JPH11242950A - Terminal connecting device for power supply circuit - Google Patents
Terminal connecting device for power supply circuitInfo
- Publication number
- JPH11242950A JPH11242950A JP10344084A JP34408498A JPH11242950A JP H11242950 A JPH11242950 A JP H11242950A JP 10344084 A JP10344084 A JP 10344084A JP 34408498 A JP34408498 A JP 34408498A JP H11242950 A JPH11242950 A JP H11242950A
- Authority
- JP
- Japan
- Prior art keywords
- ring
- slot
- power supply
- shaped loop
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Battery Mounting, Suspending (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は端子接続装置に関
し、特に、電子機器等の電源を供給する際に利用する電
源供給回路用端子接続装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal connection device, and more particularly to a terminal connection device for a power supply circuit used for supplying power to an electronic device or the like.
【０００２】[0002]
【従来の技術】近年、電子機器等に使用される電源回路
用接続装置において、リード線などの接続部材をプリン
ト回路基板に挿入および、半田付けする作業は自動化さ
れつつあり、実開平1-60366号公報及び実開平2-110180
号公報、さらに登録特許第2658586号公報等に開示され
ているような端子接続構成が考案されている。以下、従
来の電源回路用接続装置について、図８ないし図１０を
用いて簡単に説明する。2. Description of the Related Art In recent years, in a connection device for a power supply circuit used for electronic equipment and the like, the work of inserting and soldering a connection member such as a lead wire into a printed circuit board has been automated. Bulletin and Japanese Utility Model Application
A terminal connection configuration has been devised as disclosed in Japanese Unexamined Patent Publication (Kokai) No. 2000-254, and further, in Japanese Patent No. 2658586. Hereinafter, a conventional power supply circuit connection device will be briefly described with reference to FIGS.
【０００３】図８は、実開平1-60366号公報に開示のバ
ッテリー端子接続装置を示し、同図において、リード線
の一端側にはコイル状電極端子部４Ａが設けられ、中間
ブリッジ部４Ｃと蔓巻き構造の脚部４Ｄを介在して、他
端側には直線状の取り付け端部４Ｂが設けられている。FIG. 8 shows a battery terminal connecting device disclosed in Japanese Utility Model Laid-Open Publication No. 1-60366. In FIG. 8, a coil-shaped electrode terminal portion 4A is provided at one end of a lead wire, and an intermediate bridge portion 4C is provided. A linear attachment end 4B is provided on the other end side with the leg portion 4D having a spiral structure interposed therebetween.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら，この従
来の端子接続構成においては、配線板に当接させる接続
部材のブリッジ脚部４Ｄをつる巻き構造とすることによ
り、ブリッジ部の倒れを防止し半田付けを容易にしてい
るものの、半田付けする前の状態において、接続部材が
端部４Ｂの１ヵ所で配線板の穴にフリ−な状態で挿入さ
れている為、接続部材を寝かせないようにする効果、す
なわち自立効果は小さかった。また、ブリッジ部に加わ
る外力は、つる巻き部の半田付け部に直接作用すること
になり、半田クラックが発生し、導通不良を起こし易い
と言う問題点があった。さらに、つる巻き部を配線板に
当接させて半田付けしている為、厚みが大きくなり薄型
の電子機器には不向きであった。However, in this conventional terminal connection configuration, the bridge leg 4D of the connection member to be brought into contact with the wiring board has a helical structure, thereby preventing the bridge portion from falling down and soldering. Although the attachment is easy, the connection member is inserted in the hole of the wiring board at one position of the end 4B in a free state before soldering, so that the connection member is not laid down. The effect, the self-sustaining effect, was small. Further, the external force applied to the bridge portion directly acts on the soldering portion of the helical winding portion, which causes a problem that a solder crack is generated and a conduction failure is likely to occur. Furthermore, since the helical winding is brought into contact with the wiring board and soldered, the thickness becomes large, which is not suitable for thin electronic devices.
【０００５】図９は、実開平2-110180号公報に開示のリ
ード端子構成を示し、同図において、リード線４の中間
部に形成された径Ｄの略Ｕ字状ループ部５は、絶縁基板
１に形成された長さＬのスロット３に挿入係止され、半
田７によってスロットの周辺部に形成された回路パター
ン２に接続固定されている。FIG. 9 shows a lead terminal structure disclosed in Japanese Utility Model Laid-Open No. 2-110180. In FIG. 9, a substantially U-shaped loop portion 5 having a diameter D formed at an intermediate portion of a lead wire 4 is insulated. It is inserted and locked in a slot 3 having a length L formed on a substrate 1 and is connected and fixed to a circuit pattern 2 formed around the slot by solder 7.
【０００６】しかしながら，上記従来の端子接続構成に
おいては、金属リード線のル−プ部分が絶縁基板の穴に
挿入され弾接係止されるものの、挿入部分がル−プ（略
Ｕ字形）形状で１ヵ所しかない為、自立効果が小さく、
絶縁基板または金属線やリ−ド端子への加振に対し、は
ずれ易いというの問題点があった。However, in the above-described conventional terminal connection structure, although the loop portion of the metal lead wire is inserted into the hole of the insulating substrate and is elastically engaged therewith, the inserted portion has a loop (substantially U-shaped) shape. Because there is only one place, the independence effect is small,
There has been a problem that it is easily detached from the insulating substrate, the metal wire, or the vibration applied to the lead terminals.
【０００７】図１０は、特公平第2658586号公報に開示
のリード端子接続構成を示し、同図において、リード線
４の一端側に鉤型に折り曲げた直線状端子部４Ｂを設
け、他端側にコイルバネ状電源接続部４Ａを設け、その
中間部に径Ｄの略Ｕ字状ループ端子部５を設け、該Ｕ字
状ループ端子部５は、絶縁基板１に形成された長さＬの
スロット３に挿入係止され、半田７Ａによってスロット
の周辺部に形成された回路パターンに接続固定され、直
線状端子部４Ｂは絶縁基板１に形成された穴６に挿入係
止され、半田７Ｂによって周辺部の回路パターンに接続
固定されている。FIG. 10 shows a lead terminal connection structure disclosed in Japanese Patent Publication No. 2658586. In FIG. 10, a straight terminal portion 4B bent in a hook shape is provided at one end of a lead wire 4 and the other end is provided. And a substantially U-shaped loop terminal portion 5 having a diameter D is provided at an intermediate portion thereof, and the U-shaped loop terminal portion 5 has a length L slot formed in the insulating substrate 1. 3, the linear terminal portion 4B is inserted and locked into a hole 6 formed in the insulating substrate 1 by a solder 7A, and connected and fixed to a circuit pattern formed around the slot by a solder 7A. It is connected and fixed to the circuit pattern of the section.
