JPH1117292A - Printed circuit board and part mounter for mounting parts on the board - Google Patents
Printed circuit board and part mounter for mounting parts on the boardInfo
- Publication number
- JPH1117292A JPH1117292A JP9169327A JP16932797A JPH1117292A JP H1117292 A JPH1117292 A JP H1117292A JP 9169327 A JP9169327 A JP 9169327A JP 16932797 A JP16932797 A JP 16932797A JP H1117292 A JPH1117292 A JP H1117292A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- board
- distortion
- data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
Landscapes
- Structure Of Printed Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、部品実装に使用さ
れるプリント基板とこの基板に部品を実装する部品実装
機に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board used for component mounting and a component mounter for mounting components on the board.
【0002】[0002]
【従来の技術】部品実装に使用されるプリント基板は、
設計データ(通常はCADデータ)をもとに製作される
が、製作の工程においていくつかの製造誤差により設計
データと実際のプリント基板には、誤差が生じている。2. Description of the Related Art Printed circuit boards used for component mounting are:
Although it is manufactured based on design data (usually CAD data), errors occur between the design data and the actual printed circuit board due to some manufacturing errors in the manufacturing process.
【0003】プリント基板には、図4(a)に示す、表
面に部品実装用のランドRを設けた表面実装部品用プリ
ント基板1、図4(b)に示す、部品実装用の挿入穴S
を設けた挿入用プリント基板2、および図4(c)に示
す、ランドRと挿入穴Sを共に設けた表面実装および挿
入の混在プリント基板3の3種類がある。The printed circuit board has a surface-mounted component printed circuit board 1 provided with a component mounting land R on its surface as shown in FIG. 4A, and a component mounting insertion hole S shown in FIG. 4B.
There are three types: an insertion printed circuit board 2 provided with and a mixed printed circuit board 3 of surface mounting and insertion provided with both a land R and an insertion hole S shown in FIG.
【0004】表面実装部品用プリント基板1と挿入用プ
リント基板2には、図4(d)に実線で示すプリント基
板の歪み(基板製作上の誤差の分布)4が均等に発生す
る。このような、プリント基板の歪み4を検出するため
に、従来、図5に示すように、基板1(2)の対角に2
つの基板マーク6を付加しており、これらプリント基板
のマーク6間の距離を計測することにより歪み(基板の
収縮等)を算出している。In the printed circuit board 1 for surface mounting components and the printed circuit board 2 for insertion, distortion (distribution of errors in manufacturing the printed circuit board) 4 of the printed circuit board shown by a solid line in FIG. In order to detect such a distortion 4 of the printed circuit board, conventionally, as shown in FIG.
One substrate mark 6 is added, and the distortion (shrinkage of the substrate, etc.) is calculated by measuring the distance between the marks 6 on the printed circuit board.
【0005】図6のフローチャートを参照しながら部品
実装機における従来のプリント基板の歪み補正方法につ
いて説明する。まず、設計データ(CADデータなど)
をもとに基板マーク6の座標を含むNCデータを生成す
る(ステップ#1)。A conventional method for correcting the distortion of a printed circuit board in a component mounter will be described with reference to the flowchart of FIG. First, design data (CAD data, etc.)
The NC data including the coordinates of the substrate mark 6 is generated based on the above (Step # 1).
【0006】次に、ステップ#1で生成したNCデータ
を元に対角2点の基板マーク6を撮像装置(カメラな
ど)で撮影して実際の基板マーク6の座標を計測し、N
Cデータの基板マーク6の座標との差を検出し、図5に
示すX方向とY方向の補正率を算出する。たとえば、図
5において、NCデータが(X1,Y1)=(0,0)
mm、(X2,Y2)=(100,100)mmであ
り、プリント基板1(2)を実際に計測した結果が(X
1,Y1)=(0,0)mm、(X2,Y2)=(9
0,95)mmであった場合、X方向には、10%収縮
し、Y方向には5%収縮していることがわかる(ステッ
プ#2)。Next, based on the NC data generated in step # 1, two diagonal board marks 6 are photographed by an image pickup device (such as a camera), and the actual coordinates of the board marks 6 are measured.
The difference between the C data and the coordinates of the substrate mark 6 is detected, and the correction rates in the X and Y directions shown in FIG. 5 are calculated. For example, in FIG. 5, the NC data is (X1, Y1) = (0, 0)
mm, (X2, Y2) = (100, 100) mm, and the result of actually measuring the printed circuit board 1 (2) is (X
(1, Y1) = (0, 0) mm, (X2, Y2) = (9
In the case of (0,95) mm, it can be seen that it contracted 10% in the X direction and contracted 5% in the Y direction (step # 2).
