JPH11135572A - Electronic component mounting device - Google Patents

Electronic component mounting device

Info

Publication number
JPH11135572A
JPH11135572A JP29531697A JP29531697A JPH11135572A JP H11135572 A JPH11135572 A JP H11135572A JP 29531697 A JP29531697 A JP 29531697A JP 29531697 A JP29531697 A JP 29531697A JP H11135572 A JPH11135572 A JP H11135572A
Authority
JP
Japan
Prior art keywords
transfer
electronic component
connection member
electrode
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29531697A
Other languages
Japanese (ja)
Inventor
Shuichi Ishiwata
修一 石綿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP29531697A priority Critical patent/JPH11135572A/en
Publication of JPH11135572A publication Critical patent/JPH11135572A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/118—Post-treatment of the bump connector
    • H01L2224/1182—Applying permanent coating, e.g. in-situ coating
    • H01L2224/11822—Applying permanent coating, e.g. in-situ coating by dipping, e.g. in a solder bath
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector

Abstract

PROBLEM TO BE SOLVED: To reduce load for enabling a worker to monitor transfer failure, prevent electronic parts with transfer failure from being mounted, and mount high-quality electronic parts by speedily and positively judging whether the electronic parts are conforming or not. SOLUTION: It is judged whether the transfer state of a bump electrode is conforming or not by processing the image of the transfer mark of the bump electrode that is left at a connection member on a transfer stage 20 being taken by an optical system and a camera 103 at the upper portion from the transfer surface of a transfer stage 20 for transferring the connection member to the bump electrode being formed at the electronic components.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、突起電極を有する
電子部品を配線板上に位置決め搭載する装置に関する。The present invention relates to an apparatus for positioning and mounting an electronic component having a protruding electrode on a wiring board.

【０００２】[0002]

【従来の技術】フリップチップボンディングに代表され
る突起電極を有する電子部品の実装には、特開昭５７−
１７３９５０号公報に開示された電子部品搭載装置が用
いられる。電子部品搭載装置の代表的な構成を図１５に
示す。電子部品２は、電子部品搭載装置１上の部品供給
部１４に整列される。本構成例では、部品供給部１４は
マトリクス状のトレイで示したが、電子部品２をウェハ
ーで作成した後にダイシングしエキスパンドした状態で
供給できる部品供給部１４の例もある。その他にテープ
で供給する装置やスティックで供給する装置などチップ
マウンタなどで多くの例がある。2. Description of the Related Art Japanese Patent Application Laid-Open No. Sho 57-79 discloses the mounting of electronic components having protruding electrodes typified by flip chip bonding.
An electronic component mounting apparatus disclosed in Japanese Patent No. 173950 is used. FIG. 15 shows a typical configuration of an electronic component mounting apparatus. The electronic components 2 are arranged in the component supply unit 14 on the electronic component mounting device 1. In the present configuration example, the component supply unit 14 is illustrated as a matrix-shaped tray, but there is also an example of the component supply unit 14 that can supply the electronic components 2 in a state of being diced and expanded after forming the electronic components 2 on a wafer. In addition, there are many examples of chip mounters and the like, such as a device for supplying with a tape and a device for supplying with a stick.

【０００３】電子部品２が位置決め搭載される配線板４
は、基板コンベア１６上を上流工程より流れてきて図１
５の位置で固定される。電子部品搭載装置１での工程が
終了すれば、電子部品２を搭載した配線板４は基板コン
ベア１６によって下流工程に流される。[0003] Wiring board 4 on which electronic component 2 is positioned and mounted
1 flows from the upstream process on the substrate conveyor 16 in FIG.
It is fixed at position 5. When the process in the electronic component mounting apparatus 1 is completed, the wiring board 4 on which the electronic components 2 are mounted is flowed to a downstream process by the board conveyor 16.

【０００４】電子部品搭載装置１内の電子部品２の搬送
と位置決め搭載は、ＸＹ軸を有するロボット１０により
行われる。ロボット１０は電子部品２を把持または吸着
して上下および旋回が可能な搬送ヘッド１１をもつ。こ
のようにロボット１０はＸＹ軸と上下および旋回の４軸
構成が一般的であるが、一部の軸を複数有する例もあ
る。また、基板コンベア１６の一部がロボット１０の軸
となり、配線板４が平面移動する例もある。[0004] The transport and positioning and mounting of the electronic component 2 in the electronic component mounting apparatus 1 are performed by a robot 10 having XY axes. The robot 10 has a transport head 11 that can move up and down and turn by gripping or sucking the electronic component 2. As described above, the robot 10 generally has an XY axis and a four-axis configuration of up and down and turning, but there is also an example in which a plurality of some axes are provided. Further, there is an example in which a part of the substrate conveyor 16 becomes the axis of the robot 10 and the wiring board 4 moves in a plane.

【０００５】ロボット１０の搬送ヘッド１１には、配線
板４の位置決めに用いる光学系をもつカメラ１３が取り
付けられていて、搬送ヘッド１１を配線板４上へ移動し
た後に配線板４に設けた特定のパターンの画像をカメラ
１３で取り込む。通常は、あらかじめ教示されている特
定パターンの位置と取り取んだパターンの画像の比較か
ら、配線板の位置決め誤差を画像処理装置にて演算し
て、電子部品２を配線板４に位置決め搭載するときの座
標の修正を行う。A camera 13 having an optical system used for positioning the wiring board 4 is attached to the transfer head 11 of the robot 10. After the transfer head 11 is moved onto the wiring board 4, The image of the pattern is captured by the camera 13. Normally, the position of the specific pattern taught in advance is compared with the image of the taken pattern, and the positioning error of the wiring board is calculated by an image processing device, and the electronic component 2 is positioned and mounted on the wiring board 4. Correct the coordinates at the time.