【０００８】しかしながら，図９及び図１０に示すよう
なＵ字状ループ端子部を形成する従来の端子接続構成に
おいては、ル−プ形状の最小半径Ｒは、コイリングマシ
ンによる製造では一般的に金属線材の線径ｄの３倍以上
必要である為、ル−プ部の高さ（外径）を小さくするこ
とは困難であった。従って、絶縁基板の厚みよりル−プ
部の高さＨは金属材線径の３倍以上突出することにな
り、接続装置を装着した絶縁基板完成品の厚みが大きく
なり、薄型の電子機器には不向きであった。However, in the conventional terminal connection configuration for forming a U-shaped loop terminal portion as shown in FIGS. 9 and 10, the minimum radius R of the loop shape is generally a metal radius in the production by a coiling machine. Since it is necessary to be at least three times the wire diameter d of the wire, it has been difficult to reduce the height (outer diameter) of the loop portion. Therefore, the height H of the loop portion protrudes more than three times the diameter of the metal wire from the thickness of the insulating substrate, and the thickness of the finished insulating substrate on which the connecting device is mounted is increased. Was unsuitable.
【０００９】本発明はこのような従来の課題を解消し、
電源回路用接続装置に乾電池等のバッテリー電源を接続
する場合など、電源接続部に外力が加わっても、外力は
半田付け部に作用せず良好な導通状態を維持でき、接続
部材とプリント基板の相互を半田付け接続していない場
合でも、接続部材の自立と係止を維持でき、かつ、接続
部材組立品の厚みを薄く小型にすることができる電源回
路用接続装置を提供するものである。The present invention solves such a conventional problem,
Even when an external force is applied to the power connection, such as when a battery power source such as a dry battery is connected to the power supply circuit connection device, the external force does not act on the soldered portion and can maintain a good conduction state. It is an object of the present invention to provide a power supply circuit connecting device that can maintain the self-supporting and locking of a connecting member even when they are not connected by soldering, and can reduce the thickness of the connecting member assembly to a small size.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決するため
に本発明の電源回路用端子接続装置は、回路パターン層
を有する基板に装着された接続リード部材を有し、該接
続リード部材は、基板の表面に載置されたブリッジ部
と、該ブリッジ部の中間部に形成された所定外径の略リ
ング状ループ部と、該ブリッジ部から鈎形状に折り曲げ
て延在する直線状装着端子部が形成され、該直線状装着
端子部は、基板内の対応する位置に形成された穴に挿入
され、半田付によって基板の回路パターン層に接続固定
され、上記リング状ループ部は、上記ブリッジ部に対し
て略直交する方向に突出し、基板内の対応する位置に形
成されたスロット内に挿入され係止保持される構成であ
る。In order to solve the above-mentioned problems, a terminal connection device for a power supply circuit according to the present invention has a connection lead member mounted on a substrate having a circuit pattern layer. A bridge portion mounted on the surface of the substrate, a substantially ring-shaped loop portion having a predetermined outside diameter formed at an intermediate portion of the bridge portion, and a linear mounting terminal portion bent and extended from the bridge portion into a hook shape Is formed, the linear mounting terminal portion is inserted into a hole formed at a corresponding position in the substrate, connected and fixed to a circuit pattern layer of the substrate by soldering, and the ring-shaped loop portion is connected to the bridge portion. And is inserted into a slot formed at a corresponding position in the substrate and locked and held.
【００１１】本発明は上記した構成によって、接続部材
の厚みを薄く小型にでき、接続部材の直線状装着端子部
とリング状ループ部を、対応する基板の穴とスロットに
それぞれ挿通することにより、リング状ループ部がスロ
ットに弾接係止される。According to the present invention, the thickness of the connecting member can be made small and small by the above-described structure, and the linear mounting terminal portion and the ring-shaped loop portion of the connecting member are inserted into the corresponding holes and slots of the board, respectively. The ring-shaped loop portion is elastically engaged with the slot.
【００１２】[0012]
【発明の実施の形態】本発明の第１の発明による電源回
路用端子接続装置は、回路パターン層を有する基板に装
着された略一定線径の接続リード部材を有し、該接続リ
ード部材は、基板の表面に載置されたブリッジ部と、該
ブリッジ部の中間部に形成された所定外径の略リング状
ループ部と、該ブリッジ部から鈎形状に折り曲げて延在
する直線状装着端子部が形成され、該直線状装着端子部
は、基板内の対応する位置に形成された穴に挿入され、
半田付によって基板の回路パターン層に接続固定され、
上記リング状ループ部は、上記ブリッジ部に対して略直
交する方向に突出し、基板内の対応する位置に形成され
たスロット内に挿入され係止保持される構成である。DESCRIPTION OF THE PREFERRED EMBODIMENTS A terminal connection device for a power supply circuit according to a first aspect of the present invention has a connection lead member having a substantially constant wire diameter mounted on a substrate having a circuit pattern layer, and the connection lead member is A bridge portion mounted on the surface of the substrate, a substantially ring-shaped loop portion having a predetermined outer diameter formed at an intermediate portion of the bridge portion, and a linear mounting terminal extending from the bridge portion in a hook shape. Portion is formed, the linear mounting terminal portion is inserted into a hole formed at a corresponding position in the substrate,
Connected and fixed to the circuit pattern layer of the board by soldering,
The ring-shaped loop portion protrudes in a direction substantially orthogonal to the bridge portion, and is inserted into a slot formed at a corresponding position in the substrate and locked and held.
