JPH11222555A - Insulating protective coating agent for optical semiconductor - Google Patents
Insulating protective coating agent for optical semiconductorInfo
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- JPH11222555A JPH11222555A JP2679798A JP2679798A JPH11222555A JP H11222555 A JPH11222555 A JP H11222555A JP 2679798 A JP2679798 A JP 2679798A JP 2679798 A JP2679798 A JP 2679798A JP H11222555 A JPH11222555 A JP H11222555A
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- protective agent
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、光半導体の絶縁被
覆保護剤に関し、さらに詳しくは、電気絶縁性および光
透過性に優れ、かつ封止樹脂との密着性に優れた、光半
導体の絶縁被覆保護剤に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a protective agent for insulating coatings of optical semiconductors, and more particularly, to an insulating agent for optical semiconductors which is excellent in electrical insulation and light transmittance and excellent in adhesion to a sealing resin. It relates to a coating protective agent.
【０００２】[0002]
【従来の技術】オプトカプラーは、発光ダイオードのよ
うな発光素子で発生した光を受光素子に送り、スイッチ
ング回路を構成している。発光素子と受光素子の間は、
電気的には絶縁され、光学的には結合している。従来か
ら、発光部と受光部の間は、透明性を有するシリコーン
が絶縁被覆保護剤として用いられている。しかしなが
ら、シリコーン樹脂は、封止材として用いられるエポキ
シ樹脂との間に熱膨張係数の差が大きく、両者の界面が
剥離してその間に空気層を生じ、該空気層にコンデンサ
機能を生じるので、絶縁の耐電圧を高くすることができ
ない。2. Description of the Related Art An optocoupler sends light generated by a light emitting element such as a light emitting diode to a light receiving element to constitute a switching circuit. Between the light emitting element and the light receiving element,
It is electrically insulated and optically coupled. Conventionally, transparent silicone has been used as an insulating coating protective agent between a light emitting unit and a light receiving unit. However, the silicone resin has a large difference in thermal expansion coefficient between the silicone resin and the epoxy resin used as a sealing material, and the interface between the two peels off to form an air layer therebetween, thereby producing a capacitor function in the air layer. The insulation withstand voltage cannot be increased.
【０００３】そのため、空気層の形成を防ぐために、封
止用エポキシ樹脂の射出成形条件を制御して、エポキシ
樹脂とシリコーン樹脂の界面が剥離しないようにする、
オプトカプラーの製造プロセスの改良が行われている。
しかしながら、オプトカプラーの構造が多岐にわたるこ
とと、さらに高い耐電圧が切望されていることから、該
プロセスの複雑な制御を必要としないように、エポキシ
樹脂との密着性に優れた、光半導体用の絶縁被覆保護剤
が求められていた。[0003] Therefore, in order to prevent the formation of an air layer, the injection molding conditions of the sealing epoxy resin are controlled so that the interface between the epoxy resin and the silicone resin does not peel off.
Improvements have been made in the manufacturing process of optocouplers.
However, since the structure of the optocoupler is diversified, and a higher withstand voltage is eagerly desired, an optical semiconductor material having excellent adhesion with an epoxy resin so as not to require complicated control of the process. There has been a demand for an insulating coating protective agent.
【０００４】[0004]
【発明が解決しようとする課題】本発明の目的は、シリ
コーン固有の耐熱性および電気絶縁性を有し、光透過性
に優れ、さらにエポキシ樹脂のような封止用樹脂に対す
る密着性が著しく優れた、光半導体の絶縁被覆保護剤を
提供することである。SUMMARY OF THE INVENTION It is an object of the present invention to provide heat resistance and electrical insulation inherent to silicone, excellent light transmittance, and extremely excellent adhesion to a sealing resin such as an epoxy resin. Another object of the present invention is to provide an insulating protective agent for an optical semiconductor.
【０００５】[0005]
【課題を解決するための手段】本発明者は、上記の目的
を達成するために検討を重ねた結果、付加反応によって
架橋しうるポリオルガノシロキサンを含む被覆保護剤に
おいて、架橋密度を制御し、充填剤として特定量の煙霧
質シリカを用い、かつ硬化して得られるゲル状物の針入
度を特定の範囲にすることにより、その目的を達成しう
ることを見出して、本発明を完成するに至った。Means for Solving the Problems As a result of repeated studies to achieve the above object, the present inventors have found that a coating protective agent containing a polyorganosiloxane that can be crosslinked by an addition reaction controls the crosslink density, It has been found that the object can be achieved by using a specific amount of fumed silica as a filler and setting the penetration of a gel obtained by curing to a specific range, thereby completing the present invention. Reached.
【０００６】すなわち、本発明の光半導体絶縁被覆保護
剤は、 （Ａ）一般式：That is, the protective agent for an optical semiconductor insulating coating of the present invention comprises: (A) a general formula:
【化３】 （式中、Ｒ1 はアルケニル基を表し；Ｒ2 は脂肪族不飽
和結合を含まない置換または非置換の１価の炭化水素基
を表し；ａは１〜３の整数であり；ｂは０〜２の整数で
あり；ただし、ａ＋ｂは１〜３の整数である）で示され
るシロキサン単位を有するアルケニル基含有ポリオルガ
ノシロキサンを含み、残余がケイ素原子に結合した有機
基がＲ2 である直鎖状または分岐状のポリオルガノシロ
キサンであり、（Ａ）の全分子に対してＲ1 を平均０．
１〜０．８個有し、２５℃における粘度が５０〜１，０
００，０００cSt であるポリオルガノシロキサン混合物
１００重量部； （Ｂ）一般式：Embedded image (Wherein, R 1 represents an alkenyl group; R 2 represents a substituted or unsubstituted monovalent hydrocarbon group containing no aliphatic unsaturated bond; a is an integer of 1 to 3; b is 0 Alkenyl group-containing polyorganosiloxane having a siloxane unit represented by the formula (1), wherein a + b is an integer of 1 to 3), and the remainder is a direct bond in which the organic group bonded to the silicon atom is R 2. a linear or branched polyorganosiloxane, averaged R 1 for all molecules of (a) 0.
