JPH11264038A - Copper alloy foil - Google Patents
Copper alloy foilInfo
- Publication number
- JPH11264038A JPH11264038A JP8822298A JP8822298A JPH11264038A JP H11264038 A JPH11264038 A JP H11264038A JP 8822298 A JP8822298 A JP 8822298A JP 8822298 A JP8822298 A JP 8822298A JP H11264038 A JPH11264038 A JP H11264038A
- Authority
- JP
- Japan
- Prior art keywords
- inclusions
- width
- less
- foil
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Parts Printed On Printed Circuit Boards (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブルプリ
ント配線基板用およびＩＣテープキャリア等半導体実装
の用途に好適な、強度および電気伝導性に優れた銅合金
箔に関するものであり、特には介在物の幅および介在物
の個数を規制したＣｕ−Ｓｎ−Ｐ系合金箔に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper alloy foil having excellent strength and electrical conductivity suitable for use in semiconductor mounting such as a flexible printed wiring board and an IC tape carrier. The present invention relates to a Cu—Sn—P alloy foil in which the width and the number of inclusions are regulated.
【０００２】[0002]
【従来の技術】有機物を基材としたプリント配線基板
は、ガラスエポキシ、紙フェノール基板を構成材料とす
る硬質銅張積層板（リジット）と、ポリイミド、ポリエ
ステル基板を構成材料とする可撓性銅張積層基板（フレ
キシブル）とに大別され、プリント配線基板の導電材と
しては主として銅箔が使用されている。銅箔はその製造
方法の違いにより電解銅箔と圧延銅箔に分類される。2. Description of the Related Art Printed wiring boards based on organic substances include rigid copper-clad laminates (rigid) made of glass epoxy and paper phenol boards, and flexible copper boards made of polyimide and polyester boards. Copper foil is mainly used as a conductive material of a printed wiring board. Copper foils are classified into electrolytic copper foils and rolled copper foils depending on the manufacturing method.
【０００３】上記プリント配線基板のうち、プリント配
線板のより高密度回路化による多層板化および高可撓性
が要求されるフレキシブルプリント回路基板は、樹脂基
板に銅箔をラミネートし、接着剤あるいは加熱加圧によ
り一体化して形成される。使用される銅箔としては、タ
フピッチ銅または無酸素銅の圧延銅箔が多く用いられて
おり、近年では高密度実装の有効な手段として、ビルド
アップ基板と呼ばれる多層配線基板が多く用いられてい
る。[0003] Among the above printed wiring boards, a flexible printed circuit board which requires a multi-layered board and higher flexibility by increasing the density of the printed wiring board is required. It is formed integrally by heating and pressing. As the copper foil to be used, a rolled copper foil of tough pitch copper or oxygen-free copper is often used, and in recent years, a multilayer wiring board called a build-up board is often used as an effective means of high-density mounting. .
【０００４】さらに、プリント配線基板の一部は、テー
プキャリア、ＴＡＢ（テープ・オートメイティド・ボン
ディング）リードとして半導体チップの実装に使用され
ている。半導体チップの実装の分野においては、近年そ
の実装密度の向上のためＢＧＡ（ボール・グリッド・ア
レイ）化、ＣＳＰ（チップ・サイズ・パッケージ）化が
進められている。これにより、面積当たりの端子数は増
加するが、同時に端子は狭ピッチとなるため、実装する
基板にも、高密度の配線基板が必要となる。高密度化実
現のための有効な手段として、半導体実装分野において
も多層基板が用いられている。Further, a part of the printed wiring board is used as a tape carrier and TAB (tape automated bonding) lead for mounting a semiconductor chip. In the field of semiconductor chip mounting, in recent years, BGA (ball grid array) and CSP (chip size package) have been promoted to improve the mounting density. As a result, the number of terminals per area increases, but at the same time, the terminals have a narrow pitch, so that a high-density wiring board is also required as a mounting board. As an effective means for realizing high density, a multilayer substrate is also used in the field of semiconductor mounting.