【００１３】本発明の第２の発明は、上記接続リード部
材がその中間部において所定角度で折り曲げられ、第１
と第２のブリッジ部を有し、該第１と第２のブリッジ部
がそれぞれ第１と第２のリング状ループ部を形成し、該
第１及び第２のリング状ループ部は基板内の対応する所
定個所に形成された第１及び第２のスロットにそれぞれ
挿入保持された構成である。According to a second aspect of the present invention, the connecting lead member is bent at a predetermined angle at an intermediate portion thereof, and
And a second bridge portion, the first and second bridge portions respectively forming first and second ring-shaped loop portions, and the first and second ring-shaped loop portions are formed in the substrate. This is a configuration in which first and second slots formed at corresponding predetermined locations are respectively inserted and held.
【００１４】上記第１の発明によれば、基盤にリード接
続部材が装着された端子接続装置の組立て完成部品は、
その厚さが従来と比較して格段に薄くでき、リード線ル
ープ部のスロット内への係止保持がより確実かつ安定し
て行われ、薄型の電子機器にも最適な構成となる。According to the first aspect of the present invention, the assembled terminal part of the terminal connection device in which the lead connection member is mounted on the base is:
The thickness can be made much thinner as compared with the related art, the locking of the lead wire loop portion in the slot is performed more reliably and stably, and the configuration is optimal for a thin electronic device.
【００１５】上記第２の発明によれば、電源端子部に外
力が加わることによりループ部の半田接合部でクラック
が発生したとしても、端子装着部の半田接合部には外力
の影響は及ぼさず、低価格で良好な導通状態を維持でき
る。さらに、接続リード部材が基板に２箇所で固定され
ているため、接続部材とプリント基板の相互を半田付け
接合していない場合でも、接続部材の自立と係止が確実
に維持でき、作業性を向上させることができる。According to the second aspect of the present invention, even if a crack occurs at the solder joint of the loop portion due to an external force applied to the power supply terminal portion, the external force does not affect the solder joint of the terminal mounting portion. A good conduction state can be maintained at low cost. Furthermore, since the connection lead member is fixed to the board at two locations, even when the connection member and the printed board are not soldered and joined to each other, the connection member can be reliably maintained independently and locked, and workability can be improved. Can be improved.
【００１６】以下、本発明の実施の形態の電源回路用端
子接続装置について、添付の図面を参照しながら説明す
る。ただし、図面において、同様の部材要素については
従来例と同一の参照番号を付している。Hereinafter, a terminal connection device for a power supply circuit according to an embodiment of the present invention will be described with reference to the accompanying drawings. However, in the drawings, the same reference numerals are given to the same member elements as in the conventional example.
【００１７】（実施の形態１）図１は本発明の第１の実
施の形態における電源回路用端子接続装置の組立て前の
要部外観を示すものである。(Embodiment 1) FIG. 1 shows an appearance of a main part of a power supply circuit terminal connection device before assembly according to a first embodiment of the present invention.
【００１８】図１において、１はプリント回路用絶縁基
板、４は回路基板１に装着される略一定の線径を有する
リード線接続部材である。接続リード部材４は、直線状
ブリッジ部４Ｃを有し、その中間部に１回巻きのスピン
状巻回構造のリング状ループ部５が形成されている。ま
た、一端側には電源端子部としてのコイルバネ状端子部
４Ａを有し、他端側には直線状挿入装着端子部４Ｂが形
成され、鈎形状折り曲げ部４Ｄから図で下方に延在して
絶縁基板に装着される。In FIG. 1, reference numeral 1 denotes an insulating substrate for a printed circuit, and 4 denotes a lead wire connecting member having a substantially constant wire diameter mounted on the circuit board 1. The connection lead member 4 has a linear bridge portion 4C, and a ring-shaped loop portion 5 having a single-turn spin-shaped winding structure is formed at an intermediate portion thereof. Further, a coil spring-shaped terminal portion 4A as a power supply terminal portion is provided on one end side, and a linear insertion mounting terminal portion 4B is formed on the other end side, and extends downward from the hook-shaped bent portion 4D in the figure. It is mounted on an insulating substrate.
【００１９】コイルバネ端子部４Ａにはバッテリーなど
の直流電源〈不図示）が接続され、電源がリード部材の
直線状装着端子部４Ｂおよびリング状ループ部５を介し
て基板の回路パターン層に供給される。A DC power source (not shown) such as a battery is connected to the coil spring terminal portion 4A, and the power is supplied to the circuit pattern layer of the substrate via the linear mounting terminal portion 4B of the lead member and the ring-shaped loop portion 5. You.
【００２０】上記構成において、装着端子部４Ｂはブリ
ッジ部４Ｃに対して略直角方向に延在し、基板１内の対
応する所定個所に形成された穴６に挿入される。穴６の
径は、リード線４の径よりも僅かに大きく形成されてい
る。In the above configuration, the mounting terminal portion 4B extends in a direction substantially perpendicular to the bridge portion 4C, and is inserted into a hole 6 formed at a corresponding predetermined position in the substrate 1. The diameter of the hole 6 is formed slightly larger than the diameter of the lead wire 4.
【００２１】リング状ループ部５はブリッジ部４Ｃに関
して略直角方向に突出形成し、基板１内の対応する所定
個所に形成されたスロット３に挿入され固定保持され
る。スロット３の長さＬは、リング状ループ部５の外径
Ｄに実質等しいか、またはそれより僅かに小さく形成さ
れ、リング状ループ部の最外径部が、リング状ループ部
のばね張力により、スロット３の長手方向に内壁３ａと
弾接係止可能にしたものであり、接続部材とプリント基
板の相互を半田付け接続しなくても、接続部材の自立と
係止を維持できる効果がある。一方、スロット３の幅Ｗ
は、リング状ループ部５が一回巻き構造の場合は、リー
ド部材４の線径ｄより僅かに大きく形成され、リング状
ループ部５をスロットの幅方向に確実に挿入保持する。The ring-shaped loop portion 5 protrudes in a direction substantially perpendicular to the bridge portion 4C, and is inserted and fixedly held in a slot 3 formed at a corresponding predetermined position in the substrate 1. The length L of the slot 3 is substantially equal to or slightly smaller than the outer diameter D of the ring-shaped loop portion 5, and the outermost diameter portion of the ring-shaped loop portion is formed by the spring tension of the ring-shaped loop portion. And the inner wall 3a can be elastically engaged with the slot 3 in the longitudinal direction, so that the connection member and the printed circuit board can be maintained independently and locked without soldering and connecting each other. . On the other hand, the width W of the slot 3
When the ring-shaped loop portion 5 has a single-turn structure, the ring-shaped loop portion 5 is formed to be slightly larger than the wire diameter d of the lead member 4 to securely insert and hold the ring-shaped loop portion 5 in the width direction of the slot.
