JPH1126214A - Variable resistor - Google Patents
Variable resistorInfo
- Publication number
- JPH1126214A JPH1126214A JP9182215A JP18221597A JPH1126214A JP H1126214 A JPH1126214 A JP H1126214A JP 9182215 A JP9182215 A JP 9182215A JP 18221597 A JP18221597 A JP 18221597A JP H1126214 A JPH1126214 A JP H1126214A
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- variable resistor
- terminal
- insulating board
- rough surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板の表面に抵抗
体が形成された可変抵抗器に係わり、特に、リフロー半
田付けによりプリント基板に半田付けしたときのフラッ
クスが、前記抵抗体表面に上昇するのを防止するのに好
適な可変抵抗器に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a variable resistor in which a resistor is formed on a surface of a substrate, and more particularly, a flux when soldered to a printed circuit board by reflow soldering rises to the surface of the resistor. The present invention relates to a variable resistor suitable for preventing the occurrence of an electric current.
【０００２】[0002]
【従来の技術】この種の従来の可変抵抗器で、例えばチ
ップタイプの可変抵抗器は、図示を省略するが、セラミ
ック製の基板と、該基板に回転可能に軸止された摺動子
とで構成されている。そして、前記セラミック製の基板
には表面に抵抗体が形成されていると共に、この抵抗体
の両端に接続される一対の第１端子と第３端子と、前記
摺動子に接続される第２端子とが設けられている。2. Description of the Related Art A conventional variable resistor of this type, for example, a chip type variable resistor, although not shown, includes a ceramic substrate and a slider rotatably fixed to the substrate. It is composed of A resistor is formed on the surface of the ceramic substrate, a pair of first and third terminals connected to both ends of the resistor, and a second terminal connected to the slider. Terminals are provided.
【０００３】前記セラミック製の基板は、縦横のサイズ
が大きく、厚さが略１ｍｍと薄いセラミック基板上に、
複数の多数の抵抗体、および電極等が印刷形成され、そ
の後一個の可変抵抗器に相当する大きさに前記セラミッ
ク基板を切断して基板を形成していた。そして、該切断
後の基板に摺動子等を取り付けてチップタイプの可変抵
抗器が形成されている。このようなチップタイプの可変
抵抗器は、リフロー半田付け装置等を用いてクリーム半
田により容易にプリント基板に半田付けすることができ
る。[0003] The ceramic substrate has a large vertical and horizontal size and a thickness of about 1 mm.
A plurality of resistors, electrodes, and the like are formed by printing, and then the ceramic substrate is cut into a size corresponding to one variable resistor to form a substrate. A slider or the like is attached to the cut substrate to form a chip-type variable resistor. Such a chip type variable resistor can be easily soldered to a printed board by cream solder using a reflow soldering device or the like.
【０００４】[0004]
【発明が解決しようとする課題】しかし、前述したよう
な従来の可変抵抗器は、セラミック等から成る基板は厚
さが略１ｍｍと薄いため、従来の可変抵抗器をリフロー
半田等によりプリント基板に半田付けした時に、フラッ
クスが基板の側面を伝わって基板上面に上昇し、この基
板上面に形成している抵抗体の表面まで流れることがあ
る。また、前記抵抗体表面まで流れるフラックスは、前
記リフロー半田付け時のクリーム半田に含まれているフ
ラックスだけではなく、このリフロー半田後に前記プリ
ント基板にその他の電気部品がディップ等により半田付
けされていることがあり、このディップ時に使われるフ
ラックスがプリント基板上に流れ出すものもある。そし
て、前記抵抗体の表面にフラックスが流れると、抵抗体
の表面を摺動する摺動子の接点部が抵抗体と接触不良を
起こして抵抗値がオープンになる等、可変抵抗器として
の機能を発揮できなく弊害がある。However, in the conventional variable resistor as described above, since the substrate made of ceramic or the like has a thin thickness of approximately 1 mm, the conventional variable resistor is mounted on a printed circuit board by reflow soldering or the like. At the time of soldering, the flux may travel along the side surface of the substrate, rise to the upper surface of the substrate, and flow to the surface of the resistor formed on the upper surface of the substrate. The flux flowing to the surface of the resistor is not limited to the flux contained in the cream solder at the time of the reflow soldering, and other electric components are soldered to the printed circuit board by dip or the like after the reflow soldering. In some cases, the flux used during this dipping flows out onto the printed circuit board. When the flux flows on the surface of the resistor, the contact portion of the slider that slides on the surface of the resistor causes a contact failure with the resistor, and the resistance value becomes open. Can not be exhibited and there is an adverse effect.
【０００５】[0005]
【課題を解決するための手段】前記課題を解決するする
ための第１の手段として本発明の可変抵抗器は、絶縁基
板の上面に形成された抵抗体と、該抵抗体に摺接する摺
動子と、前記抵抗体に接続される端子とを備え、前記絶
縁基板の側面に表面粗さが４０μｍ以上の粗面部を形成
したことを特徴とする可変抵抗器。As a first means for solving the above-mentioned problems, a variable resistor according to the present invention comprises a resistor formed on an upper surface of an insulating substrate and a sliding member slidingly contacting the resistor. A variable resistor, comprising: a resistor; and a terminal connected to the resistor, wherein a roughened surface having a surface roughness of 40 μm or more is formed on a side surface of the insulating substrate.
【０００６】また、前記課題を解決するするための第２
の手段として本発明の可変抵抗器は、 前記粗面部の表
面粗さは少なくとも４０μｍ〜２００μｍの範囲で形成
した構成とした。[0006] A second aspect for solving the above-mentioned problem is as follows.
As means for (1), the variable resistor according to the present invention has a configuration in which the surface roughness of the rough surface portion is formed in a range of at least 40 μm to 200 μm.
