JPH11184539A - Driving device and stage device and exposure device using it - Google Patents
Driving device and stage device and exposure device using itInfo
- Publication number
- JPH11184539A JPH11184539A JP35501997A JP35501997A JPH11184539A JP H11184539 A JPH11184539 A JP H11184539A JP 35501997 A JP35501997 A JP 35501997A JP 35501997 A JP35501997 A JP 35501997A JP H11184539 A JPH11184539 A JP H11184539A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- cooling
- driving
- driving means
- stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Flow Control (AREA)
- Control Of Temperature (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えば半導体露光
装置や形状計測装置の移動テーブル、高精度加工機など
の精密位置決め装置に好適に使用される駆動装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a driving device suitably used for a precision positioning device such as a moving table of a semiconductor exposure device or a shape measuring device and a high-precision processing machine.
【０００２】[0002]
【従来の技術】ナノメートル（ｎｍ）オーダーの精密位
置決め精度が要求される超高精度の装置では、例えば１
００ｍｍの低熱膨張材（熱膨張係数１×１０-6）が１℃
の温度変化で１００ｎｍ変形し、また、光干渉式測長計
の光路における空気温度の変化が１℃であっても位置の
測定値が条件によっては１００ｎｍ変化するため、これ
ら温度変化の防止策として駆動手段から放出される熱を
回収する駆動装置の冷却は必須となっている。また、温
度分布の不均一も、光干渉式測長計の誤差要因である空
気揺らぎの主な原因の一つであるため、駆動装置の温度
不均一を出来るだけ抑える努力がなされている。2. Description of the Related Art In an ultra-high-precision apparatus requiring a precise positioning accuracy on the order of nanometers (nm), for example, 1
00mm low thermal expansion material (thermal expansion coefficient 1 × 10 -6 ) 1 ℃
Of the air temperature in the optical path of the optical interferometer is 1 ° C., but the measured value at the position changes by 100 nm depending on the conditions. Cooling of the drive to recover the heat released from the means is essential. In addition, since uneven temperature distribution is also one of the main causes of air fluctuation which is an error factor of the optical interference type length measuring device, efforts have been made to minimize the uneven temperature of the driving device.
【０００３】駆動手段の発熱が構造体の熱変形や光干渉
式測長計の誤差要因となる空気揺らぎをもたらすため、
精密な位置決め装置においては冷媒、ヒートパイプ、ペ
ルチェ素子等の手段を用いて冷却を行っており、駆動手
段の発熱時に駆動手段や駆動手段が搭載される装置が所
定温度になるように、冷媒の温度や流量、ヒートパイプ
の放熱部温度、ペルチェ素子の駆動電流等を調整してい
る。特に、冷媒を循環させて熱を回収するときには、特
開平7-302124号公報、特開平7-302747号公報のように発
熱源近傍に温度計測手段を設け、これにより得られた温
度をもとに冷媒温度や冷媒流量を調整して駆動装置全体
の冷却を調整している。The heat generated by the driving means causes thermal deformation of the structure and air fluctuation which causes an error in the optical interference type length measuring device.
In the precise positioning device, cooling is performed using means such as a refrigerant, a heat pipe, and a peltier element.When the driving means generates heat, the driving means and the device on which the driving means is mounted have a predetermined temperature. The temperature and flow rate, the temperature of the heat radiating section of the heat pipe, the drive current of the Peltier element, and the like are adjusted. In particular, when recovering heat by circulating the refrigerant, JP-A-7-302124, a temperature measuring means is provided near the heat source as in JP-A-7-302747, and based on the temperature obtained thereby, The cooling of the entire drive device is adjusted by adjusting the coolant temperature and the coolant flow rate.
【０００４】図１３はこのような従来の駆動装置の一例
を示す構成図である。同図に示されているように、位置
計測手段１２、コントローラ１４、およびドライバ１５
により位置決め対象１０の精密な位置決めを行う駆動装
置では、冷却手段６により冷媒３を循環させて駆動手段
１ａ，１ｂからの熱を回収している。このとき流れる冷
媒３の温度や流量は、駆動手段もしくはその近傍に温度
センサ５および温度計測手段２を設け、その温度に基き
冷却量制御手段４が冷却手段６に冷媒３ａの温度、又は
流量の設定指令を出している。FIG. 13 is a block diagram showing an example of such a conventional driving device. As shown in the figure, the position measuring means 12, the controller 14, and the driver 15
In the drive device that performs precise positioning of the positioning target 10 by using the cooling means 6, the cooling medium 6 circulates the refrigerant 3 to recover heat from the driving means 1a and 1b. The temperature and the flow rate of the refrigerant 3 flowing at this time are determined by providing a temperature sensor 5 and a temperature measuring means 2 at or near the driving means, and based on the temperature, the cooling amount control means 4 gives the cooling means 6 the temperature or flow rate of the refrigerant 3a. A setting command has been issued.
【０００５】すなわち、駆動手段の発熱が多く温度が上
がるときには冷媒の温度を下げる又は冷媒の流量を多く
して冷却量を増し、反対に発熱が少なく温度が下がると
きには冷媒の温度を上げる又は冷媒の流量を少なくして
冷却量を減らすことにより、駆動装置全体やその近傍の
構造体、雰囲気などの温度が変動しないようにしてい
る。That is, when the driving means generates a large amount of heat and the temperature rises, the temperature of the refrigerant is decreased or the flow rate of the refrigerant is increased to increase the cooling amount. Conversely, when the heat generation is small and the temperature is decreased, the temperature of the refrigerant is increased or the refrigerant is cooled. By reducing the flow rate and the cooling amount, the temperature of the entire driving device, the structure near the driving device, the atmosphere, and the like does not fluctuate.