【０００６】つぎに、電子部品２の流れに沿って電子部
品搭載装置１の構成を説明する。まず、電子部品２はロ
ボット１０によって部品供給部１４からプリアライメン
ト部１５に搬送される。プリアライメント部１５は、電
子部品２の外形を基準にして電子部品２を位置決め修正
する装置で、電子部品２をプリアライメント部１５の爪
で基準に押しつけて位置決めを行う。プリアライメント
部１５の必要性は電子部品搭載装置１の各部の仕様や電
子部品２の仕様によって異なるため、略されているもの
も多い。Next, the configuration of the electronic component mounting apparatus 1 will be described along the flow of the electronic component 2. First, the electronic component 2 is transported from the component supply unit 14 to the pre-alignment unit 15 by the robot 10. The pre-alignment unit 15 is a device that positions and corrects the electronic component 2 with reference to the outer shape of the electronic component 2, and performs positioning by pressing the electronic component 2 with the claw of the pre-alignment unit 15 as a reference. Since the necessity of the pre-alignment unit 15 differs depending on the specifications of each unit of the electronic component mounting apparatus 1 and the specifications of the electronic component 2, many of them are omitted.

【０００７】つぎに、電子部品２はロボット１０によっ
て転写ステージ２０に搬送される。転写ステージ２０
は、電子部品２の突起電極３に、電子部品２の突起電極
３と配線板４上の電極パッド５の電気的かつ機械的な接
続に共する接続部材６を転写塗布する装置である。Next, the electronic component 2 is transferred to the transfer stage 20 by the robot 10. Transfer stage 20
Is a device that transfers and coats a connection member 6 that is electrically and mechanically connected to the projection electrode 3 of the electronic component 2 and the electrode pad 5 on the wiring board 4 on the projection electrode 3 of the electronic component 2.

【０００８】接続部材、突起電極３の材料と接続方式に
よって異なる。電子部品２の突起電極３がはんだの場合
は、接続部材６はフラックスまたははんだペーストであ
り、突起電極３が金、ニッケル、銅の場合は、導電性接
着剤またははんだペーストである。The connection member and the material of the protruding electrode 3 differ depending on the connection method. When the protruding electrode 3 of the electronic component 2 is solder, the connection member 6 is a flux or a solder paste, and when the protruding electrode 3 is gold, nickel, or copper, it is a conductive adhesive or a solder paste.

【０００９】転写ステージ２０は、図２に示すように回
転ディスク２１をベルト２５を介して矢印の方向へ回転
駆動するモータ２２をもち、回転ディスク２１上に接続
部材６を間欠的に供給するシリンジ２３を備える。回転
ディスク２１上に供給された接続部材６は、スキージ２
４によって液面を平滑にされる。接続部材６の液面が平
滑にされることによって、電子部品２の突起電極３の先
端の接続部材６の転写量を正確に制御することが可能と
なる。図３に転写ステージ２０の断面を示し、スキージ
２４が接続部材６の液面を平滑化する概念を図４に示
す。As shown in FIG. 2, the transfer stage 20 has a motor 22 for driving the rotary disk 21 to rotate in the direction of the arrow via a belt 25, and supplies the connection member 6 to the rotary disk 21 intermittently. 23. The connecting member 6 supplied onto the rotating disk 21 is a squeegee 2
4 smoothes the liquid surface. By smoothing the liquid surface of the connection member 6, it is possible to accurately control the transfer amount of the connection member 6 at the tip of the protruding electrode 3 of the electronic component 2. FIG. 3 shows a cross section of the transfer stage 20, and FIG. 4 shows a concept in which the squeegee 24 smoothes the liquid surface of the connection member 6.

【００１０】転写ステージ２０は、電子部品２がロボッ
ト１０により搬送されてきたとき、回転ディスク２１の
回転を停止する。その後、図５の状態から図７の状態の
ようにロボット１０の搬送ヘッド１１はチャック１２で
保持した電子部品２を回転ディスク２１上の平滑化され
た接続部材６の液面に降下させて、電子部品２の突起電
極３に接続部材６を濡らして転写する。The transfer stage 20 stops the rotation of the rotating disk 21 when the electronic component 2 is transported by the robot 10. Thereafter, the transfer head 11 of the robot 10 lowers the electronic component 2 held by the chuck 12 from the state of FIG. 5 to the level of the smoothed connection member 6 on the rotating disk 21 as shown in FIG. The connection member 6 is transferred to the projecting electrode 3 of the electronic component 2 by wetting.

【００１１】つぎに、ロボット１０は電子部品２を図１
５に示す光学系１７とカメラ１８の上方へ搬送する。光
学系１７とカメラ１８は、図８のように光軸を上に向け
て設置されており、ロボット１０の搬送ヘッド１１の先
端にあるチャック１２が保持する電子部品２を撮像して
電子部品２の位置誤差を演算し、さきに説明した配線板
４の位置誤差のデータと総合して、ロボット１０は電子
部品２と配線板４の相対的な位置決めを行う。そして、
最終的に配線板４の所定の位置に電子部品２を搭載す
る。Next, the robot 10 moves the electronic component 2 to the position shown in FIG.
5 is conveyed above the optical system 17 and the camera 18. The optical system 17 and the camera 18 are installed with their optical axes facing upward as shown in FIG. 8. The optical system 17 and the camera 18 image the electronic component 2 held by the chuck 12 at the tip of the transfer head 11 of the robot 10 and capture the electronic component 2. Is calculated, and the robot 10 performs relative positioning between the electronic component 2 and the wiring board 4 based on the data of the positional error of the wiring board 4 described above. And
Finally, the electronic component 2 is mounted at a predetermined position on the wiring board 4.