Having a viscosity of 50 to 1,0 at 25 ° C.
100 parts by weight of a polyorganosiloxane mixture of 00000 cSt; (B) the general formula:
【化４】 （式中、Ｒ3 は置換または非置換の１価の炭化水素基を
表し；ｃは０〜２の整数であり；ｄは１〜３の整数であ
り；ただし、ｃ＋ｄは１〜３の整数である）で示される
シロキサン単位を有し、ケイ素原子に結合した水素原子
を分子中に平均２個を越える数有するポリオルガノハイ
ドロジェンシロキサン、（Ａ）成分中のアルケニル基１
個に対して、（Ｂ）成分中のケイ素原子に結合した水素
原子が０．２〜２．０個になる量； （Ｃ）白金および白金化合物からなる群より選ばれた触
媒の触媒量；および （Ｄ）場合によっては表面処理されていてもよい煙霧質
シリカ８〜３０重量部を含み、硬化して得られるゲル状
物のＡＳＴＭ Ｄ１４０３ １／４コーンによる針入度
が、８０〜１４０であることを特徴とする。Embedded image (Wherein, R 3 represents a substituted or unsubstituted monovalent hydrocarbon group; c is an integer of 0 to 2; d is an integer of 1 to 3; provided that c + d is an integer of 1 to 3) A polyorganohydrogensiloxane having an average of more than two hydrogen atoms bonded to silicon atoms in the molecule, and an alkenyl group 1 in the component (A).
(B) an amount of 0.2 to 2.0 hydrogen atoms bonded to silicon atoms in component (B); (C) a catalytic amount of a catalyst selected from the group consisting of platinum and a platinum compound; And (D) a gel-like material containing 8 to 30 parts by weight of fumed silica which may optionally be surface-treated, and having a penetration of 80 to 140 with an ASTM D1403 1/4 cone, which is obtained by curing. There is a feature.
【０００７】[0007]
【発明の実施の形態】本発明に用いられる（Ａ）成分の
ポリオルガノシロキサン混合物は、本発明の被覆保護剤
のベースポリマーであり、前述の式（Ｉ）で示されるシ
ロキサン単位中に、ケイ素原子に直結したアルケニル基
Ｒ1 を有するアルケニル基含有ポリオルガノシロキサン
を含む。該アルケニル基含有ポリオルガノシロキサンの
シロキサン骨格は、直鎖状、分岐状、環状または網状の
いずれであってもよい。（Ａ）成分中の残余のポリオル
ガノシロキサンは、ケイ素原子に結合した有機基がＲ2
であり、直鎖状または分岐状のシロキサン骨格を有す
る。混合物である（Ａ）成分の粘度は、２５℃において
５０〜１，０００，０００cSt であり、１００〜５０
０，０００cSt が好ましい。５０cSt 未満では、硬化し
て得られるゲル状物がもろく、１，０００，０００cSt
を越えると未架橋状態における被覆保護剤の流動性が悪
くなり、作業性が劣る。BEST MODE FOR CARRYING OUT THE INVENTION The polyorganosiloxane mixture of the component (A) used in the present invention is a base polymer of the coating protective agent of the present invention, and contains a silicon compound in the siloxane unit represented by the above formula (I). Includes alkenyl group-containing polyorganosiloxanes having an alkenyl group R 1 directly bonded to an atom. The siloxane skeleton of the alkenyl group-containing polyorganosiloxane may be linear, branched, cyclic or network. The remaining polyorganosiloxane in the component (A) has an organic group bonded to a silicon atom of R 2.
Which has a linear or branched siloxane skeleton. The viscosity of component (A), which is a mixture, is 50 to 1,000,000 cSt at 25 ° C, and 100 to 50 cSt.
000 cSt is preferred. If it is less than 50 cSt, the gel obtained by curing is fragile and has a viscosity of 1,000,000 cSt.
If the ratio exceeds the above range, the flowability of the coating protective agent in an uncrosslinked state becomes poor, resulting in poor workability.