【０００６】[0006]
【発明が解決しようとする課題】従来以上のさらなる高
精度かつ高速な位置決めの追求には、駆動装置の温度変
化をさらに軽減することはもちろん、レーザー干渉計に
よる長さ計測の安定性をさらに向上させるために駆動装
置の温度均一性の向上も不可欠である。In pursuit of higher precision and higher speed positioning than before, not only the temperature change of the driving device is further reduced, but also the stability of the length measurement by the laser interferometer is further improved. In order to achieve this, it is essential to improve the temperature uniformity of the driving device.
【０００７】しかし上記従来例では、複数の温度センサ
および温度計測手段からの出力温度をもとに、それぞれ
の温度に重み付けを行ったり、それぞれの温度の最大値
を選択するなどして駆動装置の全体的な温度を基準にし
て調整された温度又は流量の冷媒を循環させているが、
駆動手段の発熱分布が変化するに従い駆動装置の温度分
布も変化してしまい、近年の温度均一性に関する要求に
対応できなくなってきた。However, in the above-mentioned conventional example, the respective temperatures are weighted based on the output temperatures from the plurality of temperature sensors and the temperature measuring means, or the maximum value of each temperature is selected, for example. While circulating a refrigerant at a temperature or flow rate adjusted based on the overall temperature,
As the heat generation distribution of the driving means changes, the temperature distribution of the driving device also changes, and it has become impossible to cope with recent demands regarding temperature uniformity.
【０００８】一般に駆動手段の発熱分布が均一でない場
合、発熱していない部分は駆動手段の位置的な温度上昇
割合が少なく、発熱部分は位置的な温度上昇割合が大き
くなるが、発熱部の位置が変化すると温度上昇の小さい
部分と大きい部分の位置が変化するため、駆動装置での
温度分布が変わってくる。また、駆動装置の駆動範囲の
長尺化に対して冷却範囲が広くなってきており、これに
伴って駆動装置の最高温度と最低温度との温度差が大き
くなり、温度許容差に対する要求に応えられなくなって
いる。これらの状況・度合いは発熱分布つまりは駆動パ
ターンによって様々に変化する。そのため位置測定手段
の測定誤差が生じかつ安定せず、また測定誤差を減らす
ための補正も時系列的な温度変化のため難しく、ナノメ
ートルオーダーの精密位置決めの障害になる。In general, when the heat generation distribution of the driving means is not uniform, the portion where heat is not generated has a small local temperature rise rate of the drive means, and the heat generation portion has a large local temperature rise rate. Changes, the positions of the portion where the temperature rise is small and the portion where the temperature rise is large change, so that the temperature distribution in the driving device changes. In addition, the cooling range has become wider as the driving range of the drive unit has become longer, and the temperature difference between the highest temperature and the lowest temperature of the drive unit has increased accordingly. Is no longer possible. These situations / degrees change variously depending on the heat generation distribution, that is, the driving pattern. For this reason, a measurement error occurs in the position measuring means and the measurement is not stable, and correction for reducing the measurement error is difficult due to a time-series temperature change, which hinders precise positioning on the order of nanometers.
【０００９】本発明の目的は、より一層の許容温度の要
求に応えられるように、駆動手段が発する熱に起因する
位置決め精度への悪影響を除去することにある。また、
この駆動装置を用いた優れた位置決め精度を有するステ
ージ装置や露光装置、さらにはデバイス製造方法を提供
することを目的とする。An object of the present invention is to eliminate the adverse effect on the positioning accuracy due to the heat generated by the driving means so as to meet the demand for a higher allowable temperature. Also,
An object of the present invention is to provide a stage apparatus and an exposure apparatus having excellent positioning accuracy using the driving apparatus, and a device manufacturing method.
【００１０】[0010]
【課題を解決するための手段】この目的を達成するため
本発明の駆動装置は、位置決めを行うための駆動力を発
生する駆動手段と、前記駆動手段から生じる熱を冷媒を
用いて回収する冷却手段とを備える駆動装置において、
前記冷却手段が冷却範囲を分割して冷却することを特徴
とするものである。To achieve this object, a driving device according to the present invention comprises a driving means for generating a driving force for positioning, and a cooling means for recovering heat generated from the driving means by using a refrigerant. And a driving device comprising:
The cooling means is characterized in that cooling is performed by dividing a cooling range.
【００１１】これにより、駆動装置、駆動装置周囲の構
造体、雰囲気などの温度変化と温度不均一をなくし、構
造体の熱変形、温度変化・温度不均一に起因する測長誤
差を軽減し、駆動装置の位置決め精度を向上させること
ができる。This eliminates the temperature change and temperature non-uniformity of the driving device, the structure around the driving device, the atmosphere, etc., and reduces the thermal deformation of the structure, the length measurement error caused by the temperature change and the temperature non-uniformity, The positioning accuracy of the driving device can be improved.
【００１２】すなわち、駆動手段の発熱が駆動手段内で
不均一である場合、発熱の高い部分は冷媒の流量を多く
又は温度を下げて冷却量を増し、反対に、発熱が少ない
部分は冷媒の流量を少なく又は温度を上げて冷却量を減
らすことにより、駆動装置全体の温度を一定にし、駆動
パターンの変化による駆動装置の温度分布の変化を軽減
される。また、駆動部を分割して冷却することにより、
各部分に最適な冷却量を供給できるため、冷却効率も上
がり、駆動装置もしくはその近傍の構造体、もしくは雰
囲気などの温度変化も最小限に抑えられる。In other words, when the heat generated by the driving means is not uniform in the driving means, the high heat generating portion increases the flow rate of the refrigerant or lowers the temperature to increase the cooling amount. By reducing the cooling amount by decreasing the flow rate or increasing the temperature, the temperature of the entire driving device is kept constant, and the change in the temperature distribution of the driving device due to the change in the driving pattern is reduced. Also, by dividing and cooling the drive unit,
Since the optimum cooling amount can be supplied to each part, the cooling efficiency is increased, and the temperature change of the driving device or the structure near the driving device or the atmosphere is minimized.
