JPH11261113A - Surface-mounting luminous equipment - Google Patents
Surface-mounting luminous equipmentInfo
- Publication number
- JPH11261113A JPH11261113A JP11007732A JP773299A JPH11261113A JP H11261113 A JPH11261113 A JP H11261113A JP 11007732 A JP11007732 A JP 11007732A JP 773299 A JP773299 A JP 773299A JP H11261113 A JPH11261113 A JP H11261113A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- board
- view
- light emitting
- led element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、面実装型発光器に
関する。[0001] The present invention relates to a surface mount type light emitting device.
【０００２】[0002]
【従来の技術】従来、面実装型発光器は、実開平１−１
６３３５２号に開示されるように、絶縁基板上に実装さ
れたＬＥＤ素子を樹脂体で封止した構造のものが提案さ
れている。前記基板の四角には切欠部が形成され、そこ
にスルーホール電極が形成され、前記樹脂体は前記切欠
部（スルーホール電極）を覆わないように前記基板の側
縁から離されて形成されている。2. Description of the Related Art Conventionally, a surface mount type light emitting device has been disclosed in
As disclosed in JP-A-63352, a structure in which an LED element mounted on an insulating substrate is sealed with a resin body has been proposed. A notch is formed in the square of the substrate, a through-hole electrode is formed therein, and the resin body is formed apart from a side edge of the substrate so as not to cover the notch (through-hole electrode). I have.
【０００３】[0003]
【発明が解決しようとする課題】最近、ＬＥＤ素子を用
いた発光器は、電子機器の小型化に伴い、他の電子部品
と変わらず面実装型への移行とともに更なる小型化が要
望されている。しかしながら、上記従来の構造のもので
は、樹脂体が基板側縁より内側に離れて形成されている
ために、小型化を図ろうとすると、樹脂体の上部の面積
が基板の面積よりも小さいために、自動実装における吸
着ノズルによる搬送時に発光器を傾いて保持したり脱落
させるという吸着ミスを来たすおそれがあるものとなっ
てしまうのである。Recently, with the downsizing of electronic devices, there has been a demand for a light emitting device using an LED element, which has been changed to a surface mounting type as in other electronic components, and further downsized. I have. However, in the above-mentioned conventional structure, since the resin body is formed inside the side edge of the substrate, the area of the upper part of the resin body is smaller than the area of the substrate in order to reduce the size. In addition, there is a risk that a suction error may occur when the light emitting device is tilted and held or dropped during the conveyance by the suction nozzle in the automatic mounting.
【０００４】そこで、上記従来の構造のものにおいて、
樹脂体と基板とが平面視同一の大きさとなるようにすれ
ばよいが、もし樹脂体を基板側縁に一致させると、通
常、上記樹脂体が溶融樹脂を金型に注入することにより
形成されるために、樹脂体が上記切欠部（スルーホール
電極）を埋設してしまい、このような発光器を回路基板
上に半田付けにより面実装すると、回路基板に十分な強
度で固定できないという危険性があるのである。従っ
て、従来の構造のものでは、どうしても上記切欠部（ス
ルーホール電極）を覆わないように樹脂体を形成しなけ
ればならない必然性があったのである。本発明は、上記
課題を解決すべくなされたもので、基板の側面の切欠部
に設けた電極を露出する一方、樹脂体を発光器のサイズ
にまで大きくすることで、小型化しても自動実装性に優
れ、且つ良好な半田付けを行うことができる面実装型発
光器を提供することを目的とする。Therefore, in the above-mentioned conventional structure,
The resin body and the substrate may have the same size in plan view, but if the resin body is aligned with the side edge of the substrate, the resin body is usually formed by injecting a molten resin into a mold. Therefore, the resin body buries the notch (through-hole electrode), and when such a light emitting device is surface-mounted on a circuit board by soldering, there is a danger that it cannot be fixed to the circuit board with sufficient strength. There is. Therefore, in the case of the conventional structure, it is necessary to form the resin body so as not to cover the notch (through-hole electrode). The present invention has been made in order to solve the above-mentioned problems, and while exposing electrodes provided in cutouts on side surfaces of a substrate, the resin body is enlarged to the size of a light emitting device, so that even if the size is reduced, automatic mounting is achieved. It is an object of the present invention to provide a surface mount type light emitting device having excellent solderability and capable of performing good soldering.