【０００８】Ｒ1 としては、ビニル、アリル、１−ブテ
ニル、１−ヘキセニルなどが挙げられるが、合成が容易
で、適切な硬化速度が得られることから、ビニル基が好
ましい。Ｒ2 およびその他のシロキサン単位のケイ素原
子に結合する有機基としては、メチル、エチル、プロピ
ル、ブチル、ヘキシル、ドデシルなどのアルキル基；フ
ェニルなどのアリール基；２−フェニルエチル、２−フ
ェニルプロピルなどのアラルキル基；３，３，３−トリ
フルオロプロピル、３−メトキシプロピル、３−グリシ
ドキシプロピル、２−（３，４−エポキシシクロヘキシ
ル）などの置換炭化水素基などが例示される。これらの
うち、合成しやすく、しかも架橋後に良好な物理的性質
を保つうえで必要な重合度を有して架橋前には低い粘度
を保持するという点から、メチル基が最も好ましい。ま
た、光半導体にしばしば求められる−６０℃以下の低温
における安定性を必要とする場合、Ｒ2 およびその他の
シロキサン単位の有機基として、若干のフェニル基を導
入することが好ましい。すなわち、（Ａ）成分の全シロ
キサン単位に対して、フェニル基をメチルフェニルシロ
キサン単位として導入する場合は５〜１５モル％、ジフ
ェニルシロキサン単位として導入する場合は２．５〜１
０モル％のフェニル基含有単位を含むことが好ましい。
また、特に高い光透過性が求められる場合、配合される
煙霧質シリカと屈折率を合わせるために、Ｒ2 およびそ
の他のシロキサン単位の有機基の一部にフェニル基を用
いることもできる。Examples of R 1 include vinyl, allyl, 1-butenyl, 1-hexenyl and the like, but a vinyl group is preferred because it is easy to synthesize and an appropriate curing speed can be obtained. R 2 and other organic groups bonded to the silicon atom of the siloxane unit include alkyl groups such as methyl, ethyl, propyl, butyl, hexyl and dodecyl; aryl groups such as phenyl; 2-phenylethyl, 2-phenylpropyl and the like And substituted hydrocarbon groups such as 3,3,3-trifluoropropyl, 3-methoxypropyl, 3-glycidoxypropyl, and 2- (3,4-epoxycyclohexyl). Of these, a methyl group is most preferred because it is easy to synthesize, has a degree of polymerization necessary for maintaining good physical properties after crosslinking, and maintains a low viscosity before crosslinking. In addition, when stability at a low temperature of −60 ° C. or less, which is often required for optical semiconductors, is required, it is preferable to introduce some phenyl groups as organic groups of R 2 and other siloxane units. That is, 5 to 15 mol% based on all siloxane units of the component (A) when a phenyl group is introduced as a methylphenylsiloxane unit, and 2.5 to 1% when a phenyl group is introduced as a diphenylsiloxane unit.
It preferably contains 0 mol% of phenyl group-containing units.
Further, when particularly high light transmittance is required, a phenyl group may be used as a part of the organic group of R 2 and other siloxane units in order to match the refractive index with that of the fumed silica compounded.
【０００９】Ｒ1 は、（Ａ）成分の全分子に対して平均
０．１〜０．８個、好ましくは０．３〜０．７個存在す
る。この数が０．１個未満では、十分な架橋反応が行わ
れず、形状が不安定で、また十分な機械的強度が得られ
ない。一方、０．８個を越えると、硬化物が硬くなっ
て、硬化後に適切な針入度の範囲の硬さの被覆保護剤が
得られない。[0009] R 1 is an average 0.1 to 0.8 pieces based on the total molecule of the component (A) is preferably present from 0.3 to 0.7 units. If the number is less than 0.1, sufficient crosslinking reaction is not performed, the shape is unstable, and sufficient mechanical strength cannot be obtained. On the other hand, if the number exceeds 0.8, the cured product becomes hard, and after curing, a coating protective agent having a hardness in an appropriate penetration range cannot be obtained.
【００１０】式（Ｉ）で示されるアルケニル基含有シロ
キサン単位は、（Ａ）成分の分子鎖の末端、途中のいず
れに存在しても、またその両方に存在してもよいが、硬
化性および硬化後の物性の経時安定性を得るためには、
（Ａ）成分中のアルケニル基含有ポリオルガノシロキサ
ンの大部分の、一方の末端に存在することが好ましい。
すなわち、（Ａ）成分としては、その一部が、一方の末
端をジメチルビニルシロキシ基で封鎖されたポリジメチ
ルシロキサンか、同様に一方の末端をジメチルビニルシ
ロキシ基で封鎖されたポリメチルフェニルシロキサン、
またはその両方を用いることが、特に好ましい。The alkenyl group-containing siloxane unit represented by the formula (I) may be present at the terminal of the molecular chain of the component (A), at any point in the molecular chain, or at both of them. In order to obtain stability over time of physical properties after curing,
It is preferable that most of the alkenyl group-containing polyorganosiloxane in the component (A) be present at one end.
That is, as the component (A), a part thereof is polydimethylsiloxane having one end blocked with a dimethylvinylsiloxy group, or similarly, polymethylphenylsiloxane having one end blocked with a dimethylvinylsiloxy group,
It is particularly preferred to use both or both.
【００１１】本発明に用いられる（Ｂ）成分のポリオル
ガノハイドロジェンシロキサンは、ケイ素原子に結合し
た水素原子が、式（II）で示されるシロキサン単位中に
存在し、そのＳｉ−Ｈ結合と、（Ａ）成分中のアルケニ
ル基との付加反応により、架橋剤として働く成分であ
る。ケイ素原子に結合した水素原子の数は、（Ｂ）成分
全体として分子中に平均２個を越える数であり、硬化し
て得られる被覆保護剤に機械的強度が必要な場合は、平
均３個以上であることが好ましい。Ｒ3 およびその他の
シロキサン単位の有機基としては、（Ａ）成分における
Ｒ2 と同様のものが例示され、合成が容易なこと、
（Ａ）成分との相溶性、および得られる被覆保護剤の物
性から、メチル基が最も好ましく、必要に応じてＲ3 の
一部としてフェニル基を導入してもよい。（Ｂ）成分の
粘度は、合成および取扱いが容易なこと、ならびに保存
中および架橋反応の際に揮発しないことから、２５℃に
おいて１０〜１０，０００cSt が好ましく、１５〜５０
０cSt がさらに好ましい。In the polyorganohydrogensiloxane of the component (B) used in the present invention, a hydrogen atom bonded to a silicon atom is present in the siloxane unit represented by the formula (II), (A) A component that acts as a crosslinking agent by an addition reaction with an alkenyl group in the component. The number of hydrogen atoms bonded to silicon atoms is more than two on average in the molecule as a whole of the component (B). If the coating protective agent obtained by curing requires mechanical strength, it is three on average. It is preferable that it is above. Examples of the organic group of R 3 and other siloxane units are the same as those of R 2 in the component (A), and the synthesis is easy.
