film conductor thinner than the first glaze layer are substantially parallel to each other. And an individual electrode and a common electrode are connected to both ends of the heating resistor, and one end of the common electrode is extended over the thick film conductor to be electrically connected to the thick film conductor. A glaze layer, a heating resistor, a common electrode, and a thick-film conductor are covered with a protective film having a substantially constant thickness, and the recording medium conveyed from the first glaze layer toward the thick-film conductor is coated on the surface of the protective film. A thermal head for forming a print by selectively causing the heating resistor to generate Joule heat while being in sliding contact with the insulating substrate, wherein an upper surface of the insulating substrate is provided between the first glaze layer and the thick film conductor. , Thinner than the first glaze layer,
A thermal head comprising a second glaze layer having a thickness greater than that of a thick film conductor.
層に対して記録媒体の搬送方向上流側に、第１グレーズ
層よりも厚みの薄い第３グレーズ層が形成されているこ
とを特徴とする請求項１に記載のサーマルヘッド。2. A third glaze layer, which is thinner than the first glaze layer, is formed on the upper surface of the insulating substrate and on the upstream side of the first glaze layer in the recording medium conveyance direction. The thermal head according to claim 1, wherein
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10085191A JPH11277781A (en) | 1998-03-31 | 1998-03-31 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10085191A JPH11277781A (en) | 1998-03-31 | 1998-03-31 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11277781A true JPH11277781A (en) | 1999-10-12 |
Family
ID=13851773
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10085191A Pending JPH11277781A (en) | 1998-03-31 | 1998-03-31 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11277781A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002103661A (en) * | 2000-09-27 | 2002-04-09 | Kyocera Corp | Thermal printer |
| JP2006035723A (en) * | 2004-07-29 | 2006-02-09 | Kyocera Corp | Thermal head and thermal printer using this thermal head |
| JP2008213316A (en) * | 2007-03-05 | 2008-09-18 | Tdk Corp | Thermal head, photographic printing equipment, and manufacturing method for thermal head |
| JP2012121283A (en) * | 2010-12-10 | 2012-06-28 | Rohm Co Ltd | Thermal print head |
| JP2014069442A (en) * | 2012-09-28 | 2014-04-21 | Toshiba Hokuto Electronics Corp | Thermal printing head, and thermal printer using the same |
| JP2016005916A (en) * | 2015-10-13 | 2016-01-14 | ローム株式会社 | Thermal print head |
| JP2019064122A (en) * | 2017-09-29 | 2019-04-25 | 京セラ株式会社 | Thermal head and thermal printer |
-
1998
- 1998-03-31 JP JP10085191A patent/JPH11277781A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002103661A (en) * | 2000-09-27 | 2002-04-09 | Kyocera Corp | Thermal printer |
| JP4565724B2 (en) * | 2000-09-27 | 2010-10-20 | 京セラ株式会社 | Thermal printer |
| JP2006035723A (en) * | 2004-07-29 | 2006-02-09 | Kyocera Corp | Thermal head and thermal printer using this thermal head |
| JP4666972B2 (en) * | 2004-07-29 | 2011-04-06 | 京セラ株式会社 | Thermal head and thermal printer using the same |
| JP2008213316A (en) * | 2007-03-05 | 2008-09-18 | Tdk Corp | Thermal head, photographic printing equipment, and manufacturing method for thermal head |
| JP2012121283A (en) * | 2010-12-10 | 2012-06-28 | Rohm Co Ltd | Thermal print head |
| JP2014069442A (en) * | 2012-09-28 | 2014-04-21 | Toshiba Hokuto Electronics Corp | Thermal printing head, and thermal printer using the same |
| JP2016005916A (en) * | 2015-10-13 | 2016-01-14 | ローム株式会社 | Thermal print head |
| JP2019064122A (en) * | 2017-09-29 | 2019-04-25 | 京セラ株式会社 | Thermal head and thermal printer |
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