JPH1117288A - Flexible circuit board capable of holding parts on both surfaces - Google Patents

Flexible circuit board capable of holding parts on both surfaces

Info

Publication number
JPH1117288A
JPH1117288A JP9162883A JP16288397A JPH1117288A JP H1117288 A JPH1117288 A JP H1117288A JP 9162883 A JP9162883 A JP 9162883A JP 16288397 A JP16288397 A JP 16288397A JP H1117288 A JPH1117288 A JP H1117288A
Authority
JP
Japan
Prior art keywords
sided
fpc
flexible circuit
circuit board
double
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9162883A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Mizumo
義之 水藻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Minolta Co Ltd
Original Assignee
Minolta Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minolta Co Ltd filed Critical Minolta Co Ltd
Priority to JP9162883A priority Critical patent/JPH1117288A/en
Publication of JPH1117288A publication Critical patent/JPH1117288A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers

Landscapes

  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a flexible printed circuit board having flexibility and limitation-reduced bending angle, by enabling separation of single-sided flexible circuit boards, from a front-rear surfaces overlap portion where singlesided flexible circuit boards are joined to have rigidity, so as to realize free bending. SOLUTION: A double-sided flexible printed circuit board (FPC) 1 is formed by overlapping two single-sided flexible printed circuit boards 2 and 3 and joining them by using adhesive 4 with high rigidity. Electric parts 5 are mounted on both front and rear surfaces of the double-sided FPC, having rigidity by the junction, and copper patterns 6 of the respective single-sided FPC's 2 and 3 are electrically connected via a through hole 1. Other parts of the FPC 1 without adhesive than the part having rigidity are separated into the single-sided FPC's 2 and 3 from the front-rear surfaces overlap portion. The separated sides can be subjected to wiring as bending-free single-sided FPC's without hampering with each other. Thus, the flexibility can be ensured, and limitation on bending angle can be reduced.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、２枚の片面フレキ
シブル回路基板を重ね合わせて構成した両面に部品搭載
が可能なフレキシブル回路基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible circuit board on which two single-sided flexible circuit boards can be mounted on both sides.

【０００２】[0002]

【従来の技術】従来、両面に部品を載可能なフレキシブ
ル回路基板（以下、両面ＦＰＣという）は、フィルムベ
ースの両面に銅パターンが構成されており、大きく折り
曲げを行う場合は、その部分を片面ＦＰＣ構成とするこ
とが知られている。図面を参照して説明すると、図５は
従来の両面ＦＰＣの断面構成を示し、両面ＦＰＣ５１
は、フィルムベース５２の両面に銅パターン５３，５３
´が構成されている。このため、同一箇所で表裏別々に
片面ＦＰＣを構成することができず、表又は裏に限定し
た片面ＦＰＣ５４を構成している。2. Description of the Related Art Conventionally, a flexible circuit board on which components can be mounted on both sides (hereinafter referred to as "double-sided FPC") has a copper pattern formed on both sides of a film base. It is known to have an FPC configuration. Referring to the drawings, FIG. 5 shows a cross-sectional configuration of a conventional double-sided FPC, and FIG.
Are copper patterns 53, 53 on both sides of the film base 52.
'Is configured. For this reason, the single-sided FPC cannot be configured separately for the front and back at the same location, and the single-sided FPC 54 limited to the front or back is configured.

【０００３】また、図６は上述したような従来の両面Ｆ
ＰＣに片面ＦＰＣを接続した構成例を示す。両面ＦＰＣ
６１において、機器への組み込みの都合で基板幅を狭く
しなければならない場合に、その箇所を片面ＦＰＣ６２
として引き回しを可能としているが、裏面部に一体でＦ
ＰＣを引き出すことができないため、別のＦＰＣ６３を
両面ＦＰＣ６１に接続しなければならない。しかも、Ｆ
ＰＣ６３の接続部６３ａは、接続を確実に行えるように
十分な面積を確保しなければならない。FIG. 6 shows a conventional double-sided F as described above.
A configuration example in which a single-sided FPC is connected to a PC is shown. Double-sided FPC
In 61, when the board width has to be reduced for the sake of incorporation into the device, that portion is replaced with a single-sided FPC 62.
It is possible to route it as
Since the PC cannot be pulled out, another FPC 63 must be connected to the double-sided FPC 61. And F
The connecting portion 63a of the PC 63 must secure a sufficient area so that the connection can be reliably performed.