From the viewpoint of compatibility with the component (A) and the properties of the resulting coating protective agent, a methyl group is most preferable, and a phenyl group may be introduced as a part of R 3 as necessary. The viscosity of the component (B) is preferably 10 to 10,000 cSt at 25 ° C., because it is easy to synthesize and handle, and does not volatilize during storage and during the crosslinking reaction.
0 cSt is more preferred.
【００１２】この（Ｂ）成分は、前述のようにケイ素原
子に直接結合した水素原子を１分子中に平均２個を越え
る数有するものであれば、その分子構造に特に制限はな
く、直鎖状、分岐状または環状のシロキサン骨格を有す
るものが使用できるが、合成のしやすさから、直鎖状の
もの、またはＲ3 2ＨＳｉＯ1/2 単位とＳｉＯ2 単位から
なるポリオルガノハイドロジェンシロキサンが好まし
い。また、被覆保護剤に機械的性質が特に必要な場合
は、そのシロキサン骨格の如何によらず、ケイ素原子に
直接結合した水素原子の少なくとも一部は、ジメチルハ
イドロジェンシロキサン単位のようなＲ3 2ＨＳｉＯ1/2
単位として存在すること、すなわち、直鎖状の場合は両
末端に存在することが特に好ましい。The molecular structure of component (B) is not particularly limited as long as it has more than two hydrogen atoms directly bonded to silicon atoms on average per molecule as described above. Although it is possible to use those having a linear, branched or cyclic siloxane skeleton, straight-chain ones or polyorganohydrogensiloxanes comprising R 3 2 HSiO 1/2 units and SiO 2 units for ease of synthesis Is preferred. Moreover, if the covering agent is particularly necessary mechanical properties, regardless of whether the siloxane backbone, at least some of the hydrogen atoms bonded directly to silicon atom, R 3 2, such as dimethyl siloxane units HSiO 1/2
It is particularly preferred that it is present as a unit, that is, it is present at both ends when it is linear.
【００１３】（Ｂ）成分の配合量は、（Ａ）成分中のア
ルケニル基１個に対し、（Ｂ）成分中のケイ素原子に結
合した水素原子の数が０．２〜２．０個となるような量
である。上記のアルケニル基１個に対する水素原子の数
が０．２個未満の場合は、架橋密度が低くなり過ぎるた
め架橋が十分進行せず、架橋後でも流動性が残るなど、
所望の物理的性質が得られず、好ましくない。また、水
素原子が２．０個を越えると、硬化後の被覆保護剤が硬
くなり、適切な針入度のものが得られない。The amount of component (B) is such that the number of hydrogen atoms bonded to silicon atoms in component (B) is 0.2 to 2.0 per alkenyl group in component (A). It is such an amount. When the number of hydrogen atoms per one alkenyl group is less than 0.2, the crosslinking density is too low, so that crosslinking does not proceed sufficiently and fluidity remains even after crosslinking.
The desired physical properties cannot be obtained, which is not preferred. On the other hand, when the number of hydrogen atoms exceeds 2.0, the coating protective agent after curing becomes hard, and a material having an appropriate penetration cannot be obtained.
【００１４】本発明に用いられる（Ｃ）成分の白金およ
び白金化合物から選ばれる触媒は、（Ａ）成分のアルケ
ニル基と（Ｂ）成分のヒドロシリル基との間の付加反応
を促進するものである。（Ｃ）成分としては、塩化白金
酸、塩化白金酸とアルコールより得られる錯体、白金−
オレフィン錯体、白金−ビニルシロキサン錯体、その他
の白金配位化合物、白金の単体（白金黒）、またはアル
ミナ、シリカなどの担体に白金の単体を担持したものな
どを用いることができる。なお、未硬化の本発明の被覆
保護剤を単一の容器中に保存する場合、アルコール系ま
たはグリコール系の溶媒を共存させると、系の経時安定
性を損なうことがある。したがって、そのような場合に
は、これらの溶媒の使用を避けて、エーテル系溶剤、炭
化水素系溶剤などに溶解して用いることが好ましい。The catalyst selected from the platinum component (C) and the platinum compound used in the present invention promotes the addition reaction between the alkenyl group of the component (A) and the hydrosilyl group of the component (B). . As the component (C), chloroplatinic acid, a complex obtained from chloroplatinic acid and an alcohol, platinum-
An olefin complex, a platinum-vinylsiloxane complex, another platinum coordination compound, a simple substance of platinum (platinum black), or a substance in which a simple substance of platinum is supported on a carrier such as alumina or silica can be used. When the uncured coating protective agent of the present invention is stored in a single container, the coexistence of an alcohol-based or glycol-based solvent may impair the temporal stability of the system. Therefore, in such a case, it is preferable to avoid using these solvents and dissolve them in ether solvents, hydrocarbon solvents, and the like.