【０００５】一方、製造工程においては、箔の厚さが薄
くなると、歩留よく圧延することが困難となってくる。
特に、介在物等の内部欠陥は、圧延時に破断を生じ、ピ
ンホールの発生する原因となるため、生産性を低下さ
せ、ひいては製造コストの増大を招く。従って、素材に
は介在物の少ないことが望まれる。On the other hand, in the manufacturing process, when the thickness of the foil becomes thin, it becomes difficult to perform rolling at a high yield.
In particular, internal defects such as inclusions cause breakage at the time of rolling and cause pinholes, thereby lowering productivity and consequently increasing manufacturing costs. Therefore, it is desired that the material has few inclusions.
【０００６】[0006]
【発明が解決しようとする課題】前述のプリント基板
は、（１）組み立て時に曲げた状態で固定されて使用さ
れるもの、（２）駆動系統（例えばプリンターのヘッド
部分、ハードディスク内の駆動用回路基板等）に使用さ
れ、１万回以上の屈曲が繰り返されるもの、等に用いら
れる。近年の電子機器の小型化と高密度化に伴いプリン
ト基板自体も小型化が要求され、純銅箔では強度が不足
するため、部品の加工および組み立て時に切断あるいは
変形といった問題が生じる。また純銅は耐熱性が著しく
低いため、銅箔を樹脂基板にラミネートする際の加熱に
よって変形、断線という問題が発生し、信頼性が低下す
るという欠点があった。The above-mentioned printed circuit board is (1) used while being fixed in a bent state at the time of assembling, and (2) a driving system (for example, a head portion of a printer, a driving circuit in a hard disk). Substrate and the like, which is repeatedly bent 10,000 times or more. In recent years, as electronic devices have become smaller and denser, the printed circuit boards themselves have also been required to be smaller, and pure copper foils have insufficient strength, which causes problems such as cutting or deformation when processing and assembling parts. In addition, since pure copper has a remarkably low heat resistance, there is a problem that a problem of deformation and disconnection occurs due to heating when laminating a copper foil on a resin substrate, and reliability is reduced.
【０００７】半導体チップの実装の分野においては、搭
載されるチップの回路ルールの微細化が進展しており、
「０．１〜０．２μｍルール」が開発されている。０．
１〜０．２μｍルールの場合、チップ裏面につける金あ
るいはアルミバンプのピッチは４０μｍ程度になり、４
０μｍピッチのバンプを接合するには、基板の配線ピッ
チを１５μｍ以下にする必要がある。配線のピッチを１
５μｍ以下にするためには、基板に使用される銅箔の板
厚を１４μｍ以下にする必要がある。これは、銅箔の板
厚をピッチ以下にしないと、エッチング、組み立て加工
ができないためである。しかし、従来の圧延銅箔では板
厚が１４μｍ以下になると強度の不足から、ＩＲＢ（イ
ンナーリード・ボンディング）時に切断あるいは変形と
いった問題が生じる。従って上記要請に対処しうる十分
な強度とさらに十分な電気伝導性を持った材料が求めら
れている。[0007] In the field of semiconductor chip mounting, the circuit rules of mounted chips have been miniaturized.
The “0.1-0.2 μm rule” has been developed. 0.
In the case of the 1 to 0.2 μm rule, the pitch of the gold or aluminum bumps to be attached to the back of the chip is about 40 μm,
In order to bond bumps having a pitch of 0 μm, the wiring pitch of the substrate needs to be 15 μm or less. Wiring pitch is 1
In order to reduce the thickness to 5 μm or less, it is necessary to reduce the thickness of the copper foil used for the substrate to 14 μm or less. This is because etching and assembling cannot be performed unless the thickness of the copper foil is equal to or less than the pitch. However, in the case of a conventional rolled copper foil having a thickness of 14 μm or less, a problem such as cutting or deformation occurs at the time of IRB (inner lead bonding) due to insufficient strength. Therefore, there is a demand for a material having sufficient strength and further sufficient electric conductivity to meet the above demand.