【００１２】[0012]

【発明が解決しようとする課題】図９に電子部品２の突
起電極３に接続部材６が従来の技術で示した転写ステー
ジ２０を用いて転写塗布された状態を示し、図１０には
電子部品２が配線板４上に位置決め搭載された状態を示
す。また図１１にははんだの突起電極３とフラックスの
接続部材６を用いた場合を例にしたリフロー後の正常な
接続状態を示す。FIG. 9 shows a state in which the connection member 6 is transferred and applied to the projecting electrode 3 of the electronic component 2 by using the transfer stage 20 shown in the prior art, and FIG. 10 shows the electronic component. 2 shows a state where it is positioned and mounted on the wiring board 4. FIG. 11 shows a normal connection state after the reflow, in which the solder bump electrode 3 and the flux connection member 6 are used as an example.

【００１３】つぎに転写不良の例を示す。図１２に示し
たように接続部材６の転写量が多くなりすぎた場合は、
突起電極間の短絡や絶縁不良の原因となる。また、図１
３のように接続部材６の転写量が少なすぎるまたは転写
されない場合は、接続不良の原因となる。図１４は、は
んだの突起電極３とフラックスの接続部材６を用いた場
合を例にしたリフロー後の接続不良状態を示す。もちろ
ん、ロボット１０の搬送ヘッド１１の下降量と転写ステ
ージ２０の機械的安定性があれば、初期の調整後に前述
のような不良転写は発生しないはずであり、転写ステー
ジ２０を用いて電子部品２の突起電極３に接続部材６を
転写塗布する方法は、接続部材６の必要最小限度の供給
方法として有効である。Next, an example of a transfer failure will be described. When the transfer amount of the connecting member 6 becomes too large as shown in FIG.
This may cause a short circuit between the protruding electrodes and insulation failure. FIG.
When the transfer amount of the connection member 6 is too small or is not transferred as in the case of 3, the connection failure is caused. FIG. 14 shows a connection failure state after reflow in a case where the solder bump electrode 3 and the flux connection member 6 are used as an example. Of course, if the transfer head 11 of the robot 10 is lowered and the transfer stage 20 is mechanically stable, the above-described defective transfer should not occur after the initial adjustment. The method of transferring and applying the connection member 6 to the projecting electrode 3 is effective as a method of supplying the connection member 6 to the minimum necessary.

【００１４】一方、突起電極３に転写する場合の接続部
材６は、はんだペーストや導電性接着剤は直径数μｍか
ら数１０μｍの固形物を含むが、フラックスも含めてい
ずれの場合も安定した転写塗布が可能なように粘度が１
０００ｃｐｓから１００００ｃｐｓの液状としてある。
しかし電子部品搭載装置１を連続で運転していると、雰
囲気や接続部材６の種類にもよるが、接続部材の接続部
材６中の成分が揮発を生じ、粘度に変化が出てくる。接
続部材６の粘度が変化してくると、電子部品２の突起電
極３への転写量に変化が生じ、不良転写を引き起こす。On the other hand, when the connection member 6 is transferred to the protruding electrode 3, the solder paste or the conductive adhesive contains a solid substance having a diameter of several μm to several tens μm. Viscosity 1 so that it can be applied
It is in a liquid form of 000 cps to 10,000 cps.
However, when the electronic component mounting apparatus 1 is operated continuously, the components in the connection member 6 of the connection member volatilize, depending on the atmosphere and the type of the connection member 6, and the viscosity changes. When the viscosity of the connection member 6 changes, the amount of transfer of the electronic component 2 to the protruding electrode 3 changes, causing defective transfer.

【００１５】また、連続運転により、転写ステージ２０
のスキージ２４の裏面に増粘した接続部材６が付着し、
回転ディスク２１上の接続部材６の液面の平滑性が失わ
れてくる。このまま、電子部品搭載装置１の運転を続け
ていくと、電子部品２の各突起電極の転写量に差が生じ
て、最終的には不良を作り続けることになる。The transfer stage 20 is operated by continuous operation.
The thickened connection member 6 adheres to the back surface of the squeegee 24,
The smoothness of the liquid surface of the connecting member 6 on the rotating disk 21 is lost. If the operation of the electronic component mounting apparatus 1 is continued as it is, a difference occurs in the transfer amount of each protruding electrode of the electronic component 2, and eventually, the defect continues to be produced.

【００１６】このように、従来の電子部品搭載装置１で
は、電子部品２の突起電極３への接続部材６の転写量の
安定が、非常に重要なポイントであるにも関わらず、転
写状態の良否の判別ができないため、経験的に作業者が
接続部材６の転写状態の確認のために電子部品搭載装置
１の運転を停止する必要があった。また、これを怠れ
ば、転写不良の電子部品搭載を行っていても、このこと
に気付くことが遅れ、大量の不良品を生産してしまうこ
とになる。As described above, in the conventional electronic component mounting apparatus 1, although the stability of the transfer amount of the connection member 6 to the protruding electrode 3 of the electronic component 2 is a very important point, the transfer state of the transfer state is not so important. Since the quality cannot be determined, the operator has to empirically stop the operation of the electronic component mounting apparatus 1 in order to confirm the transfer state of the connection member 6. Also, if this is neglected, even if electronic components with defective transfer are mounted, it will be delayed to notice this, and a large number of defective products will be produced.

【００１７】（発明の目的）本発明の目的は、電子部品
の突起電極への接続部材の転写状態の良否判別を高速か
つ確実に行うことで、作業者が転写不良の監視を行う負
担を軽減し、転写不良の電子部品搭載を防止して、安定
な転写による品質の高い電子部品の搭載を行うことがで
きる電子部品搭載装置を提供することにある。(Object of the Invention) It is an object of the present invention to reduce the burden of monitoring a transfer failure by an operator by quickly and reliably determining whether or not a transfer state of a connection member to a projecting electrode of an electronic component is good or bad. It is another object of the present invention to provide an electronic component mounting apparatus capable of mounting a high-quality electronic component by stable transfer by preventing mounting of an electronic component having a transfer failure.