【００１５】（Ｃ）成分の配合量は、（Ｃ）成分の触媒
としての有効量であるが、（Ａ）成分に対する白金原子
として１．０〜３０ppm が好ましく、２．０〜２０ppm
の範囲が特に好ましい。１．０ppm 未満では硬化阻害な
どの影響を受けやすく、３０ppm を越えると、加熱によ
り着色することがある。The amount of the component (C) is an effective amount of the component (C) as a catalyst, and is preferably 1.0 to 30 ppm, more preferably 2.0 to 20 ppm, as a platinum atom relative to the component (A).
Is particularly preferred. If it is less than 1.0 ppm, it is susceptible to curing inhibition, and if it exceeds 30 ppm, it may be colored by heating.
【００１６】本発明で用いられる（Ｄ）成分の煙霧質シ
リカは、本発明の被覆保護剤の、封止剤に対する密着性
を向上させるものである。密着性は、煙霧質シリカ表面
のシラノール基の効果によるものであり、少量の煙霧質
シリカの使用によって密着性を向上させるには比表面積
の大きいものほど有効であるが、作業性を考慮して、Ｂ
ＥＴ法による比表面積が１７５〜３３０m2/gの範囲のも
のが好ましい。（Ａ）成分および（Ｂ）成分との親和
性、ならびに硬化後の被覆保護剤の透明性および耐熱性
を向上させるためには、トリメチルクロロシラン、トリ
メチルメトキシシラン、ヘキサメチルジシラザン、ヘキ
サメチルシクロトリシロキサン、オクタメチルシクロテ
トラシロキサンのようなシラン類、シラザン類および／
またはシロキサン類で表面処理して用いることが好まし
い。The fumed silica of the component (D) used in the present invention improves the adhesion of the coating protective agent of the present invention to a sealant. The adhesion is due to the effect of silanol groups on the surface of the fumed silica, and the use of a small amount of fumed silica is more effective for improving the adhesion, the larger the specific surface area, the more effective it is. , B
Those having a specific surface area of 175 to 330 m 2 / g by the ET method are preferred. In order to improve the affinity with the components (A) and (B) and the transparency and heat resistance of the coating protective agent after curing, trimethylchlorosilane, trimethylmethoxysilane, hexamethyldisilazane, hexamethylcyclotri Siloxanes, silanes such as octamethylcyclotetrasiloxane, silazanes and / or
Alternatively, it is preferable to use a surface treated with siloxanes.
【００１７】（Ｄ）成分の配合量は、（Ａ）成分１００
重量部に対して８〜３０重量部であり、１０〜２５重量
部が好ましい。８重量部未満では、エポキシ樹脂のよう
な封止剤との密着性に乏しく、３０重量部を越えると、
煙霧質シリカが凝集して、硬化した被覆保護剤の透明性
や耐熱性を低下させることがある。The amount of the component (D) is 100%.
The amount is 8 to 30 parts by weight, preferably 10 to 25 parts by weight based on parts by weight. If the amount is less than 8 parts by weight, the adhesion to a sealing agent such as an epoxy resin is poor.
The fumed silica may aggregate to reduce the transparency and heat resistance of the cured coating protective agent.
【００１８】本発明の光半導体絶縁被覆保護剤は、
（Ａ）〜（Ｄ）成分を含み、硬化後の硬さが、ＡＳＴＭ
Ｄ１４０３に規定され、１／４コーンによって測定さ
れた針入度が８０〜１４０、好ましくは８５〜１２０の
範囲になるように処方される。針入度が８０未満では、
封止剤との十分な密着性が得られず、１４０を越える
と、封止剤を射出成形する際に硬化被覆保護剤層の変形
が起こる。The protective agent for an optical semiconductor insulating coating of the present invention comprises:
ASTM, which contains components (A) to (D)
It is prescribed so that the penetration measured by a 1/4 cone is in the range of 80 to 140, preferably 85 to 120, as defined in D1403. If the penetration is less than 80,
If the adhesion to the sealant is not sufficient, and if it exceeds 140, the cured coating protective agent layer is deformed when the sealant is injection-molded.
【００１９】本発明の被覆保護剤に、本発明の目的を阻
害しないかぎり、必要に応じて種々の添加剤を含有させ
ることができる。たとえば接着性付与の目的で（メタ）
アクリロイル基やエポキシ基のような炭素官能性基を有
するシラン化合物もしくはシロキサン化合物、またはト
リアルコキシシリル基とエステル結合を含む側鎖を有
し、かつ環状のケイ素原子に結合した水素原子を有する
環状シロキサンのような接着性付与剤；被覆保護剤を調
製した後の常温における保存中の安定性を増すための架
橋反応遅延剤；難燃化剤などを配合することができる。Various additives can be added to the coating protective agent of the present invention, if necessary, as long as the object of the present invention is not impaired. For example, for the purpose of providing adhesion (meta)
A silane compound or siloxane compound having a carbon functional group such as an acryloyl group or an epoxy group, or a cyclic siloxane having a side chain containing a trialkoxysilyl group and an ester bond and having a hydrogen atom bonded to a cyclic silicon atom And a cross-linking reaction retarder for increasing stability during storage at room temperature after the coating protective agent is prepared; and a flame retardant.
