JPH11172354A - Zn alloy for high temperature soldering - Google Patents
Zn alloy for high temperature solderingInfo
- Publication number
- JPH11172354A JPH11172354A JP33442997A JP33442997A JPH11172354A JP H11172354 A JPH11172354 A JP H11172354A JP 33442997 A JP33442997 A JP 33442997A JP 33442997 A JP33442997 A JP 33442997A JP H11172354 A JPH11172354 A JP H11172354A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- weight
- melting point
- eutectic
- solder alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子部品や機械部
品の組立などにおける高温はんだ付用に好適なＺｎ合金
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Zn alloy suitable for high-temperature soldering in assembling electronic parts and mechanical parts.
【０００２】[0002]
【従来の技術】パワートランジスタ素子のダイボンディ
ングを始めとする各種電子部品の組立工程におけるはん
だ付では高温はんだ付が行われ、比較的高温の３００℃
前後の融点を有するはんだ合金（以下、単に「はんだ合
金」という）が用いられている。このはんだ合金には、
Ｐｂ−５重量％Ｓｎ合金に代表されるＰｂ合金（Ｐｂ系
はんだ合金）が従来より用いられている。2. Description of the Related Art In the process of assembling various electronic parts including die bonding of power transistor elements, high-temperature soldering is performed at a relatively high temperature of 300 ° C.
A solder alloy having a melting point before and after is used (hereinafter, simply referred to as “solder alloy”). This solder alloy includes:
A Pb alloy (Pb-based solder alloy) represented by a Pb-5% by weight Sn alloy has been conventionally used.
【０００３】近年、環境汚染に対する配慮からＰｂの使
用を制限する動きが強くなってきている。こうした動き
に対応して電子組立の分野においても、Ｐｂを含まない
はんだ合金が求められている。In recent years, there has been a strong movement to limit the use of Pb in consideration of environmental pollution. In response to these movements, a solder alloy containing no Pb has been required in the field of electronic assembly.
【０００４】しかしながら、従来のＰｂ系はんだ合金を
代替できるはんだ合金はまだ提案されていない。[0004] However, a solder alloy that can replace the conventional Pb-based solder alloy has not yet been proposed.
【０００５】[0005]
【発明が解決しようとする課題】本発明の目的は、上記
事情に鑑み、上記Ｐｂ系はんだ合金を代替できるはんだ
合金を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a solder alloy which can replace the above-mentioned Pb-based solder alloy in view of the above circumstances.
【０００６】[0006]
【課題を解決するための手段】本発明者は、上記課題を
解決すべく、下記（１）、（２）の点にまず着目し、Ｚ
ｎ−Ａｌ−Ｍｇ系３元共晶合金は、Ｐｂ−５重量％Ｓｎ
合金と比べると融点がまだ高いが、Ｚｎ−Ａｌ−Ｍｇ系
３元共晶合金を基本とする合金は、上記Ｐｂ系はんだ合
金を代替できるはんだ合金になり得ると考えた。Means for Solving the Problems In order to solve the above-mentioned problems, the present inventor first pays attention to the following points (1) and (2).
n-Al-Mg ternary eutectic alloy is Pb-5% by weight Sn
Although the melting point is still higher than that of the alloy, it was considered that an alloy based on a Zn-Al-Mg ternary eutectic alloy could be a solder alloy that could replace the Pb-based solder alloy.
【０００７】（１）Ｐｂ−５重量％Ｓｎ合金は、固相線
温度と液相線温度がそれぞれ３０５℃、３１５℃であ
る。(1) The Pb-5 wt% Sn alloy has a solidus temperature and a liquidus temperature of 305 ° C. and 315 ° C., respectively.
【０００８】（２）Ｚｎ−Ａｌ−Ｍｇ系３元共晶合金
は、共晶温度が３４０℃付近にあるといわれている。(2) It is said that the eutectic temperature of a Zn-Al-Mg ternary eutectic alloy is around 340 ° C.