【０００５】[0005]
【課題を解決するための手段】即ち、本発明の面実装型
発光器は、平面視略矩形状の基板と、該基板の側面に設
けられた切欠部と、該切欠部から前記基板の表面及び裏
面に延設された電極と、前記基板の表面側に実装された
ＬＥＤ素子と、該ＬＥＤ素子を覆う平面視略矩形状の樹
脂体とを有する面実装型発光器であって、前記樹脂体を
前記基板と略同一の平面視略矩形状に形成して略六面体
形状をなすとともに前記電極の切欠部に形成された部分
が露出していることを特徴とする。That is, a surface mount type light emitting device of the present invention comprises a substrate having a substantially rectangular shape in plan view, a notch provided on a side surface of the substrate, and a surface of the substrate from the notch. And an electrode extending on the back surface, an LED element mounted on the front side of the substrate, and a substantially rectangular resin body in a plan view that covers the LED element, wherein the resin is It is characterized in that the body is formed in substantially the same rectangular shape in plan view as the substrate and has a substantially hexahedral shape, and a portion formed in a cutout portion of the electrode is exposed.
【０００６】[0006]
【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照しつつ具体的に説明する。本発明は、例え
ば次のようにして実現できる。図１は本発明の面実装型
発光器の一例を示す斜視図であり、図２は図１の正面
図、図３は図１の側面図、図４は図１の平面図、図５は
図１の背面図である。１は略六面体の形状を有する面実
装型発光器であって、この発光器１は厚み０．８ｍｍ程
度のガラエポ基板５と、このガラエポ基板５の表面側に
接着材で接合される厚み０．８ｍｍ程度の樹脂製の反射
ケ−ス１０とを主な構成としている。Embodiments of the present invention will be specifically described below with reference to the drawings. The present invention can be realized, for example, as follows. 1 is a perspective view showing an example of the surface mount type light emitting device of the present invention, FIG. 2 is a front view of FIG. 1, FIG. 3 is a side view of FIG. 1, FIG. 4 is a plan view of FIG. FIG. 2 is a rear view of FIG. 1. Reference numeral 1 denotes a surface-mounted light-emitting device having a substantially hexahedral shape. The light-emitting device 1 has a thickness of about 0.8 mm and a thickness of 0.1 mm which is bonded to the front side of the glass-epoxy substrate 5 with an adhesive. The main configuration is a reflection case 10 made of resin of about 8 mm.
【０００７】前記ガラエポ基板５は、その側面である４
つの角部に厚み方向に貫通する円弧状の切欠部を形成し
た略矩形状（２．０ｍｍ×３．０ｍｍ）を有し、その表
面にはＬＥＤ素子２のアノ−ド側をダイボンデイングす
るためのアイランド部６と、ダイボンデングしたＬＥＤ
素子２の表面（カソ−ド側）とワイヤ３で接続されるボ
ンデイングパッド部７がそれぞれ独立して設けられる一
方、前記ガラエポ基板５の切欠部にアノ−ド電極８およ
びカソ−ド電極９を設けてある。The glass epoxy substrate 5 has a side surface 4.
It has a substantially rectangular shape (2.0 mm × 3.0 mm) having an arc-shaped notch formed in one corner portion penetrating in the thickness direction, and the anode side of the LED element 2 is die-bonded on the surface thereof. Island part 6 and die-bonded LED
Bonding pad portions 7 connected to the surface (cathode side) of the element 2 and the wires 3 are provided independently of each other, while anode electrodes 8 and cathode electrodes 9 are provided in the cutouts of the glass epoxy substrate 5. It is provided.
【０００８】そして、アイランド部６とアノ−ド電極８
およびボンデイングパッド部７とカソ−ド電極９とは、
それぞれガラエポ基板５上に形成された配線パタ−ン５
Ａによって電気的に接続されている。本実施例では８を
アノ−ド電極、９をカソ−ド電極としたが、これに限ら
ず８をカソ−ド電極、９をアノ−ド電極とすることも可
能である。また、アノード電極８及びカソード電極９
は、ガラエポ基板５の裏面にまで延設されている。The island portion 6 and the anode electrode 8
And the bonding pad portion 7 and the cathode electrode 9
Wiring pattern 5 formed on glass epoxy substrate 5
A is electrically connected. In this embodiment, 8 is an anode electrode and 9 is a cathode electrode. However, the present invention is not limited to this, and it is also possible to use 8 as a cathode electrode and 9 as an anode electrode. Further, the anode electrode 8 and the cathode electrode 9
Extend to the back surface of the glass epoxy substrate 5.