【００２２】本実施例では、実際に使用されるリード線
４としてはその線径ｄが、例えば 0.5 mm、0.55 mm、1.
0 mmであり、一方、基板１の厚さＳは、例えば 1.0 m
m、1.2mm、1.6 mm のものが使用されている。ただし、
これらの数値は単に例示しただけであり、他の数値のも
のも使用できることはいうまでもない。In this embodiment, the lead wire 4 actually used has a wire diameter d of, for example, 0.5 mm, 0.55 mm, 1.
0 mm, while the thickness S of the substrate 1 is, for example, 1.0 m
m, 1.2 mm and 1.6 mm are used. However,
These numerical values are merely examples, and it goes without saying that other numerical values can also be used.
【００２３】図２及び図３は、図１に示す端子接続装置
の組立て構成の要部断面形状を示す。同図において、本
実施例では、スロット３の内壁３ａは、基板１の表面１
ａ（または１ｂ）に対して例えば実質垂直となるように
形成され、スロット３内に保持されたリング状ループ部
５は、半田７Ａによって基板の裏面１ｂに設けられた半
田箔〈不図示）を介してスロット周辺の回路パターン層
２に接続固定されている。FIGS. 2 and 3 show a sectional view of a main part of the assembled structure of the terminal connecting device shown in FIG. In this embodiment, in this embodiment, the inner wall 3 a of the slot 3 is
For example, the ring-shaped loop portion 5 formed so as to be substantially perpendicular to a (or 1b) and held in the slot 3 is made of a solder foil (not shown) provided on the back surface 1b of the substrate by the solder 7A. It is connected and fixed to the circuit pattern layer 2 around the slot through the slot.
【００２４】一方、基板内の穴６に挿入された装着端子
部４Ｂは、同様に半田７Ｂによって半田箔を介して基板
の回路パターン層２に接続固定される。実際の部品組立
て製造工程では、接続リード部材４の基板への挿入およ
び半田付け工程は自動化できる構成である。On the other hand, the mounting terminal portion 4B inserted into the hole 6 in the board is similarly connected and fixed to the circuit pattern layer 2 of the board via the solder foil by the solder 7B. In the actual component assembling and manufacturing process, the process of inserting the connection lead member 4 into the board and the process of soldering can be automated.
【００２５】このように、本実施例では、リング状ルー
プ部は基板のスロット３内に確実に係止され、接続部材
の自立効果を保持しつつ、半田クラックの発生を効果的
に防止している。As described above, in this embodiment, the ring-shaped loop portion is securely locked in the slot 3 of the substrate, and the occurrence of solder cracks is effectively prevented while maintaining the self-supporting effect of the connecting member. I have.
【００２６】なお、本実施例では回路パターン層２は基
板の裏面側に設けた構成として説明しているが、回路パ
ターン層は基板の上面側にも設けた構成とすることも同
様に可能であることは言うまでもない。In this embodiment, the circuit pattern layer 2 is described as being provided on the back side of the substrate. However, the circuit pattern layer may be provided also on the top side of the substrate. Needless to say, there is.
【００２７】本実施例では、リング状ループ部５はスピ
ン状巻回構成としているため、該ループ部５の外径Ｄは
リード線４の線径ｄの略５倍程度にまで減少させること
ができる。即ち、ループ部５をコイリングマシーンを用
いて形成する場合、ループ部の必要な最小半径Ｒは、リ
ード線径ｄの２.５倍程度あれば形成可能である。した
がって、ル−プ部の基板下面からの突出部の高さＨは、
従来の構成と比較して遥かに小さくすることができる。In this embodiment, since the ring-shaped loop portion 5 has a spin-shaped winding configuration, the outer diameter D of the loop portion 5 can be reduced to approximately five times the wire diameter d of the lead wire 4. it can. That is, when the loop portion 5 is formed using a coiling machine, the loop portion 5 can be formed if the required minimum radius R is about 2.5 times the lead wire diameter d. Therefore, the height H of the projecting portion of the loop portion from the lower surface of the substrate is:
It can be made much smaller than the conventional configuration.
【００２８】端子接続装置の製作実験において、本願発
明者は、上記リード線ループ部５の基板下面からの突出
部の必要最小限の高さＨに関して、リード線ループ部の
外径Ｄがリード線径ｄの５倍以上であるとの前提で、突
出部の高さＨはリード線径ｄと実質等しい値にまで減少
できることを見出した。即ち、ループ突出部の高さＨの
値が少なくともリード線径ｄ以上あれば、ループ部５を
スロット３内に確実に係止することが可能である。この
最も薄型形状の構成では、ループ部５の内径部に対応す
る部分は基板のスロット３内に保持され、リード線ルー
プ部の上端部５ａと下端部５ｂのみが、それぞれ図示に
おいて基板の上面１ａおよび下面１ｂより外側に突出し
ており、基板の厚さＳに関して下記の式が成立してい
る。D = S + 2d (D ≧ 5d, H = d)In an experiment for manufacturing the terminal connection device, the inventor of the present application has found that the outer diameter D of the lead wire loop portion 5 is smaller than the outer diameter D of the lead wire loop portion 5 with respect to the necessary minimum height H of the projecting portion from the lower surface of the substrate. It has been found that the height H of the protrusion can be reduced to a value substantially equal to the lead wire diameter d on the assumption that the diameter is at least five times the diameter d. That is, if the value of the height H of the loop protrusion is at least equal to or greater than the lead wire diameter d, the loop 5 can be securely locked in the slot 3. In the thinnest configuration, the portion corresponding to the inner diameter of the loop portion 5 is held in the slot 3 of the substrate, and only the upper end portion 5a and the lower end portion 5b of the lead wire loop portion are respectively shown on the upper surface 1a of the substrate in the drawing. And protrudes outward from the lower surface 1b, and the following expression holds for the thickness S of the substrate. D = S + 2d (D ≥ 5d, H = d)
【００２９】なお、本実施例ではループ部５のスピン巻
き線は１回巻き構成としたが、巻回数は１回に限定され
るものではなく、変形例として複数回の巻回構成とする
ことも可能である。この複数巻き構成では、スロット３
の幅Ｗは巻き線の巻回数に応じて決定され、ループ部５
のスロット３への装着がより確実かつ安定しておこなえ
るとともに、リードループ部の不具合な傾斜または曲げ
を防止するとともに、ループ部のスロット内への挿入ミ
スを防止して作業性を向上させる。In the present embodiment, the spin winding of the loop portion 5 has a single winding configuration, but the number of windings is not limited to one. Is also possible. In this multiple winding configuration, slot 3
Is determined according to the number of turns of the winding, and the loop portion 5
Can be more reliably and stably mounted in the slot 3, and can prevent the lead loop portion from being inclined or bent unnecessarily, and can prevent erroneous insertion of the loop portion into the slot, thereby improving workability.