【０００７】また、前記課題を解決するするための第３
の手段として本発明の可変抵抗器は、前記絶縁基板を合
成樹脂材料で形成し、前記粗面部は前記絶縁基板の側面
に前記絶縁基板の底面と平行の横方向に形成された切断
面で構成された構成とした。[0007] Further, a third aspect for solving the above-mentioned problem is as follows.
In the variable resistor according to the present invention, the insulating substrate is formed of a synthetic resin material, and the rough surface portion is formed by a cut surface formed on a side surface of the insulating substrate in a lateral direction parallel to a bottom surface of the insulating substrate. Configuration.
【０００８】また、前記課題を解決するするための第４
の手段として本発明の可変抵抗器は、前記絶縁基板の合
成樹脂材料にガラス繊維を充填させた構成とした。[0008] A fourth aspect of the present invention for solving the above-mentioned problems.
The variable resistor according to the present invention has a structure in which the synthetic resin material of the insulating substrate is filled with glass fibers.
【０００９】また、前記課題を解決するするための第５
の手段として本発明の可変抵抗器は、前記端子は前記絶
縁基板の底面と側面の一部にメッキまたは印刷で形成し
た構成とした。A fifth aspect of the present invention for solving the above-mentioned problems.
In the variable resistor according to the present invention, the terminal is formed by plating or printing on a part of the bottom and side surfaces of the insulating substrate.
【００１０】また、前記課題を解決するするための第６
の手段として本発明の可変抵抗器は、前記端子は金属材
料から成り、前記端子は前記絶縁基板に埋設され該絶縁
基板の底面から側面に沿って上面側に折り曲げ形成され
た構成とした。[0010] A sixth aspect for solving the above-mentioned problems.
In the variable resistor according to the present invention, the terminal is made of a metal material, and the terminal is buried in the insulating substrate and bent from the bottom surface to the upper surface along the side surface of the insulating substrate.
【００１１】また、前記課題を解決するするための第７
の手段として本発明の可変抵抗器は、前記粗面部は、前
記絶縁基板の底面との間に隙間を設け該底面より上部に
形成した構成とした。[0011] Further, a seventh aspect for solving the above-mentioned problems.
The variable resistor according to the present invention has a configuration in which the rough surface portion is formed above the bottom surface by providing a gap between the rough surface portion and the bottom surface of the insulating substrate.
【００１２】また、前記課題を解決するするための第８
の手段として本発明の可変抵抗器は、前記粗面部の縦方
向の幅寸法は、少なくとも０．１５ｍｍ以上とした構成
とした。An eighth aspect of the present invention for solving the above-mentioned problems.
In the variable resistor according to the present invention, the width of the rough surface in the vertical direction is at least 0.15 mm or more.
【００１３】また、前記課題を解決するするための第９
の手段として本発明の可変抵抗器は、前記絶縁基板の底
面側をプリント基板に載置し、前記端子をプリント基板
に半田付けして取り付けた構成とした。Further, a ninth aspect for solving the above-mentioned problem is provided.
As a means of the present invention, the variable resistor according to the present invention has a configuration in which the bottom surface side of the insulating substrate is mounted on a printed circuit board, and the terminals are mounted on the printed circuit board by soldering.
【００１４】[0014]
【発明の実施の形態】本発明の１実施の形態の可変抵抗
器を図面を参照して説明すると、図１は可変抵抗器の平
面図、図２はこの可変抵抗器の側面図、図３はこの可変
抵抗器に備えられる端子の斜視図、図４はこの可変抵抗
器に備えられる絶縁基板の平面図、図５は図１のＡ−Ａ
断面図、図６はこの可変抵抗器の分解斜視図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS A variable resistor according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of the variable resistor, FIG. 2 is a side view of the variable resistor, and FIG. FIG. 4 is a perspective view of a terminal provided in the variable resistor, FIG. 4 is a plan view of an insulating substrate provided in the variable resistor, and FIG.
FIG. 6 is an exploded perspective view of the variable resistor.
【００１５】これらの図に示すように、本発明の１実施
の形態に係わる可変抵抗器は、ＰＰＳ、あるいはＰＢＴ
等の材料から成る合成樹脂製の絶縁基板１と、この絶縁
基板１上に回転可能に配設された金属性の摺動子２とで
構成されている。前記絶縁基板１は外形が略矩形で、そ
の外周は側面１ａ、１ｂ、１ｃ、１ｄから成り、絶縁基
板１の上面中央には図４、図６に示すような平面視略円
形の凹部１ｅが設けられ、この凹部１ｅの側面１ｄの周
面には内方にせり出す一対の突部１ｆが形成されてい
る。また、前記絶縁基板１の上面には、平坦部１ｇが形
成され、図６に示すように前記略円形の凹部１ｅから側
面１ｄまでには、前記凹部１ｅよりも浅めの溝部１ｈが
形成されている。As shown in these figures, the variable resistor according to one embodiment of the present invention is a PPS or PBT
An insulating substrate 1 made of a synthetic resin made of such a material as described above, and a metallic slider 2 rotatably disposed on the insulating substrate 1. The insulating substrate 1 has a substantially rectangular outer shape, and its outer periphery is composed of side surfaces 1a, 1b, 1c, and 1d. At the center of the upper surface of the insulating substrate 1, there is provided a concave portion 1e having a substantially circular shape in plan view as shown in FIGS. A pair of protrusions 1f are formed on the peripheral surface of the side surface 1d of the concave portion 1e so as to protrude inward. Further, a flat portion 1g is formed on the upper surface of the insulating substrate 1, and a groove portion 1h shallower than the concave portion 1e is formed from the substantially circular concave portion 1e to the side surface 1d as shown in FIG. I have.