【０００９】この実施例では、前記ガラス・エポキシ材
からなるガラエポ基板５を採用したがこれに限定される
ものでなく、セラミック材などからなる基板も採用でき
るし、前述したように４つの角部の円弧状の切り欠きに
限らず斜めに面取りしたものなど適宜形状を採用でき
る。しかしながら、４つの角部に切欠部を設け、この切
欠部の形状に沿ってアノ−ド電極８およびカソ−ド電極
９を形成し、当該両電極８、９を半田等の導電接着材に
て回路基板のパッドに接着することにより、面実装型発
光器１を強固に面実装することができる。すなわち、切
欠部を有するため前記面実装型発光器１の電極８、９と
パッドとの間に厚い半田層が形成できるとともに半田フ
ィレットも十分確保できるから、回路基板に対して強固
に前記面実装型側面発光器１を固定できる効果が得られ
るのである。In this embodiment, the glass epoxy substrate 5 made of the glass / epoxy material is used. However, the present invention is not limited to this. A substrate made of a ceramic material or the like can also be used. The shape is not limited to the arc-shaped notch but may be any shape such as a chamfered obliquely. However, a notch is provided at each of the four corners, and an anode electrode 8 and a cathode electrode 9 are formed along the shape of the notch, and the electrodes 8 and 9 are connected with a conductive adhesive such as solder. By adhering to the pads of the circuit board, the surface mount type light emitting device 1 can be firmly surface mounted. That is, since the notch is provided, a thick solder layer can be formed between the electrodes 8 and 9 of the surface mount type light emitting device 1 and the pad and a solder fillet can be sufficiently secured. The effect that the mold side surface light emitting device 1 can be fixed can be obtained.
【００１０】前記反射ケース１０は、発光窓部枠１１Ａ
を形成した遮光性材からなる枠体１１と、前記発光窓部
枠１１Ａを閉塞するように透光樹脂で封止した発光窓部
１２とからなり、平滑な上面を有する。また、反射ケ−
ス１０は、平面視略矩形状で前記ガラエポ基板５と略同
一外状を有し、ガラエポ基板５の側面の切欠部を覆うよ
うにその上部に突出している。詳しくは、ガラエポ基板
５は、平面視矩形状の側縁にガラエポ基板５の表面から
裏面に貫通する切欠部が設けられており、そのガラエポ
基板５の上面に、外郭を平面視でガラエポ基板５とほぼ
同じ大きさの完全な矩形状の反射ケース１０が、その四
辺をガラエポ基板５の４辺と一致されて設けられること
により、ガラエポ基板５の切欠部の上部が反射ケース１
０の樹脂体の周縁部で覆われている。また、前記ガラエ
ポ基板５のＬＥＤ素子２の実装面に、該ＬＥＤ素子が枠
体１１の発光窓部枠１１Ａ内に位置するように、反射ケ
ース１０の前記枠体１１を接着材で接着し、その後、前
記発光窓部枠１１Ａから透光性の樹脂をポッティングな
どの手法により滴下して前記ＬＥＤ素子を含み樹脂封止
してなる。このようにＬＥＤ素子２を樹脂で封止するこ
とによって、ＬＥＤ素子２に水分が侵入したりして素子
２を破壊するなどの虞を回避できる。The reflection case 10 includes a light emitting window frame 11A.