【0007】次に、ステップ#2をもとに、部品を実際
に実装する際にステップ#1で生成したNCデータに対
し、ステップ#2に検出した補正率(X方向には、10
%収縮、Y方向には5%収縮)をかけて補正を行う(ス
テップ#3)。Next, based on step # 2, the NC data generated in step # 1 when the component is actually mounted is subjected to the correction factor (10 in the X direction) detected in step # 2.
% Contraction and 5% contraction in the Y direction) to perform correction (step # 3).
【0008】[0008]
【発明が解決しようとする課題】しかし、上記のような
プリント基板1,2における均等に分布した歪み4に対
しては適当な補正が可能であるが、局部的な分布の歪み
や基板上に不均一に分布する歪みについては全く役に立
たないのが現状であった。However, although it is possible to appropriately correct the uniformly distributed distortion 4 on the printed circuit boards 1 and 2 as described above, it is possible to locally correct the distortion 4 At present, nonuniformly distributed strains are of no use.
【0009】上記表面実装および挿入の混在プリント基
板3は、プリント基板3上に表面実装用のランドRを製
作後、挿入用の挿入穴Sを開けるため、その挿入穴Sの
分布が図4(c)に示すように全体に均等でないのが一
般的であり、ある局部的に挿入穴Sが集中していると、
他の部分と比較して図4(e)に示すようにプリント基
板の歪み5はばらついてしまう。このようなばらついた
基板の歪み5にたいして従来の補正の方法は全く役に立
たない。なお、図4(b)に示す挿入用プリント基板2
であっても、挿入穴Sの分布が均等でなければプリント
基板の歪みにばらつきが生じる。In the printed circuit board 3 in which the surface mounting and the insertion are mixed, since the land R for the surface mounting is formed on the printed circuit board 3 and the insertion hole S for the insertion is opened, the distribution of the insertion hole S is shown in FIG. As shown in c), it is general that the insertion holes S are not uniformly uniform.
As shown in FIG. 4E, the distortion 5 of the printed circuit board varies as compared with other portions. The conventional correction method is not useful at all for such uneven substrate distortion 5. In addition, the printed circuit board 2 for insertion shown in FIG.
However, if the distribution of the insertion holes S is not uniform, variations occur in the distortion of the printed circuit board.
【0010】本発明は、このようなプリント基板におい
て、局部的な分布の歪みや基板上に不均一に分布する歪
みを検出可能とすることを目的とする。また本発明は、
部品実装機において、基板上に分布する局所収縮または
広域収縮など様々な歪みに対して補正をかけプリント基
板上のランドや挿入穴に対して常に正確に実装するため
のデータを生成可能とすることを目的とする。An object of the present invention is to make it possible to detect a local distribution distortion and a non-uniform distribution on the substrate in such a printed circuit board. The present invention also provides
In the component mounter, it is necessary to correct various distortions such as local shrinkage or wide area shrinkage distributed on the board, and to be able to generate data for always accurate mounting on lands and insertion holes on the printed board. With the goal.
【0011】[0011]
【課題を解決するための手段】本発明のプリント基板に
おいては、基板表面全体に局所収縮または広域収縮を計
測するための被測定体を分布させたことを特徴としたも
のである。A printed circuit board according to the present invention is characterized in that a measurement object for measuring local shrinkage or wide area shrinkage is distributed on the entire surface of the board.
【0012】上記被測定体は、マークや模様により形成
される。この本発明によれば、局部的な分布の歪みや基
板上に不均一に分布する歪みを検出可能なプリント基板
が得られる。The object to be measured is formed of a mark or a pattern. According to the present invention, it is possible to obtain a printed circuit board capable of detecting local distribution distortion and distortion unevenly distributed on the substrate.
【0013】[0013]
【発明の実施の形態】本発明の請求項1に記載の発明
は、基板表面全体に局所収縮または広域収縮を計測する
ための被測定体を分布させたことを特徴としたものであ
り、基板全体に分布した被測定体の位置を計測すること
により、全体の歪みが検出可能となるという作用を有す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is characterized in that an object to be measured for measuring local shrinkage or wide area shrinkage is distributed over the entire surface of a substrate. By measuring the positions of the object to be measured distributed over the entirety, the entire distortion can be detected.