【００１８】[0018]

【課題を解決するための手段】上記目的を達成するため
に、本発明の電子部品搭載装置の構造は、下記記載の構
成を採用する。In order to achieve the above object, the structure of the electronic component mounting apparatus of the present invention adopts the following configuration.

【００１９】本発明の電子部品搭載装置は、電子部品供
給位置から配線板上の搭載位置までの電子部品の搬送経
路上に、電子部品の突起電極と配線板上の電極パッドの
電気的かつ機械的な接続に共する接続部材を、突起電極
に転写するための転写ステージをもち、光学系とカメラ
を用いて取り込んだ転写ステージ上の接続部材に残され
た突起電極の転写痕の画像を処理することで、突起電極
の転写状態の良否判別が可能とした。According to the electronic component mounting apparatus of the present invention, the electrical and mechanical connection between the projecting electrodes of the electronic component and the electrode pads on the wiring board is provided on the transport path of the electronic component from the electronic component supply position to the mounting position on the wiring board. Has a transfer stage for transferring the connection member that is involved in the initial connection to the protruding electrode, and processes the image of the transfer mark of the protruding electrode left on the connection member on the transfer stage captured using an optical system and a camera. By doing so, the quality of the transfer state of the protruding electrode can be determined.

【００２０】また本発明の電子部品搭載装置は、転写ス
テージ上の接続部材に残された突起電極の転写痕の画像
を取り込む光学系とカメラが、少なくとも転写ステージ
の転写面よりも上方に固定されている。In the electronic component mounting apparatus of the present invention, an optical system and a camera for capturing an image of a transfer mark of the protruding electrode left on the connection member on the transfer stage are fixed at least above the transfer surface of the transfer stage. ing.

【００２１】第２の本発明の電子部品搭載装置の構成と
しては、転写ステージ上の接続部材に残された突起電極
の転写痕の画像を取り込む光学系とカメラが少なくとも
転写ステージの転写面よりも上方にあり電子部品の搬送
ヘッドと共に移動する。According to a second aspect of the present invention, there is provided an electronic component mounting apparatus in which an optical system for capturing an image of a transfer mark of a projection electrode left on a connecting member on a transfer stage and a camera are at least higher than the transfer surface of the transfer stage. It is above and moves with the transport head for electronic components.

【００２２】[0022]

【発明の実施の形態】以下、図面を用いて本発明の最良
の実施形態における電子部品搭載装置の構成を説明す
る。図１に本発明の電子部品搭載装置１０１の全体を示
す。本発明の電子部品搭載装置１０１のうち、ロボット
１０、およびその搬送ヘッド１１、および搬送ヘッド１
１に取り付けられたカメラ１３、および部品供給部１
４、およびプリアライメント部１５、および基板コンベ
ア１６、および光学系１７とカメラ１８は、さきに説明
した図１の従来技術と同一である。また、転写ステージ
２０とその構成も、図２から図４に示した従来技術と同
一である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of an electronic component mounting apparatus according to a preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows the entire electronic component mounting apparatus 101 of the present invention. In the electronic component mounting apparatus 101 of the present invention, the robot 10, the transport head 11 thereof, and the transport head 1
1 attached to camera 1 and component supply unit 1
4, the pre-alignment unit 15, the substrate conveyor 16, the optical system 17, and the camera 18 are the same as those of the prior art of FIG. 1 described above. Further, the transfer stage 20 and its configuration are the same as those of the prior art shown in FIGS.

【００２３】まず、部品供給部１４に整列されている電
子部品２は、ロボット１０によってプリアライメント部
１５に搬送され、プリアライメント部１５で後述する光
学系１７とカメラ１８の視野に十分入るだけの位置決め
をされる。実際にプリアライメント部１５によって、□
１０ｍｍのシリコンチップの電子部品２は、外形を基準
にして±１０μｍの精度で位置決めすることが可能であ
る。First, the electronic components 2 aligned in the component supply unit 14 are conveyed to the pre-alignment unit 15 by the robot 10, and the pre-alignment unit 15 is sufficient to enter the field of view of an optical system 17 and a camera 18 described later. Positioned. Actually, □
The electronic component 2 of a 10 mm silicon chip can be positioned with an accuracy of ± 10 μm based on the outer shape.

【００２４】つぎに電子部品２は、ロボット１０によっ
てプリアライメント部１５から転写ステージ２０に搬送
される。図５に示すように電子部品２が転写ステージ２
０の回転ディスク２１の上方に到着した時点で、回転デ
ィスク２１は回転を停止し、ロボット１０の搬送ヘッド
１１は、チャック１２で保持した電子部品２を静かに下
降して、回転ディスク２１上のスキージ２４によって平
滑化された接続部材６の液面に電子部品２の突起電極３
の先端を濡らす。この状態は図６に示す。Next, the electronic component 2 is transferred from the pre-alignment unit 15 to the transfer stage 20 by the robot 10. As shown in FIG. 5, the electronic component 2 is
At the time when the rotating disk 21 arrives above the rotating disk 21, the transport head 11 of the robot 10 gently descends the electronic component 2 held by the chuck 12, and The protruding electrode 3 of the electronic component 2 is provided on the surface of the connection member 6 smoothed by the squeegee 24.
Wet the tip. This state is shown in FIG.