【００２０】（Ａ）〜（Ｄ）成分を、架橋反応遅延剤の
存在または非存在下に、ニーダーなどの混合手段を用い
て均一に混合することによって調製し、常温または低温
下に単一容器に保存することができ、作業性からはこの
タイプのものが好ましい。また、（Ａ）成分の一部と
（Ｂ）成分とを含む混合物、および（Ａ）成分の一部と
（Ｃ）成分とを含む混合物を別々に調製しておき、使用
直前に混合して被覆保護剤としてもよい。この場合、
（Ｄ）成分は、一方または両方の混合物中に配合してよ
いが、通常は、両方の混合物がそれぞれ適度の流動性を
保つように、両方の混合物中に分配される。The components (A) to (D) are prepared by mixing uniformly using a mixing means such as a kneader in the presence or absence of a cross-linking reaction retarder. This type is preferable from the viewpoint of workability. Further, a mixture containing a part of the component (A) and the component (B) and a mixture containing a part of the component (A) and the component (C) are separately prepared and mixed immediately before use. It may be a coating protective agent. in this case,
The component (D) may be blended in one or both mixtures, but is usually distributed in both mixtures such that both mixtures maintain a proper fluidity.
【００２１】本発明の被覆保護剤は、通常、押出し、滴
下、または注入装置によって半導体チップの表面に処理
され、加熱によって架橋反応を起こし、所定の性状の架
橋体を形成する。加熱条件は、たとえば６０℃で数分の
加熱により、流動せず、形状を保持できる架橋体が得ら
れる。The coating protective agent of the present invention is usually applied to the surface of a semiconductor chip by an extrusion, dropping, or pouring device, and causes a crosslinking reaction by heating to form a crosslinked product having a predetermined property. Regarding the heating conditions, for example, by heating at 60 ° C. for several minutes, a crosslinked body which does not flow and can maintain the shape can be obtained.
【００２２】[0022]
【発明の効果】本発明によって得られる光半導体絶縁被
覆保護剤は、透明性、電気絶縁性および耐熱性に優れ、
かつ封止剤との密着性に優れており、光半導体を用いる
デバイスの耐電圧を向上させることに大きく寄与する。
したがって、本発明の被覆保護剤は、オプトカプラーな
どの光半導体の被覆保護剤として、極めて有用である。The protective agent for an optical semiconductor insulating coating obtained by the present invention has excellent transparency, electrical insulation and heat resistance,
In addition, it has excellent adhesion to a sealant, and greatly contributes to improving the withstand voltage of a device using an optical semiconductor.
Therefore, the coating protective agent of the present invention is extremely useful as a coating protective agent for optical semiconductors such as optocouplers.
【００２３】[0023]
【実施例】以下、実施例により、本発明をさらに具体的
に説明する。本発明はこれらの実施例に限定されるもの
ではない。実施例および比較例中、部はすべて重量部を
意味し、粘度は２５℃における粘度を表す。なお、炭化
水素基には、次の記号を用いる。 Ｍｅ：メチル基、Ｖｉ：ビニル基、Ｐｈ：フェニル基。The present invention will be described more specifically with reference to the following examples. The present invention is not limited to these examples. In the examples and comparative examples, all parts mean parts by weight, and the viscosity indicates a viscosity at 25 ° C. The following symbols are used for the hydrocarbon group. Me: methyl group, Vi: vinyl group, Ph: phenyl group.
【００２４】実施例および比較例において、（Ａ）〜
（Ｄ）成分として、下記の材料を用いた。なお、以下の
分子式はすべて平均式であり、複数の中間シロキサン単
位および／または複数の末端シロキサン単位を含むもの
は、単にシロキサン単位の数を示すのであって、ブロッ
ク共重合体を意味せず、共重合体はすべてランダム共重
合体である。In Examples and Comparative Examples, (A)
The following materials were used as the component (D). The following molecular formulas are all average formulas, and those containing a plurality of intermediate siloxane units and / or a plurality of terminal siloxane units simply indicate the number of siloxane units and do not mean a block copolymer, All copolymers are random copolymers.
【００２５】Ａ−１：平均式A-1: Average formula
【化５】 で示される、一部のポリシロキサンの末端にビニル基を
含有する、粘度が７００cPのポリジメチルシロキサン混
合物； Ａ−２：平均式Embedded image A: a polydimethylsiloxane mixture having a viscosity of 700 cP containing a vinyl group at the terminal of some polysiloxanes; A-2: average formula
【化６】 で示される、一部のポリシロキサンの末端にビニル基を
含有する、粘度が２，０００cPのポリメチルフェニルシ
ロキサン混合物； Ａ−３：平均式Embedded image A-3: a polymethylphenylsiloxane mixture having a viscosity of 2,000 cP and containing a vinyl group at a terminal of some of the polysiloxanes;
【化７】 で示される、一部のポリシロキサンの末端にビニル基を
含有する、粘度が６５０cPのポリジメチルシロキサン； Ａ−４：平均式Embedded image A-4: a polydimethylsiloxane having a viscosity of 650 cP containing a vinyl group at the terminal of some polysiloxanes;
【化８】 で示される、粘度が６５０cPの両末端ビニル基含有ポリ
ジメチルシロキサン； Ａ−５：平均式Embedded image A-5: average formula having both ends vinyl group-containing polydimethylsiloxane having a viscosity of 650 cP.
【化９】 で示される、粘度が２，０００cPの両末端ビニル基含有
ポリメチルフェニルシロキサン； Ｂ−１：平均式Embedded image B-1: average formula having a viscosity of 2,000 cP and having both ends vinyl group-containing polymethylphenylsiloxane.