【０００８】上記要求に対し、ある種の添加元素を加え
た銅合金を用いることは有効な手段の一つではあるが、
銅合金を用いるということだけでは必ずしも十分な強度
は得られず、加えて元素の添加により基板の他の必要特
性である電気伝導度の低下といった問題が生じる。こう
した背景において、Ｃｕ−Ｓｎ−Ｐ系合金が候補の一つ
として考慮されうる。Ｃｕ−Ｓｎ−Ｐ系合金を銅合金箔
材料として実用化するに当たって、マトリックス中に酸
化物、硫化物、珪化物等の比較的大きな介在物が分散し
た組織である場合、これらの粗大な介在物の存在は、圧
延時に破断、ピンホールの生じる原因となるため、生産
性を低下させ、ひいてはコストの増大を招く。本発明は
上述した問題解決のためになされたもので、十分な強度
および電気伝導度を有し、さらには生産性にも優れたＣ
ｕ−Ｓｎ−Ｐ系銅合金箔を提供することを目的としてい
る。[0008] In response to the above requirements, the use of a copper alloy to which a certain additive element is added is one of effective means.
The use of a copper alloy alone does not always provide sufficient strength, and the addition of an element causes a problem such as a decrease in electrical conductivity, which is another required characteristic of the substrate. In such a background, a Cu-Sn-P-based alloy can be considered as one of the candidates. In putting a Cu-Sn-P-based alloy into practical use as a copper alloy foil material, when a relatively large inclusion such as an oxide, a sulfide, or a silicide is dispersed in a matrix, these coarse inclusions may be used. Presence causes breakage and pinholes at the time of rolling, thereby lowering productivity and consequently increasing costs. The present invention has been made to solve the above-mentioned problems, and has a sufficient strength and electric conductivity, and furthermore, has excellent productivity.
An object is to provide a u-Sn-P-based copper alloy foil.
【０００９】[0009]
【課題を解決するための手段】そこで、本発明者らは、
金属箔として適する銅合金箔の研究を重ねたところ、Ｃ
ｕ−Ｓｎ−Ｐ系合金の成分調整を行った上で、必要に応
じてＮｉおよび／またはＺｎ、さらに必要に応じてＴ
ｉ、Ｚｒ、Ｃｒ、Ｍｇ、Ｍｎ、Ｆｅ、Ｃｏ、Ａｌ、Ｂ
ｅ、Ｓｉおよび／またはＢを含有させると共に、製造条
件を制御・選定してマトリックス中の酸化物、硫化物、
珪化物等の介在物の分布の制御することにより、合金箔
として好適な素材を提供できることを見出した。本発明
は、上記知見を基にして完成されたものであり、銅合金
において、Ｓｎを０．２〜３％およびＰを０．０１〜
０．４％含有し、必要に応じて０．０５〜１．５％のＮ
ｉおよび０．０１〜３％のＺｎのうち１種または２種を
含有し、さらに必要に応じてＴｉ、Ｚｒ、Ｃｒ、Ｍｇ、
Ｍｎ、Ｆｅ、Ｃｏ、Ａｌ、Ｂｅ、ＳｉおよびＢのうち１
種以上を総量で０．０１〜１％を含有し、残部がＣｕお
よびその不可避的不純物からなり、介在物の幅が１０μ
ｍ以下であり、かつ圧延平行断面における１〜１０μｍ
の幅の介在物個数が１００個／ｍｍ2 未満であることを
特徴とする、プリント配線基板用やＩＣテープキャリア
用として十分な強度と電気伝導性を兼備せしめ、さらに
は生産性も良好な銅合金箔を提供する。Means for Solving the Problems Accordingly, the present inventors have:
After repeated research on copper alloy foil suitable as metal foil, C
After adjusting the components of the u-Sn-P-based alloy, Ni and / or Zn if necessary, and T
i, Zr, Cr, Mg, Mn, Fe, Co, Al, B
e, Si and / or B, and control / select production conditions to control oxides, sulfides,
It has been found that by controlling the distribution of inclusions such as silicide, a material suitable as an alloy foil can be provided. The present invention has been completed on the basis of the above findings, and in a copper alloy, Sn has a content of 0.2 to 3% and P has a content of 0.01 to 0.01%.
0.4%, optionally 0.05-1.5% N
i and 0.01 to 3% of one or two of Zn, and optionally Ti, Zr, Cr, Mg,
One of Mn, Fe, Co, Al, Be, Si and B
Containing at least 0.01% of seeds, the balance consisting of Cu and its unavoidable impurities, and the width of inclusions is 10 μm.
m or less, and 1 to 10 μm in a rolling parallel section
Characterized in that the number of inclusions having a width of less than 100 / mm 2 is sufficient copper having both sufficient strength and electric conductivity for printed wiring boards and IC tape carriers, and also having good productivity. Provide alloy foil.