【００２５】図１２、図１３に示すような接続部材６の
転写不良を引き起こさないようにするために、突起電極
３が鉛と錫の合金のはんだからなる半球状で突起電極の
直径が１６０μｍ、突起電極の高さが１００μｍであ
り、接続部材６に粘度１５００ｃｐｓのフラックスを用
いた場合、転写ステージ２０で平滑化された接続部材６
の液面に対して、突起電極の突っ込み量は、約４０から
５０μｍとして、ロボット１０の搬送ヘッド１１の下降
量を設定しておくとよい。In order to prevent the transfer failure of the connecting member 6 as shown in FIGS. 12 and 13, the projecting electrode 3 has a hemispherical shape made of an alloy of lead and tin and has a diameter of 160 μm. When the height of the projecting electrode is 100 μm and a flux having a viscosity of 1500 cps is used for the connection member 6, the connection member 6 smoothed by the transfer stage 20 is used.
The amount of protrusion of the protruding electrode with respect to the liquid surface is preferably about 40 to 50 μm, and the amount of descent of the transfer head 11 of the robot 10 is preferably set.

【００２６】さらに図７に示すように、ロボット１０の
搬送ヘッド１１が電子部品２を上昇させると、電子部品
２の突起電極３の先端に接続部材６が転写塗布されてお
り、また、回転ステージ２１上の平滑化された接続部材
６の液面に突起電極３の転写痕１０５が残る。As shown in FIG. 7, when the transfer head 11 of the robot 10 raises the electronic component 2, the connecting member 6 is transferred and applied to the tip of the protruding electrode 3 of the electronic component 2. A transfer mark 105 of the protruding electrode 3 remains on the smoothed liquid surface of the connection member 6 on 21.

【００２７】図１６に示すように、転写痕１０５の上方
のロボット１０の搬送ヘッド１１に干渉しない位置に、
支持台１０１に支えられた光学系１０２とカメラ１０３
とを設置しており、転写塗布の終了した電子部品２を保
持するロボット１０の搬送ヘッド１１が光学系１０２と
カメラ１０３との視野外に移動すると同時に、転写痕１
０５の画像を取り込む。As shown in FIG. 16, at a position above the transfer mark 105 where the transfer head 11 of the robot 10 does not interfere,
Optical system 102 and camera 103 supported by support table 101
The transfer head 11 of the robot 10 that holds the electronic component 2 on which the transfer coating has been completed moves out of the field of view of the optical system 102 and the camera 103, and at the same time, the transfer mark 1
Capture the 05 image.

【００２８】取り込まれた突起電極３の転写痕１０５の
画像は電子部品搭載装置１０１の画像処理部で二値化処
理されると、回転ステージ２１上の平滑化された接続部
材６の液面に垂直方向から均一に照明された場合、図１
７のように、円の列として認識することが可能な処理画
像１０６が得られる。本発明の実施形態では、光学系１
０２に落射の照明装置を内蔵した。仮に、別個の照明装
置を設け、広角系１０２の光軸に平行でない照明を与え
た場合は、図１７の転写痕１０５の円は三日月状になる
が、本発明の転写良否判別の以下の処理に支障なく、同
様の処理が可能である。When the image of the transferred transfer mark 105 of the protruding electrode 3 is binarized by the image processing unit of the electronic component mounting apparatus 101, the image is transferred to the smoothed liquid surface of the connection member 6 on the rotary stage 21. When illuminated uniformly from the vertical direction, FIG.
7, a processed image 106 that can be recognized as a circle column is obtained. In the embodiment of the present invention, the optical system 1
02 was equipped with an epi-illumination device. If a separate illuminating device is provided and illumination that is not parallel to the optical axis of the wide-angle system 102 is given, the circle of the transfer mark 105 in FIG. 17 has a crescent shape. The same processing can be performed without any problem.

【００２９】図１７の転写痕１０５の円の大きさは、す
なわち電子部品２の突起電極３に転写塗布された接続部
材６の転写量を表すことになる。接続部材６の転写量が
多すぎる場合は、図１８のように転写痕１０５の円の直
径が大きくなり、図１２のような転写不良のときには転
写痕１０５の円がつながってしまう。逆に、接続部材６
の転写量が少なすぎる場合は、図１９のように転写痕１
０５の円の直径が小さくなり、最悪の場合は転写痕１０
５がない。The size of the circle of the transfer mark 105 in FIG. 17 indicates the transfer amount of the connection member 6 transferred and applied to the protruding electrode 3 of the electronic component 2. If the transfer amount of the connection member 6 is too large, the diameter of the circle of the transfer mark 105 becomes large as shown in FIG. 18, and the circle of the transfer mark 105 is connected at the time of transfer failure as shown in FIG. Conversely, connecting member 6
If the transfer amount is too small, as shown in FIG.
05 has a smaller diameter, and in the worst case a transfer mark 10
There is no 5.

【００３０】つぎに電子部品２の突起電極３が図２０の
ように一部欠けている場合、または突起電極３の高さが
極端に不揃いの場合は、図２１の処理画像１０６のよう
に不規則な転写痕１０５の円が得られる。Next, when the protruding electrodes 3 of the electronic component 2 are partially missing as shown in FIG. 20, or when the heights of the protruding electrodes 3 are extremely uneven, an irregularity is obtained as shown in a processed image 106 in FIG. A regular circle of transfer marks 105 is obtained.

【００３１】さらに図２２で示すゴミ１０７がチャック
１２と電子部品２の間に挟まった場合のように、電子部
品２と転写ステージ２０の回転ディスク２１上の平滑化
された接続部材６の液面の平行が失われた場合は、図２
３で示すように転写痕１０５の大きさが順次変化してい
る処理画像１０６が得られる。Further, as in the case where dust 107 shown in FIG. 22 is caught between the chuck 12 and the electronic component 2, the liquid surface of the electronic component 2 and the smoothed connecting member 6 on the rotating disk 21 of the transfer stage 20 Figure 2
As shown by 3, a processed image 106 in which the size of the transfer mark 105 sequentially changes is obtained.