【０００４】[0004]

【発明が解決しようとする課題】ところが、上記図５に
示したような両面ＦＰＣにおいて、表裏別々に片面ＦＰ
Ｃを引き回す場合は、表裏が重ならないように異なった
箇所に別の片面ＦＰＣを接続する必要があり、その接続
部分に銅パターンの接着が残るため、本来の片面ＦＰＣ
より硬くなり、折り曲げの制限が生じていた。また、図
６に示したような構成においては、両面ＦＰＣ６１の部
品実装面積が減少することになり、さらに、両面ＦＰＣ
６１からＦＰＣ６３と同一方向に折り曲げて基板部６３
´を配置する場合も、この基板部６３´は別部材となる
と共に接続面積を確保しなければならない。このため、
所定量の部品搭載面積を確保しようとすると、両面ＦＰ
Ｃのサイズが大きくなり、別のＦＰＣを接続するために
要するコストや基板自体のコストが高くなる。However, in a double-sided FPC as shown in FIG.
In the case of routing C, it is necessary to connect another one-sided FPC to different places so that the front and back sides do not overlap, and since the copper pattern remains at the connection part, the original one-sided FPC
It became harder and had limitations on bending. Further, in the configuration shown in FIG. 6, the component mounting area of the double-sided FPC 61 is reduced.
Folded in the same direction as FPC 63 from 61
Also, when the 'is disposed, the substrate portion 63' must be a separate member and secure a connection area. For this reason,
When trying to secure a certain amount of component mounting area, double-sided FP
The size of C increases, and the cost required to connect another FPC and the cost of the substrate itself increase.

【０００５】本発明は、上述した問題点を解決するため
になされたものであり、柔らかくて折り曲げ角度を大き
く取って引き回すことが容易で、しかも、基板の表裏両
面の同一箇所から片面部を引き出すことが可能で、別の
基板を接続する必要がなくなり、基板サイズの小型化、
接続のためのコスト低減が図れる、両面に部品搭載が可
能なフレキシブル回路基板を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is soft and easy to be routed with a large bending angle. It eliminates the need to connect another board, reducing the size of the board,
It is an object of the present invention to provide a flexible circuit board capable of mounting components on both sides, which can reduce the cost for connection.

【０００６】[0006]

【課題を解決するための手段】上記目的を達成するため
に請求項１の発明は、少なくとも２枚の片面フレキシブ
ル回路基板を重ね合わせるようにしてその間を剛性の高
い接着剤で接合し、その接合により剛性を持たせた部分
の表裏両面に部品を搭載可能なフレキシブル回路基板に
おいて、剛性を持たせた部分の表裏重なる箇所より各片
面フレキシブル回路基板を分離し、この分離された側を
折り曲げ自在な片面フレキシブル回路基板部としたもの
である。この構成においては、片面フレキシブル回路基
板同士の接合により剛性を持たせた表裏重なる箇所より
各片面フレキシブル回路基板を分離して、折り曲げ自在
としている。これにより、それぞれ異なった箇所へ引き
回し、配置接続することが容易となる。また、別の基板
を接続する必要がないので、その接続のための面積を費
やすことがなく、基板サイズが大きくなることがない。In order to achieve the above object, according to the first aspect of the present invention, at least two single-sided flexible circuit boards are overlapped with each other and bonded with a highly rigid adhesive. In a flexible circuit board that allows components to be mounted on both front and back sides of the rigidized part, each single-sided flexible circuit board is separated from the overlapping part of the rigidized part, and this separated side can be bent freely This is a single-sided flexible circuit board. In this configuration, the single-sided flexible circuit boards are separated from the front and back overlapping portions, which are made rigid by joining the single-sided flexible circuit boards, and can be bent. This makes it easy to route to different locations and to connect and arrange them. Further, since it is not necessary to connect another substrate, an area for the connection is not consumed, and the size of the substrate is not increased.

