JPH11151239A - Ultrasonic wave probe - Google Patents
Ultrasonic wave probeInfo
- Publication number
- JPH11151239A JPH11151239A JP9319702A JP31970297A JPH11151239A JP H11151239 A JPH11151239 A JP H11151239A JP 9319702 A JP9319702 A JP 9319702A JP 31970297 A JP31970297 A JP 31970297A JP H11151239 A JPH11151239 A JP H11151239A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- vibrator
- electrode
- ultrasonic
- ultrasonic probe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は超音波診断装置に用
いられる超音波プローブに関し、特に、超音波プローブ
の振動子電極に対する信号導体等の接続構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultrasonic probe used in an ultrasonic diagnostic apparatus, and more particularly, to a connection structure of a signal conductor and the like to a transducer electrode of the ultrasonic probe.
【０００２】[0002]
【従来の技術】図１は従来の超音波プローブの概略構成
を示す断面図である。同図に示す超音波プローブの振動
子部は、例えば次のように構成される。すなわち、超音
波を発生する圧電素子と、この圧電振動子から発せられ
た超音波を収束させるための音響レンズと、不要振動を
吸収するためのバッキング材と、振動子部に形成される
正負の振動子電極と、これら二つの振動子電極に各々接
続される二つの接続導体とによって構成される。2. Description of the Related Art FIG. 1 is a sectional view showing a schematic structure of a conventional ultrasonic probe. The vibrator portion of the ultrasonic probe shown in FIG. 1 is configured as follows, for example. That is, a piezoelectric element for generating ultrasonic waves, an acoustic lens for converging the ultrasonic waves emitted from the piezoelectric vibrator, a backing material for absorbing unnecessary vibration, and a positive / negative formed on the vibrator part. It is composed of a vibrator electrode and two connection conductors respectively connected to these two vibrator electrodes.
【０００３】正負からなる振動子電極の配線部は、超音
波信号が送受信される領域を避けるように振動子の端部
に設けられ、その振動子端部の振動子電極に接続導体が
配線される。[0003] Wiring portions of the positive and negative vibrator electrodes are provided at the ends of the vibrator so as to avoid an area where ultrasonic signals are transmitted and received, and a connection conductor is wired to the vibrator electrode at the vibrator end. You.
【０００４】ここで、外部からの電磁ノイズや、隣接す
る振動子間での電磁クロストークノイズを低減するため
に、振動子と正負の振動子電極に配線する接続導体が形
成する電気的なループを小さくすることが望ましい。Here, in order to reduce electromagnetic noise from outside and electromagnetic crosstalk noise between adjacent vibrators, an electric loop formed by connecting conductors connected to the vibrator and the positive and negative vibrator electrodes. Is desirably reduced.
【０００５】そのために、振動子の一端の上下面に設け
られた正負の振動子電極の各々に接続導体を配線し、更
にそれら接続導体は薄い絶縁体を介して隣接して配置さ
れる。To this end, connecting conductors are wired to each of the positive and negative vibrator electrodes provided on the upper and lower surfaces of one end of the vibrator, and these connecting conductors are arranged adjacently via a thin insulator.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、振動子
の送受信面に接続導体を配線することは、振動子への負
荷を大きくすることとなり、よって振動子の破損強度を
低下させるとともに、接続導体が損傷する原因になるこ
とも憂慮される。However, wiring the connecting conductor on the transmitting and receiving surfaces of the vibrator increases the load on the vibrator, thereby reducing the breaking strength of the vibrator and reducing the connecting conductor. There is also concern that it can cause damage.
【０００７】また振動子の振動周波数が高く（例えば５
ＭＨｚ以上）なると、それに伴い振動子の超音波送受信
面に形成する音響整合層を、その振動周波数に反比例し
て薄くする（例えば０．２ｍｍ以下）必要があり、その
結果、超音波送受信面に接続導体を配線することが困難
になってくる。The vibration frequency of the vibrator is high (for example, 5
MHz or more), the acoustic matching layer formed on the ultrasonic transmission / reception surface of the vibrator must be thinned in inverse proportion to the vibration frequency (for example, 0.2 mm or less). It becomes difficult to wire connection conductors.
