JPH11238822A - Package for accommodating optical semiconductor element - Google Patents
Package for accommodating optical semiconductor elementInfo
- Publication number
- JPH11238822A JPH11238822A JP10040814A JP4081498A JPH11238822A JP H11238822 A JPH11238822 A JP H11238822A JP 10040814 A JP10040814 A JP 10040814A JP 4081498 A JP4081498 A JP 4081498A JP H11238822 A JPH11238822 A JP H11238822A
- Authority
- JP
- Japan
- Prior art keywords
- optical semiconductor
- semiconductor element
- metal
- optical fiber
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
- Light Receiving Elements (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は光半導体素子を収容
するための光半導体素子収納用パッケージに関し、詳し
くは外部部材へのネジ止めによる光半導体素子と光ファ
イバとの位置整合のずれを防止した光半導体素子収納用
パッケージに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device housing package for housing an optical semiconductor device, and more particularly, to prevent the optical semiconductor device and the optical fiber from being misaligned by screwing to an external member. The present invention relates to an optical semiconductor element storage package.
【0002】[0002]
【従来の技術】従来、光半導体素子を収容するための光
半導体素子収納用パッケージは、図3に断面図でおよび
図4に平面図で示すように、銅−タングステン合金から
成り、その上面中央部に光半導体素子31が基板32を介し
て載置される光半導体素子載置部21aを、その両端領域
である四隅にパッケージを外部部材に固定するためのネ
ジ止め孔21bが形成されたネジ止め部21cを有する四角
平板状の金属基体21と、鉄−ニッケル−コバルト合金か
ら成り、光半導体素子載置部21aを囲繞するとともにネ
ジ止め部21cを外側に突出させるようにして金属基体21
上に銀ロウ等のロウ材を介して取着され、側壁に貫通孔
22aおよび下端側に金属基体21との間で開口を形成する
切欠き22bを有する四角形状の金属枠体22と、鉄−ニッ
ケル−コバルト合金から成り、金属枠体22側壁の貫通孔
22a内に取着された光ファイバ固定部材23と、外部リー
ド端子24がロウ付けされたメタライズ配線層25aを有す
るアルミナ質焼結体から成り、金属枠体22の切欠き22b
と金属基体21との間で形成された開口内に取着された絶
縁端子部材25と、金属枠体22の上部に取着され、光半導
体素子31を気密に封止する金属蓋体26とから構成されて
いる。2. Description of the Related Art Conventionally, an optical semiconductor device housing package for housing an optical semiconductor device is made of a copper-tungsten alloy as shown in a sectional view of FIG. 3 and a plan view of FIG. The optical semiconductor device mounting portion 21a on which the optical semiconductor device 31 is mounted via the substrate 32, and the screw formed with screw holes 21b at the four corners, which are both end regions, for fixing the package to an external member. A metal substrate 21 having a rectangular flat plate shape having a stopper 21c and an iron-nickel-cobalt alloy, surrounding the optical semiconductor element mounting portion 21a and projecting the screwing portion 21c outward.
It is attached through a brazing material such as silver brazing, and a through hole is formed in the side wall.
22a and a square metal frame 22 having a notch 22b formed at the lower end with the metal substrate 21; and a through-hole formed of an iron-nickel-cobalt alloy and having a side wall of the metal frame 22.
An optical fiber fixing member 23 attached inside 22a and an alumina-based sintered body having a metallized wiring layer 25a to which external lead terminals 24 are brazed, and a notch 22b of a metal frame 22
An insulating terminal member 25 attached to an opening formed between the metal base 21 and a metal lid 26 attached to an upper portion of the metal frame 22 to hermetically seal the optical semiconductor element 31; It is composed of
【0003】この光半導体素子収納用パッケージは、金
属基体21の光半導体素子載置部21aに光半導体素子31を
接着固定するとともに光半導体素子31の各電極をボンデ
ィングワイヤ33を介して外部リード端子24が取着されて
いるメタライズ配線層25aに接続し、次に金属枠体22の
上部に金属蓋体26を取着させ、金属基体21と金属枠体22
と金属蓋体26とから成る容器内部に光半導体素子31を収
容し、最後に金属枠体22に取着された光ファイバ固定部
材23に光ファイバ34をレーザ光線の照射による溶接等に
よって接合させ、光ファイバ34を光ファイバ固定部材23
を介して金属枠体22に固定することによって製品として
の光半導体装置となる。In this package for housing an optical semiconductor element, an optical semiconductor element 31 is bonded and fixed to an optical semiconductor element mounting portion 21a of a metal base 21 and each electrode of the optical semiconductor element 31 is connected to an external lead terminal via a bonding wire 33. 24 is attached to the metallized wiring layer 25a, and then a metal lid 26 is attached to the upper part of the metal frame 22.
The optical semiconductor element 31 is housed inside a container consisting of a metal lid 26 and an optical fiber 34 is bonded to the optical fiber fixing member 23 attached to the metal frame 22 by welding or the like by irradiating a laser beam. The optical fiber 34 to the optical fiber fixing member 23
An optical semiconductor device as a product is obtained by fixing to the metal frame 22 via the.