【００１３】また、本発明のより好ましい形態は、前記
駆動手段の発熱部もしくはその近傍の温度を計測する温
度計測手段と、前記温度計測手段により得られた温度に
基づいて前記冷却手段が循環させる冷媒の温度又は流量
を制御する制御手段とを有することを特徴とする。これ
により、駆動パターンの変化により発熱分布が変化した
場合にも適切な冷却量を供給できるようになる。In a more preferred form of the present invention, a temperature measuring means for measuring a temperature of a heating portion of the driving means or a vicinity thereof, and the cooling means circulating based on a temperature obtained by the temperature measuring means. Control means for controlling the temperature or the flow rate of the refrigerant. Thus, an appropriate cooling amount can be supplied even when the heat generation distribution changes due to a change in the driving pattern.
【００１４】また、本発明は上記駆動装置を用いてステ
ージを移動することを特徴とするステージ装置、このス
テージ装置を有することを特徴とする露光装置、この露
光装置を用いてデバイスを製造することを特徴とするデ
バイス製造方法などである。According to the present invention, there is provided a stage apparatus for moving a stage using the above-described driving apparatus, an exposure apparatus having the stage apparatus, and a device manufactured using the exposure apparatus. And the like.
【００１５】[0015]
【発明の実施の形態】＜実施例１＞図１は本発明の実施
形態に係る駆動装置を示す構成図である。同図におい
て、１ａ，１ｂは一対の駆動手段であり、１ａは固定側
の駆動手段、１ｂは図面の左右方向に移動可能な可動側
の駆動手段である。５は駆動手段１ａもしくは１ｂに配
置された温度センサ、２は温度センサ５で測定した温度
データを外部へ出力する温度計測手段、３は駆動手段１
ａ，１ｂを冷却する冷媒、４は温度計測手段２から温度
データを受け取り冷媒３の温度を制御するための指令信
号を出力する温度制御手段、６ａ，６ｂ，６ｃは冷却量
制御手段４からの指令信号に基づき所定の冷却量の冷媒
を流す冷却手段、１０は可動側駆動手段１ｂに載置され
た位置決め対象、１１は可動側駆動手段１ｂに載置され
た位置決め対象１０の位置基準、１２は位置決め対象１
０の位置を位置基準１１を参照して計測する位置計測手
段、１３は位置計測手段１２が計測する長さ、１４は位
置計測手段１２から得た位置決め対象１０の位置データ
により駆動手段の駆動量を制御するための指令信号を出
力するコントローラ、１５はコントローラ１４からの指
令信号に従って駆動手段１ａ，１ｂを駆動するドライバ
である。Embodiment 1 FIG. 1 is a block diagram showing a driving apparatus according to an embodiment of the present invention. In the figure, reference numerals 1a and 1b denote a pair of driving means, 1a denotes a fixed driving means, and 1b denotes a movable driving means which is movable in the left-right direction of the drawing. 5 is a temperature sensor arranged in the driving means 1a or 1b, 2 is a temperature measuring means for outputting temperature data measured by the temperature sensor 5 to the outside, 3 is a driving means 1
a, a coolant for cooling 1b, 4 a temperature control means for receiving a temperature data from the temperature measuring means 2 and outputting a command signal for controlling a temperature of the coolant 3, 6a, 6b, 6c A cooling means for flowing a predetermined amount of cooling medium based on the command signal; 10 a positioning object mounted on the movable driving means 1b; 11 a position reference of the positioning object 10 mounted on the movable driving means 1b; Is the positioning target 1
Position measuring means for measuring the position of 0 with reference to the position reference 11, 13 is the length measured by the position measuring means 12, 14 is the driving amount of the driving means based on the position data of the positioning target 10 obtained from the position measuring means 12. Is a controller that outputs a command signal for controlling the driving means, and 15 is a driver that drives the driving units 1a and 1b in accordance with the command signal from the controller 14.
【００１６】固定された駆動手段１ａに対して、駆動手
段１ｂが図面の左右方向に動くことにより位置決め対象
１０は同方向に動き、位置決め対象１０の位置は位置基
準１１を基準として位置計測手段１２によって計測され
る。例えば、位置基準１１が反射ミラーで位置計測手段
１２がレーザ干渉計である場合には長さ１３が光路長と
なり、これが位置決め対象１０の位置となる。一般に位
置決め対象１０と位置基準１１はいくらか離れているた
め、かつ位置基準１１の位置を位置決め対象１２の位置
としているため、この両者間の距離変動は位置決めの誤
差となる。コントローラ１４は位置計測手段１２の位置
データを用いて位置決め対象１０が所定の位置に位置決
めされるようドライバ１５に指令を与え、ドライバ１５
は駆動手段１ａ，１ｂを駆動する。The positioning object 10 moves in the same direction as the driving means 1b moves in the horizontal direction in the drawing with respect to the fixed driving means 1a, and the position of the positioning object 10 is determined by the position measuring means 12 with reference to the position reference 11. Is measured by For example, when the position reference 11 is a reflection mirror and the position measuring means 12 is a laser interferometer, the length 13 is the optical path length, and this is the position of the positioning target 10. In general, since the positioning target 10 and the position reference 11 are somewhat distant from each other, and the position of the position reference 11 is set as the position of the positioning target 12, a change in the distance between the two results in a positioning error. The controller 14 gives a command to the driver 15 so that the positioning target 10 is positioned at a predetermined position by using the position data of the position measuring means 12, and the driver 15
Drives the driving means 1a and 1b.