【０００８】さらに、振動子の上下面それぞれに接続導
体を配線することにより、接続導体としては二つ以上の
部品が必要となり、またそれら別々の二つの接続導体を
隣接するための工程も必要となり、それによって部品コ
スト、製造コストが増加する。Further, by arranging connection conductors on the upper and lower surfaces of the vibrator, two or more components are required as connection conductors, and a step for adjoining these two separate connection conductors is also required. , Thereby increasing parts costs and manufacturing costs.
【０００９】本発明はこのような事情を考慮してなされ
たものであり、その目的は、振動子電極に接続される接
続導体の部品点数を減少でき、これに伴い所定の接合工
程を削減でき、製造性を向上できる超音波プローブを提
供することである。The present invention has been made in view of such circumstances, and an object of the present invention is to reduce the number of parts of a connecting conductor connected to a vibrator electrode, and to reduce a predetermined joining process. Another object of the present invention is to provide an ultrasonic probe capable of improving manufacturability.
【００１０】[0010]
【課題を解決するための手段】上記課題を解決し目的を
達成するために本発明の超音波プローブは次のように構
成されている。すなわち、本発明は被検体との間で超音
波信号を送受信する振動子の所定の面上に、互いに極性
が異なる第１及び第２の電極が設けられ、これらの電極
に対して接続導体が配線される超音波プローブにおい
て、前記接続導体は、絶縁板と、当該絶縁板の両面に各
々設けられる第１及び第２の導体とによって構成される
一体部品から成ることを特徴とする。In order to solve the above problems and achieve the object, an ultrasonic probe according to the present invention is configured as follows. That is, in the present invention, first and second electrodes having different polarities are provided on a predetermined surface of a transducer that transmits and receives an ultrasonic signal to and from a subject, and a connection conductor is provided for these electrodes. In the ultrasonic probe to be wired, the connection conductor is formed of an integral component including an insulating plate and first and second conductors provided on both surfaces of the insulating plate.
【００１１】[0011]
【発明の実施の形態】以下、図面を参照しながら本発明
の実施形態を説明する。図１は本発明の第１実施形態に
係る超音波プローブを備えた超音波診断装置の概略構成
を示す図である。同図に示すように本実施形態の超音波
診断装置は、超音波診断装置本体１と、超音波プローブ
２と、電気信号伝送ケーブル３とから構成されている。
超音波診断装置本体１は、図示しない被検体との間で超
音波プローブ２を介して超音波信号を送受信させ、これ
により得られる例えばエコー信号に基づいて超音波診断
画像を作成するものである。超音波プローブ２は、超音
波診断装置本体１に対し電気信号伝送ケーブル３を介し
て接続されている。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of an ultrasonic diagnostic apparatus including an ultrasonic probe according to a first embodiment of the present invention. As shown in the figure, the ultrasonic diagnostic apparatus of the present embodiment includes an ultrasonic diagnostic apparatus main body 1, an ultrasonic probe 2, and an electric signal transmission cable 3.
The ultrasonic diagnostic apparatus main body 1 transmits and receives an ultrasonic signal to and from a subject (not shown) via an ultrasonic probe 2, and creates an ultrasonic diagnostic image based on, for example, an echo signal obtained thereby. . The ultrasonic probe 2 is connected to the ultrasonic diagnostic apparatus main body 1 via an electric signal transmission cable 3.
【００１２】超音波プローブ２のケーシング１１の内部
には振動子４が設けられる。振動子４は、超音波診断装
置本体１から送られてきた送信信号により駆動されて超
音波を発生する。これにより超音波プローブ２から被検
体内に向けて超音波が放射される。また、超音波プロー
ブ２は被検体内に放射された超音波の反射波を受波す
る。超音波プローブ２が受波した信号は振動子４におい
て、その圧電効果により電気信号に変換され、例えばエ
コー信号として超音波診断装置本体１に送出される。A vibrator 4 is provided inside a casing 11 of the ultrasonic probe 2. The vibrator 4 is driven by a transmission signal sent from the ultrasonic diagnostic apparatus main body 1 to generate an ultrasonic wave. As a result, ultrasonic waves are emitted from the ultrasonic probe 2 into the subject. The ultrasonic probe 2 receives a reflected wave of the ultrasonic wave radiated into the subject. The signal received by the ultrasonic probe 2 is converted into an electric signal by the piezoelectric effect in the vibrator 4 and sent to the ultrasonic diagnostic apparatus main body 1 as an echo signal, for example.