【０００７】また、請求項２の発明は、上記請求項１に
記載の構成において、折り曲げ可能な片面フレキシブル
回路基板部を構成する部分には接着剤を配置しないよう
にしたものである。この構成においては、接着剤を配置
した部分は剛性が高まり、折り曲げ可能な片面フレキシ
ブル回路基板部は柔軟性が高まり、後者の基板部を容易
に引き回すことが可能となる。According to a second aspect of the present invention, in the configuration of the first aspect, an adhesive is not disposed on a portion constituting the foldable single-sided flexible circuit board portion. In this configuration, the portion where the adhesive is disposed has increased rigidity, and the bendable single-sided flexible circuit board portion has increased flexibility, so that the latter board portion can be easily routed.

【０００８】[0008]

【発明の実施の形態】以下、本発明を具体化した一実施
形態を図面を参照して説明する。図１は両面に部品搭載
が可能なフレキシブル回路基板の断面図である。両面フ
レキシブル回路基板（以下、両面ＦＰＣという）１は、
２枚の片面フレキシブル回路基板（以下、片面ＦＰＣと
いう）２，３を重ね合わせるようにしてその間を剛性の
高い接着剤４で接合したものである。接合により剛性を
持たせた両面ＦＰＣ部の表裏両面には、電気部品５が搭
載され、また、各片面ＦＰＣ２，３の銅パターン６，６
´間はスルーホール７により電気的に接続されている。
接着剤４を介在していない部分は、剛性を持たせた部分
の表裏重なる箇所より片面ＦＰＣ２，３として分離して
おり、この分離された側は互いに制約されることなく、
折り曲げ自在な片面ＦＰＣ部として引き回す（配回）こ
とができるようになっている。なお、片面ＦＰＣ２，３
における表層としてのカバーレイの材質は、折り曲げ性
を考慮して、一方の面には液状レジストを、他方の面に
はカバーフィルムを貼り合わせたものを用いることがで
きる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a flexible circuit board on which components can be mounted on both sides. A double-sided flexible circuit board (hereinafter referred to as a double-sided FPC) 1
The two single-sided flexible circuit boards (hereinafter, referred to as single-sided FPCs) 2 and 3 are overlapped with each other and bonded with an adhesive 4 having high rigidity. Electrical components 5 are mounted on the front and back surfaces of the double-sided FPC section which is made rigid by bonding, and the copper patterns 6 and 6 of the single-sided FPCs 2 and 3 are provided.
Are electrically connected by a through hole 7.
The portion where the adhesive 4 is not interposed is separated as single-sided FPCs 2 and 3 from the portion where the rigidity is provided, and the separated sides are not restricted by each other.
It can be routed (arranged) as a bendable single-sided FPC. In addition, single-sided FPC2,3
The material of the cover lay as the surface layer in the above can be a material in which a liquid resist is bonded to one surface and a cover film is bonded to the other surface in consideration of the bendability.

【０００９】図２は、上述のような両面ＦＰＣ１を具体
的な基板形態にした例を示す正面図である。両面ＦＰＣ
１より表裏同じ位置より配出した片面ＦＰＣ２，３は、
それぞれ異なった箇所へ配回し、配置接続される。ま
た、重なった基板の配置接続部３´も従来では別体のＦ
ＰＣを接続するしか構成方法がなかったが、本実施形態
では、片面ＦＰＣを分離することで、一体的に構成する
ことが可能となる。FIG. 2 is a front view showing an example in which the above-described double-sided FPC 1 is formed into a specific board form. Double-sided FPC
The single-sided FPCs 2, 3 distributed from the same position on both sides from 1
They are routed to different locations and connected. In addition, the arrangement connection portion 3 'of the overlapped substrate is also conventionally a separate F
Although there has been only a configuration method of connecting a PC, in the present embodiment, it is possible to integrally configure by separating the single-sided FPC.

【００１０】図３は本実施形態の両面ＦＰＣ１をカメラ
に組み込んだ状態の上面透視図、図４は同正面透視図で
ある。両面ＦＰＣ１に各種の部品が搭載され回路基板ユ
ニット１−１とされ、カメラボディＣＢ内に組み込まれ
ている。内蔵のＡＦモジュール５−１の配置上、基板の
配回しの制限があっても、表裏別々に片面ＦＰＣ２，３
を配回すことにより、何ら影響を受けずに、カメラに組
込み配置することができる。片面ＦＰＣ２は途中で直角
に折り曲げて下方に配向させ、別の基板ユニット８に接
続している。また、両面基板１と同一箇所に折れ曲り配
置される基板部３´も別基板にすることなく、配置構成
することができる。FIG. 3 is a top perspective view showing a state in which the double-sided FPC 1 of this embodiment is incorporated in a camera, and FIG. 4 is a front perspective view of the same. Various components are mounted on the double-sided FPC 1 to form a circuit board unit 1-1, which is incorporated in the camera body CB. Due to the layout of the built-in AF module 5-1, even if there is a restriction on the layout of the substrates, the single-sided FPCs 2, 3
Can be installed in the camera without any influence. The one-sided FPC 2 is bent at a right angle on the way and oriented downward, and is connected to another substrate unit 8. In addition, the board portion 3 'that is bent and arranged at the same location as the double-sided board 1 can be arranged and configured without using another board.