【００３０】なお、本実施例では、基板上に配置された
リード部材４のブリッジ部４Ｃは直線状としたが、該ブ
リッジ部は曲げ部を有する構成とすることも可能であ
る。In the present embodiment, the bridge portion 4C of the lead member 4 disposed on the substrate is linear, but the bridge portion may have a bent portion.
【００３１】さらに別の変形例として、図３に示すよう
に、リング状ループ部５をスロット３にさらに確実かつ
安定して係合保持するために、スロット３の内壁３ａを
基盤面に関して非垂直とする、即ち、スロットの断面形
状が台形となるように僅かにテーパ状に形成して、スロ
ットの長さＬがその深さ位置によって変化させることも
できる。即ち、スロットの長さＬはその上端位置（基板
表面１ａ）で最小（Ｌmin)となり、スロットの深さ位置
が下方に向かうにつれて長さＬは増加し、その下端位置
（基板下面１ｂ）で最大（Ｌmax）となる。ここで、上
端位置での最小長さ（Ｌmin)は、リードループ部５の外
径Ｄよりも所定値だけ僅かに小さく形成され、スロット
内に装着されたループ部を確実に係止保持している。As a further modification, as shown in FIG. 3, in order to more securely and stably hold the ring-shaped loop portion 5 in the slot 3, the inner wall 3a of the slot 3 is not perpendicular to the base surface. That is, the slot can be formed in a slightly tapered shape so that the cross-sectional shape of the slot becomes trapezoidal, and the length L of the slot can be changed depending on its depth position. That is, the length L of the slot is minimum (Lmin) at the upper end position (substrate surface 1a), increases as the depth position of the slot goes downward, and becomes maximum at the lower end position (substrate lower surface 1b). (Lmax). Here, the minimum length (Lmin) at the upper end position is formed to be slightly smaller than the outer diameter D of the lead loop portion 5 by a predetermined value, and the loop portion mounted in the slot is securely locked and held. I have.
【００３２】上記構成において、スロットの下端位置で
の最大長さＬmaxをループ部５の外径Ｄと実質等しくす
ることにより、スロットに挿入保持されたループ部が、
半田７Ａを設けることなしに、基板裏面の回路パターン
層２と機械的に密着固定することができる。In the above configuration, by making the maximum length Lmax at the lower end position of the slot substantially equal to the outer diameter D of the loop portion 5, the loop portion inserted and held in the slot can be
Without providing the solder 7A, it can be mechanically tightly fixed to the circuit pattern layer 2 on the back surface of the substrate.
【００３３】このように、第１の実施例では、基盤にリ
ード接続部材が装着された端子接続装置の組立て完成部
品は、その厚さが従来と比較して格段に薄くでき、リー
ド線ループ部のスロット内への係止保持がより確実かつ
安定して行われ、薄型の電子機器にも最適な構成とな
る。As described above, in the first embodiment, the assembled parts of the terminal connection device in which the lead connection member is mounted on the base can be made much thinner as compared with the conventional one, and the lead loop portion can be formed. Is more reliably and stably performed in the slot, and the configuration is optimal for a thin electronic device.
【００３４】また、本実施例では、電源端子部４Ａに外
力が加わることによりループ部の半田接合部７Ａでクラ
ックが発生したとしても、端子装着部４Ｂの半田接合部
７Ｂには外力の影響は及ぼさず、低価格で良好な導通状
態を維持できる。さらに、接続リード部材が基板に２箇
所で固定されているため、接続部材とプリント基板の相
互を半田付け接合していない場合でも、接続部材の自立
と係止が確実に維持でき、作業性を向上させることがで
きる。In this embodiment, even if a crack occurs in the solder joint 7A of the loop due to an external force applied to the power supply terminal 4A, the external force does not affect the solder joint 7B of the terminal mounting part 4B. A good conduction state can be maintained at a low price without any effect. Furthermore, since the connection lead member is fixed to the board at two locations, even when the connection member and the printed board are not soldered and joined to each other, the connection member can be reliably maintained independently and locked, and workability can be improved. Can be improved.
【００３５】（実施の形態２）図４は本発明の第２の実
施の形態における電源回路用端子接続装置の組立て前の
要部外観を示すものである。同図に示すように、第１の
実施例と異なる本実施例の特徴は、接続リード部材４が
第１と第２の直線状ブリッジ部４Ｃと４Ｃ'を有し、そ
れぞれ第１と第２のリング状ループ部５と５'を形成し
ていることである。(Embodiment 2) FIG. 4 shows an external appearance of a main part of a power supply circuit terminal connecting device according to a second embodiment of the present invention before assembly. As shown in the figure, a feature of the present embodiment different from the first embodiment is that the connection lead member 4 has first and second linear bridge portions 4C and 4C ', and the first and second linear bridge portions 4C' and 4C ', respectively. Are formed in the ring-shaped loop portions 5 and 5 ′.
【００３６】図４において、接続リード部材４は、その
中間部４Ｅにおいて、例えば、略直角に等しい所定角度
で屈曲され、第１と第２の直線状ブリッジ部４Ｃと４
Ｃ'が互いに略直角方向に延在している。したがって、
第１及び第２のリング状ループ部５と５'はその軸心が
互いに略直交する構成である。そして、第１及び第２の
リング状ループ部５と５'は、それぞれ、第１および第
２のブリッジ部４Ｃと４Ｃ'に関して略直角方向に突出
形成し、基板１内の対応する所定個所に形成された第１
及び第２のスロット３及び３'にそれぞれ挿入され固定
保持される。In FIG. 4, the connecting lead member 4 is bent at an intermediate portion 4E thereof, for example, at a predetermined angle substantially equal to a right angle to form first and second linear bridge portions 4C and 4C.