【００１０】本発明において用語「介在物」とは、溶解
時に生成する、例えば溶湯内での反応により生じる不純
物である酸化物、硫化物、珪化物など、本合金の顕微鏡
観察によりマトリックス中に観察されるものとして使用
する。「介在物の幅」は、介在物を顕微鏡観察下でその
介在物の板厚方向の最大幅をいう。「介在物の個数」と
は、材料の圧延平行断面を顕微鏡観察により多数箇所に
おいて実際に数えた単位平方ｍｍ当たりの介在物個数で
ある。In the present invention, the term "inclusions" refers to oxides, sulfides, silicides, etc., which are formed during melting, such as impurities generated by a reaction in a molten metal, and are observed in a matrix by microscopic observation of the alloy. To be used. The “width of the inclusion” refers to the maximum width of the inclusion in the thickness direction of the inclusion under microscopic observation. The “number of inclusions” is the number of inclusions per unit square mm actually counted at a number of locations by rolling observation of a parallel section of the material under a microscope.
【００１１】[0011]
【発明の実施の形態】次に本発明において銅合金の成分
組成を前記の如くに限定した理由をその作用とともに説
明する。Next, the reason why the composition of the copper alloy in the present invention is limited as described above will be described together with its operation.
【００１２】（Ｓｎ）Ｓｎには、合金の強度を確保する
作用があるが、その含有量が０．２％未満であると、他
の成分の複合添加を伴っても所望とする強度が得られ
ず、一方３％を超える割合でＳｎを含有させると導電率
が著しく低下することから、Ｓｎの含有量を０．２％以
上３％以下と定めた。好ましくはＳｎの含有量は０．５
〜２．０％である。(Sn) Sn has the effect of ensuring the strength of the alloy, but if its content is less than 0.2%, the desired strength can be obtained even with the complex addition of other components. On the other hand, when Sn is contained in a proportion exceeding 3%, the conductivity is remarkably reduced. Therefore, the content of Sn is set to 0.2% or more and 3% or less. Preferably, the Sn content is 0.5
~ 2.0%.
【００１３】（Ｐ）Ｐには合金の強度並びに耐熱性を確
保する作用があるが、その含有量が０．０１％未満では
Ｐ含有における所望の強度、耐熱性向上効果は得られ
ず、一方Ｐ含有量が０．４％以上になるとＳｎの含有量
の如何に関わらず導電率の低下が著しくなることから、
Ｐ含有量は０．０１％以上０．４％以下と定めた。好ま
しいＰ含有量は０．０２〜０．２％である。(P) Although P has an effect of securing the strength and heat resistance of the alloy, if its content is less than 0.01%, the desired effect of improving the strength and heat resistance in the P content cannot be obtained. When the P content is 0.4% or more, the conductivity significantly decreases regardless of the Sn content.
The P content was determined to be 0.01% or more and 0.4% or less. The preferred P content is 0.02 to 0.2%.
【００１４】（Ｎｉ）ＮｉにはＳｎ−Ｐ系銅合金の強度
を確保するとともに、半田接合部の耐熱剥離性を改善す
る効果があるが、０．０５％未満ではＮｉ含有による所
望の強度が得られず、一方Ｎｉ含有量が１．５％を超え
るとＳｎの含有量の如何に関わらず導電率の低下が著し
くなることから、Ｎｉ含有量は０．０５％以上１．５％
以下と定めた。好ましいＮｉ含有量は０．１〜１．２％
である。(Ni) Ni has the effect of securing the strength of the Sn-P-based copper alloy and improving the heat-peeling resistance of the solder joints. On the other hand, when the Ni content exceeds 1.5%, the conductivity significantly decreases regardless of the Sn content. Therefore, the Ni content is 0.05% or more and 1.5% or less.
It is determined as follows. Preferred Ni content is 0.1 to 1.2%
It is.