【００１６】また、図２、図６に示すように、前記それ
ぞれの側面１ａ、１ｂ、１ｃ、１ｄ、には、後述する絶
縁基板１をアウトサート成形するときに形成される連結
部１３を、切断する切断面から成る粗面部１ｊが、前記
絶縁基板１の底面と平行の横方向に帯状に形成されてい
る。また、前記粗面部１ｆの表面粗さは、４０〜２００
μｍ（接触圧０．５ｇｆ以下の表面粗さ計で測定）の範
囲に形成されている。また、前記粗面部１ｊは、前記絶
縁基板１の底面との間に隙間を設け、該底面より上部に
形成されている。また、前記粗面部１ｊの縦方向の幅寸
法Ｃは少なくと０．１５ｍｍ以上に形成されている。As shown in FIGS. 2 and 6, a connecting portion 13 formed when the insulating substrate 1 described later is formed by outsert molding is provided on each of the side surfaces 1a, 1b, 1c and 1d. A rough surface portion 1j composed of a cut surface to be cut is formed in a strip shape in a lateral direction parallel to the bottom surface of the insulating substrate 1. The surface roughness of the rough surface portion 1f is 40 to 200.
μm (measured with a surface roughness meter having a contact pressure of 0.5 gf or less). Further, the rough surface portion 1j is provided with a gap between the rough surface portion 1j and the bottom surface of the insulating substrate 1, and is formed above the bottom surface. The width C in the vertical direction of the rough surface portion 1j is formed to be at least 0.15 mm or more.
【００１７】また、前記絶縁基板１の裏面には図３に示
すような一対の第１端子３ａと、第３端子３ｂと、１つ
の第２端子４が配設されて、これらの端子３ａ、３ｂ、
４は共に金属平板を所定形状にフォーミングしたものか
ら成り、アウトサート成形により前記絶縁基板１が取り
付けられて一体化されている。前記一対の第１端子３
ａ、第３端子３ｂは、その端部３ｃ、３ｄが上方に折り
曲げられて、該端部３ｃ，３ｄの折り曲げ部はアウトサ
ート成形後前記絶縁基板１に埋設されて、前記端部３
ｃ、３ｄは平坦部１ｇと同一平面に形成され、平坦部１
ｃから露出している。また、前記第２端子４には一対の
ストッパ片１０、１０とハトメ部材６が一体に形成さ
れ、このハトメ部材６は前記絶縁基板１の凹部１ｅ内の
中央に位置している。また、前記一対のストッパ片１
０、１０は側面にストッパ面１０ａを有し、折り曲げ線
Ｌに沿って上方に折り曲げられ、前記絶縁基板１の突部
１ｆ内に埋設される。そして、折り曲げ線Ｌと直交する
ストッパ面１０ａは、絶縁基板１の突部１ｆの側面と同
一平面に形成されて突部１ｆの側面から露出している。A pair of first terminals 3a, third terminals 3b, and one second terminal 4 are disposed on the back surface of the insulating substrate 1 as shown in FIG. 3b,
4 is formed by forming a metal flat plate into a predetermined shape, and the insulating substrate 1 is attached and integrated by outsert molding. The pair of first terminals 3
a, the third terminal 3b has its ends 3c, 3d bent upward, and the bent portions of the ends 3c, 3d are embedded in the insulating substrate 1 after outsert molding, and
c and 3d are formed on the same plane as the flat portion 1g.
It is exposed from c. Further, a pair of stopper pieces 10 and 10 and an eyelet member 6 are formed integrally with the second terminal 4, and the eyelet member 6 is located at the center in the concave portion 1 e of the insulating substrate 1. Further, the pair of stopper pieces 1
Reference numerals 0 and 10 each have a stopper surface 10a on a side surface, are bent upward along a bending line L, and are embedded in the protrusion 1f of the insulating substrate 1. The stopper surface 10a orthogonal to the bending line L is formed on the same plane as the side surface of the protrusion 1f of the insulating substrate 1, and is exposed from the side surface of the protrusion 1f.
【００１８】また、前記摺動子２は、環状の第１プレー
ト７の中央から下方に延出する筒状部８と、第１プレー
ト７の外縁部から折り畳まれた環状の第２プレート９と
から成り、これら第１プレート７と第２プレート９とは
１枚の金属平板をプレス等で打ち抜いて形成されてい
る。また、前記筒状部８の底面には中心孔８ａが形成さ
れ、該中心孔８ａに前記第２端子４のハトメ部材６を挿
入して、該ハトメ部材６の先端をカシメることにより、
摺動子２が前記絶縁基板１上に回転可能に軸止され、摺
動子２と第２端子４とが電気的に接続されている。ま
た、前記摺動子２の第２プレート９には接点部９ａが形
成され、この接点部９ａが前記抵抗体５表面に弾接し
て、摺動するようになっている。また、前記筒状部８の
上部には両側に破断面を有する４つのドライバ溝８ｂが
形成され、更に、筒状部８の上部から下部にかけて外側
に突出する前記ドライバ溝８ｂと同様な破断面を両側に
有する張出し部８ｃが形成されている。この張出し部８
ｃの内側に形成される溝は、前記ドライバ溝８ｂの１つ
に連接して形成されている。The slider 2 includes a cylindrical portion 8 extending downward from the center of the first annular plate 7 and an annular second plate 9 folded from the outer edge of the first plate 7. The first plate 7 and the second plate 9 are formed by stamping one metal flat plate with a press or the like. Also, a center hole 8a is formed in the bottom surface of the cylindrical portion 8, and the eyelet member 6 of the second terminal 4 is inserted into the center hole 8a, and the tip of the eyelet member 6 is caulked.