【化１０】 で示される、粘度が５０cPのポリメチルハイドロジェン
シロキサン； Ｂ−２：平均式Embedded image A polymethylhydrogensiloxane having a viscosity of 50 cP; B-2: average formula
【化１１】 で示される、粘度が１００cPのポリメチルハイドロジェ
ンシロキサン； Ｂ−３：平均式Embedded image A polymethylhydrogensiloxane having a viscosity of 100 cP; B-3: average formula
【化１２】 で示される、粘度が５０cPのポリメチルハイドロジェン
シロキサン； Ｃ−１：白金−ビニルシロキサン錯体を、両末端がビニ
ルジメチルシロキシ単位で封鎖されたポリジメチルシロ
キサンに溶解した、白金原子換算０．５重量％の有効成
分を含有する溶液； Ｄ−１：平均粒径が１２nm、比表面積が２００m2/gであ
り、表面をヘキサメチルジシラザンで処理した煙霧質シ
リカ；および Ｄ−２：平均粒径が７nm、比表面積が３００m2/gの煙霧
質シリカ。Embedded image A polymethylhydrogensiloxane having a viscosity of 50 cP; C-1: a platinum-vinylsiloxane complex dissolved in polydimethylsiloxane having both ends blocked with vinyldimethylsiloxy units, in terms of platinum atom, 0.5 wt. D-1: fumed silica having an average particle size of 12 nm, a specific surface area of 200 m 2 / g and a surface treated with hexamethyldisilazane; and D-2: an average particle size. Is 7 nm and the specific surface area is 300 m 2 / g.
【００２６】実施例１〜６、比較例１〜３ 表１に示す組成で、上記の材料をそれぞれニーダーによ
って均一になるまで常温で混合して、それぞれ未硬化の
被覆保護剤を調製した。これらの被覆保護剤の硬化後の
針入度、光透過性、およびエポキシ樹脂との密着性を、
次のようにして評価した。Examples 1 to 6 and Comparative Examples 1 to 3 With the compositions shown in Table 1, the above-mentioned materials were mixed at room temperature until uniform using a kneader to prepare uncured coating protective agents. Penetration after curing of these coating protective agents, light transmittance, and adhesion with epoxy resin,
The evaluation was performed as follows.
【００２７】針入度 未硬化の被覆剤をパイレックスビーカーにとり、１８０
℃の熱風乾燥機中で３０分間加熱して硬化させた。室温
においてビーカーから取り出し、ＡＳＴＭ Ｄ１４０３
により、１／４コーンを用いて針入度を測定して、初期
針入度とした。これをさらに１８０℃の熱風乾燥機に３
０日放置してから室温に戻し、再び同様に針入度を測定
して、耐熱試験後の値とした。Penetration Uncured coating agent is placed in a Pyrex beaker, and
It was cured by heating in a hot air drier at 30 ° C. for 30 minutes. Remove from beaker at room temperature, ASTM D1403
The penetration was measured using a 1/4 cone to obtain the initial penetration. This is further placed in a hot air dryer at 180 ° C for 3
After standing for 0 days, the temperature was returned to room temperature, and the penetration was measured again as the value after the heat resistance test.
【００２８】光透過率 未硬化の被覆剤を、上記と同様にして１８０℃で３０分
加熱することによって硬化させた後、厚さ１mmの石英セ
ルに入れて、波長６００nmの光の透過率を測定した。Light transmittance The uncured coating material is cured by heating at 180 ° C. for 30 minutes in the same manner as described above, and then placed in a 1 mm-thick quartz cell to measure the transmittance of light having a wavelength of 600 nm. It was measured.
【００２９】エポキシ樹脂との密着性 未硬化の被覆剤１ｇをアルミシャーレにとり、１８０℃
で３０分間加熱して硬化させた。ついで、未硬化のエポ
キシ樹脂１ｇをその上に流し込み、１８０℃のホットプ
レート上で１０分間加熱して硬化させた。室温まで冷却
してシャーレから取り出し、硬化した被覆剤とエポキシ
樹脂の間の引剥しを行って、密着性を定性的に評価し
た。なお、エポキシ樹脂としては、XN1184SP/XN1185SP
（長瀬チバ（株）商品名）およびMR150SGC（日東電気工
業（株）商品名）をそれぞれ用いた。Adhesion with Epoxy Resin 1 g of the uncured coating agent was placed in an aluminum dish and kept at 180 ° C.
For 30 minutes to cure. Then, 1 g of an uncured epoxy resin was poured thereon, and was cured by heating on a hot plate at 180 ° C. for 10 minutes. It was cooled to room temperature, taken out of the petri dish, and peeled off between the cured coating agent and the epoxy resin, and the adhesion was qualitatively evaluated. As epoxy resin, XN1184SP / XN1185SP
(Trade name of Nagase Chiba Co., Ltd.) and MR150SGC (trade name of Nitto Electric Industry Co., Ltd.).
【００３０】これらの結果は、表１に示すとおりであっ
た。The results are shown in Table 1.