【００１３】図２は超音波プローブ２の振動子部を示す
斜視図である。同図において、４は振動子、５は振動子
電極、６は接続導体、７は音響整合層、８は音響レン
ズ、９はバッキング材、１２は電極接合材を示してい
る。FIG. 2 is a perspective view showing the vibrator portion of the ultrasonic probe 2. In the figure, 4 is a vibrator, 5 is a vibrator electrode, 6 is a connection conductor, 7 is an acoustic matching layer, 8 is an acoustic lens, 9 is a backing material, and 12 is an electrode bonding material.
【００１４】振動子４を構成する圧電素子は例えば圧電
セラミクス等である。振動子４の超音波放射面側には、
超音波の放射効率を高めるための音響整合層７、超音波
を集束させるための音響レンズ８が設けられる。一方、
振動子４の背面には不要振動を吸収するためのバッキン
グ材９が設けられる。The piezoelectric element constituting the vibrator 4 is, for example, a piezoelectric ceramic or the like. On the ultrasonic wave emitting surface side of the transducer 4,
An acoustic matching layer 7 for improving the radiation efficiency of ultrasonic waves and an acoustic lens 8 for converging ultrasonic waves are provided. on the other hand,
A backing material 9 for absorbing unnecessary vibration is provided on the back surface of the vibrator 4.
【００１５】振動子４の表面には、振動子電極５が蒸着
又はメッキによって焼き付けられている。この振動子電
極５は、負（−）電極５ａと、正（＋）電極５ｂとに分
かれている。ここで、負電極５ａはその一部が振動子４
の超音波放射面から側面を経て振動子４の背面に回り込
むように形成されており、また正電極５ｂは振動子４の
背面に形成されており、これにより負電極５ａの一部と
正電極５ｂとが同一平面上（振動子４の背面）となって
いる。A vibrator electrode 5 is baked on the surface of the vibrator 4 by vapor deposition or plating. The vibrator electrode 5 is divided into a negative (-) electrode 5a and a positive (+) electrode 5b. Here, a part of the negative electrode 5a is
And the positive electrode 5b is formed on the back surface of the vibrator 4, so that a part of the negative electrode 5a and the positive electrode 5a are formed. 5b are on the same plane (the back surface of the vibrator 4).
【００１６】振動子電極５の負電極５ａ及び正電極５ｂ
には接続導体６が接続される。ここで、本実施形態は振
動子電極５との配線接続に係る接続導体６の電極構造に
特徴を有するものであり、接続導体６は振動子電極５の
位置及び形状に合わせて次のように構成されている。す
なわち、接続導体６は電気伝導性を有する二つの導体６
ａ及び６ｂと、これらの導体間を電気的に絶縁するため
の絶縁板６ｃとを有し、また導体６ａ、絶縁板６ｃ、及
び導体６ｂの各々の先端位置を、振動子４の背面におけ
る振動子電極５の電極配置に応じて相対的に（階段状
に）ずらしてある。The negative electrode 5a and the positive electrode 5b of the transducer electrode 5
Is connected to the connection conductor 6. Here, the present embodiment is characterized by the electrode structure of the connection conductor 6 relating to the wiring connection with the transducer electrode 5, and the connection conductor 6 is adjusted as follows according to the position and shape of the transducer electrode 5. It is configured. That is, the connection conductor 6 is composed of two conductors 6 having electrical conductivity.
a and 6b, and an insulating plate 6c for electrically insulating these conductors from each other. The tip positions of the conductor 6a, the insulating plate 6c, and the conductor 6b are adjusted by the vibration on the back surface of the vibrator 4. The sub-electrodes 5 are shifted relatively (in steps) according to the electrode arrangement.