The slider 2 is rotatably fixed on the insulating substrate 1, and the slider 2 and the second terminal 4 are electrically connected. A contact portion 9a is formed on the second plate 9 of the slider 2, and the contact portion 9a resiliently contacts the surface of the resistor 5 to slide. Further, four driver grooves 8b having fractured surfaces on both sides are formed in the upper part of the cylindrical part 8, and further, similar to the driver groove 8b protruding outward from the upper part to the lower part of the cylindrical part 8. Are formed on both sides. This overhang 8
The groove formed inside c is connected to one of the driver grooves 8b.
【００１９】即ち、前記ドライバ溝８ｂのうち、３つの
ドライバ溝８ｂは第１プレート７の内周縁７ａと筒状部
８の周面８ｄとに繋がれているが、残りのドライバ溝８
ｂは第１プレート７の内周縁７ａと張り出し部８ｃの上
端８ｅとに繋がれている。各ドライバ溝８ｂは９０度の
等間隔を保って十字状に配置されて、図５に示すよう
に、ドライバ溝８ｂにドライバ等の調整用治具１１を係
合して、摺動子２を回転操作できるようになっている。
また、前記張出し部８ｃの下部は前記絶縁基板１の凹部
１ｅ内に位置するようになっており、摺動子２の回転操
作時に、張出し部８ｃの破断面が凹部１ｅ内に露出する
前記ストッパ面１０ａと当接することにより、摺動子２
の回転角度を所定範囲内に規制することができるように
なっているThat is, of the driver grooves 8b, three driver grooves 8b are connected to the inner peripheral edge 7a of the first plate 7 and the peripheral surface 8d of the cylindrical portion 8, while the remaining driver grooves 8b are connected.
b is connected to the inner peripheral edge 7a of the first plate 7 and the upper end 8e of the overhang 8c. Each of the driver grooves 8b is arranged in a cross shape at equal intervals of 90 degrees, and as shown in FIG. 5, an adjusting jig 11 such as a driver is engaged with the driver groove 8b, and the slider 2 is moved. It can be rotated.
The lower portion of the overhang portion 8c is located in the recess 1e of the insulating substrate 1. The stopper is such that a broken surface of the overhang portion 8c is exposed in the recess 1e when the slider 2 is rotated. By contacting the surface 10a, the slider 2
Rotation angle can be regulated within a predetermined range.
【００２０】前述のような構成の本発明の可変抵抗器
の、前記粗面部１ｊが形成された絶縁基板１の製造につ
いて説明する。まず、金属平板１２をプレス装置（図示
せず）に供給し、図３に示すような前記第１端子３ａ、
第３端子３ｂおよび第２端子４等の外形をブランク加工
すると共に、第２端子４にハトメ部材６を絞り加工す
る。このようにブランク加工した第１端子３ａ、第３端
子３ｂ、第２端子４の各端子部を外方に延長し、この各
端子部を金属平板１２に繋げて支持する。また、金属平
板１２の矢印Ｂ−Ｂ方向にも第１端子３ａから延出する
繋ぎ部３ｅと、第３端子３ｂから延出する繋ぎ部３ｆと
を形成する。また、同じく第２端子４から左右に延出す
る繋ぎ部４ａ、４ｂを形成してそれぞれ金属平板１２に
接続する。The manufacture of the insulating substrate 1 having the rough surface portion 1j of the variable resistor of the present invention having the above-described structure will be described. First, the metal flat plate 12 is supplied to a pressing device (not shown), and the first terminal 3a, as shown in FIG.
The outer shapes of the third terminal 3b, the second terminal 4, and the like are blanked, and the eyelet member 6 is drawn on the second terminal 4. The terminal portions of the first terminal 3a, the third terminal 3b, and the second terminal 4 thus blanked are extended outward, and the terminal portions are connected to and supported by the metal plate 12. Further, a connecting portion 3e extending from the first terminal 3a and a connecting portion 3f extending from the third terminal 3b are also formed in the direction of arrow BB of the metal plate 12. Similarly, connecting portions 4a and 4b extending left and right from the second terminal 4 are formed and connected to the metal flat plate 12, respectively.
【００２１】次に、前記第１端子３ａ、第３端子３ｂ、
第２端子４を所定形状にフォーミングした後、この金属
平板１２を射出成形装置（図示せず）に供給し、図７に
示すように金属平板１２に、破線の斜め線で示す複数の
絶縁基板１と連結部１３をアウトサート成形する。この
連結部１３は、その表面を絶縁基板１の平坦面１ｇと同
一平面に形成し、絶縁基板１のそれぞれの側面１ａ、１
ｂ、１ｃ、１ｄに隣接して薄肉部１３ａを所定の幅で形
成し、２つの絶縁基板１に挟まれた中央部には厚肉部１
３ｂを形成する。また、前記それぞれの側面１ａ、１
ｂ、１ｃ、１ｄと連結部１３とが接する薄肉部１３ａの
表面には、それぞれＶ字状の溝１４を形成している。Next, the first terminal 3a, the third terminal 3b,
After forming the second terminal 4 into a predetermined shape, the metal flat plate 12 is supplied to an injection molding apparatus (not shown), and a plurality of insulating substrates indicated by broken oblique lines are formed on the metal flat plate 12 as shown in FIG. 1 and the connecting portion 13 are outsert molded. The connecting portion 13 has its surface formed on the same plane as the flat surface 1 g of the insulating substrate 1, and the side surfaces 1 a, 1
b, 1c, and 1d, a thin portion 13a is formed with a predetermined width, and a thick portion 1a is formed at a central portion between two insulating substrates 1.
3b is formed. Further, the respective side surfaces 1a, 1
V-shaped grooves 14 are formed on the surfaces of the thin portions 13a where b, 1c, 1d and the connecting portion 13 are in contact.