【0004】かかる光半導体装置は、外部電気回路から
供給される電気信号によって光半導体素子31に光を励起
させ、この光を光ファイバ34を介して外部に伝達するこ
とによって高速光通信等に使用される光半導体装置とし
て機能する。Such an optical semiconductor device is used for high-speed optical communication or the like by exciting light to an optical semiconductor element 31 by an electric signal supplied from an external electric circuit and transmitting the light to the outside via an optical fiber 34. Function as an optical semiconductor device.
【0005】またこの光半導体装置は、金属基体21の両
端領域のネジ止め部21cを外部部材にネジ止めすること
によって外部部材に固定されることとなる。The optical semiconductor device is fixed to the external member by screwing the screw portions 21c at both end regions of the metal base 21 to the external member.
【0006】[0006]
【発明が解決しようとする課題】しかしながら、この従
来の光半導体素子収納用パッケージは、金属基体21を構
成する銅−タングステン合金の熱膨張係数が7.0 ×10-6
/℃(室温〜800 ℃)であり、金属枠体22を構成する鉄
−ニッケル−コバルト合金の熱膨張係数(10×10-6/
℃:室温〜800 ℃)と相違することから、金属基体21上
に金属枠体22を銀ロウ等のロウ材を介してロウ付けする
と、両者の熱膨張係数の相違に起因する熱応力によって
金属基体21に10〜20μm程度の反りが発生していた。However, in this conventional package for housing an optical semiconductor device, the copper-tungsten alloy constituting the metal base 21 has a coefficient of thermal expansion of 7.0 × 10 -6.
/ ° C (room temperature to 800 ° C), and the coefficient of thermal expansion of the iron-nickel-cobalt alloy constituting the metal frame 22 (10 × 10 −6 /
(° C .: room temperature to 800 ° C.), when the metal frame 22 is brazed onto the metal base 21 via a brazing material such as silver brazing, the metal stress is caused by a thermal stress caused by a difference in thermal expansion coefficient between the two. The substrate 21 was warped by about 10 to 20 μm.
【0007】そのため、この光半導体素子収納用パッケ
ージに光半導体素子31を収容し、光ファイバ固定部材23
に光ファイバ34を固定して光半導体装置となした後、金
属基体21の両端領域に形成したネジ止め部21cを外部部
材に強固にネジ止めして光半導体装置を外部部材に固定
した場合に、金属基体21を外部部材にネジ止めする際の
締め付けの応力により金属基体21の反りが矯正され、そ
の結果、金属基体21の中央部の高さが変るとともにここ
に載置された光半導体素子31の固定高さが変り、光半導
体素子31と光ファイバ34との位置整合がくずれてしまう
ため、光半導体素子31が励起した光を光ファイバ34を介
して外部に良好に伝達することができなくなってしまう
という問題点を有していた。For this reason, the optical semiconductor element 31 is accommodated in the optical semiconductor element accommodation package, and the optical fiber fixing member 23 is accommodated.
When the optical fiber 34 is fixed to the optical semiconductor device to form an optical semiconductor device, the screw portions 21c formed at both end regions of the metal base 21 are firmly screwed to the external member to fix the optical semiconductor device to the external member. The warpage of the metal base 21 is corrected by the tightening stress when the metal base 21 is screwed to the external member, and as a result, the height of the central portion of the metal base 21 changes and the optical semiconductor element placed here is mounted. The fixed height of 31 changes, and the positional alignment between the optical semiconductor element 31 and the optical fiber 34 is lost, so that the light excited by the optical semiconductor element 31 can be transmitted well to the outside via the optical fiber 34. There was a problem that it disappeared.
【0008】本発明は、かかる従来の問題点に鑑み案出
されたものであり、内部に光半導体素子を収容するとと
もに金属枠体に光ファイバを固定して光半導体装置とな
した後、ネジ止め部を外部部材に強固にネジ止めして光
半導体装置を外部部材に固定した場合においても、内部
に収容する光半導体素子の固定高さが変ることなく、光
半導体素子と光ファイバとの位置整合が良好に保たれ、
光半導体素子が励起した光を光ファイバを介して外部に
良好に伝達させることが可能な光半導体素子収納用パッ
ケージを提供することを目的とするものである。The present invention has been devised in view of the above-mentioned conventional problems, and includes an optical semiconductor element housed therein and an optical fiber fixed to a metal frame to form an optical semiconductor device. Even when the optical semiconductor device is fixed to the external member by firmly screwing the stopper to the external member, the position of the optical semiconductor element and the optical fiber remains unchanged without changing the fixing height of the optical semiconductor element housed therein. Good alignment,
It is an object of the present invention to provide an optical semiconductor element housing package capable of transmitting light excited by an optical semiconductor element to the outside via an optical fiber.
【0009】[0009]
【課題を解決するための手段】本発明の光半導体素子収
納用パッケージは、矩形状の金属板から成り、上面中央
部に光半導体素子が載置される光半導体素子載置部を、
四隅にネジ止め孔を有する金属基体と、この金属基体上
に前記光半導体素子載置部を囲繞するとともに前記ネジ
止め孔を外側に位置させるように取着された金属枠体
と、この金属枠体の側壁に取着された光ファイバ固定部
材と、前記金属枠体の上面に取着され、前記光半導体素
子を気密に封止する金属蓋体とから成る光半導体素子収
納用パッケージであって、前記ネジ止め孔間の前記金属
基体を切り欠いてあることを特徴とするものである。An optical semiconductor element housing package according to the present invention is made of a rectangular metal plate, and has an optical semiconductor element mounting portion on which an optical semiconductor element is mounted at the center of the upper surface.