【００１７】このとき、例えば駆動手段１ａに対して１
ｂが図面の中央付近で主に駆動する場合、駆動手段１ｂ
の駆動方向真ん中の部分Ａ２の発熱が多く、反対に駆動
手段１ｂの駆動方向両端の部分Ａ１,Ａ３は発熱が少な
い。そのため、図４のように駆動手段１ａの真ん中を頂
点とする山形の発熱分布となる。また、同様に駆動手段
１ａに対して１ｂが図面の左側で主に駆動する場合は図
５のような発熱分布、右側で主に駆動する場合は図６の
ような発熱分布になる。At this time, for example, 1
b mainly drives near the center of the drawing,
Generates heat in the middle portion A2 in the driving direction, and conversely, generates less heat in the portions A1 and A3 at both ends in the driving direction of the driving means 1b. Therefore, as shown in FIG. 4, a heat distribution having a mountain shape having a vertex in the middle of the driving unit 1 a is obtained. Similarly, when the driving means 1a is mainly driven on the left side of the drawing with respect to the driving means 1a, the heat generation distribution is as shown in FIG. 5, and when the driving means 1b is mainly driven on the right side, the heat generation distribution is as shown in FIG.
【００１８】従来は、温度計測手段２からの出力をもと
に駆動手段１ａ，１ｂ全体を一括して冷却しているた
め、駆動手段内で発熱の多い部分は冷媒の流れる方向に
対して急な温度上昇を生じ、反対に発熱の少ない部分は
緩やかな温度上昇を生じるるため、発熱分布によって様
々な温度分布を呈し一定にはならなかった。図７，図
８，図９はそれぞれ図４，図５，図６に対応した駆動手
段の温度分布である。主な発熱部が真ん中、左側、右側
の場合に対して駆動手段内の温度分布は一定ではなく変
化しているのが分かる。Conventionally, the entire driving means 1a and 1b are collectively cooled on the basis of the output from the temperature measuring means 2, so that a portion of the driving means which generates a large amount of heat is sharp in the direction in which the refrigerant flows. However, since the temperature rises sharply and the portion that generates less heat slowly raises the temperature, the temperature distribution varies depending on the heat generation distribution, and the temperature distribution does not become constant. FIGS. 7, 8, and 9 show temperature distributions of the driving means corresponding to FIGS. 4, 5, and 6, respectively. It can be seen that the temperature distribution in the driving means is not constant but changes in the case where the main heat generating portions are in the middle, left and right sides.
【００１９】そこで本実施例では、冷却手段６を複数の
冷却手段６ａ，６ｂ，６ｃに置き換えて駆動手段１ａの
冷却部分を分割部Ａ1，Ａ2，Ａ3に３分割してそれぞれ
の部分の発熱に合わせて冷却することで許容温度の要求
を満たすようにしている。例えば前例のように駆動手段
のＡ2部の発熱が大きくＡ1，Ａ3部の発熱が小さいとき
は、Ａ2部に流す冷媒３ｂの流量を多くする又は温度を
下げる等をして冷却手段で冷却量を増やし、Ａ1，Ａ3部
に流す冷媒３ａ，３ｃの流量を少なくする又は温度を上
げる等して冷却手段で冷却量を減らすことにより、各部
の発熱量に応じて最適な冷却を行ない、従来より各部の
温度変化を抑え、且つ駆動手段全体の温度分布を均一に
している。これにより駆動パターンの変化つまり発熱分
布の変化に対しても変わらず図３のような均一な温度分
布にすることが出来る。また分割して冷却することによ
り、冷媒あたりの冷却領域が少なくできるため効率よく
冷却でき、また駆動手段全体の最高温度と最低温度との
温度差ΔT1を、従来の温度差ΔT0a，ΔT0b，ΔT0cに比
べてほとんど無くすことが出来る。Therefore, in this embodiment, the cooling means 6 is replaced by a plurality of cooling means 6a, 6b, 6c, and the cooling part of the driving means 1a is divided into three parts A 1 , A 2 , A 3 and each part is divided into three parts. Cooling is performed in accordance with the heat generated by the device to satisfy the requirement of the allowable temperature. Such as fever greater A 1 of A 2 parts of the drive means as precedent, when heat generation of the A 3 parts is small, cooling the like lowering or temperature to increase the flow rate of the refrigerant 3b to flow into two parts A means in increasing the cooling amount, a 1, coolant flow through the a 3 parts 3a, in such to cooling means raising or temperature to reduce the flow rate of 3c by reducing the amount of cooling, optimum cooling in accordance with the heating value of each portion Is performed, the temperature change of each part is suppressed, and the temperature distribution of the entire driving means is made uniform. As a result, a uniform temperature distribution as shown in FIG. 3 can be obtained without changing the drive pattern, that is, the change in the heat generation distribution. Further, by dividing and cooling, the cooling area per refrigerant can be reduced, so that the cooling can be efficiently performed. In addition, the temperature difference ΔT 1 between the maximum temperature and the minimum temperature of the entire driving means can be reduced by the conventional temperature difference ΔT 0 a, ΔT 0 b and ΔT 0 c can be almost eliminated.