【００２２】次に、前記絶縁基板１の平坦部１ｇにカー
ボン等から成る抵抗インクを略馬蹄形状にスクリーン印
刷し、この印刷された抵抗インクを乾燥・焼成させて抵
抗体５を形成する。このとき平坦部１ｇから露出した第
１端子の端部３ｃと第３端子３ｂの端部３ｄとに前記抵
抗体５が電気的に接続した状態になる。なお、前記スク
リーン印刷の際には、厚肉部１３ｂが印刷定盤の役目を
なし、よって印刷用スキージの圧力を均一にできるの
で、抵抗体５の膜厚を均一にできる。次に図８に示すよ
うに、前記連結部１３の薄肉部１３ａをプレス等で絶縁
基板１の側面１ａ、１ｂ，１ｃ、１ｄから切断すると、
図２、図６に示すように絶縁基板１のそれぞれの側面１
ａ、１ｂ，１ｃ、１ｄに、切断面から成る帯状の粗面部
１ｊが、絶縁基板１の底面と平行の横方向に形成され
る。次に、図９に示すように第１端子３ａ、第３端子３
ｂ、第２端子４を所定の長さでプレス等で切断し、側面
１ｂ、１ｄに沿って上方に折り曲げる。その後、前記繋
ぎ部３ｅ、３ｆ、４ａ、４ｂを側面１ａ、１ｃの表面近
くから切断して、絶縁基板１を金属平板１２から切り離
す。Next, a resistive ink made of carbon or the like is screen-printed in a substantially horseshoe shape on the flat portion 1g of the insulating substrate 1, and the printed resistive ink is dried and fired to form the resistor 5. At this time, the resistor 5 is electrically connected to the end 3c of the first terminal exposed from the flat portion 1g and the end 3d of the third terminal 3b. At the time of the screen printing, the thick portion 13b functions as a printing platen, so that the pressure of the printing squeegee can be made uniform, so that the film thickness of the resistor 5 can be made uniform. Next, as shown in FIG. 8, when the thin portion 13a of the connecting portion 13 is cut from the side surfaces 1a, 1b, 1c, and 1d of the insulating substrate 1 by pressing or the like,
As shown in FIG. 2 and FIG.
On 1a, 1b, 1c, and 1d, a band-shaped rough surface portion 1j formed of a cut surface is formed in a lateral direction parallel to the bottom surface of the insulating substrate 1. Next, as shown in FIG. 9, the first terminal 3a, the third terminal 3
b, The second terminal 4 is cut at a predetermined length by a press or the like, and is bent upward along the side surfaces 1b and 1d. Thereafter, the connecting portions 3e, 3f, 4a, and 4b are cut from near the surfaces of the side surfaces 1a and 1c to separate the insulating substrate 1 from the metal plate 12.
【００２３】次に、図示しない組立治具に前記絶縁基板
１を載置し、ハトメ部材６に摺動子２の中心孔８ａを挿
入して、ハトメ部材６の先端をカシメ付けると、摺動子
２が絶縁基板１に回転可能に軸止されて、本発明の可変
抵抗器の組み立てが終了する。前述のような可変抵抗器
の絶縁基板の底面側をプリント基板（図示せず）に載置
し前記端子３ａ、３ｂ、４をプリント基板にリフロー半
田付け装置等で半田付けすることにより、本発明の可変
抵抗器をプリント基板に取り付けることができる。Next, the insulating substrate 1 is placed on an assembling jig (not shown), the center hole 8a of the slider 2 is inserted into the eyelet member 6, and the tip of the eyelet member 6 is swaged. The element 2 is rotatably fixed to the insulating substrate 1 to complete the assembly of the variable resistor according to the present invention. By placing the bottom side of the insulating substrate of the above-described variable resistor on a printed circuit board (not shown) and soldering the terminals 3a, 3b, 4 to the printed circuit board with a reflow soldering device or the like, the present invention is achieved. Can be mounted on a printed circuit board.
【００２４】本発明の可変抵抗器に形成している粗面部
１ｊが、プリント基板にリフロー半田付け装置等で半田
付けするときの、フラックス上がりを防止する効果があ
ることが判明した。また、絶縁基板１にガラス繊維を充
填すると、粗面部１ｊの表面粗さを大きくすることがで
き、更にフラックス上がりの防止に効果があることも判
明した。そこで、本発明の可変抵抗器の絶縁基板１のガ
ラス繊維の充填率と粗面部１ｊの表面粗さと、フラック
ス上がりの関係について、実験を行ったのでその結果に
ついて説明する。まず、この実験方法はプリント基板
に、通常市販されているクリーム半田をスクリーン印刷
等で均一に印刷し、更に、この実験を過酷にするため
に、前記塗布したクリーム半田の周辺から比重０．８２
のフラックスを１５０μｍの厚さで塗布し、該フラック
スの上に前記抵抗体５が形成された、厚さが１ｍｍの絶
縁基板１を載置してプリント基板にマウントする。この
絶縁基板１がマウントされたプリント基板を遠赤外線炉
等から成るリフロー半田付け装置で、温度１５０℃で時
間１分のプリヒートを行い、ピーク温度２４０℃で時間
１０秒間のリフロー半田を行って、絶縁基板１の表面の
抵抗体５、および平坦部１ｇへのフラックス上がりを顕
微鏡で確認した。It has been found that the rough surface portion 1j formed on the variable resistor according to the present invention has an effect of preventing flux from rising when soldering to a printed circuit board by a reflow soldering device or the like. It has also been found that, when the insulating substrate 1 is filled with glass fibers, the surface roughness of the rough surface portion 1j can be increased, and it is also effective in preventing the flux from rising. An experiment was conducted on the relationship between the filling rate of the glass fiber of the insulating substrate 1 of the variable resistor of the present invention, the surface roughness of the rough surface portion 1j, and the rise in flux, and the results will be described. First, in this experiment method, a commercially available cream solder was uniformly printed on a printed circuit board by screen printing or the like. Further, in order to make this experiment severe, a specific gravity of 0.82 from the periphery of the applied cream solder was used.