【００１７】導体６ａは振動子電極５の正電極５ｂに接
続され、導体６ｂは負電極５ａに接続される。これらの
接続は例えば半田や導電性接着剤等からなる電極接合材
１２を介して行われる。なお、絶縁板６ｃの先端位置
は、導体６ａと正電極５ｂの接続部と、導体６ｂと負電
極５ａの接続部との間の位置としてある。The conductor 6a is connected to the positive electrode 5b of the transducer electrode 5, and the conductor 6b is connected to the negative electrode 5a. These connections are made via an electrode bonding material 12 made of, for example, solder or a conductive adhesive. The tip of the insulating plate 6c is located between the connection between the conductor 6a and the positive electrode 5b and the connection between the conductor 6b and the negative electrode 5a.
【００１８】導体６ａは、例えば銅などから成る信号導
体であり、あるいは信号パターンが形成されたＦＰＣ
（フレキシブルプリント基板）である。また導体６ｂ
は、例えばＧＮＤ導体又はＧＮＤのＦＰＣである。絶縁
板６ｃは例えばポリイミド又はガラス−エポキシ樹脂等
である。The conductor 6a is a signal conductor made of, for example, copper, or an FPC having a signal pattern formed thereon.
(Flexible printed circuit board). The conductor 6b
Is, for example, a GND conductor or an FPC of GND. The insulating plate 6c is made of, for example, polyimide or glass-epoxy resin.
【００１９】そして、このような接続導体６には図１に
示した電気信号伝送ケーブル３が接続され、これにより
振動子４と超音波診断装置本体１との間の電気信号の送
受信が行われる。An electric signal transmission cable 3 shown in FIG. 1 is connected to such a connecting conductor 6, whereby electric signals are transmitted and received between the transducer 4 and the ultrasonic diagnostic apparatus main body 1. .
【００２０】以上のように構成された本実施形態では、
振動子電極５と接続導体６との接続が振動子４の背面の
みでなされる。それによって振動子４、接続導体６及び
それらの配線部への機械的負荷が軽減される。その結
果、振動子４の破損、あるいは振動子電極５と接続導体
６との電気的な接触不良等を減少させることができる。
また、素子カット時における製造性も良好となる。In this embodiment configured as described above,
The connection between the transducer electrode 5 and the connection conductor 6 is made only on the back face of the transducer 4. Thereby, the mechanical load on the vibrator 4, the connection conductor 6, and their wiring portions is reduced. As a result, it is possible to reduce damage to the vibrator 4 or poor electrical contact between the vibrator electrode 5 and the connection conductor 6.
In addition, the manufacturability at the time of element cutting is improved.
【００２１】さらに、超音波放射面における振動子と接
続導体（例えばＧＮＤＦＰＣ）との接続が不要となるた
め、超音波放射面に形成する音響整合層７の厚さを、接
続導体の寸法とは関係なく選択できるようになる。さら
に、正電極５ｂ及び負電極５ａからなる二つの振動子電
極５に対して接続される接続導体６を一つの構成部品
（一体部品）とすることができ、部品数を減少できる。
これにより、正負電極用の接続導体を各々別体として構
成し、これらを振動子電極５に対して接続するという複
数の工程を一つの工程にすることができる。Further, since it is not necessary to connect the transducer and the connection conductor (for example, GNDFPC) on the ultrasonic radiation surface, the thickness of the acoustic matching layer 7 formed on the ultrasonic radiation surface is determined by the dimension of the connection conductor. You will be able to select it regardless. Furthermore, the connecting conductor 6 connected to the two transducer electrodes 5 composed of the positive electrode 5b and the negative electrode 5a can be a single component (integral component), and the number of components can be reduced.
Accordingly, a plurality of processes of separately forming the connection conductors for the positive and negative electrodes and connecting them to the vibrator electrode 5 can be made into one process.
【００２２】（第２実施形態）次に本発明の第２実施形
態を説明する。第２実施形態において第１実施形態と同
一部分には同一の参照数字が付してある。(Second Embodiment) Next, a second embodiment of the present invention will be described. In the second embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals.