A metal base having screw holes at four corners, a metal frame surrounding the optical semiconductor element mounting portion on the metal base and attached so as to position the screw holes outside, and a metal frame An optical semiconductor element housing package comprising: an optical fiber fixing member attached to a side wall of a body; and a metal lid attached to an upper surface of the metal frame and hermetically sealing the optical semiconductor element. The metal base between the screw holes is cut out.
【0010】本発明の光半導体素子収納用パッケージに
よれば、金属基体の四隅に設けられたネジ止め孔間の金
属基体を金属枠体の外側において切り欠いてあることか
ら、パッケージ内部に光半導体素子を収容するとともに
光ファイバ固定部材に光ファイバを固定して光半導体装
置となした後、金属基体の両端領域である四隅に設けら
れたネジ止め孔により金属基体を外部部材にネジ止めし
て光半導体装置を外部部材に固定しても、ネジ止めに伴
う締め付けの応力は主に金属基体の幅方向または長さ方
向の両端部に分散して印加されることとなり、金属基体
の上面中央部の光半導体素子載置部にまで伝達されるこ
とは殆どない。その結果、ネジ止め孔により金属基体を
外部部材に強固にネジ止めして光半導体装置を外部部材
に固定した場合においても、内部に収容する光半導体素
子の固定高さが変ることがなく、光半導体素子と光ファ
イバとの位置整合が良好に保たれ、光半導体素子が励起
した光を光ファイバを介して外部に良好に伝達させるこ
とが可能となる。According to the package for housing an optical semiconductor element of the present invention, since the metal base between the screw holes provided at the four corners of the metal base is cut off outside the metal frame, the optical semiconductor element is provided inside the package. After housing the element and fixing the optical fiber to the optical fiber fixing member to form an optical semiconductor device, the metal base is screwed to the external member by screw holes provided at the four corners which are both end regions of the metal base. Even when the optical semiconductor device is fixed to an external member, the tightening stress due to the screwing is mainly applied to both ends in the width direction or the length direction of the metal base, and is applied to the center of the upper surface of the metal base. Is hardly transmitted to the optical semiconductor element mounting portion. As a result, even when the optical semiconductor device is fixed to the external member by firmly screwing the metal base to the external member with the screw holes, the fixing height of the optical semiconductor element housed therein does not change, and Good alignment between the semiconductor element and the optical fiber is maintained, and the light excited by the optical semiconductor element can be transmitted to the outside via the optical fiber.
【0011】[0011]
【発明の実施の形態】次に、本発明の光半導体素子収納
用パッケージを添付の図面に基づき詳細に説明する。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a package for housing an optical semiconductor device according to the present invention.
【0012】図1は本発明の光半導体素子収納用パッケ
ージの実施の形態の一例を示す断面図であり、1は金属
基体、2は金属枠体、3は光ファイバ固定部材、4は金
属蓋体である。FIG. 1 is a sectional view showing an embodiment of an optical semiconductor element housing package according to the present invention, wherein 1 is a metal substrate, 2 is a metal frame, 3 is an optical fiber fixing member, and 4 is a metal cover. Body.
【0013】また、図2は図1における光半導体素子収
納用パッケージの金属蓋体4を除いた上面図である。FIG. 2 is a top view of the package for storing an optical semiconductor element in FIG. 1 excluding the metal cover 4.
【0014】金属基体1は、矩形状の金属板から成り、
上面の中央部に光半導体素子を載置するための光半導体
素子載置部1aを有し、光半導体素子載置部1a上には
光半導体素子11および図示しない電子部品が窒化アルミ
ニウム質焼結体等の良熱伝導性材料から成る基板12を介
して接着固定される。The metal substrate 1 is made of a rectangular metal plate.
An optical semiconductor device mounting portion 1a for mounting the optical semiconductor device is provided at the center of the upper surface. The optical semiconductor device 11 and electronic components (not shown) are sintered on the optical semiconductor device mounting portion 1a. It is bonded and fixed via a substrate 12 made of a good heat conductive material such as a body.
【0015】金属基体1は、銅−タングステン合金等の
熱伝導性に優れる金属から成り、例えば、銅−タングス
テン合金から成る場合、タングステン粉末(粒径約10μ
m)を1000kgf/cm2 の圧力で加圧成形するととも
にこれを還元雰囲気中、約2300℃の温度で焼成して多孔
質のタングステン焼結体を得、次に1100℃の温度で加熱
溶融させた銅をタングステン焼結体の多孔部分に毛管現
象を利用して含浸させることによって製作される。ま
た、金属基体1にはその上面に光半導体素子載置部1a
を囲繞するようにして、上面視で矩形状の金属枠体2が
銀ロウ等のロウ材を介して取着されている。The metal substrate 1 is made of a metal having excellent thermal conductivity such as a copper-tungsten alloy. For example, when the metal base 1 is made of a copper-tungsten alloy, tungsten powder (particle size: about 10 μm) is used.
m) is pressed at a pressure of 1000 kgf / cm 2 and fired at a temperature of about 2300 ° C. in a reducing atmosphere to obtain a porous tungsten sintered body, which is then heated and melted at a temperature of 1100 ° C. It is produced by impregnating the porous portion of the tungsten sintered body with the used copper by utilizing the capillary phenomenon. The metal substrate 1 has an optical semiconductor element mounting portion 1a on its upper surface.