【００１１】このように本実施形態の両面ＦＰＣ１によ
れば、片面ＦＰＣ２，３同士の接合により剛性を持たせ
た表裏重なる箇所より、各ＦＰＣ２，３を分離して、折
り曲げ自在としたので、容易にそれぞれ異なった箇所へ
引き回し、配置接続することができる。また、別の基板
を接続する必要がないので、接続のための面積を費やす
ことがなく基板サイズが大きくなることがない。また、
接着剤４を配置した部分は剛性が高まり、折り曲げ可能
な片面ＦＰＣ２，３部分は柔軟性が高まり、引き回しが
容易となる。As described above, according to the double-sided FPC 1 of the present embodiment, the FPCs 2 and 3 are separated from the front and back portions where the rigidity is provided by joining the single-sided FPCs 2 and 3 so that they can be bent freely. Can be routed to different locations and arranged and connected. Further, since it is not necessary to connect another substrate, an area for the connection is not consumed and the substrate size does not increase. Also,
The portion where the adhesive 4 is disposed has increased rigidity, and the bendable single-sided FPCs 2 and 3 have increased flexibility and can be easily drawn.

【００１２】[0012]

【発明の効果】以上のように本発明によれば、片面フレ
キシブル回路基板同士を接合して剛性を持たせた表裏重
なる箇所より片面フレキシブル回路基板を分離して折り
曲げ自在としたので、柔らかく、折り曲げ角度の制限が
少なくなり、そのため、基板を異なった箇所へ引き回す
ことが容易となり、配置接続の自由度が高まる。また、
異なった箇所への片面部の引き回しのために別の基板を
接続する必要がないので、基板サイズを小型化できると
共に、接続のためのコスト低減が図れる。As described above, according to the present invention, the single-sided flexible circuit boards are separated from the overlapping portions where rigidity is provided by joining the single-sided flexible circuit boards, and the single-sided flexible circuit boards can be bent freely. The limitation on the angle is reduced, so that the substrate can be easily routed to different places, and the degree of freedom in arrangement and connection is increased. Also,
Since it is not necessary to connect another substrate to route one side portion to a different portion, the size of the substrate can be reduced and the cost for connection can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施形態による両面に部品搭載が可
能なＦＰＣの断面図である。FIG. 1 is a cross-sectional view of an FPC capable of mounting components on both sides according to an embodiment of the present invention.

【図２】両面ＦＰＣを具体的な基板形態にした例を示す
正面図である。FIG. 2 is a front view showing an example in which a double-sided FPC is formed into a specific board form.

【図３】両面ＦＰＣをカメラに組み込んだ状態の上面透
視図である。FIG. 3 is a top perspective view of a state in which a double-sided FPC is incorporated in a camera.

【図４】同正面透視図である。FIG. 4 is a front perspective view of the same.

【図５】従来の両面ＦＰＣの断面図である。FIG. 5 is a cross-sectional view of a conventional double-sided FPC.

【図６】従来の両面ＦＰＣに片面ＦＰＣを接続した構成
例を示す図である。FIG. 6 is a diagram illustrating a configuration example in which a single-sided FPC is connected to a conventional double-sided FPC.