【０００９】そして、さらに研究を鋭意行った結果、Ｚ
ｎ−Ａｌ−Ｍｇ系３元共晶の融点を適当にさらに下げる
ためには、該共晶にＩｎを添加することが有効であるこ
とを見出だし、本発明に到達した。Further, as a result of further research, Z
In order to further lower the melting point of the n-Al-Mg ternary eutectic, it has been found that it is effective to add In to the eutectic, and the present invention has been achieved.
【００１０】すなわち、本発明は、Ａｌを１〜７重量
％、Ｍｇを０．５〜６重量％、およびＩｎを１〜２５重
量％含み、残部がＺｎおよび不可避不純物からなるはん
だ合金（Ｚｎ系はんだ合金）である。That is, the present invention provides a solder alloy (Zn-based alloy) containing 1 to 7% by weight of Al, 0.5 to 6% by weight of Mg, and 1 to 25% by weight of In with the balance being Zn and unavoidable impurities. Solder alloy).
【００１１】[0011]
【発明の実施の形態】本発明のＺｎ系はんだ合金におい
て、Ａｌ含有量を１〜７重量％、Ｍｇ含有量を０．５〜
６重量％としたのは、これらの組成範囲を外れると、合
金の融点が高くなりすぎるためである。上記組成範囲内
では、Ａｌ含有量を３〜４重量％、Ｍｇ含有量を２．５
〜３重量％とするのが好ましい。それは、Ｚｎ−Ａｌ−
Ｍｇ系３元共晶組成あるいはそれに近い組成となるから
である。BEST MODE FOR CARRYING OUT THE INVENTION In the Zn-based solder alloy of the present invention, the Al content is 1 to 7% by weight, and the Mg content is 0.5 to 5%.
The reason for setting the content to 6% by weight is that if the composition is out of these ranges, the melting point of the alloy becomes too high. Within the above composition range, the Al content is 3 to 4% by weight, and the Mg content is 2.5%.
Preferably, it is set to と す る 3% by weight. It is Zn-Al-
This is because the Mg-based ternary eutectic composition or a composition close thereto is obtained.
【００１２】Ｉｎは、Ｚｎ−Ａｌ−Ｍｇ系３元合金の融
点を下げる元素である。特に好適な組成範囲では、３１
０℃前後に固相線温度を下げられる。Ｉｎ含有量は、１
重量％未満では上記融点低下効果が小さすぎるので、１
重量％以上、好ましくは５重量％以上である。一方、上
記含有量の上限の限定理由は次の（１）、（２）の通り
である。In is an element that lowers the melting point of a Zn—Al—Mg based ternary alloy. In a particularly preferred composition range, 31
The solidus temperature can be lowered to around 0 ° C. The In content is 1
If the amount is less than 1% by weight, the effect of lowering the melting point is too small.
% By weight or more, preferably 5% by weight or more. On the other hand, the reasons for limiting the upper limit of the content are as follows (1) and (2).
【００１３】（１）ＺｎとＩｎは１４５℃付近で共晶反
応を起こすので、液相が出現する。しかるに、Ｉｎ含有
量を２５重量％以下、より好ましくは１５重量％以下に
すれば、上記液相の出現温度を適度に制御することがで
き、実用上問題はない。しかし、２５重量％を超える
と、上記共晶（Ｚｎ−Ｉｎ）反応により生成する液相量
が多くなりすぎてはんだ合金として不適当になる。(1) Since a eutectic reaction occurs between Zn and In at around 145 ° C., a liquid phase appears. However, if the In content is 25% by weight or less, more preferably 15% by weight or less, the appearance temperature of the liquid phase can be appropriately controlled, and there is no practical problem. However, if it exceeds 25% by weight, the amount of the liquid phase generated by the eutectic (Zn-In) reaction becomes too large, and becomes unsuitable as a solder alloy.
【００１４】（２）２５重量％を超えても、上記融点低
下効果は大きくならない。(2) Even if it exceeds 25% by weight, the effect of lowering the melting point does not increase.