And a light emitting window 12 sealed with a light transmitting resin so as to close the light emitting window frame 11A, and has a smooth upper surface. Also, the reflection case
The glass 10 has a substantially rectangular shape in plan view and has substantially the same outer shape as the glass epoxy substrate 5, and protrudes upward from the glass epoxy substrate 5 so as to cover a cutout on a side surface of the glass epoxy substrate 5. More specifically, the glass epoxy substrate 5 is provided with a cutout penetrating from the front surface to the back surface of the glass epoxy substrate 5 at a rectangular side edge in a plan view, and the outer surface of the glass epoxy substrate 5 in a plan view is formed on the upper surface of the glass epoxy substrate 5. A perfect rectangular reflective case 10 having substantially the same size as that of the glass epoxy substrate 5 is provided so that its four sides coincide with the four sides of the glass epoxy substrate 5, so that the upper part of the cutout portion of the glass epoxy substrate 5 is
0 is covered with the periphery of the resin body. Further, the frame 11 of the reflection case 10 is adhered to the mounting surface of the LED element 2 of the glass epoxy substrate 5 with an adhesive so that the LED element is located within the light emitting window frame 11A of the frame 11. Thereafter, a light-transmissive resin is dropped from the light emitting window frame 11A by a method such as potting, and the resin is sealed with the LED element. By sealing the LED element 2 with the resin as described above, it is possible to avoid a possibility that moisture enters the LED element 2 and the element 2 is broken.
【００１１】そして、前記反射ケ−ス１０の発光窓部枠
１１Ａには、外部に向かって漸次広がる反射面１１Ｂを
形成して、ＬＥＤ素子２による発光を効率良く外部に導
出するようにしてある。また、図３及び４に示したよう
に、反射ケース１０の枠体１１のガラエポ基板５との接
合面側に、ガラエポ基板５の４角に設けた切欠部と対応
してそれよりも大きな径の切欠部を形成してもよく、こ
のようにすれば枠体１１を基板５に接着剤を用いて接合
する場合に接着剤がはみ出して基板５の４角の切欠部に
設けたアノード電極８，カソード電極９の表面を覆うこ
とを防止できる。尚、前記実施の形態では基板の４つの
角部に切欠部を設けて電極を形成した例を示したが、こ
の場合はＬＥＤ素子を実装する基板表面のパッドの面積
を比較的大きくでき、小さなサイズの基板を用いた場合
であっても基板上へのＬＥＤ素子の実装をより容易に行
うことができる。また、小さい基板を用いた場合であっ
ても、基板の４隅で半田付けを強固に行うことができ
る。The light-emitting window frame 11A of the reflection case 10 is formed with a reflection surface 11B that gradually widens toward the outside, so that light emitted by the LED element 2 is efficiently guided to the outside. . As shown in FIGS. 3 and 4, the diameter of the frame 11 of the reflection case 10 on the joint surface side with the glass epoxy substrate 5 is larger than that of the cutout provided at the four corners of the glass epoxy substrate 5. When the frame 11 is joined to the substrate 5 using an adhesive, the adhesive protrudes and the anode electrode 8 provided in the square notch of the substrate 5 may be formed. In addition, it is possible to prevent the surface of the cathode electrode 9 from being covered. In the above-described embodiment, an example is shown in which notches are provided at four corners of the substrate to form electrodes, but in this case, the area of pads on the surface of the substrate on which the LED elements are mounted can be made relatively large and small. Even when a substrate having a size is used, mounting of the LED element on the substrate can be performed more easily. Further, even when a small substrate is used, soldering can be firmly performed at four corners of the substrate.
【００１２】[0012]
【発明の効果】本発明によれば、基板の側面に設けた切
欠部の上部をひさしのように覆うも上記切欠部に形成さ
れた電極を覆うことなく露出するように樹脂体をその上
面の面積を大きくして形成しているので、この面実装型
発光器を例えば回路基板に自動実装機により実装する場
合、搬送用の吸着コレットによる吸着保持を十分な吸着
力で行うことができ、吸着ミスによる実装ミスを軽減で
きるのである。しかも基板の側面の切欠部に形成された
電極が露出しているので、半田付けを半田フィレットを
十分確保できて行え、強固に回路基板等に実装できるの
である。According to the present invention, the upper surface of the notch provided on the side surface of the substrate is covered like an eaves, but the resin body is formed on the upper surface so as to be exposed without covering the electrode formed in the notch. Since the surface mount type light emitting device is mounted on a circuit board by an automatic mounting machine, for example, when the surface mount type light emitting device is formed by an automatic mounting machine, it is possible to perform suction holding by a suction collet for conveyance with a sufficient suction force, and to perform suction Mounting errors due to mistakes can be reduced. Moreover, since the electrodes formed in the cutouts on the side surfaces of the board are exposed, soldering can be performed with a sufficient solder fillet, and the board can be firmly mounted on a circuit board or the like.