, A metal frame 2 having a rectangular shape in a top view is attached via a brazing material such as silver brazing.
【0016】金属枠体2は、内部に光半導体素子11を収
容する空間を形成するための側壁部材として機能すると
ともに後述する絶縁端子部材5および光ファイバ固定部
材3を支持する作用をなす。The metal frame 2 functions as a side wall member for forming a space for accommodating the optical semiconductor element 11 therein, and has a function of supporting an insulating terminal member 5 and an optical fiber fixing member 3 described later.
【0017】金属枠体2は、例えばその相対向する長辺
側壁の下面側に金属基体1との間で開口を形成する一対
の切欠き2aを有しており、この切欠き2aと金属基体
1との間に形成される開口内にはそれぞれ絶縁端子部材
5が嵌入され、銀ロウ等のロウ材を介して取着されてい
る。The metal frame 2 has, for example, a pair of notches 2a for forming an opening between the metal frame 1 and the lower surface of the long side walls opposed to each other. Insulating terminal members 5 are fitted into openings formed between them, respectively, and are attached via brazing materials such as silver brazing.
【0018】金属枠体2に取着された絶縁端子部材5
は、酸化アルミニウム質焼結体等の電気絶縁材料から成
り、金属枠体2の内側から外側にかけて導出する複数の
メタライズ配線層5aが設けられている。Insulated terminal member 5 attached to metal frame 2
Is made of an electrically insulating material such as an aluminum oxide sintered body, and is provided with a plurality of metallized wiring layers 5a extending from the inside to the outside of the metal frame 2.
【0019】絶縁端子部材5は、内部に収容する光半導
体素子11や図示しない電子部品を外部電気回路に接続す
る作用をなし、例えば酸化アルミニウム質焼結体から成
る場合、酸化アルミニウムや酸化珪素・酸化カルシウム
・酸化マグネシウム等の原料粉末に適当な有機バインダ
および溶剤等を添加混合して泥漿状となすとともにこれ
を従来周知のドクターブレード法を採用してシート状と
なすことによって複数枚のセラミックグリーンシートを
得、しかる後、セラミックグリーンシートに必要な打ち
抜き加工を施すとともにこれらを上下に積層し、高温で
焼成することによって製作される。The insulating terminal member 5 has a function of connecting the optical semiconductor element 11 housed therein and an electronic component (not shown) to an external electric circuit. For example, when the insulating terminal member 5 is made of an aluminum oxide sintered body, aluminum oxide or silicon oxide. An appropriate organic binder and a solvent are added to the raw material powders such as calcium oxide and magnesium oxide to form a slurry by mixing, and the sheet is formed into a sheet by using a conventionally known doctor blade method. A sheet is obtained, and after that, a necessary punching process is performed on the ceramic green sheet, and these are laminated one above the other and fired at a high temperature.
【0020】絶縁端子部材5に設けられているメタライ
ズ配線層5aは、その一端に光半導体素子11の電極や図
示しない電子部品の電極がボンディングワイヤ13を介し
て接続され(ここでは簡便のため光半導体素子11に接続
されたボンディングワイヤ13のみを示す)、また他端側
には外部リード端子6が銀ロウ等のロウ材を介して取着
されている。この外部リード端子6を外部電気回路に接
続することによって、パッケージの内部に収容される光
半導体素子11や図示しない電子部品が外部電気回路に接
続されることとなる。The metallized wiring layer 5a provided on the insulated terminal member 5 is connected at one end thereof to the electrode of the optical semiconductor element 11 or the electrode of an electronic component (not shown) via a bonding wire 13 (here, for the sake of simplicity, it is necessary to use a light Only the bonding wires 13 connected to the semiconductor element 11 are shown), and an external lead terminal 6 is attached to the other end via a brazing material such as silver brazing. By connecting the external lead terminals 6 to an external electric circuit, the optical semiconductor element 11 and electronic components (not shown) housed in the package are connected to the external electric circuit.
【0021】なお、メタライズ配線導体5aは、タング
ステン・モリブデン・マンガン等の高融点金属粉末から
成り、例えばタングステン粉末やモリブデン粉末等の金
属粉末に適当な有機バインダおよび溶剤を添加混合して
得た金属ペーストを絶縁端子部材5となるセラミックグ
リーンシートに従来周知のスクリーン印刷法を採用して
予め所定のパターンに印刷塗布しておくことによって、
絶縁端子部材5の所定位置に被着形成される。The metallized wiring conductor 5a is made of a high melting point metal powder such as tungsten, molybdenum, and manganese. For example, a metal powder obtained by adding a suitable organic binder and a solvent to a metal powder such as a tungsten powder or a molybdenum powder is mixed. The paste is applied to a ceramic green sheet serving as the insulating terminal member 5 in a predetermined pattern by using a conventionally known screen printing method.