【００３２】これらの接続部材６の転写不良に対して、
転写状態の良否判別を行う方法について述べる。まず、
良好な転写状態を示すときの処理画像１０６から一つの
突起電極３の転写痕１０５の面積を求めて画像処理装置
に予めあらかじめしておく。さきに示した条件での良好
な転写状態では、突っ込み量が４０μｍのときに転写痕
面積は、約１５０００平方μｍ、５０μｍのときに約１
７３００平方μｍである。それぞれを良好な転写状態の
ときの転写痕１０５の面積の下限と上限に設定してお
く。For the transfer failure of these connecting members 6,
A method for determining whether the transfer state is good or bad will be described. First,
The area of the transfer mark 105 of one protruding electrode 3 is obtained from the processed image 106 showing a good transfer state, and the area is obtained in advance in the image processing apparatus. In the good transfer state under the conditions described above, the transfer trace area is about 15000 square μm when the plunging amount is 40 μm and about 1 when the plunge amount is 50 μm.
7,300 square μm. Each is set to the lower and upper limits of the area of the transfer mark 105 in a good transfer state.

【００３３】光学系１０２とカメラ１０３によって取り
込まれ画像処理装置で二値化された突起電極３の転写痕
１０５の全体の処理画像１０６から、転写痕１０５の計
数を行う。電子部品２の突起電極３の数と不一致の場合
は、図２０、図２１のような突起電極３の欠けや高さの
不揃い、または回転ディスク２１上の接続部材６の不足
やスキージ２４への接続部材６の付着などが考えれるの
で、電子部品搭載装置１０１はエラー処置をとる。The transfer marks 105 are counted from the entire processed image 106 of the transfer marks 105 of the protruding electrodes 3 which is captured by the optical system 102 and the camera 103 and binarized by the image processing apparatus. In the case where the number does not match the number of the protruding electrodes 3 of the electronic component 2, the protruding electrodes 3 are missing or uneven in height as shown in FIGS. Since the attachment of the connecting member 6 is considered, the electronic component mounting apparatus 101 takes an error measure.

【００３４】つぎに突起電極３の転写痕１０５の全体の
処理画像１０６から、最も面積の大きい転写痕１０５を
特定し面積を計測する。その面積がさきに設定した上限
値を超えている場合はエラー処置をとる。同様に最も面
積の小さい転写痕１０５を特定し面積を計測する。その
面積がさきに設定した下限値を下回る場合はエラー処置
をとる。エラー処置としては電子部品搭載装置１０１を
アラーム停止するが、現在、ロボット１０が保持してい
る電子部品２を不良品入れにおいて、新たな電子部品２
を部品供給部１４から取り直して数回のリトライを行う
こともできる。Next, the transfer mark 105 having the largest area is specified and the area is measured from the entire processed image 106 of the transfer mark 105 of the bump electrode 3. If the area exceeds the upper limit set earlier, take error action. Similarly, the transfer mark 105 having the smallest area is specified and the area is measured. If the area is below the lower limit set earlier, take error action. As an error measure, the electronic component mounting apparatus 101 is stopped by an alarm, but when the electronic component 2 currently held by the robot 10 is put in a defective product, a new electronic component 2 is set.
Can be retaken from the component supply unit 14 and retried several times.

【００３５】なお、電子部品２の突起電極３を転写ステ
ージ２０の回転ディスク２１上の平滑化された接続部材
６に濡れさせた後、搬送ヘッド１１が電子部品２を上昇
させてから、突起電極３の転写痕１０５は時間の経過と
共に徐々に小さく不鮮明になっていく。しかし、さきに
述べた１５００ｃｐｓのフラックスの場合、上昇後、２
秒ほどは転写痕１０５の直径も変化せず、十分に明確な
転写痕１０５の輪郭が残されている。これに対して、ロ
ボット１０の移動速度、カメラ１０３の画像取り込み速
度は十分に早いので問題はない。また１５００ｃｐｓは
転写ステージ２０を用いる接続部材６の供給方法の場
合、接続部材の１５００ｃｐｓは粘度が低い方であり、
他の接続部材を用いるときには転写痕１０５はさらに鮮
明である。After the projecting electrode 3 of the electronic component 2 is wetted by the smoothed connecting member 6 on the rotating disk 21 of the transfer stage 20, the transport head 11 raises the electronic component 2 and then moves the projecting electrode 3 up. The transfer mark 105 of No. 3 gradually becomes small and unclear over time. However, in the case of the flux of 1500 cps mentioned earlier,
The diameter of the transfer mark 105 does not change for about seconds, and a sufficiently clear outline of the transfer mark 105 remains. On the other hand, there is no problem because the moving speed of the robot 10 and the image capturing speed of the camera 103 are sufficiently fast. 1500 cps is a method of supplying the connection member 6 using the transfer stage 20, and 1500 cps of the connection member has a lower viscosity,
When another connecting member is used, the transfer mark 105 is clearer.

【００３６】このようにして本発明の電子部品搭載装置
においては、高速かつ確実に電子部品２の突起電極３へ
の接続部材６の転写状態良否判別が可能である。さら
に、転写痕１０５の個別の面積を求めず、全体の処理画
像１０６から転写痕１０５の面積の合計を画像処理装置
によって求めれば、さらに高速な処理が可能になる。二
値化された処理画像の中の複数の物体の合計面積を高速
に求めることは、すでに画像処理装置において一般化し
ている。As described above, in the electronic component mounting apparatus of the present invention, it is possible to quickly and reliably determine whether or not the transfer state of the connecting member 6 to the protruding electrode 3 of the electronic component 2 is good. Furthermore, if the total area of the transfer marks 105 is obtained by the image processing apparatus from the entire processed image 106 without obtaining the individual area of the transfer marks 105, further higher-speed processing can be performed. Finding the total area of a plurality of objects in a binarized processed image at high speed has already been generalized in image processing apparatuses.

