JPH11185579A - Protecting element - Google Patents
Protecting elementInfo
- Publication number
- JPH11185579A JPH11185579A JP36449697A JP36449697A JPH11185579A JP H11185579 A JPH11185579 A JP H11185579A JP 36449697 A JP36449697 A JP 36449697A JP 36449697 A JP36449697 A JP 36449697A JP H11185579 A JPH11185579 A JP H11185579A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- substrate
- fuse
- reagent
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
Landscapes
- Fuses (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、電子部品や電気
製品等の使用中に生じる過電流や加熱による破損から回
路やその他重要な部品を保護する保護素子に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a protection element for protecting circuits and other important parts from damage caused by overcurrent or heating during use of electronic parts and electric appliances.
【０００２】[0002]
【従来の技術】従来、保護素子はヒューズのように主と
して過電流の発生により動作する過電流保護機能、ある
いはサーミスタやバイメタルスイッチのように加熱によ
り作動する加熱保護機能を有したものがあった。2. Description of the Related Art Heretofore, there have been protection elements having an overcurrent protection function, such as a fuse, which operates mainly when an overcurrent is generated, or a heating protection function, such as a thermistor or a bimetal switch, which operates by heating.
【０００３】また特開平７−１５３３６７号公報に開示
されているように、低融点金属及び発熱体と、検知素子
から構成される保護素子であって、この低融点金属とこ
の発熱体とが絶縁層を介して接触され、電圧の異常を検
知する検知素子により発熱体が通電されて動作する保護
素子も提案されている。Further, as disclosed in Japanese Patent Application Laid-Open No. Hei 7-153467, a protective element comprising a low melting point metal and a heating element and a sensing element, wherein the low melting point metal and the heating element are insulated. There has also been proposed a protection element which is contacted via a layer, and which operates when a heating element is energized by a detection element which detects abnormal voltage.
【０００４】[0004]
【発明が解決しようとする課題】上記従来の技術の前者
の場合、保護素子は過電流、加熱あるいはその他の異常
により動作する機能のうち、一つの機能しか有しておら
ず、近年の電子機器の小型化薄型化に伴い、単一の保護
機能では開発される種々の電気製品に設けられた回路を
十分に保護することができなかった。また、各機能を有
する保護素子を複数設けると、各機能で作用する抵抗値
等の条件が異なるため、それぞれに適した抵抗値等を設
定する必要があり、回路が複雑になり、これらの保護回
路のための電力損失も生じ、さらに製造が複雑でコスト
が高くなるという問題を有していた。In the former case of the above prior art, the protection element has only one of the functions that operate due to overcurrent, heating, or other abnormalities. With the miniaturization and thinning of the electronic devices, a single protection function has not been able to sufficiently protect circuits provided in various developed electrical products. In addition, when a plurality of protection elements having each function are provided, conditions such as resistance values acting on each function are different. Therefore, it is necessary to set appropriate resistance values and the like for each, and the circuit becomes complicated. There has been a problem that power loss for the circuit also occurs, and that the manufacturing is complicated and the cost is high.
【０００５】また上記従来の技術の後者の場合、基板上
に形成した複数の抵抗体にエポキシ樹脂等の絶縁性樹脂
を被覆し、さらにこの樹脂層を介して低融点金属をヒュ
ーズとして用いている。このため、樹脂層を介して熱伝
導を行い、低融点金属を切断することから、構造が複雑
で応答性が悪く、さらに製造工程が多いため、生産コス
トが高くなるものであった。In the latter case of the prior art, a plurality of resistors formed on a substrate are coated with an insulating resin such as an epoxy resin, and a low melting point metal is used as a fuse through this resin layer. . For this reason, heat conduction is performed through the resin layer to cut the low-melting-point metal, so that the structure is complicated, the response is poor, and the number of manufacturing steps increases, so that the production cost increases.
【０００６】この発明は上記従来の技術の問題点に鑑み
てなされたものであり、過電流と加熱による保護機能を
合わせ持ち、簡単な構造の保護素子を提供することを目
的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the related art, and has as its object to provide a protection element having both a protection function by overcurrent and heating and having a simple structure.