【符号の説明】[Explanation of symbols]

１ 両面ＦＰＣ ２，３ 片面ＦＰＣ ４ 接着剤 １−１ 回路基板ユニット DESCRIPTION OF SYMBOLS 1 Double-sided FPC 2, 3 Single-sided FPC 4 Adhesive 1-1 Circuit board unit

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 少なくとも２枚の片面フレキシブル回路
基板を重ね合わせるようにしてその間を剛性の高い接着
剤で接合し、その接合により剛性を持たせた部分の表裏
両面に部品を搭載可能なフレキシブル回路基板におい
て、 前記剛性を持たせた部分の表裏重なる箇所より前記各片
面フレキシブル回路基板を分離し、この分離された側を
折り曲げ自在な片面フレキシブル回路基板部としたこと
を特徴とする両面に部品搭載が可能なフレキシブル回路
基板。1. A flexible circuit in which at least two one-sided flexible circuit boards are overlapped and bonded between them with a highly rigid adhesive, and parts can be mounted on both front and back surfaces of the part having rigidity by the bonding. In the substrate, each of the single-sided flexible circuit boards is separated from a portion where the rigidity is provided, and the separated side is formed as a bendable single-sided flexible circuit board portion. Flexible circuit board that can be used. 【請求項２】 前記折り曲げ可能な片面フレキシブル回
路基板部を構成する部分には前記接着剤を配置しないよ
うにしたことを特徴とする請求項１記載の両面に部品搭
載が可能なフレキシブル回路基板。2. The flexible circuit board according to claim 1, wherein the adhesive is not disposed on a portion constituting the bendable single-sided flexible circuit board portion.
JP9162883A 1997-06-19 1997-06-19 Flexible circuit board capable of holding parts on both surfaces Withdrawn JPH1117288A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9162883A JPH1117288A (en) 1997-06-19 1997-06-19 Flexible circuit board capable of holding parts on both surfaces

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9162883A JPH1117288A (en) 1997-06-19 1997-06-19 Flexible circuit board capable of holding parts on both surfaces

Publications (1)

Publication Number Publication Date
JPH1117288A true JPH1117288A (en) 1999-01-22

Family

ID=15763083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9162883A Withdrawn JPH1117288A (en) 1997-06-19 1997-06-19 Flexible circuit board capable of holding parts on both surfaces

Country Status (1)

Country Link
JP (1) JPH1117288A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004054334A1 (en) * 2002-12-09 2004-06-24 Fujitsu Limited Electronic part mounting structure and mounting method
WO2007021687A1 (en) * 2005-08-12 2007-02-22 3M Innovative Properties Company Method of laminating adherend
US7349054B2 (en) * 2001-11-22 2008-03-25 Advanced Display, Inc. Method of mounting flexible circuit boards, and display device
CN100417311C (en) * 2005-02-18 2008-09-03 友达光电股份有限公司 Pressure welding structure and manufacturing method of flexible printed circuit board
CN109714883A (en) * 2019-01-16 2019-05-03 九江耀宇精密电路有限公司 Line build-out FPC
CN113365412A (en) * 2020-03-05 2021-09-07 宏启胜精密电子(秦皇岛)有限公司 Composite circuit board and manufacturing method thereof
CN114189986A (en) * 2021-12-03 2022-03-15 深圳恩泽瑞显示科技有限公司 High durable FPC and LCD module

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7349054B2 (en) * 2001-11-22 2008-03-25 Advanced Display, Inc. Method of mounting flexible circuit boards, and display device
WO2004054334A1 (en) * 2002-12-09 2004-06-24 Fujitsu Limited Electronic part mounting structure and mounting method
US7288722B2 (en) 2002-12-09 2007-10-30 Fujitsu Limited Packaging structure and packaging method of electronic components
CN100417311C (en) * 2005-02-18 2008-09-03 友达光电股份有限公司 Pressure welding structure and manufacturing method of flexible printed circuit board
WO2007021687A1 (en) * 2005-08-12 2007-02-22 3M Innovative Properties Company Method of laminating adherend
CN109714883A (en) * 2019-01-16 2019-05-03 九江耀宇精密电路有限公司 Line build-out FPC
CN109714883B (en) * 2019-01-16 2021-08-03 九江耀宇精密电路有限公司 Circuit compensation FPC
CN113365412A (en) * 2020-03-05 2021-09-07 宏启胜精密电子(秦皇岛)有限公司 Composite circuit board and manufacturing method thereof
CN114189986A (en) * 2021-12-03 2022-03-15 深圳恩泽瑞显示科技有限公司 High durable FPC and LCD module
CN114189986B (en) * 2021-12-03 2024-01-26 深圳恩泽瑞显示科技有限公司 High durable FPC and LCD module

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