The insulating terminal member 5 is formed at a predetermined position.
【0022】また、絶縁端子部材5のメタライズ配線層
5aに取着された外部リード端子6は、鉄−ニッケル−
コバルト合金や鉄−ニッケル合金等の金属から成り、光
半導体素子11や図示しない電子部品を外部電気回路に電
気的に接続する作用をなし、例えば、鉄−ニッケル−コ
バルト合金から成る板材に打ち抜き加工やエッチング加
工を施すことによって所定の形状に形成される。The external lead terminal 6 attached to the metallized wiring layer 5a of the insulated terminal member 5 is made of iron-nickel-
It is made of a metal such as a cobalt alloy or an iron-nickel alloy, and serves to electrically connect the optical semiconductor element 11 and an electronic component (not shown) to an external electric circuit. For example, a punching process is performed on a plate made of an iron-nickel-cobalt alloy. It is formed in a predetermined shape by performing etching or etching.
【0023】さらに、金属枠体2の一方の短辺側壁の中
央部には貫通孔2bが設けられており、この貫通孔2b
内には光ファイバ14を固定するための光ファイバ固定部
材3が金属枠体2の内外を貫通するようにして取着され
ている。Further, a through hole 2b is provided at the center of one short side wall of the metal frame 2, and the through hole 2b
Inside, an optical fiber fixing member 3 for fixing the optical fiber 14 is attached so as to pass through the inside and outside of the metal frame 2.
【0024】光ファイバ固定部材3は、光ファイバ14を
パッケージに固定するための固定部材として機能し、光
ファイバ14の一端部に金属から成るフランジ部材14aを
予め取着させておくとともにこのフランジ部材14aを接
着剤や溶接により光ファイバ固定部材3に固定すること
によって、光半導体素子11が励起した光を外部に伝達す
る光ファイバ14が光半導体素子収納用パッケージに接続
固定されることとなる。The optical fiber fixing member 3 functions as a fixing member for fixing the optical fiber 14 to a package. A flange member 14a made of metal is attached to one end of the optical fiber 14 in advance. By fixing 14a to the optical fiber fixing member 3 with an adhesive or welding, the optical fiber 14 for transmitting the light excited by the optical semiconductor element 11 to the outside is connected and fixed to the optical semiconductor element housing package.
【0025】光ファイバ固定部材3は、鉄−ニッケル−
コバルト合金等の金属から成る円筒部材であり、その内
側にサファイアやガラス等の透光性材料から成る窓部材
7が取着されており、この窓部材7を介して光半導体素
子11が励起した光が光ファイバ14に伝達される。The optical fiber fixing member 3 is made of iron-nickel-
A cylindrical member made of a metal such as a cobalt alloy, and a window member 7 made of a light-transmissive material such as sapphire or glass is attached inside the cylindrical member. The optical semiconductor element 11 is excited through the window member 7. Light is transmitted to the optical fiber.
【0026】また、金属枠体2の上面には鉄−ニッケル
−コバルト合金等の金属から成る略平板状の金属蓋体4
が金属枠体2の内部空所を塞ぐようにしてシームウエル
ド法等の溶接によって取着され、これによって金属基体
1の光半導体素子載置部1aに接着固定された光半導体
素子11がパッケージ内部に気密に収容される。On the upper surface of the metal frame 2, a substantially flat metal cover 4 made of a metal such as an iron-nickel-cobalt alloy is provided.
Is attached by welding such as seam welding so as to close the internal space of the metal frame 2, whereby the optical semiconductor element 11 adhered and fixed to the optical semiconductor element mounting portion 1a of the metal base 1 is placed inside the package. It is housed airtight.
【0027】さらに、金属基体1の四隅、本例において
は長さ方向の両端領域には、光半導体装置を外部部材に
固定するためのネジ止め孔1bを有するネジ止め部1c
が、ネジ止め孔1bが金属枠体2の外側に位置するよ
う、金属枠体2から外部に突出するようにして形成され
ている。Further, screw fixing portions 1c each having a screw fixing hole 1b for fixing the optical semiconductor device to an external member are provided at four corners of the metal base 1, in this example, at both end regions in the longitudinal direction.
However, it is formed so that the screwing hole 1b may be located outside the metal frame 2 so as to protrude from the metal frame 2 to the outside.
【0028】ネジ止め部1cにおいてはネジ止め孔1b
間の金属基体1が切り欠いてあり、ネジ止め孔1b間に
切欠き部1dが形成されている。本例では金属基体1の
長さ方向の両端領域における幅方向の中央部が切欠義部
1dを挟んで二股形状となっており、パッケージ内部に
光半導体素子11を収容するとともに光ファイバ固定部材
3に光ファイバ14を固定して光半導体装置となした後、
ネジ止め孔1bにネジを挿通してネジ止め部1cを外部
部材にネジ止めすることによって光半導体装置が外部部
材に固定されることとなる。In the screwing portion 1c, a screwing hole 1b
The metal base 1 is cut away, and a cutout 1d is formed between the screw holes 1b. In the present example, the central portion in the width direction at both end regions in the length direction of the metal base 1 has a bifurcated shape with the notch portion 1d interposed therebetween, and accommodates the optical semiconductor element 11 inside the package and the optical fiber fixing member 3 After fixing the optical fiber 14 to the optical semiconductor device,
The optical semiconductor device is fixed to the external member by inserting the screw into the screw hole 1b and screwing the screw portion 1c to the external member.