【００２３】図３は第２実施形態に係る超音波プローブ
２の振動子部を示す斜視図である。第２の実施形態で
は、図３に示すように接続導体６が振動子電極５の位置
及び形状に合わせて次のように構成されている。すなわ
ち、第１実施形態で説明した導体６ｂは、本実施形態で
は電気的に分離された二つの導体６ｂａ、６ｂｂからな
る。ここで本実施形態では、同図に示すように導体６ａ
の先端部表面、絶縁６ｃの端面、そして導体６ｂｂの表
面を包むように例えば銅やクロム又はニッケルからなる
メッキ処理（１０）が施されている。これにより導体６
ｂｂと導体６ａとは電気的に接続される。導体６ｂｂは
正電極５ｂに接続され、導体６ｂａは負電極５ａに接続
される。これにより導体６ａと正電極５ｂとは電気的に
接続されることになる。これらの接続は例えば半田や導
電性接着剤等からなる電極接合材１２を介して行われ
る。FIG. 3 is a perspective view showing the vibrator part of the ultrasonic probe 2 according to the second embodiment. In the second embodiment, as shown in FIG. 3, the connection conductor 6 is configured as follows according to the position and shape of the transducer electrode 5. That is, the conductor 6b described in the first embodiment includes two conductors 6ba and 6bb that are electrically separated in the present embodiment. Here, in the present embodiment, as shown in FIG.
A plating process (10) made of, for example, copper, chromium, or nickel is applied so as to cover the front end surface of the, the end surface of the insulation 6c, and the surface of the conductor 6bb. Thereby, the conductor 6
bb and the conductor 6a are electrically connected. Conductor 6bb is connected to positive electrode 5b, and conductor 6ba is connected to negative electrode 5a. As a result, the conductor 6a and the positive electrode 5b are electrically connected. These connections are made via an electrode bonding material 12 made of, for example, solder or a conductive adhesive.
【００２４】以上のように構成された本実施形態では、
導体６ｂｂ（導体６ａと導通）と導体６ｂａとが絶縁板
６ｃの片面（同一面）上であるため、振動子電極５への
配線が容易になるという利点が得られる。In this embodiment configured as described above,
Since the conductor 6bb (conducting with the conductor 6a) and the conductor 6ba are on one surface (the same surface) of the insulating plate 6c, there is an advantage that wiring to the transducer electrode 5 is facilitated.
【００２５】（第３実施形態）次に本発明の第３実施形
態を説明する。第３実施形態において第１実施形態と同
一部分には同一の参照数字が付してある。(Third Embodiment) Next, a third embodiment of the present invention will be described. In the third embodiment, the same parts as those in the first embodiment are denoted by the same reference numerals.
【００２６】図４（ａ）は第３実施形態に係る超音波プ
ローブ２の振動子部を示す斜視図である。図４（ｂ）は
接続導体６の一部を上面から見た図である。第３の実施
形態では、図４に示すように接続導体６が振動子電極５
の位置及び形状に合わせて次のように構成されている。
すなわち、第１実施形態で説明した導体６ｂは、本実施
形態では電気的に分離された二つの導体６ｂａ、６ｂｂ
からなる。ここで本実施形態では、導体６ｂｂから絶縁
板６ｃを経て導体６ａまで達する穴Ｈ（スルーホール）
が形成されているとともに、穴Ｈの内壁面にはメッキ処
理（１０）が施されている。これにより導体６ｂｂと導
体６ａとは電気的に接続される。導体６ｂｂは正電極５
ｂに接続され、導体６ｂａは負電極５ａに接続される。
これにより導体６ａと正電極５ｂとは電気的に接続され
ることになる。これらの接続は例えば半田や導電性接着
剤等からなる電極接合材１２を介して行われる。以上の
ように構成された本実施形態によっても、上記第２実施
形態と同様に接続導体６の振動子電極５への配線が容易
になるという利点が得られる。FIG. 4A is a perspective view showing a vibrator portion of the ultrasonic probe 2 according to the third embodiment. FIG. 4B is a view of a part of the connection conductor 6 as viewed from above. In the third embodiment, as shown in FIG.
Is configured as follows in accordance with the position and shape of.