【０００７】[0007]
【課題を解決するための手段】この発明の保護素子は、
絶縁性の第一の基板表面に、導体とこの導体を被覆する
ヒューズ試薬とを設け、またこの第一の基板と対面して
発熱体を設けた第二の基板とを備えている。この構造に
より、上記第二の基板に設けた発熱体の発熱により、対
面する第一の基板表面のヒューズ試薬の温度は上昇し、
さらに第一の基板に設けた導体中の金属がヒューズ試薬
中に拡散し、導体の導通状態を遮断し回路を保護する。
発熱体は所定の電圧以上で通電する検知用回路に接続さ
れ、導体は電子機器等のメイン回路に接続される。また
上記ヒューズ試薬は、高い熱伝導性の無機物質を分散し
た樹脂等の組成物からなる保護皮膜により被覆されでい
る。Means for Solving the Problems The protection element of the present invention comprises:
A conductor and a fuse reagent covering the conductor are provided on the surface of the insulating first substrate, and a second substrate provided with a heating element facing the first substrate is provided. With this structure, the temperature of the fuse reagent on the surface of the first substrate facing the substrate increases due to the heat generated by the heating element provided on the second substrate,
Further, the metal in the conductor provided on the first substrate diffuses into the fuse reagent, interrupting the conductive state of the conductor and protecting the circuit.
The heating element is connected to a detection circuit that is energized at a predetermined voltage or higher, and the conductor is connected to a main circuit such as an electronic device. Further, the fuse reagent is covered with a protective film made of a composition such as a resin in which an inorganic substance having high thermal conductivity is dispersed.
【０００８】[0008]
【発明の実施の形態】以下、この発明の実施形態につい
て図面に基づいて説明する。図１はこの発明の第一実施
形態を示すもので、この保護素子１０は、チップ状の基
板１２と、異常を検するための検知用回路やその他の回
路が形成された回路基板１４が所定の間隔を有して設け
られ、各基板１２，１４が向かい合う側面には各々一対
の電極１６，２４が形成されている。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. In this protection element 10, a chip-like substrate 12 and a circuit board 14 on which a detection circuit for detecting an abnormality and other circuits are formed are provided. , And a pair of electrodes 16 and 24 are formed on the side surfaces of the substrates 12 and 14 facing each other.
【０００９】基板１２に設けられた一対の電極１６上に
は、導通性を有する導体１８が形成され、さらにこの導
体１８の表面には、絶縁性のヒューズ試薬２０と、絶縁
性を有し高熱伝導性の保護皮膜２２が積層されている。
一方検知用基板１４に設けられた一対の電極２４上に
は、スクリーン印刷等を用い、導電性ペーストの発熱体
２６が形成されている。A conductive conductor 18 having conductivity is formed on a pair of electrodes 16 provided on the substrate 12, and an insulating fuse reagent 20 and an insulating and high heat A conductive protective film 22 is laminated.
On the other hand, a heating element 26 of a conductive paste is formed on the pair of electrodes 24 provided on the detection substrate 14 by screen printing or the like.
【００１０】基板１２と回路基板１４は、例えば、９６
％のアルミナを含有するセラミック等からなり、特に基
板１２は、導体１８を形成することができる材料であれ
ばよい。またこられ基板１２，１４上に設けられた電極
１６，２４は、銀塗料や銀−パラジウム塗料をスクリー
ン印刷等を用い形成される。The board 12 and the circuit board 14 are, for example, 96
%, And the substrate 12 may be made of any material that can form the conductor 18. The electrodes 16 and 24 provided on the substrates 12 and 14 are formed by screen printing of silver paint or silver-palladium paint.
【００１１】導体１８は、ニッケル−リンやニッケル−
スズからなるメッキ膜、またはＳｎＯ2とＳｂ2Ｏ4の混
合物の酸化金属からなり、抵抗値が小さい方が好まし
い。The conductor 18 is made of nickel-phosphorous or nickel-phosphorous.
A plated film made of tin or a metal oxide of a mixture of SnO 2 and Sb 2 O 4 and having a small resistance value is preferable.
【００１２】ヒューズ試薬２０は、ガラスペーストで軟
化温度が比較的低く、軟化温度が３５０℃のＰｂＯ・Ｂ
2Ｏ3系や、軟化温度が３００℃のＰｂＯ・Ｂ2Ｏ3とＴｉ
2Ｏ混合物を用いる。The fuse reagent 20 is a glass paste having a relatively low softening temperature, and PbO.B having a softening temperature of 350 ° C.
2 O 3 system and a softening temperature of the 300 ° C. PbO · B 2 O 3 and Ti
Use a 2O mixture.
【００１３】また、保護皮膜２２は、ヒューズ試薬２０
の融溶による変形を封止する耐熱性の良好な熱硬化性樹
脂からなり、エポキシ樹脂、不飽和ポリエステル樹脂、
フェノール樹脂等を用いることができる。またこの絶縁
性の保護皮膜２２に熱伝導性の高い無機粉末を分散させ
ることにより、回路基板１４に設けた発熱体２６の発熱
時の熱を効率的にヒューズ試薬２０や導体１８に伝える
ことができる。ここで用いる無機粉末には、例えばアル
ミナ粉体がある。The protective coating 22 is formed of the fuse reagent 20.