【００１５】本発明のＺｎ系はんだ合金は、ビッカース
硬度１００ぐらいの高い硬度を有するために、加工性は
劣る。従って、熱間成形してはんだ合金材とするか、粉
末にした後でペースト状のはんだ合金材とするのがよ
い。Since the Zn-based solder alloy of the present invention has a high hardness of about 100 Vickers hardness, the workability is inferior. Therefore, it is preferable to form the solder alloy material by hot forming, or to form a paste-like solder alloy material after powdering.
【００１６】[0016]
【実施例】［実施例１〜９、比較例１］Ｚｎ地金、Ａｌ
地金、Ｍｇ地金およびＩｎ地金（以上の原料は、いずれ
も純度９９．９重量％）を用い、大気溶解炉によりＺｎ
合金を溶製した。溶製したＺｎ合金を化学分析し、その
結果を表１に示す。EXAMPLES [Examples 1 to 9, Comparative Example 1] Zn metal, Al
Using ingots, Mg ingots, and In ingots (all of the above raw materials have a purity of 99.9% by weight), and Zn in an air melting furnace.
The alloy was melted. The melted Zn alloy was chemically analyzed, and the results are shown in Table 1.
【００１７】上記溶製したＺｎ合金について、融点を測
定し、濡れ性を評価した。融点の測定は、マック・サイ
エンス（ＭＡＣ ＳＣＩＥＮＣＥ）社製熱分析装置（Ｄ
ＳＣ３１００型）を用い、昇温・降温速度を１０℃／分
として行った。また、濡れ性の評価は、次の（１）、
（２）、（３）のようにして行った。The melting point of the melted Zn alloy was measured to evaluate the wettability. The melting point was measured using a thermal analyzer (D) manufactured by MAC SCIENCE.
SC3100 type) at a heating / cooling rate of 10 ° C./min. In addition, the evaluation of wettability was performed according to the following (1),
(2) and (3) were performed.
【００１８】（１）上記融点測定で得た各液相線温度よ
り２０℃高い温度に窒素気流中で保持するＺｎ合金浴を
調製する。(1) Prepare a Zn alloy bath which is maintained in a nitrogen stream at a temperature higher by 20 ° C. than each liquidus temperature obtained by the above melting point measurement.
【００１９】（２）Ａｇめっきを施した銅片を上記浴中
に５秒間浸漬した後、該銅片を取り出し観察する。(2) After immersing the Ag-plated copper piece in the above bath for 5 seconds, the copper piece is taken out and observed.
【００２０】（３）取り出した銅片のＡｇめっき面にＺ
ｎ合金融液が濡れ広がった場合に「良」と、濡れ広がら
なかった場合に「不良」と評価する。(3) Z is applied to the Ag-plated surface of the copper piece taken out.
It is evaluated as “good” when the liquid is spread, and “bad” when the liquid is not spread.
【００２１】上記測定・評価の結果を表１に示す。Table 1 shows the results of the above measurements and evaluations.
【００２２】なお、本実施例１〜９のＺｎ合金は、１４
５℃付近で微少量の液相が生成した。しかし表１に示し
た固相線温度は、上記微少量の液相を無視して測定し
た。It should be noted that the Zn alloys of Examples 1 to 9
At around 5 ° C., a very small amount of liquid phase was formed. However, the solidus temperatures shown in Table 1 were measured ignoring the small amount of liquid phase.
【００２３】[0023]
【表１】 [Table 1]
【００２４】表１より、実施例のＺｎ合金は、Ｉｎの添
加により融点が適度に低下し、より好適な組成範囲で
は、３１０℃前後の固相線温度を有するとともに、濡れ
性にも問題がないので、電子部品や機械部品の組立にお
いて高温はんだ付用に好適であることがわかる。From Table 1, it can be seen that the melting point of the Zn alloy of the embodiment is appropriately lowered by the addition of In. In a more preferable composition range, the Zn alloy has a solidus temperature of about 310 ° C. and has a problem in wettability. Therefore, it can be seen that it is suitable for high-temperature soldering in assembling electronic parts and mechanical parts.