【００２０】駆動手段の駆動パターンがある程度限られ
ている場合は、予め駆動手段の各部の温度が一定になる
ように冷却量をいくつか設定しておき、駆動パターンに
応じて設定を変えることが可能であるが、複数の温度セ
ンサ５と温度計測手段２を設け、これらより得られる各
部分の温度データをもとに冷却量を冷却手段６ａ，６
ｂ，６ｃにより変化させることで、駆動パターンが不定
の場合も自動的に駆動手段１ａにおける各部分Ａ1，
Ａ2，Ａ3の温度を一定に保つことができる。すなわち、
温度センサ５および温度計測手段２より得られた駆動手
段１ａ，１ｂの各部温度に基づき、設定温度より高い部
分は冷媒の温度を下げる又は流量を多くすることにより
冷却量を増やし、反対に設定温度より低い部分は冷媒の
温度を上げる又は流量を少なくすることにより、各部分
Ａ1，Ａ2，Ａ3の発熱量に合わせて冷却を行い駆動手段
１ｂ全体の温度分布を一定にする。When the driving pattern of the driving means is limited to some extent, it is possible to set some cooling amounts in advance so that the temperature of each part of the driving means is constant, and change the setting according to the driving pattern. Although it is possible, a plurality of temperature sensors 5 and temperature measuring means 2 are provided, and the cooling amounts are determined based on the temperature data of the respective parts obtained from these sensors.
b, 6c, the respective portions A 1 , A 1 ,
The temperature of A 2 and A 3 can be kept constant. That is,
On the basis of the temperature of each part of the driving means 1a and 1b obtained from the temperature sensor 5 and the temperature measuring means 2, a portion higher than the set temperature increases the cooling amount by lowering the coolant temperature or increasing the flow rate. By raising the temperature of the refrigerant or reducing the flow rate of the lower portion, cooling is performed in accordance with the heat generation of each portion A 1 , A 2 , A 3 , and the temperature distribution of the entire driving means 1b is made constant.
【００２１】このように、駆動手段１ａの温度分布が均
一になると、特に計測する光路１３の温度分布の不均一
を防ぐことができ、位置計測手段１２の測定値が変動す
ることを回避できるため、従来よりも位置測定の際の誤
差が軽減して位置決め精度を向上させることができる。
また、冷却領域の分割により温度変化が従来よりも抑え
られることに加えて、光路１３の温度分布の変化がない
ため位置計測の際の温度補正を精度良く行えるため、従
来よりも安定かつ精度のよい位置計測を実現できる。As described above, when the temperature distribution of the driving means 1a is uniform, the nonuniform temperature distribution of the optical path 13 to be measured can be particularly prevented, and the fluctuation of the measured value of the position measuring means 12 can be avoided. In addition, errors in position measurement can be reduced as compared with the related art, and positioning accuracy can be improved.
Further, in addition to the fact that the temperature change is suppressed more than before by the division of the cooling region, the temperature correction at the time of position measurement can be performed with high accuracy because there is no change in the temperature distribution of the optical path 13, so that it is more stable and accurate than before. Good position measurement can be realized.
【００２２】＜実施例２＞図２は駆動手段として多極の
リニアモータを用いた別の実施形態を示す構成図であ
り、リニアモータのコイル部分を抽出した図である。<Embodiment 2> FIG. 2 is a block diagram showing another embodiment in which a multi-pole linear motor is used as a driving means, in which a coil portion of the linear motor is extracted.
【００２３】図中、２３ａ，２３ｂ，２３ｃはコイル、
５ａ，５ｂ，５ｃはそれぞれコイル２３ａ，２３ｂ，２
３ｃに配置された温度センサであり、3ａ，３ｂ，３ｃ
は各冷却部分Ａ1，Ａ2，Ａ3を冷却する冷媒である。多
極のリニアモータの場合コイルが複数個あるため、図２
のように複数点に温度センサを配置し、温度計測手段２
が測定した複数の温度を基にして各発熱部に最適な各冷
媒の温度又は流量を決定する。このようにすることで、
各コイルの発熱量の違いを各コイルへの冷却量を変える
ことで対応でき、どのコイルも一定温度に保つことが出
来る。In the figure, 23a, 23b and 23c are coils,
5a, 5b and 5c are coils 23a, 23b and 2 respectively.
3a, 3b, 3c.
Is a refrigerant for cooling the respective cooling portions A 1 , A 2 , A 3 . In the case of a multi-pole linear motor, since there are a plurality of coils, FIG.
Temperature sensors are arranged at a plurality of points as shown in FIG.
Determines the optimum temperature or flow rate of each refrigerant for each heat generating part based on the plurality of measured temperatures. By doing this,
The difference in the amount of heat generated by each coil can be handled by changing the amount of cooling to each coil, and all coils can be maintained at a constant temperature.
【００２４】＜実施例３＞図１０は、上記リニアモータ
を用いたステージ装置、及びこのステージ装置を備えた
半導体デバイス製造用の露光装置の構成を示す。<Embodiment 3> FIG. 10 shows the configuration of a stage apparatus using the above-described linear motor and an exposure apparatus equipped with the stage apparatus for manufacturing a semiconductor device.