【００１５】（Ｚｎ）Ｚｎには、Ｎｉと同様に、Ｓｎ−
Ｐ系銅合金の強度を確保し、半田接合部の耐熱剥離性を
改善する作用があるが、その含有量が０．０１％未満で
はＺｎ含有による所望の効果が得られず、一方Ｚｎ含有
量が３％を超えると導電率の低下が著しくなることか
ら、Ｚｎ含有量は０．０１％以上３％以下と定めた。好
ましいＺｎ含有量は０．０５〜１．０％である。(Zn) As in the case of Ni, Sn-
It has the effect of ensuring the strength of the P-based copper alloy and improving the heat-peeling resistance of the solder joint. However, if the content is less than 0.01%, the desired effect due to the Zn content cannot be obtained. Exceeds 3%, the electrical conductivity significantly decreases, so the Zn content is determined to be 0.01% or more and 3% or less. The preferred Zn content is 0.05 to 1.0%.
【００１６】（Ｔｉ、Ｚｒ、Ｃｒ、Ｍｇ、Ｍｎ、Ｆｅ、
Ｃｏ、Ａｌ、Ｂｅ、ＳｉまたはＢ）Ｔｉ、Ｚｒ、Ｃｒ、
Ｍｇ、Ｍｎ、Ｆｅ、Ｃｏ、Ａｌ、Ｂｅ、ＳｉまたはＢに
はＳｎ−Ｐ系銅合金の強度を改善する等の作用があるの
で、必要により１種または２種以上の添加がなされる。
しかし、Ｍｇ、Ｚｎ、Ｓｎ、Ｆｅ、Ｔｉ、Ｚｒ、Ｃｒ、
Ａｌ、Ｍｎ、ＡｇまたはＢｅの含有量が総量で０．０１
％未満であると上記の効果は得られず、一方総含有量が
１％を超えると電気伝導性が著しく低下し、さらには、
活性元素を過剰に添加した場合には、酸化物、硫化物、
珪化物等粗大な介在物が母相中に生成しやすくなる。こ
の結果、圧延時の破断、ピンホールの発生等により生産
性の低下を招くことになる。そこで、これらの含有量を
総量で０．０１〜１％以下と定める。(Ti, Zr, Cr, Mg, Mn, Fe,
Co, Al, Be, Si or B) Ti, Zr, Cr,
Since Mg, Mn, Fe, Co, Al, Be, Si or B has an effect of improving the strength of the Sn—P-based copper alloy, one or more of them are added as necessary.
However, Mg, Zn, Sn, Fe, Ti, Zr, Cr,
The content of Al, Mn, Ag or Be is 0.01 in total.
%, The above effect cannot be obtained. On the other hand, when the total content exceeds 1%, the electric conductivity is remarkably reduced.
If the active element is added in excess, oxides, sulfides,
Coarse inclusions such as silicides are easily generated in the matrix. As a result, the productivity is lowered due to breakage during rolling, generation of pinholes, and the like. Therefore, their contents are determined to be 0.01 to 1% or less in total.
【００１７】（介在物）この合金系ではマトリックス中
に介在物の粒子が存在することがあるが、その幅が１０
μｍを超えると圧延工程において破断やピンホールの原
因となり、生産性を著しく低下させる。このような不具
合を起こさないためには、この粗大な介在物の幅の上限
を１０μｍとし、圧延平行断面における１〜１０μｍ以
下の幅の介在物個数を１００個／ｍｍ2 未満とすればよ
い。(Inclusions) In this alloy system, inclusion particles may be present in the matrix, but the
If it exceeds μm, breakage or pinholes will be caused in the rolling step, and the productivity will be significantly reduced. In order not to cause such a problem, the upper limit of the width of the coarse inclusion may be set to 10 μm, and the number of inclusions having a width of 1 to 10 μm or less in the parallel rolling section may be set to less than 100 / mm 2 .