【0029】このとき、ネジ止め孔1b間の金属基体1
を切り欠いてあるので、パッケージ内部に光半導体素子
11を収容するとともに光ファイバ固定部材3に光ファイ
バ14を固定して光半導体装置となした後、ネジ止め孔1
bにネジを挿通してネジ止め部1cを外部部材にネジ止
めすることによって光半導体装置を外部部材に固定して
も、ネジ止めによる締め付けの応力は主にネジ止め孔1
bの近傍のみ、本例では金属基体1の幅方向の両端部に
印加されることとなって金属基体1の上面中央部の光半
導体素子載置部1aに伝達されることは殆どない。その
結果、ネジ止めの応力により光半導体素子11の固定高さ
が変ることはなくなるため、光半導体素子11と光ファイ
バ14との位置整合が保たれ、光半導体素子11が励起した
光を光ファイバ14を介して外部に良好に伝達することが
できる。At this time, the metal substrate 1 between the screw holes 1b
Is notched, so that the optical semiconductor
11 is accommodated and the optical fiber 14 is fixed to the optical fiber fixing member 3 to form an optical semiconductor device.
Even if the optical semiconductor device is fixed to an external member by inserting a screw into the screw member 1b and screwing the screw fixing portion 1c to the external member, the tightening stress by screwing is mainly caused by the screw hole 1
In this example, only the vicinity of b is applied to both ends in the width direction of the metal base 1 and is hardly transmitted to the optical semiconductor element mounting portion 1a at the center of the upper surface of the metal base 1. As a result, the fixing height of the optical semiconductor element 11 does not change due to the screwing stress, so that the position alignment between the optical semiconductor element 11 and the optical fiber 14 is maintained, and the light excited by the optical semiconductor element 11 is transmitted to the optical fiber. Good transmission to the outside via 14.
【0030】また、ネジ止め部1cにおいてはネジ止め
孔1b間の金属基体1の中央部が切り欠いてあるので、
この切欠き部1dの上方に位置するように金属枠体2の
側壁に光ファイバ固定部材3を取着したときは、光ファ
イバ14が固定される部位の下方に金属基体1が存在しな
い構成となる。このため、光ファイバ固定部材3に光フ
ァイバ14を固定する際に金属基体1が光ファイバ14の固
定の邪魔になることがなく、光ファイバ14を光ファイバ
固定部材3に取着する作業がしやすいものとなる。In the screwing portion 1c, the central portion of the metal base 1 between the screwing holes 1b is notched.
When the optical fiber fixing member 3 is attached to the side wall of the metal frame 2 so as to be located above the notch 1d, the metal base 1 does not exist below the portion where the optical fiber 14 is fixed. Become. Therefore, when fixing the optical fiber 14 to the optical fiber fixing member 3, the metal substrate 1 does not hinder the fixing of the optical fiber 14, and the work of attaching the optical fiber 14 to the optical fiber fixing member 3 is performed. It will be easy.
【0031】なお、金属基体1は、ネジ止め孔1b間の
切欠き部1dの幅が金属基体1の幅の30%未満では、パ
ッケージ内部に光半導体素子11を収容するとともに光フ
ァイバ固定部材3に光ファイバ14を固定して光半導体装
置となした後、ネジ止め孔1bにネジを挿通してネジ止
め部1cを外部部材にネジ止めすることによって光半導
体装置を外部部材に固定した際にネジ止めの応力が金属
基体1の上面中央部の光半導体素子載置部1aに大きく
伝わってしまうこととなり、光半導体素子11の固定高さ
が変って光半導体素子11と光ファイバ14との位置の不整
合が発生し易いものとなる傾向にある。従って、金属基
体1のネジ止め孔1b間に形成する切欠き部1dの幅は
金属基体1の幅に対して30%以上としておくことが好ま
しい。When the width of the notch 1d between the screw holes 1b is less than 30% of the width of the metal substrate 1, the metal substrate 1 accommodates the optical semiconductor element 11 inside the package and simultaneously holds the optical fiber fixing member 3 When the optical semiconductor device is fixed to the external member by fixing the optical fiber 14 to the optical semiconductor device and inserting the screw into the screw hole 1b and screwing the screwed portion 1c to the external member. The screwing stress is largely transmitted to the optical semiconductor element mounting portion 1a at the center of the upper surface of the metal base 1, and the fixing height of the optical semiconductor element 11 changes, and the position of the optical semiconductor element 11 and the optical fiber 14 is changed. Tends to easily cause a mismatch. Therefore, it is preferable that the width of the notch 1d formed between the screw holes 1b of the metal base 1 be 30% or more of the width of the metal base 1.