【００２５】図中、定盤４１上にガイド４２とリニアモ
ータ４３の固定子を固設している。リニアモータ４３は
固定子に多相電磁コイルを、可動子に永久磁石群を有し
ている。リニアモータ４３の可動子を可動部４５及び可
動ガイド４４に接続して、リニアモータ４３の駆動によ
って可動ガイドを紙面法線方向に移動させる。可動部４
５は定盤４１の上面を基準に静圧軸受け４９で、ガイド
４２の側面を基準に静圧軸受け４８で保持する。可動ガ
イド４４をまたぐようにして配置した移動ステージ４７
は静圧軸受け５０によって支持している。この移動ステ
ージ４７は、上記説明したいずれかの構成を持ったリニ
アモータ４６によって、可動ガイド４４を基準にステー
ジ４７が紙面左右方向に移動する。ステージ４７の動き
はステージ４７に固設したミラー５１及びレーザー干渉
系５２を用いて計測する。ステージ４７に搭載したチャ
ックでウエハ４８を保持しており、このウエハ４８に回
路パターンを露光転写するために、光源５３及び投影光
学系５４によって、レチクル５５上の回路パターンをウ
エハ４８上に縮小転写する。上記説明したような特性の
リニアモータを用いることで、優れたステージ装置ひい
ては露光装置を達成している。In the figure, a guide 42 and a stator for a linear motor 43 are fixed on a surface plate 41. The linear motor 43 has a multi-phase electromagnetic coil on a stator and a permanent magnet group on a mover. The movable element of the linear motor 43 is connected to the movable part 45 and the movable guide 44, and the movable guide is moved in the normal direction of the drawing by driving the linear motor 43. Movable part 4
Reference numeral 5 denotes a static pressure bearing 49 based on the upper surface of the surface plate 41, and is held by a static pressure bearing 48 based on the side surface of the guide 42. Moving stage 47 arranged so as to straddle movable guide 44
Are supported by a static pressure bearing 50. The moving stage 47 is moved by the linear motor 46 having any one of the above-described configurations in the left-right direction of the drawing with respect to the movable guide 44. The movement of the stage 47 is measured using a mirror 51 fixed to the stage 47 and a laser interference system 52. A wafer 48 is held by a chuck mounted on a stage 47, and a circuit pattern on a reticle 55 is reduced and transferred onto the wafer 48 by a light source 53 and a projection optical system 54 in order to expose and transfer a circuit pattern on the wafer 48. I do. By using a linear motor having the above-described characteristics, an excellent stage device and, consequently, an exposure device are achieved.
【００２６】＜実施例４＞次に上記説明した露光装置又
は露光方法を利用したデバイス製造方法の実施形態を説
明する。<Embodiment 4> Next, an embodiment of a device manufacturing method using the above-described exposure apparatus or exposure method will be described.
【００２７】図１１は微小デバイス（ＩＣやＬＳＩ等の
半導体チップ、液晶パネル、ＣＣＤ、薄膜磁気ヘッド、
マイクロマシン等）の製造のフローを示す。ステップ１
（回路設計）ではデバイスのパターン設計を行なう。ス
テップ２（マスク製作）では設計したパターンを形成し
たマスクを製作する。一方、ステップ３（ウエハ製造）
ではシリコンやガラス等の材料を用いてウエハを製造す
る。ステップ４（ウエハプロセス）は前工程と呼ばれ、
上記用意したマスクとウエハを用いて、リソグラフィ技
術によってウエハ上に実際の回路を形成する。次のステ
ップ５（組み立て）は後工程と呼ばれ、ステップ４によ
って作製されたウエハを用いて半導体チップ化する工程
であり、アッセンブリ工程（ダイシング、ボンディン
グ）、パッケージング工程（チップ封入）等の工程を含
む。ステップ６（検査）ではステップ５で作製された半
導体デバイスの動作確認テスト、耐久性テスト等の検査
を行なう。こうした工程を経て半導体デバイスが完成
し、これが出荷（ステップ７）される。FIG. 11 shows a micro device (a semiconductor chip such as an IC or an LSI, a liquid crystal panel, a CCD, a thin film magnetic head,
2 shows a flow of manufacturing a micromachine or the like. Step 1
In (Circuit Design), a device pattern is designed. Step 2 is a process for making a mask on the basis of the designed pattern. Step 3 (wafer manufacturing)
Then, a wafer is manufactured using a material such as silicon or glass. Step 4 (wafer process) is called a pre-process,
An actual circuit is formed on the wafer by lithography using the prepared mask and wafer. The next step 5 (assembly) is called a post-process, and is a process of forming a semiconductor chip using the wafer produced in step 4, and includes processes such as an assembly process (dicing and bonding) and a packaging process (chip encapsulation). including. In step 6 (inspection), inspections such as an operation confirmation test and a durability test of the semiconductor device manufactured in step 5 are performed. Through these steps, a semiconductor device is completed and shipped (step 7).
【００２８】図１２は上記ウエハプロセスの詳細なフロ
ーを示す。ステップ１１（酸化）ではウエハの表面を酸
化させる。ステップ１２（ＣＶＤ）ではウエハ表面に絶
縁膜を形成する。ステップ１３（電極形成）ではウエハ
上に電極を蒸着によって形成する。ステップ１４（イオ
ン打込み）ではウエハにイオンを打ち込む。ステップ１
５（レジスト処理）ではウエハにレジストを塗布する。
ステップ１６（露光）では上記説明した露光装置又は露
光方法によってマスクの回路パターンをウエハの複数の
ショット領域に並べて焼付露光する。ステップ１７（現
像）では露光したウエハを現像する。ステップ１８（エ
ッチング）では現像したレジスト像以外の部分を削り取
る。ステップ１９（レジスト剥離）ではエッチングが済
んで不要となったレジストを取り除く。これらのステッ
プを繰り返し行なうことによって、ウエハ上に多重に回
路パターンが形成される。FIG. 12 shows a detailed flow of the wafer process. Step 11 (oxidation) oxidizes the wafer's surface. Step 12 (CVD) forms an insulating film on the wafer surface. Step 13 (electrode formation) forms electrodes on the wafer by vapor deposition. In step 14 (ion implantation), ions are implanted into the wafer. Step 1
In step 5 (resist processing), a resist is applied to the wafer.