【００１８】次に、この合金を得るための製造工程につ
いて説明する。溶解工程では、粗大な酸化物、硫化物、
珪化物等の介在物の生成を防ぐことが重要である。従っ
て溶解原料の溶落後は、溶湯表面を木炭等で被覆するこ
とにより、酸素濃度を低減する必要がある。また冷間圧
延により所望の板厚に仕上げるわけであるが、冷間圧延
後の箔の厚さは、１００μｍ（０．１ｍｍ）以下とする
ことが望ましく、通常の使用形態を想定した圧延銅合金
箔の好ましい厚さは、例えば０．０３５ｍｍ、０．０７
ｍｍ、０．０１８ｍｍまたは０．０１０ｍｍである。Next, a manufacturing process for obtaining this alloy will be described. In the melting process, coarse oxides, sulfides,
It is important to prevent the formation of inclusions such as silicides. Therefore, after the molten raw material is dropped, it is necessary to reduce the oxygen concentration by coating the surface of the molten metal with charcoal or the like. The desired thickness is obtained by cold rolling, and the thickness of the foil after the cold rolling is desirably 100 μm (0.1 mm) or less. The preferred thickness of the foil is, for example, 0.035 mm, 0.07
mm, 0.018 mm or 0.010 mm.
【００１９】[0019]
【実施例】以下、実施例及び比較例により本発明をさら
に詳しく説明する。高周波溶解炉にて表１に示す各種成
分組成の銅合金を溶製し、厚さ２０ｍｍのインゴットに
鋳造した。次に、このインゴットを７００〜８００℃の
温度で厚さ８ｍｍまで熱間圧延を行い、表面のスケール
除去のため面削を施した後、冷間圧延により厚さ２ｍｍ
の板とした。その後、４５０〜６５０℃の温度で１時間
の再結晶焼鈍後、０．５ｍｍまで冷間圧延した。そして
さらに、３５０〜６００℃の温度で１時間の再結晶焼鈍
を行った後、冷間圧延で厚さ０．０１８ｍｍの箔とし
た。The present invention will be described below in more detail with reference to Examples and Comparative Examples. Copper alloys having various component compositions shown in Table 1 were melted in a high-frequency melting furnace and cast into ingots having a thickness of 20 mm. Next, this ingot is hot-rolled to a thickness of 8 mm at a temperature of 700 to 800 ° C., and is subjected to facing to remove scale from the surface, and then cold-rolled to a thickness of 2 mm.
Plate. Then, after recrystallization annealing for 1 hour at a temperature of 450 to 650 ° C., cold rolling was performed to 0.5 mm. Further, after recrystallization annealing for 1 hour at a temperature of 350 to 600 ° C., a foil having a thickness of 0.018 mm was obtained by cold rolling.
【００２０】このようにして得られた各合金箔につき諸
特性の評価を行った。なお表中には従来合金としてタフ
ピッチ銅を併記した。「強度」については引張試験機に
おいて引張強さを測定した。「電気伝導性」は導電率
（％ＩＡＣＳ）によって示した。「耐熱性」の評価は、
種々の温度で３０分間加熱し、引張強さが加熱前の強度
と十分軟化した時の強度の中間になる温度を軟化温度と
して求めた。介在物個数は、材料の圧延方向断面を顕微
鏡で観察し、多数箇所において実際に数えた単位平方ｍ
ｍ当たりの幅１〜１０μｍの介在物個数である。また、
厚さ０．０１８ｍｍ、幅４５０ｍｍ、長さ５０００ｍの
箔を作製し、生産性の評価も行った。「生産性」は、圧
延工程中の破断発生状況および製品段階でのピンホール
発生状況で評価した。「破断」については、破断が発生
しなかった場合を○、破断した場合を×とした。「ピン
ホール」については１０００ｍ当たりの直径０．５ｍｍ
以上のピンホールの発生個数を計測した。The properties of each of the alloy foils thus obtained were evaluated. In the table, tough pitch copper is also described as a conventional alloy. As for “strength”, the tensile strength was measured by a tensile tester. "Electrical conductivity" was indicated by conductivity (% IACS). The evaluation of "heat resistance"
Heating was performed at various temperatures for 30 minutes, and the temperature at which the tensile strength was halfway between the strength before heating and the strength when sufficiently softened was determined as the softening temperature. The number of inclusions was obtained by observing the cross section of the material in the rolling direction with a microscope and measuring the unit square m
The number of inclusions having a width of 1 to 10 μm per m. Also,
A foil having a thickness of 0.018 mm, a width of 450 mm, and a length of 5000 m was produced, and productivity was also evaluated. "Productivity" was evaluated based on the occurrence of breaks during the rolling process and the occurrence of pinholes at the product stage. Regarding “break”, ○ indicates that no break occurred, and x indicates that break occurred. 0.5mm diameter per 1000m for "pinhole"
The number of generated pinholes was measured.