【００３１】[0031]
【表１】 [Table 1]
【００３２】実施例１〜６の絶縁被覆保護剤は、光透過
性およびエポキシ樹脂への密着性に優れ、しかも耐熱性
が優れている。それに対して、両末端にビニル基を有す
るポリジメチルシロキサンを用いた比較例１および比較
例３の保護剤は、いずれも密着性と耐熱性が悪い。また
比較例２の保護剤は、多量の煙霧質シリカを配合するこ
とにより、密着性は向上したが、光透過性が劣るうえ
に、耐熱性が著しく低い。The insulating coating protective agents of Examples 1 to 6 are excellent in light transmittance and adhesion to epoxy resin, and also excellent in heat resistance. On the other hand, the protective agents of Comparative Examples 1 and 3 using polydimethylsiloxane having vinyl groups at both ends have poor adhesion and heat resistance. The protective agent of Comparative Example 2 was improved in adhesiveness by adding a large amount of fumed silica, but was inferior in light transmittance and extremely low in heat resistance.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０１Ｌ 33/00 Ｈ０１Ｌ 31/00 Ａ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI H01L 33/00 H01L 31/00 A
Claims (4)
和結合を含まない置換または非置換の１価の炭化水素基
を表し；ａは１〜３の整数であり；ｂは０〜２の整数で
あり；ただし、ａ＋ｂは１〜３の整数である）で示され
るシロキサン単位を有するアルケニル基含有ポリオルガ
ノシロキサンを含み、残余がケイ素原子に結合した有機
基がＲ2 である直鎖状または分岐状のポリオルガノシロ
キサンであり、（Ａ）の全分子に対してＲ1 を平均０．
１〜０．８個有し、２５℃における粘度が５０〜１，０
００，０００cSt であるポリオルガノシロキサン混合物
１００重量部； （Ｂ）一般式： 【化２】 （式中、Ｒ3 は置換または非置換の１価の炭化水素基を
表し；ｃは０〜２の整数であり；ｄは１〜３の整数であ
り；ただし、ｃ＋ｄは１〜３の整数である）で示される
シロキサン単位を有し、ケイ素原子に結合した水素原子
を分子中に平均２個を越える数有するポリオルガノハイ
ドロジェンシロキサン、（Ａ）成分中のアルケニル基１
個に対して、（Ｂ）成分中のケイ素原子に結合した水素
原子が０．２〜２．０個になる量； （Ｃ）白金および白金化合物からなる群より選ばれた触
媒の触媒量；および （Ｄ）場合によっては表面処理されていてもよい煙霧質
シリカ８〜３０重量部を含み、硬化して得られるゲル状
物のＡＳＴＭ Ｄ１４０３ １／４コーンによる針入度
が、８０〜１４０であることを特徴とする光半導体絶縁
被覆保護剤。(A) A general formula: (Wherein, R 1 represents an alkenyl group; R 2 represents a substituted or unsubstituted monovalent hydrocarbon group containing no aliphatic unsaturated bond; a is an integer of 1 to 3; b is 0 Alkenyl group-containing polyorganosiloxane having a siloxane unit represented by the formula (1), wherein a + b is an integer of 1 to 3), and the remainder is a direct bond in which the organic group bonded to the silicon atom is R 2. a linear or branched polyorganosiloxane, averaged R 1 for all molecules of (a) 0.
Having a viscosity of 50 to 1,0 at 25 ° C.
100 parts by weight of a polyorganosiloxane mixture of 000 cSt; (B) the general formula: (Wherein, R 3 represents a substituted or unsubstituted monovalent hydrocarbon group; c is an integer of 0 to 2; d is an integer of 1 to 3; provided that c + d is an integer of 1 to 3) A polyorganohydrogensiloxane having an average of more than two hydrogen atoms bonded to silicon atoms in the molecule, and an alkenyl group 1 in the component (A).
(B) an amount of 0.2 to 2.0 hydrogen atoms bonded to silicon atoms in component (B); (C) a catalytic amount of a catalyst selected from the group consisting of platinum and a platinum compound; And (D) a gel-like material containing 8 to 30 parts by weight of fumed silica which may optionally be surface-treated, and having a penetration of 80 to 140 with an ASTM D1403 1/4 cone, which is obtained by curing. An optical semiconductor insulating coating protective agent, characterized in that:
ビニルシロキシ単位で封鎖されたポリジメチルシロキサ
ンおよび／またはポリメチルフェニルシロキサンであ
る、請求項１記載の被覆保護剤。2. The coating protective agent according to claim 1, wherein part of (A) is polydimethylsiloxane and / or polymethylphenylsiloxane having one end blocked with dimethylvinylsiloxy unit.
キサン単位を有するポリメチルハイドロジェンシロキサ
ンである、請求項１記載の被覆保護剤。3. The coating protective agent according to claim 1, wherein (B) is a polymethyl hydrogen siloxane having a dimethyl hydrogen siloxane unit.
求項１記載の被覆保護剤。4. The coating protective agent according to claim 1, which is a coating protective agent for an optocoupler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2679798A JP3922785B2 (en) | 1998-02-09 | 1998-02-09 | Optical semiconductor insulation coating protective agent |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2679798A JP3922785B2 (en) | 1998-02-09 | 1998-02-09 | Optical semiconductor insulation coating protective agent |
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| JPH11222555A true JPH11222555A (en) | 1999-08-17 |
| JP3922785B2 JP3922785B2 (en) | 2007-05-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2679798A Expired - Fee Related JP3922785B2 (en) | 1998-02-09 | 1998-02-09 | Optical semiconductor insulation coating protective agent |
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| JP2002141536A (en) * | 2000-08-23 | 2002-05-17 | Nisshin Steel Co Ltd | Thin film polycrystalline silicon solar cell substrate superior in heat resistance and manufacturing method thereof |
| JP2004140220A (en) * | 2002-10-18 | 2004-05-13 | Nippon Pelnox Corp | Photoelectric converter |
| JP2004292807A (en) * | 2003-03-12 | 2004-10-21 | Shin Etsu Chem Co Ltd | Covering protective material for light-emitting semiconductor and light-emitting semiconductor device |
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