Made of thermosetting resin with good heat resistance to seal deformation due to melting of epoxy resin, unsaturated polyester resin,
A phenol resin or the like can be used. In addition, by dispersing inorganic powder having high thermal conductivity in the insulating protective film 22, heat generated by the heating element 26 provided on the circuit board 14 can be efficiently transmitted to the fuse reagent 20 and the conductor 18. it can. The inorganic powder used here includes, for example, alumina powder.
【００１４】発熱体２６は、ＲｕＯ2−ガラス等からな
る厚膜ペーストや、カーボン系のレジンペースト等から
なり、過電流及び長時間の一定の電流により発熱しやす
く、過電流や加熱が生じた場合、これらを検知する作用
を有している。The heating element 26 is made of a thick film paste made of, for example, RuO 2 -glass, a carbon-based resin paste, or the like, and easily generates heat due to an overcurrent and a constant current for a long time, causing overcurrent and heating. In such a case, it has the function of detecting these.
【００１５】次に、この保護素子１０の作用を説明す
る。通常の使用状態においては、基板１２に設けた電極
１６間の導体１８に所定の電流が流れ、電子機器が作動
する。ここで、基板１２に設けた電極１６間の導体１８
は、ほとんど抵抗がない。そして使用中等に異常な電圧
が生じると、図示しない検知回路により回路基板１４に
設けた電極２４間の発熱体２４に電気が流れ発熱する。
また、発熱体２６は所定の抵抗値を有し、一定量以上の
過電流や、長時間に渡る電流が流れ続けると、発熱体２
６が発熱するものでも良い。さらに、検知回路は、所定
の電圧を検知して発熱体２６に通電するものであれば、
その回路構成は問わない。Next, the operation of the protection element 10 will be described. In a normal use state, a predetermined current flows through the conductor 18 between the electrodes 16 provided on the substrate 12, and the electronic device operates. Here, a conductor 18 between the electrodes 16 provided on the substrate 12
Has little resistance. When an abnormal voltage is generated during use or the like, a detection circuit (not shown) causes electricity to flow to the heating element 24 between the electrodes 24 provided on the circuit board 14 to generate heat.
Further, the heating element 26 has a predetermined resistance value, and when an overcurrent exceeding a certain amount or a current for a long time continues to flow, the heating element 2
6 may generate heat. Furthermore, if the detection circuit detects a predetermined voltage and energizes the heating element 26,
The circuit configuration does not matter.
【００１６】発熱体２６から生じた熱は、高い熱伝導性
を有する保護皮膜２２とヒューズ試薬２０を一定温度以
上にするとともに、導体１８に含有される金属が熱によ
りヒューズ試薬２０中に拡散する。そのため、所定温度
以上で導体１８は導電性を失い、電極１６間の通電状態
が遮断され、導体２６に直列に接続された電子機器のメ
イン回路が、過電流や発熱から保護される。The heat generated from the heating element 26 causes the protective film 22 having high thermal conductivity and the fuse reagent 20 to reach a certain temperature or higher, and the metal contained in the conductor 18 diffuses into the fuse reagent 20 due to the heat. . Therefore, the conductor 18 loses conductivity at a predetermined temperature or higher, the conduction between the electrodes 16 is cut off, and the main circuit of the electronic device connected in series with the conductor 26 is protected from overcurrent and heat generation.
【００１７】次にこの発明の第二実施形態について図２
をもとにして説明する。ここで、上記実施形態と同様の
部材は同一符号を付して説明を省略する。この実施形態
は、導体１６と発熱体２６を基板１２を挟んで表裏に形
成したものである。そして、電極１６を回路基板側の電
極１６に接続し、上記実施形態と同様に使用する。Next, a second embodiment of the present invention will be described with reference to FIG.
It will be described based on Here, the same members as those in the above embodiment are denoted by the same reference numerals, and description thereof will be omitted. In this embodiment, the conductor 16 and the heating element 26 are formed on both sides of the substrate 12. Then, the electrode 16 is connected to the electrode 16 on the circuit board side, and is used in the same manner as in the above embodiment.
【００１８】この実施形態の保護素子によれば、一つの
チップ状基板に発熱体とチップ抵抗器を形成したので、
保護素子１０の取付が容易であり、基板１２をセラミッ
ク基板にすることにより熱伝導も良好であり、動作も確
実である。According to the protection element of this embodiment, since the heating element and the chip resistor are formed on one chip-shaped substrate,
The mounting of the protection element 10 is easy, the heat conduction is good and the operation is reliable by using the ceramic substrate as the substrate 12.