That is, in the present embodiment, the conductor 6b described in the first embodiment is different from the two conductors 6ba and 6bb electrically separated from each other.
Consists of Here, in the present embodiment, a hole H (through hole) extending from the conductor 6bb to the conductor 6a via the insulating plate 6c.
Are formed, and the inner wall surface of the hole H is plated (10). Thereby, conductor 6bb and conductor 6a are electrically connected. The conductor 6bb is the positive electrode 5
b, and the conductor 6ba is connected to the negative electrode 5a.
As a result, the conductor 6a and the positive electrode 5b are electrically connected. These connections are made via an electrode bonding material 12 made of, for example, solder or a conductive adhesive. According to the present embodiment configured as described above, the advantage that the wiring of the connection conductor 6 to the vibrator electrode 5 is facilitated similarly to the second embodiment is obtained.
【００２７】[0027]
【発明の効果】以上説明したように本発明によれば、振
動子電極に接続される接続導体の部品点数を減少でき、
これに伴い所定の接合工程を削減でき、製造性を向上で
きる超音波プローブを提供できる。As described above, according to the present invention, the number of connecting conductors connected to the transducer electrode can be reduced.
Accordingly, it is possible to provide an ultrasonic probe that can reduce the number of predetermined bonding steps and improve manufacturability.
【図１】本発明の第１実施形態に係る超音波プローブを
備えた超音波診断装置の概略構成を示す図。FIG. 1 is a diagram showing a schematic configuration of an ultrasonic diagnostic apparatus including an ultrasonic probe according to a first embodiment of the present invention.
【図２】本発明の第１実施形態に係る超音波プローブの
振動子部を示す斜視図。FIG. 2 is a perspective view showing a transducer section of the ultrasonic probe according to the first embodiment of the present invention.
【図３】本発明に係る第２実施形態による超音波プロー
ブの振動子部を示す斜視図。FIG. 3 is a perspective view showing a transducer section of an ultrasonic probe according to a second embodiment of the present invention.
【図４】（ａ）は本発明の第３実施形態に係る超音波プ
ローブの振動子部を示す斜視図、（ｂ）は接続導体の一
部を上面から見た図。FIG. 4A is a perspective view showing a vibrator part of an ultrasonic probe according to a third embodiment of the present invention, and FIG. 4B is a view of a part of a connection conductor viewed from above.
１…超音波診断装置本体 ２…超音波プローブ ３…電気信号伝送ケーブル ４…振動子 ５…振動子電極 ６…接続導体 ６ａ…導体（ＧＮＤ） ６ｂ…導体 ６ｃ…絶縁板 ７…音響整合層 ８…音響レンズ ９…バッキング材 １０…メッキ １１…ケーシング １２…電極接合材 Ｈ…スルーホール DESCRIPTION OF SYMBOLS 1 ... Ultrasonic diagnostic device main body 2 ... Ultrasonic probe 3 ... Electric signal transmission cable 4 ... Transducer 5 ... Transducer electrode 6 ... Connection conductor 6a ... Conductor (GND) 6b ... Conductor 6c ... Insulating plate 7 ... Acoustic matching layer 8 ... Acoustic lens 9 ... Backing material 10 ... Plating 11 ... Casing 12 ... Electrode bonding material H ... Through hole
Claims (5)
振動子の所定の面上に、互いに極性が異なる第１及び第
２の電極が設けられ、これらの電極に対して接続導体が
配線される超音波プローブにおいて、 前記接続導体は、絶縁板と、当該絶縁板の両面に各々設
けられる第１及び第２の導体とによって構成される一体
部品から成ることを特徴とする超音波プローブ。A first electrode and a second electrode having different polarities are provided on a predetermined surface of a vibrator for transmitting and receiving an ultrasonic signal to and from a subject, and a connecting conductor is provided for these electrodes. In the ultrasonic probe to be wired, the connection conductor is formed of an integral part including an insulating plate and first and second conductors provided on both surfaces of the insulating plate. .