C 'extend in a direction substantially perpendicular to each other. Therefore,
The first and second ring-shaped loop portions 5 and 5 'are configured so that their axes are substantially orthogonal to each other. The first and second ring-shaped loop portions 5 and 5 ′ are formed so as to protrude substantially perpendicularly to the first and second bridge portions 4C and 4C ′, respectively, and are formed at corresponding predetermined locations in the substrate 1. First formed
And inserted and fixedly held in the second slots 3 and 3 ', respectively.
【００３７】第１及び第２のスロット３及び３'に挿入
保持された第１及び第２のリング状ループ部５と５'の
中いずれか一方は回路基板に半田接合される。また、直
線状装着端子部４Ｂは第２ブリッジ部４Ｃ'に対して略
直角方向に延在し、基板１内の対応する所定個所に形成
された穴６に挿入され、回路基板に半田接合されること
は第１の実施例と同様である。One of the first and second ring-shaped loop portions 5 and 5 'inserted and held in the first and second slots 3 and 3' is soldered to a circuit board. The linear mounting terminal portion 4B extends in a direction substantially perpendicular to the second bridge portion 4C ', is inserted into a hole 6 formed at a corresponding predetermined position in the board 1, and is soldered to the circuit board. This is the same as in the first embodiment.
【００３８】図５は、図４の矢印Ａ方向から見た電源回
路用端子接続装置の組立状態における要部断面形状を示
し、図６は、図４の矢印Ｂ方向から見た電源回路用接続
装置の組立状態における要部断面形状を示す。両図に示
すように、本実施例の構成については、図２に示す第１
の実施例の構成と実質同等であるので、簡潔のために重
複する個所についてはその詳細な説明は省略する。い
ま、コイル状電源端子部４Ａ側に近い方の第１のスロッ
ト３に挿入保持された第１のリング状ループ部５は回路
基板に半田接合しないで、第２のスロット３'に挿入保
持された第２のリング状ループ部５'のみが回路基板に
半田７Ａで接合された場合について説明する。FIG. 5 shows a sectional view of a main part in an assembled state of the power supply circuit terminal connection device as seen from the direction of arrow A in FIG. 4, and FIG. 6 shows the connection for power supply circuit as seen from the direction of arrow B in FIG. 2 shows a cross-sectional shape of a main part in an assembled state of the device. As shown in both figures, the configuration of this embodiment is the same as that of the first embodiment shown in FIG.
Since the configuration is substantially the same as that of the embodiment described above, detailed description of overlapping portions will be omitted for the sake of brevity. Now, the first ring-shaped loop portion 5 inserted and held in the first slot 3 closer to the coil-shaped power supply terminal portion 4A side is inserted and held in the second slot 3 'without soldering to the circuit board. The case where only the second ring-shaped loop portion 5 'is joined to the circuit board with the solder 7A will be described.
【００３９】バッテリなどの電源装着によりコイル状電
源端子部４Ａに外力が付加された場合、この外力は半田
付されていない第１のリング状ループ部５に作用すると
ともに、第１のスロット３により吸収される。その結
果、上記外力は第２のリング状ループ部５'の半田７Ａ
には作用を及ぼさず、良好な導通状態が維持される。When an external force is applied to the coil-shaped power supply terminal portion 4A by mounting a power source such as a battery, the external force acts on the first ring-shaped loop portion 5 which is not soldered, and the first slot 3 Absorbed. As a result, the external force is applied to the solder 7A of the second ring-shaped loop portion 5 '.
Has no effect, and a good conduction state is maintained.
【００４０】本実施例においても、第１の実施例と同様
に、リング状ループ部の外径Ｄはプリント基板への挿入
時に自立と半田付けができる最小寸法であり、プリント
基板からの突出高さ寸法Ｈを最小にすることにより、電
源回路用接続装置及びプリント基板完成品としての厚み
を薄く小型にすることができるという効果がある。Also in this embodiment, as in the first embodiment, the outer diameter D of the ring-shaped loop portion is the minimum size that allows self-supporting and soldering at the time of insertion into the printed circuit board, and the protrusion height from the printed circuit board. By minimizing the dimension H, there is an effect that the thickness of the power supply circuit connection device and the finished printed circuit board can be made thin and small.
【００４１】本実施例では、リード接続部材は２個のリ
ング状ループ部を有する構成としたが、第１及び第２の
直線状ブリッジ部のいずれか一方にのみ１個のループ部
を設ける構成とすることもできる。In this embodiment, the lead connection member has a configuration having two ring-shaped loop portions. However, a configuration in which one loop portion is provided only in one of the first and second linear bridge portions. It can also be.
【００４２】図７は本発明の一実施の形態における電源
回路用接続装置を使ったリモコン発信器の部品を分解し
て裏面側から見た斜視図である。FIG. 7 is an exploded perspective view of a part of a remote control transmitter using a power supply circuit connection device according to an embodiment of the present invention, as viewed from the back side.
【００４３】図７において、４Ａ及び４Ａ'は電源接続
部で、それぞれ接続リード部材４及び４'に設けられた
＋（プラス）側を及び−（マイナス）側端子を示してい
る。７８は電源接続部４Ａと４Ａ'と、接続リード部材
４及び４'と、プリント基板１と電気部品７７等々の本
発明の電源回路用接続装置を備えたプリント基板完成品
を示し、７０は電源接続部４Ａと４Ａ'を収納する収納
室７１と７１'と、さらに乾電池等を収納する凹部７２
を具備した筐体（下）で、７３は電源部用蓋で、筐体
（下）７０に取り付けられる。７４はゴム等で形成され
た操作ボタンで、凸部を有し、７５の筐体（上）の操作
ボタン用穴７６に挿通される。In FIG. 7, reference numerals 4A and 4A 'denote power supply connection portions, and the + (plus) side and-(minus) side terminals provided on the connection lead members 4 and 4', respectively. Reference numeral 78 denotes a printed circuit board finished product provided with the power supply circuit connecting device of the present invention such as the power supply connection parts 4A and 4A ', the connection lead members 4 and 4', the printed circuit board 1 and the electric component 77, and 70 denotes a power supply. Storage chambers 71 and 71 'for storing the connection portions 4A and 4A', and a recess 72 for storing a dry battery and the like.