【００３７】接続部材６の転写状態の画像を取り込む方
法として、突起電極３の先端に転写塗布された接続部材
６を直接画像として取り込む方法も考えられるが、図９
のような転写状態の接続部材６の形や寸法を識別するこ
とは極めて困難である。カラー画像処理を行って突起電
極３と転写された接続部材６の識別を行う方法も考えら
れるが、システムが複雑化する上、接続部材６がフラッ
クスのように透明に近い材料では使用できない。As a method for taking in the image of the transfer state of the connection member 6, a method of directly taking in the connection member 6 transferred and applied to the tip of the protruding electrode 3 as an image is also conceivable.
It is extremely difficult to identify the shape and size of the connection member 6 in the transfer state as described above. Although a method of performing color image processing to identify the protruding electrode 3 and the transferred connection member 6 can be considered, the system becomes complicated, and the connection member 6 cannot be used with a material that is nearly transparent such as flux.

【００３８】このようにして、本発明の突起電極３への
接続部材６の転写状態の良否判別によって、接続部材６
の粘度変化による転写不良などを自動的に検知すること
ができる。さらに本発明の応用として、転写痕１０５の
処理画像１０６から面積を求める方法によって、段取り
替えを行うときの電子部品搭載装置１０１の転写ステー
ジ２０における搭載ヘッド１１の下降量を設定や確認を
行うこともできる。In this manner, by judging whether the transfer state of the connection member 6 to the protruding electrode 3 of the present invention is good or not, the connection member 6 is determined.
Transfer failure due to a change in viscosity of the toner can be automatically detected. Further, as an application of the present invention, the amount of lowering of the mounting head 11 on the transfer stage 20 of the electronic component mounting apparatus 101 at the time of setup change is set and confirmed by a method of obtaining the area from the processed image 106 of the transfer mark 105. Can also.

【００３９】電子部品搭載装置１０１は、転写状態の良
否判別を行っている間に、ロボット１０によって電子部
品２を光学系１７の上方へ搬送し、電子部品２の最終的
な位置誤差を計測する。以下、電子部品２と配線板４の
相対的な位置決めを行って、最終的に配線板４の所定の
位置に電子部品２を搭載することは、従来従来技術一で
ある。The electronic component mounting apparatus 101 conveys the electronic component 2 above the optical system 17 by the robot 10 while determining the quality of the transfer state, and measures the final position error of the electronic component 2. . Hereinafter, relative positioning of the electronic component 2 and the wiring board 4 and finally mounting the electronic component 2 at a predetermined position on the wiring board 4 is a conventional technique.

【００４０】また、電子部品２の突起電極３の転写痕１
０５の画像を取り込む光学系１０６とカメラ１０７を、
図２４のようにロボット１０の搬送ヘッド１１に取り付
けることもできる。さらに光学系１０８とカメラ１０９
を、図１に示す配線板４の位置誤差計測に用いるカメラ
１３と兼ねることもできる。これによって、転写ステー
ジ２０の上方が空き、転写ステージ２０のメンテナンス
が容易になる。The transfer mark 1 of the protruding electrode 3 of the electronic component 2
The optical system 106 for taking in the image 05 and the camera 107 are
As shown in FIG. 24, it can be attached to the transport head 11 of the robot 10. Further, the optical system 108 and the camera 109
Can also be used as the camera 13 used for measuring the position error of the wiring board 4 shown in FIG. Thus, the space above the transfer stage 20 is empty, and maintenance of the transfer stage 20 is facilitated.

【００４１】[0041]

【発明の効果】本発明の電子部品搭載装置では、転写後
の転写ステージ上の接続部材に残された突起電極の転写
痕を画像として取り込み処理することで、高速かつ確実
な良否判別を可能とした。これによって、転写不良を起
こしている電子部品を配線板上に誤って搭載し、不良品
を大量に生産してしまうことがなくなり、安定した突起
電極への接続部材に転写が保証されて品質の高い電子部
品の搭載ができる上に、作業者による装置の監視や定期
的な装置停止の必要もなくなった。According to the electronic component mounting apparatus of the present invention, the transfer mark of the protruding electrode left on the connecting member on the transfer stage after the transfer is captured as an image and processed, so that high-speed and reliable quality judgment can be performed. did. This eliminates the risk of improperly mounting electronic components on which defective transfer has occurred on the wiring board, resulting in mass production of defective products, assuring transfer to stable connection members to protruding electrodes, and ensuring quality. In addition to mounting high electronic components, it is no longer necessary for an operator to monitor the device or to periodically stop the device.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の実施形態の電子部品搭載装置の構成を
示す平面図である。FIG. 1 is a plan view showing a configuration of an electronic component mounting apparatus according to an embodiment of the present invention.

【図２】本発明の実施形態および従来技術における転写
ステージの構成を示す平面図である。FIG. 2 is a plan view illustrating a configuration of a transfer stage according to the embodiment of the present invention and the related art.

【図３】本発明の実施形態および従来技術における転写
ステージの構成を示す断面図である。FIG. 3 is a cross-sectional view illustrating a configuration of a transfer stage according to the embodiment of the present invention and the related art.

【図４】本発明の実施形態および従来技術における転写
ステージのスキージが接続部材の液面を平滑化する概念
を示す断面図である。FIG. 4 is a cross-sectional view showing a concept in which a squeegee of a transfer stage smoothes a liquid surface of a connection member according to the embodiment of the present invention and the related art.

【図５】本発明の実施形態および従来技術における電子
部品の突起電極に接続部材を転写塗布する課程を示す側
面図である。FIG. 5 is a side view showing a process of transferring and applying a connection member to a protruding electrode of an electronic component according to the embodiment of the present invention and a conventional technique.