波振動子の超音波放射面から側面を経て当該超音波振動
子の背面に回り込むように形成され、 前記第２の電極は、前記超音波振動子の背面に形成され
ることを特徴とする請求項１に記載の超音波プローブ。2. The first electrode is formed so that a part of the first electrode wraps around a side surface from an ultrasonic wave emitting surface of the ultrasonic vibrator to a back surface of the ultrasonic vibrator. The ultrasonic probe according to claim 1, wherein the ultrasonic probe is formed on a back surface of the ultrasonic transducer.
第２の導体の各々の先端位置を前記第１及び第２の電極
の電極配置に応じて相対的にずらしたことを特徴とする
請求項１又は２に記載の超音波プローブ。3. The method according to claim 1, wherein the tip positions of the first conductor, the insulating plate, and the second conductor are relatively shifted in accordance with the electrode arrangement of the first and second electrodes. The ultrasonic probe according to claim 1, wherein
第３及び第４の導体から成り、 前記第３の導体と前記第１の導体とは、前記絶縁板の端
面に施されたメッキを介して結合されることを特徴とす
る請求項１又は２に記載の超音波プローブ。4. The second conductor includes third and fourth conductors that are electrically separated, and the third conductor and the first conductor are provided on an end surface of the insulating plate. The ultrasonic probe according to claim 1, wherein the ultrasonic probe is coupled via a plating.
第３及び第４の導体から成り、 前記第３の導体と前記第１の導体とは、前記第３の導体
から前記絶縁板を経て前記第１の導体に達する穴に施さ
れたメッキを介して結合されることを特徴とする請求項
１又は２に記載の超音波プローブ。5. The second conductor comprises electrically separated third and fourth conductors, and the third conductor and the first conductor are insulated from the third conductor. The ultrasonic probe according to claim 1, wherein the ultrasonic probe is coupled via plating provided in a hole reaching the first conductor via a plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31970297A JP4080580B2 (en) | 1997-11-20 | 1997-11-20 | Ultrasonic probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31970297A JP4080580B2 (en) | 1997-11-20 | 1997-11-20 | Ultrasonic probe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11151239A true JPH11151239A (en) | 1999-06-08 |
| JP4080580B2 JP4080580B2 (en) | 2008-04-23 |
Family
ID=18113235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31970297A Expired - Lifetime JP4080580B2 (en) | 1997-11-20 | 1997-11-20 | Ultrasonic probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4080580B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007167445A (en) * | 2005-12-22 | 2007-07-05 | Toshiba Corp | Ultrasonic probe |
| JP2010278766A (en) * | 2009-05-28 | 2010-12-09 | Ge Medical Systems Global Technology Co Llc | Ultrasonic probe and ultrasonic diagnostic device |
| JP5730452B1 (en) * | 2014-02-27 | 2015-06-10 | 京セラ株式会社 | Piezoelectric actuator, piezoelectric vibration device including the same, portable terminal, sound generator, sound generator, electronic device |
| WO2015129061A1 (en) * | 2014-02-27 | 2015-09-03 | 京セラ株式会社 | Piezoelectric actuator, and piezoelectric vibration device, portable terminal, acoustic generator, acoustic generation device, and electronic device provided therewith |
-
1997
- 1997-11-20 JP JP31970297A patent/JP4080580B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007167445A (en) * | 2005-12-22 | 2007-07-05 | Toshiba Corp | Ultrasonic probe |
| US7745977B2 (en) | 2005-12-22 | 2010-06-29 | Kabushiki Kaisha Toshiba | Ultrasonic probe |
| JP2010278766A (en) * | 2009-05-28 | 2010-12-09 | Ge Medical Systems Global Technology Co Llc | Ultrasonic probe and ultrasonic diagnostic device |
| JP5730452B1 (en) * | 2014-02-27 | 2015-06-10 | 京セラ株式会社 | Piezoelectric actuator, piezoelectric vibration device including the same, portable terminal, sound generator, sound generator, electronic device |
| WO2015129061A1 (en) * | 2014-02-27 | 2015-09-03 | 京セラ株式会社 | Piezoelectric actuator, and piezoelectric vibration device, portable terminal, acoustic generator, acoustic generation device, and electronic device provided therewith |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4080580B2 (en) | 2008-04-23 |
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