【0032】また、金属基体1のネジ止め孔1b間に形
成する切欠き部1dの深さは、ネジ止め孔1bにネジを
挿通してネジ止め部1cを外部部材にネジ止めすること
によって光半導体装置を外部部材に固定した際にネジ止
めによる締め付けの応力が主にネジ止め孔1bの近傍の
み、本例では金属基体1の幅方向の両端部のみに印加さ
れることとなって金属基体1の上面中央部の光半導体素
子載置部1aに伝達されないようにするために、ネジ止
め孔1bよりも深いものとしておくことが好ましい。The depth of the notch 1d formed between the screw holes 1b of the metal base 1 is adjusted by inserting a screw into the screw hole 1b and screwing the screw portion 1c to an external member. When the semiconductor device is fixed to the external member, the tightening stress by screwing is applied mainly only to the vicinity of the screw hole 1b, and in this example, only to both ends in the width direction of the metal base 1, In order to prevent the light from being transmitted to the optical semiconductor element mounting portion 1a in the central portion of the upper surface of the device 1, it is preferable to make the hole deeper than the screw hole 1b.
【0033】かくして、本発明の光半導体素子収納用パ
ッケージによれば、金属基体1の光半導体素子載置部1
aに光半導体素子11を基板12を介して接着固定するとと
もに光半導体素子11の電極をボンディングワイヤ13を介
して絶縁端子部材5のメタライズ配線層5aに電気的に
接続し、次に光ファイバ固定部材3に光ファイバー14を
光半導体素子11と光ファイバ14の光軸が合うように位置
決めして固定し、最後に金属枠体2の上面に金属蓋体4
をシームウエルド法等により接合することによって光半
導体装置が完成する。Thus, according to the optical semiconductor element housing package of the present invention, the optical semiconductor element mounting portion 1 of the metal base 1 is provided.
a, the electrodes of the optical semiconductor element 11 are electrically connected to the metallized wiring layer 5a of the insulating terminal member 5 through bonding wires 13, and then the optical fiber is fixed. The optical fiber 14 is positioned and fixed to the member 3 so that the optical axes of the optical semiconductor element 11 and the optical fiber 14 are aligned. Finally, the metal cover 4 is placed on the upper surface of the metal frame 2.
Are bonded by a seam welding method or the like, whereby an optical semiconductor device is completed.
【0034】なお、本発明の光半導体素子収納用パッケ
ージは、上述の実施の形態の例に限定されるものではな
く、本発明の要旨を逸脱しない範囲であれば種々の変更
は可能である。例えば、上述の実施の形態の例では金属
基体1の長さ方向の両端領域のネジ止め部1cの両方を
金属基体1の幅方向の中央部を切り欠いて、ネジ止め部
1cを切欠き部1dを挟んだ二股形状としたが、金属基
体1の長さ方向の両端領域のネジ止め部1cの一方のみ
を金属基体1の幅方向の中央部を切り欠いた二股形状と
しても良く、この場合、光ファイバ14が固定される側の
ネジ止め孔1b間の金属基体1を切り欠いておくと、光
ファイバ14を光ファイバ固定部材3に固定する際の作業
がやり易くなるので、光ファイバ14が固定される側のネ
ジ止め部1cでネジ止め孔1b間の金属基体1を切り欠
いておくことが好ましい。The package for housing an optical semiconductor element of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. For example, in the example of the above-described embodiment, both the screwed portions 1c at both end regions in the longitudinal direction of the metal base 1 are cut off at the center in the width direction of the metal base 1, and the screwed portions 1c are cut out. Although the two-pronged shape sandwiching 1d is used, only one of the screwed portions 1c at both end regions in the length direction of the metal base 1 may be formed into a bifurcated shape in which a center portion in the width direction of the metal base 1 is cut out. If the metal base 1 is cut off between the screw holes 1b on the side where the optical fiber 14 is fixed, the work of fixing the optical fiber 14 to the optical fiber fixing member 3 becomes easier, so that the optical fiber 14 is fixed. It is preferable that the metal base 1 between the screw holes 1b be cut off at the screw portions 1c on the side where is fixed.
【0035】また、上述の実施の形態の例では金属基体
1の四隅のネジ止め孔1bを金属基体1の長さ方向に金
属枠体2から突出する位置に設けたが、同様の金属枠体
2に対して金属基体1の幅方向に突出するようにネジ止
め孔1bを位置させてもよく、この場合は、図2におい
て金属枠体2の上下に位置するネジ止め孔1b間の金属
基体を切り欠いたものとなる。In the above-described embodiment, the screw holes 1b at the four corners of the metal base 1 are provided at positions protruding from the metal frame 2 in the longitudinal direction of the metal base 1. 2, the screw holes 1b may be positioned so as to protrude in the width direction of the metal base 1. In this case, the metal base between the screw holes 1b located above and below the metal frame 2 in FIG. Is notched.
【0036】さらに、金属基体1を金属枠体2に対して
一回り大きな矩形状としてネジ止め孔1bが金属枠体2
の対角線の延長上に位置するような構成とし、ネジ止め
孔1b間の金属基体1を図2において金属枠体2の上下
左右でそれぞれ切り欠いたものとしてもよい。Further, the metal base 1 is formed in a rectangular shape slightly larger than the metal frame 2 so that the screw holes 1 b are formed in the metal frame 2.
2, the metal base 1 between the screw holes 1b may be cut out at the upper, lower, left and right sides of the metal frame 2 in FIG.