Is applied at a thickness of 150 μm, and an insulating substrate 1 having a thickness of 1 mm, on which the resistor 5 is formed, is mounted on the flux and mounted on a printed circuit board. The printed circuit board on which the insulating substrate 1 is mounted is preheated at a temperature of 150 ° C. for 1 minute at a temperature of 150 ° C., and reflow soldered for 10 seconds at a peak temperature of 240 ° C. The rise of the flux to the resistor 5 and the flat portion 1 g on the surface of the insulating substrate 1 was confirmed with a microscope.
【００２５】この実験に使用した絶縁基板１は、材質は
ＰＰＳ（ポリフェニレンサルファイド）を使用し、側面
１ａ、１ｂ、１ｃ、１ｄに形成した粗面部１ｊは、前記
絶縁基板１の底面との間に隙間を設け、該底面より上部
に形成し、この粗面部１ｊの縦方向の幅寸法は０．１５
ｍｍで形成した。 上記表面粗さの測定は、接触圧０．５ｇｆ以下の表面粗
さ計を使用した。 上記結果の記号は◎＝フラックスが平坦部１ｇまで上昇
しなかったもの。 ○＝フラックスが平坦部１ｇまで上がったが抵抗体まで
流れなかったもの。 ×＝フラックスが抵抗体５まで流れたもの。 また、★従来のセラミック基板は、参考として前述した
従来の可変抵抗器を本実験と同条件でリフロー半田付け
したもので、基板の厚さは本発明の絶縁基板１と同じ１
ｍｍである。 上記実験結果から、粗面部１ｊの表面粗さが４０から２
００μｍの範囲のものが抵抗体５の表面まで流れない
で、可変抵抗器の性能に影響ないことが判明した。The insulating substrate 1 used in this experiment is made of PPS (polyphenylene sulfide). A gap is formed and formed above the bottom surface. The vertical width of the rough surface portion 1j is 0.15.
mm. The surface roughness was measured using a surface roughness meter having a contact pressure of 0.5 gf or less. The symbol of the above result is ◎ = the flux did not rise to 1 g of the flat portion. ＝= The flux rose to 1 g in the flat portion but did not flow to the resistor. × = Flux flowing to resistor 5. The conventional ceramic substrate is obtained by reflow soldering the conventional variable resistor described above for reference under the same conditions as in this experiment, and the thickness of the substrate is the same as that of the insulating substrate 1 of the present invention.
mm. From the above experimental results, the surface roughness of the rough surface portion 1j was from 40 to 2
It turned out that the thing of the range of 00 μm did not flow to the surface of the resistor 5 and did not affect the performance of the variable resistor.
【００２６】本発明のその他の実施の形態として、絶縁
基板１のそれぞれの側面１ａ、１ｂ、１ｃ、１ｄに形成
する粗面部１ｊは、連結部１３を切断した切断面に限定
されるものでなく、側面の全周、あるいは側面の一部に
表面粗さが４０〜２００μｍの範囲の微小の凹凸を形成
したものでもよい。また、前記少なくとも一対の端子３
ａ、３ｂは金属平板１２に限定されず、図１０に示すよ
うに、前記抵抗体５の端部に接して絶縁基板１の側面１
ｄから底面の一部までに、導電性のメッキ、または印刷
で端子３ａ′、３ｂ′を形成したものでもよい。As another embodiment of the present invention, the rough surface portion 1j formed on each of the side surfaces 1a, 1b, 1c and 1d of the insulating substrate 1 is not limited to the cut surface obtained by cutting the connecting portion 13. Alternatively, fine irregularities having a surface roughness in the range of 40 to 200 μm may be formed on the entire periphery of the side surface or a part of the side surface. The at least one pair of terminals 3
a and 3b are not limited to the metal flat plate 12, and as shown in FIG.
Terminals 3a 'and 3b' may be formed from d to a part of the bottom surface by conductive plating or printing.
【００２７】[0027]
【発明の効果】本発発明の可変抵抗器は、絶縁基板の側
面に表面粗さが４０μｍ以上の粗面部を形成したので、
この粗面部でリフロー半田付けするときのフラックス上
がりを防止することができ、半田付け時に抵抗体表面に
フラックスが流れない高性能の可変抵抗器を提供するこ
とができる。According to the variable resistor of the present invention, a rough surface having a surface roughness of 40 μm or more is formed on the side surface of the insulating substrate.
It is possible to prevent a flux from rising when reflow soldering is performed on the rough surface portion, and to provide a high-performance variable resistor in which flux does not flow on the surface of the resistor during soldering.
【００２８】また、本発明の可変抵抗器の前記粗面部の
表面粗さは少なくとも４０〜２００μｍの範囲で形成さ
れているので、該粗面部により更に確実にフラックス上
がりを防止することができる。Further, since the surface roughness of the rough surface portion of the variable resistor according to the present invention is at least in the range of 40 to 200 μm, the rise of the flux can be more reliably prevented by the rough surface portion.