【００２１】[0021]
【表１】 [Table 1]
【００２２】表１からわかるように、本発明合金箔は優
れた強度、導電率および耐熱性を有している。ピンホー
ル発生個数も少ない。一方、比較合金の No.１〜 No.４
は、本発明合金と一部の組成が異なるものであるが、本
発明合金と比較すると、比較合金 No.１は、Ｓｎが低い
ため強度が劣る。比較合金 No.２は、Ｚｎが高いため導
電率が劣る。比較合金 No.３は、Ｐが高いために導電性
が劣る。比較合金 No.４は、本発明の濃度範囲を超えて
副成分を含有するため導電率が劣る。また比較例 No.
２、４は、介在物個数が多いために、製造工程中で破断
が発生し、ピンホールの個数が増加した例である。As can be seen from Table 1, the alloy foil of the present invention has excellent strength, electrical conductivity and heat resistance. The number of pinholes generated is also small. On the other hand, the comparative alloys No.1 to No.4
Although the composition of the alloy of the present invention is partially different from that of the alloy of the present invention, the comparative alloy No. 1 is inferior in strength due to low Sn as compared with the alloy of the present invention. Comparative Alloy No. 2 is inferior in conductivity due to high Zn. Comparative alloy No. 3 has poor conductivity due to high P. Comparative alloy No. 4 is inferior in electric conductivity because it contains subcomponents exceeding the concentration range of the present invention. Comparative Example No.
Nos. 2 and 4 are examples in which breakage occurred during the manufacturing process due to a large number of inclusions, and the number of pinholes increased.
【００２３】[0023]
【発明の効果】以上説明したように、本発明によれば、
優れた強度と電気伝導性、さらには優れた耐熱性をも有
した銅合金箔が得られ、本銅合金箔は、プリント配線基
板用およびＩＣテープキャリア等半導体実装分野の用途
において信頼性の高い銅合金箔材料として好適である。As described above, according to the present invention,
A copper alloy foil having excellent strength and electrical conductivity, and also excellent heat resistance can be obtained.This copper alloy foil has high reliability in applications in the semiconductor mounting field such as printed wiring boards and IC tape carriers. It is suitable as a copper alloy foil material.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ２２Ｆ 1/00 ６３０ Ｃ２２Ｆ 1/00 ６３０Ａ ６５０ ６５０Ａ ６６１ ６６１Ａ ６８５ ６８５Ｚ ６８６ ６８６Ｚ ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 6 Identification symbol FI C22F 1/00 630 C22F 1/00 630A 650 650A 661 661A 685 685Z 686 686Z
Claims (4)
０．０１〜０．４％のＰを含有し、残部がＣｕおよびそ
の不可避的不純物からなり、そして介在物の幅が１０μ
ｍ以下であり、かつ１〜１０μｍの幅の介在物個数が圧
延平行断面で１００個／ｍｍ2 未満であることを特徴と
する銅合金箔。1. The composition contains, by weight, 0.2 to 3% of Sn and 0.01 to 0.4% of P, the balance consisting of Cu and its unavoidable impurities, and a width of inclusions of 10 μm.
m, and the number of inclusions having a width of 1 to 10 μm is less than 100 / mm 2 in a parallel rolled section.
０．０１〜０．４％のＰを含有し、さらに０．０５〜
１．５％のＮｉおよび０．０１〜３％のＺｎのうち１種
または２種を含有し、残部がＣｕおよびその不可避的不
純物からなり、そして介在物の幅が１０μｍ以下であ
り、かつ１〜１０μｍの幅の介在物個数が圧延平行断面
で１００個／ｍｍ2 未満であることを特徴とする銅合金
箔。2. It contains 0.2 to 3% of Sn and 0.01 to 0.4% of P by weight, and further contains 0.05 to
One or two of 1.5% Ni and 0.01 to 3% Zn, the balance consisting of Cu and its unavoidable impurities, and the width of inclusions is 10 μm or less; A copper alloy foil characterized in that the number of inclusions having a width of 10 to 10 µm is less than 100 / mm 2 in a rolled parallel section.