Step 16 (exposure) uses the above-described exposure apparatus or exposure method to print the circuit pattern of the mask on a plurality of shot areas of the wafer by printing. Step 17 (development) develops the exposed wafer. In step 18 (etching), portions other than the developed resist image are removed. In step 19 (resist stripping), unnecessary resist after etching is removed. By repeating these steps, multiple circuit patterns are formed on the wafer.
【００２９】本実施例の生産方法を用いれば、従来は製
造が難しかった大型のデバイスを低コストに製造するこ
とができる。By using the production method of this embodiment, a large-sized device, which has been conventionally difficult to produce, can be produced at low cost.
【００３０】[0030]
【発明の効果】以上説明したように、駆動手段の分割し
た領域をそれぞれ冷却することで、駆動手段、駆動手段
周囲の構造体、雰囲気などの温度分布の不均一をなく
し、かつ温度変化を従来よりも抑えることが出来るた
め、構造体の熱変形、温度変化や温度分布の不均一に起
因する測長誤差を少なくし、駆動装置のナノメートルオ
ーダーの位置決め精度をさらに向上させることができ
る。As described above, by cooling each of the divided areas of the driving means, the temperature distribution of the driving means, the structure around the driving means, the atmosphere, and the like can be eliminated, and the temperature change can be reduced. Therefore, the length measurement error caused by the thermal deformation of the structure, the temperature change, and the non-uniform temperature distribution can be reduced, and the positioning accuracy of the nanometer order of the driving device can be further improved.
【００３１】また、駆動手段の分割された冷却部の温度
もしくはその近傍の温度を計測し、その温度に基づいて
前記分割された各冷却部に対する冷媒の温度又は流量を
制御することで、任意の駆動パターンに対しても駆動手
段の温度分布を一定にすることができ、さらなる高精度
化が達成できる。Further, by measuring the temperature of the divided cooling section of the driving means or the temperature in the vicinity thereof, and controlling the temperature or the flow rate of the refrigerant to each of the divided cooling sections based on the measured temperature, an arbitrary temperature can be obtained. The temperature distribution of the driving means can be kept constant with respect to the driving pattern, and higher accuracy can be achieved.
【００３２】また、このような駆動装置にリニアモータ
を用いたステージ装置を構成することにより、優れた位
置決め精度を有するステージ装置を提供することができ
る。Further, by configuring a stage device using a linear motor for such a driving device, a stage device having excellent positioning accuracy can be provided.
【００３３】また、前記ステージを有する露光装置によ
り優れた露光装置やデバイス製造方法を提供することが
出来る。Further, it is possible to provide an excellent exposure apparatus and a device manufacturing method using the exposure apparatus having the stage.
【図１】駆動装置の実施形態を示す構成図FIG. 1 is a configuration diagram showing an embodiment of a driving device.
【図２】リニアモータの構成図FIG. 2 is a configuration diagram of a linear motor.
【図３】固定側の駆動手段の温度分布を示す図FIG. 3 is a diagram illustrating a temperature distribution of a fixed-side driving unit.
【図４】固定側の駆動手段の発熱分布の一例を示す図FIG. 4 is a diagram showing an example of a heat generation distribution of a fixed-side drive unit.
【図５】図４に対する比較図FIG. 5 is a diagram comparing with FIG. 4;
【図６】固定側の駆動手段の発熱分布の一例を示す図FIG. 6 is a diagram illustrating an example of a heat generation distribution of a fixed-side driving unit.
【図７】図６に対する比較図FIG. 7 is a diagram comparing with FIG. 6;
【図８】固定側の駆動手段の発熱分布の一例を示す図FIG. 8 is a diagram illustrating an example of a heat generation distribution of a fixed-side driving unit.
【図９】図８に対する比較図FIG. 9 is a diagram comparing with FIG.
【図１０】リニアモータを用いたステージ装置を有する
露光装置の構成図FIG. 10 is a configuration diagram of an exposure apparatus having a stage device using a linear motor.
【図１１】デバイスの製造フローを示す図FIG. 11 is a view showing a device manufacturing flow.
【図１２】ウエハプロセスの詳細なフローを示す図FIG. 12 is a diagram showing a detailed flow of a wafer process.
【図１３】駆動装置の従来例を示す構成図FIG. 13 is a configuration diagram showing a conventional example of a driving device.