【００２９】また、本発明の可変抵抗器は、絶縁基板を
合成樹脂材料で形成し、前記粗面部は前記絶縁基板の側
面に前記絶縁基板の底面と平行の横方向に形成された切
断面で構成されているので、前記粗面部は連結部を切断
することにより自動的に形成される。そのために、特別
の工程を追加しなくとも表面粗さが４０〜２００μｍの
粗面部を形成することができ、低コストでフラックス上
がりを防止できる可変抵抗器を提供することができる。Further, in the variable resistor according to the present invention, the insulating substrate is formed of a synthetic resin material, and the rough surface portion is a cut surface formed on a side surface of the insulating substrate in a lateral direction parallel to a bottom surface of the insulating substrate. With such a configuration, the rough surface portion is automatically formed by cutting the connecting portion. Therefore, it is possible to form a rough surface portion having a surface roughness of 40 to 200 μm without adding a special step, and to provide a variable resistor that can prevent the flux from rising at low cost.
【００３０】また、本発明の可変抵抗器は、絶縁基板の
合成樹脂材料にガラス繊維を充填させたので、前記粗面
部の表面粗さを４０〜２００μｍの範囲に確実に形成す
ることができ、フラックス上がりを、確実に防止するこ
とができる。Further, in the variable resistor according to the present invention, since the synthetic resin material of the insulating substrate is filled with glass fiber, the surface roughness of the rough surface portion can be reliably formed in the range of 40 to 200 μm. The flux rise can be reliably prevented.
【００３１】また、本発明の可変抵抗器の端子は前記絶
縁基板の底面と側面の一部にメッキまたは印刷で形成し
たので、前記記粗面部を前記端子のすぐ近くまで形成す
ることができ、半田付け時の側面を伝わって絶縁基板上
面に流れるフラックスを前記粗面部で確実に防止するこ
とができる。Further, since the terminals of the variable resistor according to the present invention are formed by plating or printing on a part of the bottom and side surfaces of the insulating substrate, the rough surface can be formed as close as possible to the terminals. Flux flowing along the side surface at the time of soldering and flowing to the upper surface of the insulating substrate can be reliably prevented by the rough surface portion.
【００３２】また、本発明の可変抵抗器の端子は金属平
板から成り、前記端子に絶縁基板に埋設され該絶縁基板
の底面から側面に沿って上面側に折り曲げ形成されてい
るので、前記金属平板に絶縁基板をアウトサート成形す
ることにより、容易に粗面部を前記端子周辺に形成する
ことができ、端子を伝わって絶縁基板上面に流れるフラ
ックスを前記粗面部で確実に防ぐことができる。The terminal of the variable resistor according to the present invention is formed of a flat metal plate. The terminal is embedded in an insulating substrate and is bent from the bottom surface of the insulating substrate to the upper surface along the side surface. By performing the outsert molding of the insulating substrate, a rough surface portion can be easily formed around the terminal, and the flux flowing to the upper surface of the insulating substrate through the terminal can be reliably prevented by the rough surface portion.
【００３３】また、本発明の可変抵抗器の粗面部は、前
記絶縁基板の底面との間に隙間を設け該底面より上部に
形成したので、クリーム半田が接する絶縁基板の底面と
粗面部との間の隙間でフラックス上がりを防ぐことがで
きる。The rough surface portion of the variable resistor according to the present invention is formed above the bottom surface by providing a gap between the rough surface portion and the bottom surface of the insulating substrate. The flux can be prevented from rising in the gap between them.
【００３４】また、本発明の可変抵抗器の粗面部の縦方
向の幅寸法は、少なくとも０．１５ｍｍ以上としたの
で、この粗面部でフラックス上がりを確実に防ぐことが
できる。Further, since the vertical width of the rough surface portion of the variable resistor of the present invention is at least 0.15 mm or more, it is possible to reliably prevent the flux from rising at the rough surface portion.
【００３５】また、本発明の可変抵抗器は、絶縁基板の
底面側をプリント基板に載置し前記端子をプリント基板
に半田付けして取り付けたので、前記絶縁基板の粗面部
で半田付け時のフラックス上がりを防止することができ
る、高性能の可変抵抗器を提供できる。In the variable resistor according to the present invention, the bottom surface of the insulating substrate is mounted on the printed circuit board and the terminals are mounted on the printed circuit board by soldering. A high-performance variable resistor that can prevent the flux from rising can be provided.
【図１】本発明の可変抵抗器の平面図。FIG. 1 is a plan view of a variable resistor according to the present invention.
【図２】本発明の可変抵抗器の側面図。FIG. 2 is a side view of the variable resistor according to the present invention.
【図３】本発明の可変抵抗器に備えられる端子の斜視
図。FIG. 3 is a perspective view of a terminal provided in the variable resistor of the present invention.
【図４】本発明の可変抵抗器に備えられる絶縁基板の平
面図。FIG. 4 is a plan view of an insulating substrate provided in the variable resistor of the present invention.
【図５】本発明の可変抵抗器の図１のＡ−Ａ断面図。FIG. 5 is a sectional view of the variable resistor according to the present invention, taken along the line AA in FIG. 1;
【図６】本発明の可変抵抗器の分解斜視図である。FIG. 6 is an exploded perspective view of the variable resistor according to the present invention.
【図７】本発明の可変抵抗器の絶縁基板の製造方法を説
明する平面図。FIG. 7 is a plan view illustrating a method for manufacturing an insulating substrate of a variable resistor according to the present invention.
【図８】本発明の可変抵抗器の絶縁基板の製造方法を説
明する平面図。FIG. 8 is a plan view illustrating a method for manufacturing an insulating substrate of a variable resistor according to the present invention.
【図９】本発明の可変抵抗器の絶縁基板の製造方法を説
明する平面図。FIG. 9 is a plan view illustrating a method for manufacturing an insulating substrate of a variable resistor according to the present invention.
【図１０】本発明のその他の実施の形態を説明する斜視
図。FIG. 10 is a perspective view illustrating another embodiment of the present invention.