【0014】本発明の請求項2に記載の発明は、請求項
1に記載のプリント基板に部品を実装する部品実装機で
あって、被測定体を計測して前記プリント基板の局所収
縮または広域収縮を計測し、前記部品の実装位置を補正
する手段を有することを特徴としたものであり、基板全
体に分布した被測定体の位置を計測することにより、基
板上に分布する局所収縮または広域収縮など様々な全体
の歪みを求め、求めた歪みに対して補正をかけることに
よりプリント基板上のランドや挿入穴に対して常に正確
に部品を実装するためのデータが生成できるという作用
を有する。According to a second aspect of the present invention, there is provided a component mounting machine for mounting a component on the printed circuit board according to the first aspect, wherein a measured object is measured to locally shrink or widen the printed circuit board. It is characterized by having a means for measuring shrinkage and correcting the mounting position of the component, and measuring the position of the measured object distributed over the entire board, so that local shrinkage or wide area distributed on the board is measured. By obtaining various overall distortions such as shrinkage and correcting the obtained distortions, there is an effect that data for always mounting components accurately on lands and insertion holes on a printed circuit board can be generated.
【0015】以下、本発明の実施の形態について図面に
基づいて説明する。図1は本発明の実施の形態における
プリント基板の平面図である。図1(a)は、基板全体
に分布される被測定体として同心円状に付加された模様
(パターン)11を設けたプリント基板12であり、図1
(b)は、基板全体に分布される被測定体として均等に
配置されたマーク13を設けたプリント基板14である。こ
れら模様11とマーク13は共に、基板12または14に挿入用
の穴Sを開ける(パンチング)などの基板歪みが発生す
る製造工程前にプリント基板に付加されたものである。An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view of a printed circuit board according to an embodiment of the present invention. FIG. 1A shows a printed circuit board 12 provided with a pattern (pattern) 11 which is concentrically added as an object to be measured distributed over the entire board.
(B) is a printed circuit board 14 provided with marks 13 uniformly arranged as a measured object distributed over the entire board. Both the pattern 11 and the mark 13 are added to the printed circuit board before a manufacturing process in which a substrate distortion occurs, such as making a hole S for insertion (punching) in the substrate 12 or 14.
【0016】図2は本発明の実施の形態における、図1
のプリント基板12(または14)に部品を実装する部品実
装機の構成図である。部品実装機は、プリント基板12に
実際に部品を実装する部品実装機本体16と、この部品実
装機本体16に取り付けられ、プリント基板12を撮像する
撮像装置(スキャナ、CCDカメラなど)17と、この撮
像装置4に接続され、プリント基板の模様11(またはマ
ーク13)の位置を計測し、その模様データを出力するパ
ーソナルコンピュータなどからなる制御装置18と、制御
装置18により求められた模様11のデータと設計データ
(CADデータなど)などを入力してNCデータを生成
して部品実装機本体16に設定するパーソナルコンピュー
タなどからなるNCデータ生成装置19により構成されて
いる。FIG. 2 shows an embodiment of the present invention.
1 is a configuration diagram of a component mounter that mounts components on a printed circuit board 12 (or 14). The component mounter includes a component mounter body 16 that actually mounts components on the printed circuit board 12, an imaging device (scanner, CCD camera, etc.) 17 mounted on the component mounter body 16 and imaging the printed circuit board 12, and A control device 18 that is connected to the imaging device 4 and measures the position of the pattern 11 (or mark 13) on the printed circuit board and outputs the pattern data. The control device 18 includes a personal computer and the like. It comprises an NC data generating device 19 composed of a personal computer or the like for inputting data and design data (such as CAD data) to generate NC data and set the NC data in the component mounter body 16.
【0017】以下、図3のフローチャートを参照しなが
ら、NCデータ生成装置19による実装データ作成方法に
ついて説明する。まず、設計データ(CADデータな
ど)をもとにNCデータ(部品実装位置データ)を生成
する(ステップ#1)。Hereinafter, a method of creating mounting data by the NC data generator 19 will be described with reference to the flowchart of FIG. First, NC data (component mounting position data) is generated based on design data (such as CAD data) (step # 1).
【0018】次に、プリント基板12の収縮(歪み)を検
出する模様11の基本データを取り込む(ステップ#
2)。次に、撮像装置17より撮像された画像データに基
づいて制御装置17により求められた模様11の計測データ
と、ステップ#2の基本データと比較することで、プリ
ント基板12の全域、局所的な歪みを認識し、プリント基
板12のそれぞれのアロケーション(場所)に対して、歪
みの補正率を算出する(ステップ#3)。Next, the basic data of the pattern 11 for detecting the contraction (distortion) of the printed circuit board 12 is fetched (step #).