Is a power supply unit lid, which is attached to the housing (lower) 70. An operation button 74 is formed of rubber or the like, has a convex portion, and is inserted into an operation button hole 76 of the housing 75 (upper).
【００４４】従って、本発明の電源回路用端子接続装置
を使用したプリント基板完成品７８によれば、操作ボタ
ン７４側に接続部材４と４'が突出する高さが小さくで
き、操作ボタン７４も筐体７５も薄くすることができる
効果がある。Therefore, according to the printed circuit board finished product 78 using the power supply circuit terminal connection device of the present invention, the height of the connection members 4 and 4 ′ protruding toward the operation button 74 can be reduced, and the operation button 74 is also There is an effect that the housing 75 can be made thin.
【００４５】なお、本実施の形態では鈎形に折り曲げた
直線状端子部４Ｂと、リング状ループ部５は電源接続端
子部４Ａを設けた側とは反対側（裏面側）のプリント基
板に半田付け接続を２ヵ所設ける構成としたが、プリン
ト基板の半田付け面の構成により電源接続部４Ａ側の基
板表面より半田付け接合しても良い。また、電源接続部
に小さい外力しか加わらない場合半田付けは１ヵ所でも
良いことは前述した通りである。In this embodiment, the linear terminal portion 4B bent in a hook shape and the ring-shaped loop portion 5 are soldered to the printed circuit board on the side opposite to the side on which the power supply connection terminal section 4A is provided (back side). Although the attachment connection is provided at two places, it may be soldered and joined from the substrate surface on the power supply connection portion 4A side according to the configuration of the soldering surface of the printed board. As described above, when only a small external force is applied to the power supply connection portion, soldering may be performed at one location.
【００４６】[0046]
【発明の効果】以上のように、本発明の電源回路用端子
接続装置に乾電池等を接続する場合、外力が加わっても
外力は半田付け部には作用せず良好な導通状態を維持で
き、接続部材とプリント基板の相互を半田付け接続して
いない場合でも、接続部材の自立と係止を維持でき、か
つ、接続部材を薄型形状にすることにより電源回路用端
子接続装置の厚みを薄く小型にすることができる効果が
ある。As described above, when a dry battery or the like is connected to the terminal connection device for a power supply circuit of the present invention, even if an external force is applied, the external force does not act on the soldered portion and a good conduction state can be maintained. Even when the connection member and the printed circuit board are not connected by soldering, the connection member can maintain self-supporting and locked, and the thickness of the terminal connection device for the power supply circuit can be reduced by making the connection member thinner and smaller. There is an effect that can be.
【図１】 本発明の第１の実施形態における電源回路用
端子接続装置の組立て前の外観図。FIG. 1 is an external view of a power supply circuit terminal connection device according to a first embodiment of the present invention before assembly.
【図２】 図１の電源回路用端子接続装置の組立て状態
における側面断面図。FIG. 2 is a side sectional view of the terminal connection device for a power supply circuit in FIG. 1 in an assembled state.
【図３】 図２の電源回路用端子接続装置の変形例にお
ける要部断面図。FIG. 3 is a sectional view of a main part of a modified example of the power supply circuit terminal connection device of FIG. 2;
【図４】 本発明の第２の実施形態における電源回路用
端子接続装置の組立て前の外観図。FIG. 4 is an external view of a terminal connection device for a power supply circuit according to a second embodiment of the present invention before assembly.
【図５】 図４の電源回路用端子接続装置の組立て状態
における矢印Ａ方向の側面断面図。FIG. 5 is a side sectional view in the direction of arrow A in an assembled state of the power supply circuit terminal connection device of FIG. 4;
【図６】 図４の電源回路用端子接続装置の組立て状態
における矢印Ｂ方向の側面断面図。6 is a side sectional view in the direction of arrow B in an assembled state of the power supply circuit terminal connection device of FIG. 4;
【図７】 本発明の一実施形態における電源回路用端子
接続装置を使ったリモコン発信器を裏面側から見た分解
斜視図。FIG. 7 is an exploded perspective view of the remote control transmitter using the power supply circuit terminal connection device according to the embodiment of the present invention, as viewed from the back side.
【図８】 接続部材がつる巻き状ブリッジ脚部を有する
従来例の構成を示す断面図。FIG. 8 is a cross-sectional view showing a configuration of a conventional example in which a connecting member has a helical bridge leg.
【図９】 略Ｕ字形状の接続部材を有する従来例の構成
の部分断面図。FIG. 9 is a partial cross-sectional view of a configuration of a conventional example having a substantially U-shaped connecting member.
【図１０】 略Ｕ字形状の接続部材を有する他の従来例
の構成の部分断面図。FIG. 10 is a partial cross-sectional view of another conventional configuration having a substantially U-shaped connecting member.
１ 基板 ２ 回路パターン ３ スロット ４ リード部材 ５ リング状ループ部 ６ 端子部取付穴 ７Ａ、７Ｂ 半田 DESCRIPTION OF SYMBOLS 1 Board 2 Circuit pattern 3 Slot 4 Lead member 5 Ring-shaped loop part 6 Terminal part mounting hole 7A, 7B Solder
Claims (9)
た略一定線径の接続リード部材を有し、 該接続リード部材は、基板の表面に載置されたブリッジ
部と、該ブリッジ部の中間部に形成された所定外径の略
リング状ループ部と、該ブリッジ部から鈎形状に折り曲
げて延在する直線状装着端子部が形成され、 該直線状装着端子部は、基板内の対応する位置に形成さ
れた穴に挿入され、半田付けによって基板の回路パター
ン層に接続固定され、 上記リング状ループ部は、上記ブリッジ部に対して略直
交する方向に突出し、基板内の対応する位置に形成され
たスロット内に挿入され係止保持されることを特徴とす
る電源回路用端子接続装置。1. A connection lead member having a substantially constant wire diameter mounted on a substrate having a circuit pattern layer, wherein the connection lead member is provided between a bridge portion mounted on a surface of the substrate and the bridge portion. A substantially ring-shaped loop portion having a predetermined outer diameter formed in the portion, and a linear mounting terminal portion that is bent from the bridge portion in a hook shape and extends, and the linear mounting terminal portion corresponds to a corresponding one in the substrate. The ring-shaped loop portion is inserted into the hole formed at the position, is connected and fixed to the circuit pattern layer of the substrate by soldering, and projects in a direction substantially orthogonal to the bridge portion, and is located at a corresponding position in the substrate. A terminal connection device for a power supply circuit, wherein the terminal connection device is inserted into a formed slot to be locked and held.