１ 絶縁基板 １ａ〜１ｄ側面 １ｅ 凹部 １ｆ 突部 １ｇ 平坦部 １ｊ 粗面部 ２ 摺動子 ３ａ 第１端子 ３ｂ 第２端子 ３ｃ〜３ｄ端部 ３ｅ〜３ｆ繋ぎ部 ４ 第２端子 ５ 抵抗対 ６ ハトメ部材 ７ 第１プレート ８ 筒状部 ８ａ 中心孔 ８ｂ ドライバ溝 ８ｃ 張出し部 ８ｄ 周面 ９ 第２プレート １０ ストッパ片 １０ａストッパ面 １１ 調整治具 １２ 金属平板 １３ 連結部 １４ Ｖ字状溝 DESCRIPTION OF SYMBOLS 1 Insulating substrate 1a-1d side surface 1e Depression 1f Projection 1g Flat part 1j Rough surface part 2 Slider 3a 1st terminal 3b 2nd terminal 3c-3d end 3e-3f connection part 4 2nd terminal 5 Resistance pair 6 eyelet member 7 First plate 8 Cylindrical portion 8a Center hole 8b Driver groove 8c Overhanging portion 8d Peripheral surface 9 Second plate 10 Stopper piece 10a Stopper surface 11 Adjusting jig 12 Metal flat plate 13 Connecting portion 14 V-shaped groove
Claims (9)
該抵抗体に摺接する摺動子と、前記抵抗体に接続される
端子とを備え、前記絶縁基板の側面に表面粗さが４０μ
ｍ以上の粗面部を形成したことを特徴とする可変抵抗
器。A resistor formed on an upper surface of an insulating substrate;
A slider connected to the resistor, and a terminal connected to the resistor; and a side surface of the insulating substrate having a surface roughness of 40 μm.
A variable resistor characterized by having a rough surface portion of m or more.
μｍ〜２００μｍの範囲に形成されていることを特徴と
する請求項１記載の可変抵抗器。2. The surface roughness of the rough surface portion is at least 40.
2. The variable resistor according to claim 1, wherein the variable resistor is formed in a range of [mu] m to 200 [mu] m.
前記粗面部は前記絶縁基板の側面に前記絶縁基板の底面
と平行の横方向に形成された切断面で構成されたことを
特徴とする請求項１、あるいは２記載の可変抵抗器。3. The insulating substrate is formed of a synthetic resin material.
3. The variable resistor according to claim 1, wherein the rough surface portion is formed by a cut surface formed on a side surface of the insulating substrate in a horizontal direction parallel to a bottom surface of the insulating substrate.
維を充填させたことを特徴とする請求項３記載の可変抵
抗器。4. The variable resistor according to claim 3, wherein the synthetic resin material of the insulating substrate is filled with glass fibers.
一部にメッキまたは印刷で形成したことを特徴とする請
求項１、あるいは２、あるいは３、あるいは４記載の可
変抵抗器。5. The variable resistor according to claim 1, wherein said terminal is formed by plating or printing on a part of a bottom surface and a side surface of said insulating substrate.
は前記絶縁基板に埋設され該絶縁基板の底面から側面に
沿って上面側に折り曲げ形成されたことを特徴とする請
求項１、あるいは２、あるいは３、あるいは４記載の可
変抵抗器。6. The terminal according to claim 1, wherein the terminal is made of a metal material, and the terminal is buried in the insulating substrate and is bent from a bottom surface to a top surface along a side surface of the insulating substrate. Or the variable resistor according to 3 or 4.
間に隙間を設け該底面より上部に形成したことを特徴と
する請求項１、あるいは２、あるいは３、あるいは４、
あるいは５、あるいは６記載の可変抵抗器。7. A method according to claim 1, wherein a gap is provided between the rough surface portion and the bottom surface of the insulating substrate, and the rough surface portion is formed above the bottom surface.
Alternatively, the variable resistor according to 5 or 6.
とも０．１５ｍｍ以上としたことを特徴とする請求項
１、あるいは２、あるいは３、あるいは４、あるいは
５、あるいは６、あるいは７記載の可変抵抗器。8. A method according to claim 1, wherein the width of the rough surface in the vertical direction is at least 0.15 mm or more. Variable resistor.
載置し、前記端子をプリント基板に半田付けして取り付
けたことを特徴とする請求項３、あるいは４、あるいは
５、あるいは６、あるいは７、あるいは８記載の可変抵
抗器。9. The printed circuit board according to claim 3, wherein the bottom surface of the insulating board is mounted on a printed board, and the terminals are mounted on the printed board by soldering. 7. The variable resistor according to 7 or 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18221597A JP3474083B2 (en) | 1997-07-08 | 1997-07-08 | Variable resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18221597A JP3474083B2 (en) | 1997-07-08 | 1997-07-08 | Variable resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1126214A true JPH1126214A (en) | 1999-01-29 |
| JP3474083B2 JP3474083B2 (en) | 2003-12-08 |
Family
ID=16114370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18221597A Expired - Fee Related JP3474083B2 (en) | 1997-07-08 | 1997-07-08 | Variable resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3474083B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003229304A (en) * | 2001-11-30 | 2003-08-15 | Murata Mfg Co Ltd | Electronic component, variable resistor and manufacturing method thereof |
| JP2008130974A (en) * | 2006-11-24 | 2008-06-05 | Fdk Corp | Coil component |
-
1997
- 1997-07-08 JP JP18221597A patent/JP3474083B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003229304A (en) * | 2001-11-30 | 2003-08-15 | Murata Mfg Co Ltd | Electronic component, variable resistor and manufacturing method thereof |
| JP2008130974A (en) * | 2006-11-24 | 2008-06-05 | Fdk Corp | Coil component |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3474083B2 (en) | 2003-12-08 |
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