【0037】また、ネジ止め孔をさらに金属基体の四隅
以外にも設けてもよく、この場合は、四隅のネジ止め孔
間とそれらネジ止め孔間との金属基体を切り欠いておけ
ばよい。Further, screw holes may be provided at other than the four corners of the metal substrate. In this case, the metal substrate between the four corner screw holes and between the screw holes may be cut out.
【0038】[0038]
【発明の効果】本発明の光半導体素子収納用パッケージ
によれば、金属基体の四隅に設けられたネジ止め孔間の
金属基体が金属枠体の外側において切り欠いてあること
から、パッケージ内部に光半導体素子を収容するととも
に光ファイバ固定部材に光ファイバを固定して光半導体
装置となした後、金属基体をネジ止め孔によって外部部
材にネジ止めして光半導体装置を外部部材に固定する
と、ネジ止めに伴う応力は主に金属基体のネジ止め孔近
傍の隅部のみに印加されることとなって金属基体の上面
中央部の光半導体素子載置部に伝達されることは殆どな
くなる。その結果、ネジ止めの応力により光半導体素子
の高さが変ることはなく、光半導体素子と光ファイバと
の位置整合が保たれ、光半導体素子が励起した光を光フ
ァイバを介して外部に良好に伝達することができる。According to the package for storing an optical semiconductor element of the present invention, the metal base between the screw holes provided at the four corners of the metal base is cut off outside the metal frame, so that the inside of the package is cut off. After accommodating the optical semiconductor element and fixing the optical fiber to the optical fiber fixing member to form an optical semiconductor device, when the metal base is screwed to the external member with a screw hole and the optical semiconductor device is fixed to the external member, The stress caused by the screwing is mainly applied only to the corners near the screw holes of the metal base, and is hardly transmitted to the optical semiconductor element mounting portion at the center of the upper surface of the metal base. As a result, the height of the optical semiconductor element does not change due to the stress of screwing, the positional alignment between the optical semiconductor element and the optical fiber is maintained, and the light excited by the optical semiconductor element is transmitted to the outside via the optical fiber. Can be transmitted to
【図1】本発明の光半導体素子収納用パッケージの実施
の形態の一例を示す断面図である。FIG. 1 is a cross-sectional view showing an example of an embodiment of an optical semiconductor element housing package of the present invention.
【図2】図1に示す光半導体素子収納用パッケージの金
属蓋体を除いた上面図である。FIG. 2 is a top view of the package for housing an optical semiconductor element shown in FIG. 1 without a metal cover.
【図3】従来の光半導体素子収納用パッケージの断面図
である。FIG. 3 is a sectional view of a conventional package for housing an optical semiconductor element.
【図4】図3に示す光半導体素子収納用パッケージの金
属蓋体を除いた上面図である。FIG. 4 is a top view of the package for storing an optical semiconductor element shown in FIG. 3 without a metal cover.
1・・・金属基体 1a・・光半導体素子載置部 1b・・ネジ止め孔 1d・・切欠き部 2・・・金属枠体 3・・・光ファイバ固定部材 4・・・金属蓋体 11・・・光半導体素子 14・・・光ファイバ DESCRIPTION OF SYMBOLS 1 ... Metal base 1a ... Opto-semiconductor element mounting part 1b ... Screw hole 1d ... Notch part 2 ... Metal frame 3 ... Optical fiber fixing member 4 ... Metal lid 11 ... Optical semiconductor element 14 ... Optical fiber
Claims (1)
光半導体素子が載置される光半導体素子載置部を、四隅
にネジ止め孔を有する金属基体と、該金属基体上に前記
光半導体素子載置部を囲繞するとともに前記ネジ止め孔
を外側に位置させるように取着された金属枠体と、該金
属枠体の側壁に取着された光ファイバ固定部材と、前記
金属枠体の上面に取着され、前記光半導体素子を気密に
封止する金属蓋体とから成る光半導体素子収納用パッケ
ージであって、前記ネジ止め孔間の前記金属基体を切り
欠いてあることを特徴とする光半導体素子収納用パッケ
ージ。1. An optical semiconductor device mounting portion comprising a rectangular metal plate, in which an optical semiconductor device is mounted at the center of the upper surface, a metal substrate having screw holes at four corners, and A metal frame attached to the optical semiconductor element mounting portion so as to position the screw hole outside, an optical fiber fixing member attached to a side wall of the metal frame, and the metal frame. A metal cover attached to the upper surface of the body and hermetically sealing the optical semiconductor element, wherein the metal base between the screw holes is notched. Characteristic package for storing optical semiconductor elements.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10040814A JPH11238822A (en) | 1998-02-23 | 1998-02-23 | Package for accommodating optical semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10040814A JPH11238822A (en) | 1998-02-23 | 1998-02-23 | Package for accommodating optical semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11238822A true JPH11238822A (en) | 1999-08-31 |
Family
ID=12591128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10040814A Pending JPH11238822A (en) | 1998-02-23 | 1998-02-23 | Package for accommodating optical semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH11238822A (en) |
-
1998
- 1998-02-23 JP JP10040814A patent/JPH11238822A/en active Pending
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