【図１】本発明の面実装型発光器の一例を示す斜視図で
ある。FIG. 1 is a perspective view showing an example of a surface mount type light emitting device of the present invention.
【図２】図１の正面図である。FIG. 2 is a front view of FIG.
【図３】図１の一部を切り欠いた右側面図である。FIG. 3 is a right side view in which a part of FIG. 1 is cut away.
【図４】図１の側面図である。FIG. 4 is a side view of FIG. 1;
【図５】図１の背面図である。FIG. 5 is a rear view of FIG. 1;
１ 面実装型発光器 ２ ＬＥＤ素子 ５ ガラエポ基板 ８ アノ−ド電極 ９ カソ−ド電極 １１ 枠体 １２ 発光窓部 DESCRIPTION OF SYMBOLS 1 Surface mount type light-emitting device 2 LED element 5 Glass epoxy board 8 Anode electrode 9 Cathode electrode 11 Frame 12 Light emission window
Claims (1)
に設けられた切欠部と、該切欠部から前記基板の表面及
び裏面に延設された電極と、前記基板の表面側に実装さ
れたＬＥＤ素子と、該ＬＥＤ素子を覆う平面視略矩形状
の樹脂体とを有する面実装型発光器であって、前記樹脂
体を前記基板と略同一の平面視略矩形状に形成して略六
面体形状をなすとともに前記電極の切欠部に形成された
部分が露出されていることを特徴とする面実装型発光
器。1. A substrate having a substantially rectangular shape in a plan view, a notch provided on a side surface of the substrate, an electrode extending from the notch to a front surface and a back surface of the substrate, and a front surface of the substrate. A surface-mounted light emitting device having a mounted LED element and a resin body having a substantially rectangular shape in plan view that covers the LED element, wherein the resin body is formed in a substantially rectangular shape in plan view substantially the same as the substrate. A surface-mounted light emitting device having a substantially hexahedral shape and a portion formed in a cutout portion of the electrode is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11007732A JPH11261113A (en) | 1999-01-14 | 1999-01-14 | Surface-mounting luminous equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11007732A JPH11261113A (en) | 1999-01-14 | 1999-01-14 | Surface-mounting luminous equipment |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5271634A Division JPH07131072A (en) | 1993-10-29 | 1993-10-29 | Surface-mount type side face light emitting equipment, light emitting device using it, and liquid crystal display using light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11261113A true JPH11261113A (en) | 1999-09-24 |
Family
ID=11673889
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11007732A Pending JPH11261113A (en) | 1999-01-14 | 1999-01-14 | Surface-mounting luminous equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11261113A (en) |
Cited By (7)
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|---|---|---|---|---|
| US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
| US9035439B2 (en) | 2006-03-28 | 2015-05-19 | Cree Huizhou Solid State Lighting Company Limited | Apparatus, system and method for use in mounting electronic elements |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
-
1999
- 1999-01-14 JP JP11007732A patent/JPH11261113A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9035439B2 (en) | 2006-03-28 | 2015-05-19 | Cree Huizhou Solid State Lighting Company Limited | Apparatus, system and method for use in mounting electronic elements |
| US9711703B2 (en) | 2007-02-12 | 2017-07-18 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| US9070850B2 (en) | 2007-10-31 | 2015-06-30 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US10892383B2 (en) | 2007-10-31 | 2021-01-12 | Cree, Inc. | Light emitting diode package and method for fabricating same |
| US11791442B2 (en) | 2007-10-31 | 2023-10-17 | Creeled, Inc. | Light emitting diode package and method for fabricating same |
| US9722158B2 (en) | 2009-01-14 | 2017-08-01 | Cree Huizhou Solid State Lighting Company Limited | Aligned multiple emitter package |
| US9012938B2 (en) | 2010-04-09 | 2015-04-21 | Cree, Inc. | High reflective substrate of light emitting devices with improved light output |
| US9601670B2 (en) | 2014-07-11 | 2017-03-21 | Cree, Inc. | Method to form primary optic with variable shapes and/or geometries without a substrate |
| US10622522B2 (en) | 2014-09-05 | 2020-04-14 | Theodore Lowes | LED packages with chips having insulated surfaces |
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