2). Next, by comparing the measurement data of the pattern 11 obtained by the control device 17 based on the image data taken by the imaging device 17 with the basic data of step # 2, the entire area of the printed The distortion is recognized, and a distortion correction rate is calculated for each allocation (location) of the printed circuit board 12 (step # 3).
【0019】次に、ステップ#1で生成したNCデータ
に補正を行う(ステップ#4)。このように、基板表面
全体に局所収縮または広域収縮を計測するための被測定
体(模様11、マーク13)を分布させ、この被測定体の位
置を計測することにより、基板上に分布する局所収縮ま
たは広域収縮など様々な全体の歪みを検出でき、さらに
検出した歪みにより補正率を算出し、NCデータの補正
を行うことにより、プリント基板1上のランドRや挿入
穴Sに対して常に正確に部品を実装するためデータを生
成でき、正確な部品実装が可能となる。Next, the NC data generated in step # 1 is corrected (step # 4). In this way, the object to be measured (pattern 11, mark 13) for measuring local shrinkage or wide area shrinkage is distributed over the entire surface of the substrate, and the position of the object to be measured is measured. Various overall distortions such as shrinkage or wide-area shrinkage can be detected. Further, a correction rate is calculated based on the detected distortion, and the NC data is corrected, so that the land R and the insertion hole S on the printed circuit board 1 are always accurate. The data can be generated to mount the components on the device, and accurate component mounting can be performed.
【0020】なお、本実施の形態では、同心円状に付加
した模様11や均等に配置されたマーク13を設けたプリン
ト基板12または14で説明したが、局所的な歪みが計測で
きる被測定体であれば同様に実施可能である。Although the present embodiment has been described with reference to the printed circuit board 12 or 14 provided with the concentrically added pattern 11 and the marks 13 arranged evenly, the object to be measured can measure local distortion. If there is, it can be implemented similarly.
【0021】また、NCデータを生成する際に局所的な
歪みの補正を行うことで説明したが、NCデータはその
ままで、部品実装機にて実装する際にステップ#2を行
い部品実装時に補正を行うことでも同様に実施可能であ
る。当然のことながら、この場合、ステップ#1は、省
略することができる。In the above description, the local distortion is corrected when generating the NC data. However, when the NC data is mounted as it is, the step # 2 is performed when mounting is performed by the component mounter, and the correction is performed at the time of mounting the component. Can be similarly implemented. Of course, in this case, step # 1 can be omitted.
【0022】[0022]
【発明の効果】以上のように本発明のプリント基板によ
れば、プリント基板のどのような局部的な分布の歪みや
基板上に不均一に分布する歪みについても、計測ができ
るという有利な効果が得られる。As described above, according to the printed circuit board of the present invention, it is possible to measure any local distribution distortion of the printed circuit board or distortion unevenly distributed on the substrate. Is obtained.
【図1】本発明の実施の形態におけるプリント基板の平
面図である。FIG. 1 is a plan view of a printed circuit board according to an embodiment of the present invention.
【図2】本発明の実施の形態における部品実装機の構成
図である。FIG. 2 is a configuration diagram of a component mounter according to an embodiment of the present invention.
【図3】同部品実装機のNCデータ生成装置における実
装データ作成方法を説明するためのフローチャートであ
る。FIG. 3 is a flowchart for explaining a mounting data creating method in the NC data generating device of the component mounter.
【図4】従来のプリント基板の種類および歪みを説明す
るための図である。FIG. 4 is a diagram for explaining the type and distortion of a conventional printed circuit board.
【図5】従来のプリント基板の基板マークを説明する図
である。FIG. 5 is a view for explaining board marks of a conventional printed board.
【図6】従来の実装データ作成方法を説明するためのフ
ローチャートである。FIG. 6 is a flowchart for explaining a conventional mounting data creating method.
11 模様(被測定体) 12,14 プリント基板 13 マーク(被測定体) 16 部品実装機本体 17 撮像装置 18 制御装置 19 NCデータ生成装置 11 Pattern (Measurement object) 12, 14 Printed circuit board 13 Mark (Measurement object) 16 Main body of component mounter 17 Imaging device 18 Control device 19 NC data generation device
───────────────────────────────────────────────────── フロントページの続き (72)発明者 栗林 毅 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Takeshi Kuribayashi 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (2)
を計測するための被測定体を分布させたことを特徴とす
るプリント基板。1. A printed circuit board, wherein an object to be measured for measuring local shrinkage or wide area shrinkage is distributed over the entire surface of the board.