【００２５】[0025]
【発明の効果】本発明により、従来のＰｂ系はんだ合金
を代替できるはんだ合金を提供することができる。According to the present invention, it is possible to provide a solder alloy which can replace a conventional Pb-based solder alloy.
Claims (3)
重量％、およびＩｎを１〜２５重量％含み、残部がＺｎ
および不可避不純物からなる高温はんだ付用Ｚｎ合金。1. An Al content of 1 to 7% by weight and a Mg content of 0.5 to 6%.
% By weight, and 1 to 25% by weight of In, with the balance being Zn
And a Zn alloy for high-temperature soldering comprising unavoidable impurities.
ｇの含有量が２．５〜３重量％である請求項１に記載の
高温はんだ付用Ｚｎ合金。2. The method according to claim 1, wherein the content of Al is 3 to 4% by weight,
The Zn alloy for high-temperature soldering according to claim 1, wherein the content of g is 2.5 to 3% by weight.
求項１または２に記載の高温はんだ付用Ｚｎ合金。3. The Zn alloy for high-temperature soldering according to claim 1, wherein the content of In is 5 to 15% by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33442997A JPH11172354A (en) | 1997-12-04 | 1997-12-04 | Zn alloy for high temperature soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33442997A JPH11172354A (en) | 1997-12-04 | 1997-12-04 | Zn alloy for high temperature soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11172354A true JPH11172354A (en) | 1999-06-29 |
Family
ID=18277287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33442997A Pending JPH11172354A (en) | 1997-12-04 | 1997-12-04 | Zn alloy for high temperature soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11172354A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009066704A1 (en) | 2007-11-20 | 2009-05-28 | Toyota Jidosha Kabushiki Kaisha | Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module |
| US7604154B2 (en) | 2003-08-08 | 2009-10-20 | Kabushiki Kaisha Toshiba | Thermosetting flux and solder paste |
| WO2010089647A1 (en) | 2009-02-05 | 2010-08-12 | Toyota Jidosha Kabushiki Kaisha | Junction body, semiconductor module, and manufacturing method for junction body |
| JP2014221484A (en) * | 2013-05-13 | 2014-11-27 | 住友金属鉱山株式会社 | Pb-FREE Zn-BASED SOLDER PASTE |
| WO2017187378A1 (en) * | 2016-04-28 | 2017-11-02 | Slovenská Technická Univerzita V Bratislave | Active soft solder and method of soldering |
| US10556292B2 (en) | 2010-08-31 | 2020-02-11 | Nissan Motor Co., Ltd. | Method for bonding aluminum-based metals |
-
1997
- 1997-12-04 JP JP33442997A patent/JPH11172354A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7604154B2 (en) | 2003-08-08 | 2009-10-20 | Kabushiki Kaisha Toshiba | Thermosetting flux and solder paste |
| WO2009066704A1 (en) | 2007-11-20 | 2009-05-28 | Toyota Jidosha Kabushiki Kaisha | Solder material, process for producing the solder material, joint product, process for producing the joint product, power semiconductor module, and process for producing the power semiconductor module |
| US8283783B2 (en) | 2007-11-20 | 2012-10-09 | Toyota Jidosha Kabushiki Kaisha | Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same |
| WO2010089647A1 (en) | 2009-02-05 | 2010-08-12 | Toyota Jidosha Kabushiki Kaisha | Junction body, semiconductor module, and manufacturing method for junction body |
| US10556292B2 (en) | 2010-08-31 | 2020-02-11 | Nissan Motor Co., Ltd. | Method for bonding aluminum-based metals |
| JP2014221484A (en) * | 2013-05-13 | 2014-11-27 | 住友金属鉱山株式会社 | Pb-FREE Zn-BASED SOLDER PASTE |
| WO2017187378A1 (en) * | 2016-04-28 | 2017-11-02 | Slovenská Technická Univerzita V Bratislave | Active soft solder and method of soldering |
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Legal Events
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