なくとも上記スロットの長さ寸法以上であり、上記基板
の厚みより大きく、スロットへの挿入時に自立と半田付
けができる最小の値である請求項１記載の電源回路用接
続装置。2. The outer diameter of the ring-shaped loop portion is at least equal to or greater than the length of the slot, is larger than the thickness of the substrate, and is a minimum value that allows self-supporting and soldering when inserted into the slot. The connection device for a power supply circuit according to claim 1.
ループ部の基板面からの挿通突出部の高さは、接続リー
ド部材の線径以上である請求項１記載の電源回路用端子
接続装置。3. The terminal connection device for a power supply circuit according to claim 1, wherein the height of the insertion protrusion from the substrate surface of the ring-shaped loop portion inserted and held in the slot is equal to or larger than the wire diameter of the connection lead member.
ループ部の基板面からの挿通突出部が、半田付によって
基板の回路パターン層に接続固定されている請求項３記
載の電源回路用端子接続装置。4. The terminal connection for a power supply circuit according to claim 3, wherein an insertion projecting portion of the ring-shaped loop portion inserted and held in the slot from the board surface is connected and fixed to a circuit pattern layer of the board by soldering. apparatus.
スロットの内壁は、基板表面に関して略垂直である請求
項１記載の電源回路用端子接続装置。5. The terminal connection device for a power supply circuit according to claim 1, wherein an inner wall of the slot into which the ring-shaped loop portion is inserted and locked is substantially perpendicular to a surface of the substrate.
スロットの内壁は、基板表面に関して非垂直であり、断
面形状が台形である請求項１記載の電源回路用端子接続
装置。6. The terminal connection device for a power supply circuit according to claim 1, wherein the inner wall of the slot in which the ring-shaped loop portion is inserted and locked is non-perpendicular to the substrate surface and has a trapezoidal cross section.
径の５倍以上であり、上記スロットに挿入保持されたリ
ング状ループ部の基板面からの挿通突出部の必要最小限
の高さはリード線径ｄと実質等しい値である請求項２記
載の電源回路用端子接続装置。7. An outer diameter of the ring-shaped loop portion is at least five times a lead wire diameter, and a minimum necessary height of a projecting portion of the ring-shaped loop portion inserted and held in the slot from a substrate surface. 3. The terminal connection device for a power supply circuit according to claim 2, wherein is a value substantially equal to the lead wire diameter d.
て所定角度で折り曲げられ第１と第２のブリッジ部を形
成し、該第１と第２のブリッジ部がそれぞれ第１と第２
のリング状ループ部を有し、該第１及び第２のリング状
ループ部は基板内の対応する所定個所に形成された第１
及び第２のスロットにそれぞれ挿入保持された請求項１
記載の電源回路用端子接続装置。8. The connecting lead member is bent at a predetermined angle at an intermediate portion thereof to form first and second bridge portions, and the first and second bridge portions are respectively formed by the first and second bridge portions.
And the first and second ring-shaped loop portions are formed at corresponding predetermined locations in the substrate.
And a first slot inserted and held in the second slot.
A terminal connection device for a power supply circuit as described in the above.
された第１及び第２のリング状ループ部のうち少なくと
も一方は回路基板に半田接合された請求項８記載の電源
回路用端子接続装置。9. The terminal connection for a power supply circuit according to claim 8, wherein at least one of the first and second ring-shaped loop portions inserted and held in the first and second slots is soldered to a circuit board. apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34408498A JP4514243B2 (en) | 1997-12-05 | 1998-12-03 | Terminal connection device for power circuit |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9-335345 | 1997-12-05 | ||
| JP33534597 | 1997-12-05 | ||
| JP34408498A JP4514243B2 (en) | 1997-12-05 | 1998-12-03 | Terminal connection device for power circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11242950A true JPH11242950A (en) | 1999-09-07 |
| JP4514243B2 JP4514243B2 (en) | 2010-07-28 |
Family
ID=26575144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34408498A Expired - Fee Related JP4514243B2 (en) | 1997-12-05 | 1998-12-03 | Terminal connection device for power circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4514243B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030018087A (en) * | 2001-08-27 | 2003-03-06 | 삼성전기주식회사 | Structure of the battery source connection |
| KR100414579B1 (en) * | 2001-08-31 | 2004-01-13 | 황범식 | Battery port structure of a electronic device |
| CN110461091A (en) * | 2019-09-02 | 2019-11-15 | 珠海格力电器股份有限公司 | Conductive spring mounting assembly, PCB assembly and remote controller |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127471A (en) * | 1989-10-12 | 1991-05-30 | Matsushita Electric Ind Co Ltd | Remote control system |
| JPH0433272U (en) * | 1990-07-13 | 1992-03-18 |
-
1998
- 1998-12-03 JP JP34408498A patent/JP4514243B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03127471A (en) * | 1989-10-12 | 1991-05-30 | Matsushita Electric Ind Co Ltd | Remote control system |
| JPH0433272U (en) * | 1990-07-13 | 1992-03-18 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030018087A (en) * | 2001-08-27 | 2003-03-06 | 삼성전기주식회사 | Structure of the battery source connection |
| KR100414579B1 (en) * | 2001-08-31 | 2004-01-13 | 황범식 | Battery port structure of a electronic device |
| CN110461091A (en) * | 2019-09-02 | 2019-11-15 | 珠海格力电器股份有限公司 | Conductive spring mounting assembly, PCB assembly and remote controller |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4514243B2 (en) | 2010-07-28 |
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