実装する部品実装機であって、 被測定体を計測して前記プリント基板の局所収縮または
広域収縮を計測し、前記部品の実装位置を補正する手段
を有することを特徴とする部品実装機。2. A component mounting machine for mounting a component on a printed circuit board according to claim 1, wherein a measured object is measured to measure local shrinkage or wide area shrinkage of the printed circuit board, and a mounting position of the component is measured. A component mounter, comprising: means for correcting the error.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9169327A JPH1117292A (en) | 1997-06-26 | 1997-06-26 | Printed circuit board and part mounter for mounting parts on the board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9169327A JPH1117292A (en) | 1997-06-26 | 1997-06-26 | Printed circuit board and part mounter for mounting parts on the board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1117292A true JPH1117292A (en) | 1999-01-22 |
Family
ID=15884502
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9169327A Pending JPH1117292A (en) | 1997-06-26 | 1997-06-26 | Printed circuit board and part mounter for mounting parts on the board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1117292A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001353716A (en) * | 2000-06-13 | 2001-12-25 | Murata Mfg Co Ltd | Method for forming break groove onto ceramic aggregate substrate |
WO2015004717A1 (en) * | 2013-07-08 | 2015-01-15 | 富士機械製造株式会社 | Part holding-state detection method and part mounting device |
JP2015090933A (en) * | 2013-11-06 | 2015-05-11 | ヤマハ発動機株式会社 | Substrate processing apparatus |
-
1997
- 1997-06-26 JP JP9169327A patent/JPH1117292A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001353716A (en) * | 2000-06-13 | 2001-12-25 | Murata Mfg Co Ltd | Method for forming break groove onto ceramic aggregate substrate |
WO2015004717A1 (en) * | 2013-07-08 | 2015-01-15 | 富士機械製造株式会社 | Part holding-state detection method and part mounting device |
JPWO2015004717A1 (en) * | 2013-07-08 | 2017-02-23 | 富士機械製造株式会社 | Component holding state detection method and component mounting apparatus |
JP2015090933A (en) * | 2013-11-06 | 2015-05-11 | ヤマハ発動機株式会社 | Substrate processing apparatus |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6165658A (en) | Nonlinear image distortion correction in printed circuit board manufacturing | |
JP4646661B2 (en) | Printed wiring board printing method, mounting method, and program | |
WO2002039793A2 (en) | Multi-layer printed circuit board fabrication system and method | |
JP2002524884A (en) | Method and apparatus for calibrating the moving distance and / or angular position of a holding device provided in a manufacturing apparatus for an electrical component group, and a calibration substrate | |
JP4840997B2 (en) | Component mounting method | |
KR20010060196A (en) | A device for measuring relative position error | |
KR20130033165A (en) | Printed circuit board and manufacturing method thereof | |
US20060186182A1 (en) | Cream solder printing metal mask with positioning function and its positioning method | |
JPH1117292A (en) | Printed circuit board and part mounter for mounting parts on the board | |
JPH1051198A (en) | Electronic component mounting method | |
EP1252554A1 (en) | Nonlinear image distortion correction in printed circuit board manufacturing | |
JP2001124700A (en) | Calibration method of inspection machine with line sensor camera | |
JPH09162510A (en) | Printed wiring board and method for inspection | |
JPS6374530A (en) | Automatic mounting method for component | |
JP3692678B2 (en) | Screen printing method | |
JP2000258121A (en) | Master substrate for calibrating a plurality of cameras and calibration method for image recognition camera | |
JP2553786B2 (en) | Circuit board recognition mark placement method | |
WO2023032962A1 (en) | Direct-drawing device and method for controlling the same | |
JP3281951B2 (en) | Substrate continuity inspection method | |
US7439083B2 (en) | Technique for compensating for substrate shrinkage during manufacture of an electronic assembly | |
JP3805026B2 (en) | IC component mounting method and IC component mounting machine using the same | |
JPH0227831B2 (en) | PURINTOHAISENBAN | |
JP2000190452A (en) | Creamy solder printing machine | |
JP2005338357A (en) | Method and apparatus for manufacturing printed wiring board | |
JPH0348488A (en) | Boring method for printed wiring board |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20041001 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20050111 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050308 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050531 |