【００１９】なお、この発明の保護素子１０を形成する
部材は、上述の例に限らず、適宜他の物質等に変更する
ことが可能であり、基板１２と回路基板１４間の間隔
は、この保護素子を有する電器製品や電機部品により適
当な間隔に設定し、最適な保護効果が得られるようにす
る。The member forming the protection element 10 of the present invention is not limited to the above-described example, but can be appropriately changed to another material or the like. Appropriate intervals are set by electric appliances or electric parts having a protection element so that an optimum protection effect can be obtained.
【００２０】[0020]
【発明の効果】この発明の保護素子は、過電流又は一定
温度以上の発熱が生じた場合、すみやかに通電状態を遮
断し、電子機器のメイン回路を保護する機能を有する。
また、この発明の保護素子は、構造が単純なことから製
造工程を簡略化することができ、コストダウンが可能と
なる。The protection element according to the present invention has a function of immediately interrupting the energized state and protecting the main circuit of an electronic device when an overcurrent or heat generation exceeding a certain temperature occurs.
Further, since the protection element of the present invention has a simple structure, the manufacturing process can be simplified, and the cost can be reduced.
【図１】この発明の第一実施形態の保護素子を示す断面
図である。FIG. 1 is a sectional view showing a protection element according to a first embodiment of the present invention.
【図２】この発明の第二実施形態の保護素子を示す断面
図である。FIG. 2 is a sectional view showing a protection element according to a second embodiment of the present invention.
１０ 保護素子 １２ 基板 １４ 回路基板 １６，２４ 電極 １８ 導体 ２０ ヒューズ試薬 ２２ 保護皮膜 ２６ 発熱体 DESCRIPTION OF SYMBOLS 10 Protective element 12 Substrate 14 Circuit board 16 and 24 Electrode 18 Conductor 20 Fuse reagent 22 Protective film 26 Heating element
フロントページの続き (72)発明者 嶋田 真人 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内Continued on the front page (72) Inventor Masato Shimada 3158 Shimookubo, Osawano-cho, Kamishinkawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd.
Claims (4)
体と、この導体を被覆するヒューズ試薬とを設け、この
第一の基板と対面して発熱体を設けた第二の基板を備
え、上記発熱体の発熱による所定の温度で上記導体が遮
断されることを特徴とする保護素子。1. A second substrate provided with a conductor formed on the surface of an insulating first substrate and a fuse reagent covering the conductor, and provided with a heating element facing the first substrate. A protection element, wherein the conductor is cut off at a predetermined temperature due to heat generated by the heating element.
記ヒューズ試薬の温度上昇により、上記導体中の金属が
上記ヒューズ試薬中に拡散し、上記導体の導通状態を遮
断することを特徴とする請求項１記載の保護素子。2. The heating element generates heat at a predetermined voltage or higher, and the metal in the conductor diffuses into the fuse reagent due to a rise in the temperature of the fuse reagent, thereby interrupting the conductive state of the conductor. The protection element according to claim 1.
用回路に接続され、上記導体は保護される回路に接続さ
れることを特徴とする請求項１又は２記載の保護素子。3. The protection element according to claim 1, wherein the heating element is connected to a detection circuit that is energized at a predetermined voltage, and the conductor is connected to a circuit to be protected.
物質を分散した保護皮膜により被覆されていることを特
徴とする請求項１，２又は３記載の保護素子。4. The protective element according to claim 1, wherein said fuse reagent is covered with a protective film in which a highly thermally conductive inorganic substance is dispersed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36449697A JPH11185579A (en) | 1997-12-17 | 1997-12-17 | Protecting element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36449697A JPH11185579A (en) | 1997-12-17 | 1997-12-17 | Protecting element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11185579A true JPH11185579A (en) | 1999-07-09 |
Family
ID=18481958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36449697A Pending JPH11185579A (en) | 1997-12-17 | 1997-12-17 | Protecting element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11185579A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013512538A (en) * | 2009-11-24 | 2013-04-11 | リッテルフューズ，インコーポレイティド | Circuit protection device |
-
1997
- 1997-12-17 JP JP36449697A patent/JPH11185579A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013512538A (en) * | 2009-11-24 | 2013-04-11 | リッテルフューズ，インコーポレイティド | Circuit protection device |
| US9401257B2 (en) | 2009-11-24 | 2016-07-26 | Littelfuse, Inc. | Circuit protection device |
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