１ａ 固定側の駆動手段 １ｂ 可動側の駆動手段 ２ 温度計測手段 ３，３Ａ３ｂ，３ｃ 冷媒 ４ 温度制御手段 ５，５ａ，５ｂ，５ｃ 温度センサ ６ 冷却手段 １０ 位置決め対象 １１ 位置基準 １２ 位置計測手段 １３ 計測する長さ １４ コントローラ １５ ドライバ ２３ａ，２３ｂ，２３ｃ コイル ２４ コイル支持具 ３０ 設定温度 ３１，３２，３３，３４ 固定側の駆動手段１ａにおけ
る温度分布 ４１ 定盤 ４２ ガイド ４３ リニアモータ ４４ 可動ガイド ４５ 可動部 ４６ リニアモータ ４７ 移動ステージ ４８ ウエハ ４９ 静圧軸受け ５０ 静圧軸受け ５１ ミラー ５２ レーザー干渉系 ５３ 光源 ５４ 投影光学系 ５５ レチクル ΔＴ1 本実施形態での駆動装置での最高温度と最低温
度との差 ΔＴ0ａ，ΔＴ0ｂ，ΔＴ0ｃ 従来例装置での最高温度
と最低温度との差 Ａ1，Ａ2，Ａ3 駆動手段の各発熱部1a Fixed-side drive unit 1b Movable-side drive unit 2 Temperature measurement unit 3, 3A3b, 3c Refrigerant 4 Temperature control unit 5, 5a, 5b, 5c Temperature sensor 6 Cooling unit 10 Positioning target 11 Position reference 12 Position measurement unit 13 Measurement Length 14 controller 15 driver 23a, 23b, 23c coil 24 coil support 30 set temperature 31, 32, 33, 34 temperature distribution in fixed-side drive means 1a 41 platen 42 guide 43 linear motor 44 movable guide 45 movable part 46 the difference between the maximum and minimum temperatures of the drive device for a linear motor 47 moves the stage 48 the wafer 49 hydrostatic bearing 50 hydrostatic bearing 51 mirrors 52 laser interferometer system 53 light source 54 projecting optical system 55 reticle [Delta] T 1 present embodiment [Delta] T 0 a, ΔT 0 b, ΔT 0 c Maximum temperature in conventional device Difference between temperature and minimum temperature A 1 , A 2 , A 3 Each heating part of driving means
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｈ０１Ｌ 21/68 Ｈ０１Ｌ 21/68 Continued on the front page (51) Int.Cl. 6 Identification code FI H01L 21/68 H01L 21/68
Claims (6)
駆動手段と、前記駆動手段から生じる熱を冷媒を用いて
回収する冷却手段とを備える駆動装置において、前記冷
却手段が冷却範囲を分割して冷却することを特徴とする
駆動装置。1. A driving apparatus comprising: a driving unit for generating a driving force for performing positioning; and a cooling unit for recovering heat generated from the driving unit by using a refrigerant, wherein the cooling unit divides a cooling range. A drive device characterized by cooling by cooling.
の温度を計測する温度計測手段と、前記温度計測手段に
より得られた温度に基づいて前記冷却手段が循環させる
冷媒の温度又は流量を制御する制御手段とを有すること
を特徴とする請求項１記載の駆動装置。2. A temperature measuring means for measuring a temperature at or near a heat generating portion of the driving means, and controlling a temperature or a flow rate of a refrigerant circulated by the cooling means based on the temperature obtained by the temperature measuring means. The drive device according to claim 1, further comprising a control unit.
いて、前記駆動手段がリニアモータであること特徴とす
る駆動装置。3. The drive device according to claim 1, wherein said drive means is a linear motor.
によってステージを移動することを特徴とするステージ
装置。4. A stage device, wherein the stage is moved by the driving device according to claim 1.
とを特徴とする露光装置。5. An exposure apparatus comprising the stage device according to claim 4.
イスを製造することを特徴とするデバイス製造方法。6. A device manufacturing method, wherein a device is manufactured using the exposure apparatus according to claim 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35501997A JPH11184539A (en) | 1997-12-24 | 1997-12-24 | Driving device and stage device and exposure device using it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35501997A JPH11184539A (en) | 1997-12-24 | 1997-12-24 | Driving device and stage device and exposure device using it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11184539A true JPH11184539A (en) | 1999-07-09 |
Family
ID=18441430
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35501997A Withdrawn JPH11184539A (en) | 1997-12-24 | 1997-12-24 | Driving device and stage device and exposure device using it |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11184539A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100492476B1 (en) * | 2001-07-09 | 2005-06-03 | 캐논 가부시끼가이샤 | Exposure apparatus |
| US7177007B2 (en) | 2000-04-07 | 2007-02-13 | Canon Kabushiki Kaisha | Temperature adjustment apparatus, exposure apparatus having the temperature adjustment apparatus, and semiconductor device manufacturing method |
| JP2008288357A (en) * | 2007-05-17 | 2008-11-27 | Hitachi High-Technologies Corp | Substrate support device, and substrate support method |
| WO2009155090A3 (en) * | 2008-06-03 | 2010-03-11 | Applied Materials, Inc. | Fast substrate support temperature control |
| JP2010194638A (en) * | 2009-02-24 | 2010-09-09 | Ihi Corp | Lubricating method of inverting table device and lubricating system thereof |
| JP2012048165A (en) * | 2010-08-30 | 2012-03-08 | Hitachi High-Technologies Corp | Exposure device, stage temperature control method for exposure device, and display panel substrate manufacturing method |
-
1997
- 1997-12-24 JP JP35501997A patent/JPH11184539A/en not_active Withdrawn
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7177007B2 (en) | 2000-04-07 | 2007-02-13 | Canon Kabushiki Kaisha | Temperature adjustment apparatus, exposure apparatus having the temperature adjustment apparatus, and semiconductor device manufacturing method |
| KR100492476B1 (en) * | 2001-07-09 | 2005-06-03 | 캐논 가부시끼가이샤 | Exposure apparatus |
| JP2008288357A (en) * | 2007-05-17 | 2008-11-27 | Hitachi High-Technologies Corp | Substrate support device, and substrate support method |
| WO2009155090A3 (en) * | 2008-06-03 | 2010-03-11 | Applied Materials, Inc. | Fast substrate support temperature control |
| CN102903654A (en) * | 2008-06-03 | 2013-01-30 | 应用材料公司 | Temperature control of fast substrate support |
| US8596336B2 (en) | 2008-06-03 | 2013-12-03 | Applied Materials, Inc. | Substrate support temperature control |
| CN102903654B (en) * | 2008-06-03 | 2015-11-25 | 应用材料公司 | For controlling equipment and the method for the temperature of substrate support |
| JP2010194638A (en) * | 2009-02-24 | 2010-09-09 | Ihi Corp | Lubricating method of inverting table device and lubricating system thereof |
| JP2012048165A (en) * | 2010-08-30 | 2012-03-08 | Hitachi High-Technologies Corp | Exposure device, stage temperature control method for exposure device, and display panel substrate manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20050301 |