０．０１〜０．４％のＰを含有し、さらにＴｉ、Ｚｒ、
Ｃｒ、Ｍｇ、Ｍｎ、Ｆｅ、Ｃｏ、Ａｌ、Ｂｅ、Ｓｉおよ
びＢのうち１種以上を総量で０．０１〜１％含有し、残
部がＣｕおよびその不可避的不純物からなり、そして介
在物の幅が１０μｍ以下であり、かつ１〜１０μｍの幅
の介在物個数が圧延平行断面で１００個／ｍｍ2 未満で
あることを特徴とする銅合金箔。3. The composition according to claim 1, comprising 0.2 to 3% of Sn and 0.01 to 0.4% of P by weight, further comprising Ti, Zr,
One or more of Cr, Mg, Mn, Fe, Co, Al, Be, Si and B are contained in a total amount of 0.01 to 1%, the balance being Cu and its unavoidable impurities, and the width of inclusions. Copper alloy foil, wherein the number of inclusions having a width of 10 μm or less and a width of 1 to 10 μm is less than 100 / mm 2 in a rolled parallel section.
０．０１〜０．４％のＰを含有し、さらに０．０５〜
１．５％のＮｉおよび０．０１〜３％のＺｎのうち１種
または２種を含有するとともに、Ｔｉ、Ｚｒ、Ｃｒ、Ｍ
ｇ、Ｍｎ、Ｆｅ、Ｃｏ、Ａｌ、Ｂｅ、ＳｉおよびＢのう
ち１種以上を総量で０．０１〜１％含有し、残部がＣｕ
およびその不可避的不純物からなり、そして介在物の幅
が１０μｍ以下であり、かつ１〜１０μｍの幅の介在物
個数が圧延平行断面で１００個／ｍｍ2 未満であること
を特徴とする銅合金箔。4. The composition according to claim 1, comprising 0.2 to 3% of Sn and 0.01 to 0.4% of P by weight.
One or two of 1.5% Ni and 0.01 to 3% Zn, and Ti, Zr, Cr, M
g, Mn, Fe, Co, Al, Be, Si and B, in a total amount of 0.01 to 1%, and the balance Cu
Copper alloy foil comprising an unavoidable impurity and having a width of inclusions of 10 μm or less and a number of inclusions having a width of 1 to 10 μm in a rolled parallel section of less than 100 / mm 2. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8822298A JPH11264038A (en) | 1998-03-18 | 1998-03-18 | Copper alloy foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8822298A JPH11264038A (en) | 1998-03-18 | 1998-03-18 | Copper alloy foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11264038A true JPH11264038A (en) | 1999-09-28 |
Family
ID=13936859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8822298A Pending JPH11264038A (en) | 1998-03-18 | 1998-03-18 | Copper alloy foil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11264038A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007270314A (en) * | 2006-03-31 | 2007-10-18 | Nikko Kinzoku Kk | Copper alloy having excellent hot workability and its production method |
| JP2016135927A (en) * | 2015-01-09 | 2016-07-28 | Ｊｘ金属株式会社 | Metal base material with plating material |
| JP2016138337A (en) * | 2015-01-09 | 2016-08-04 | Ｊｘ金属株式会社 | Metal base with plating |
| DE102011013399B4 (en) * | 2010-03-10 | 2017-09-07 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | High strength copper alloy material with high heat resistance |
-
1998
- 1998-03-18 JP JP8822298A patent/JPH11264038A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007270314A (en) * | 2006-03-31 | 2007-10-18 | Nikko Kinzoku Kk | Copper alloy having excellent hot workability and its production method |
| DE102011013399B4 (en) * | 2010-03-10 | 2017-09-07 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | High strength copper alloy material with high heat resistance |
| JP2016135927A (en) * | 2015-01-09 | 2016-07-28 | Ｊｘ金属株式会社 | Metal base material with plating material |
| JP2016138337A (en) * | 2015-01-09 | 2016-08-04 | Ｊｘ金属株式会社 | Metal base with plating |
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