【図６】本発明の実施形態および従来技術における電子
部品の突起電極に接続部材を転写塗布する課程を示す側
面図である。FIG. 6 is a side view showing a process of transferring and applying a connection member to a protruding electrode of an electronic component according to the embodiment of the present invention and a conventional technique.

【図７】本発明の実施形態および従来技術における電子
部品の突起電極に接続部材を転写塗布する課程を示す側
面図である。FIG. 7 is a side view showing a process of transferring and applying a connection member to a protruding electrode of an electronic component according to the embodiment of the present invention and the related art.

【図８】本発明の実施形態および従来技術における電子
部品の撮像の側面図である。FIG. 8 is a side view of imaging of an electronic component according to the embodiment of the present invention and the related art.

【図９】本発明の実施形態および従来技術における電子
部品の突起電極の先端に接続部材が転写された状態を示
す側面図である。FIG. 9 is a side view showing a state in which a connecting member is transferred to a tip of a protruding electrode of an electronic component according to the embodiment of the present invention and a conventional technique.

【図１０】本発明の実施形態および従来技術における電
子部品の配線板上への搭載状態を示す側面図である。FIG. 10 is a side view showing a state where electronic components are mounted on a wiring board according to the embodiment of the present invention and the related art.

【図１１】本発明の実施形態および従来技術における突
起電極がはんだの場合のリフロー後の接続状態を示す側
面図である。FIG. 11 is a side view showing a connection state after reflow in a case where a projecting electrode is a solder according to the embodiment of the present invention and a conventional technique.

【図１２】従来技術における突起電極への接続部材の転
写量が多すぎた場合を示す側面図である。FIG. 12 is a side view showing a case where a transfer amount of a connection member to a protruding electrode in the related art is too large.

【図１３】従来技術における突起電極への接続部材の転
写量が少なすぎた場合を示す側面図である。FIG. 13 is a side view showing a case where a transfer amount of a connection member to a protruding electrode in the related art is too small.

【図１４】従来技術における突起電極がはんだの場合の
リフロー後の接続不良を示す側面図である。FIG. 14 is a side view showing a connection failure after reflow when a protruding electrode is a solder according to a conventional technique.

【図１５】従来技術の実施形態の電子部品搭載装置の構
成を示す平面図である。FIG. 15 is a plan view illustrating a configuration of an electronic component mounting apparatus according to an embodiment of the related art.

【図１６】本発明の実施形態の突起電極の転写痕を撮像
する光学系とカメラの位置を示す側面図である。FIG. 16 is a side view showing the position of an optical system and a camera for imaging a transfer mark of a projection electrode according to the embodiment of the present invention.

【図１７】本発明の実施形態の正常な転写が行われた場
合の突起電極の転写痕の二値化処理画像の図面である。FIG. 17 is a drawing of a binarized image of a transfer mark of a protruding electrode when normal transfer according to the embodiment of the present invention is performed.

【図１８】本発明の実施形態の転写量が多すぎた場合の
突起電極の転写痕の二値化処理画像の図面である。FIG. 18 is a drawing of a binarized image of a transfer mark of a projection electrode when the transfer amount is too large according to the embodiment of the present invention.

【図１９】本発明の実施形態の転写量が少なすぎた場合
の突起電極の転写痕の二値化処理画像の図面である。FIG. 19 is a drawing of a binarized image of a transfer mark of a projection electrode when the transfer amount is too small in the embodiment of the present invention.

【図２０】本発明の実施形態および従来技術における突
起電極の欠けまたは高さの不揃いによる転写不良を示す
側面図である。FIG. 20 is a side view showing a transfer failure due to chipping or uneven height of the protruding electrodes in the embodiment of the present invention and the related art.

【図２１】本発明の実施形態の突起電極の欠けまたは高
さの不揃いによる不規則な転写痕の二値化処理画像の図
面である。FIG. 21 is a drawing of a binarized image of an irregular transfer mark due to chipping of the protruding electrodes or irregular heights according to the embodiment of the present invention.

【図２２】本発明の実施形態および従来技術における電
子部品と平滑化された接続部材の平行が失われた場合の
転写不良を示す側面図である。FIG. 22 is a side view showing a transfer failure when the parallelism between the electronic component and the smoothed connection member is lost in the embodiment of the present invention and the related art.

【図２３】本発明の実施形態の電子部品と平滑化された
接続部材の平行が失われた場合の突起電極の転写痕の二
値化処理画像の図面である。FIG. 23 is a drawing of a binarized image of a transfer mark of a protruding electrode when the electronic component and the smoothed connection member lose parallelism according to the embodiment of the present invention.

【図２４】本発明の第２の実施形態の突起電極の転写痕
を撮像する光学系とカメラの位置を示す側面図である。FIG. 24 is a side view showing a position of an optical system for imaging a transfer mark of a bump electrode and a camera according to the second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

２ 電子部品 ３ 突起電極 ４ 配線板 ６ 接続部材 ２０ 転写ステージ ２１ 回転ディスク ２４ スキージ １０１ 電子部品搭載装置 １０２ 光学系 １０３ カメラ １０５ 転写痕 １０６ 処理画像 １０８ 光学系 １０９ カメラ Reference Signs List 2 electronic component 3 protruding electrode 4 wiring board 6 connecting member 20 transfer stage 21 rotating disk 24 squeegee 101 electronic component mounting device 102 optical system 103 camera 105 transfer mark 106 processed image 108 optical system 109 camera

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 突起電極を有する電子部品を配線板上に
位置決め搭載する装置であって、電子部品供給位置から
配線板上の搭載位置までの電子部品の搬送経路上に、電
子部品の突起電極と配線板上の電極パッドの電気的かつ
機械的な接続に共する接続部材を、突起電極に転写する
ための転写ステージをもち、光学系とカメラを用いて取
り込んだ転写ステージ上の接続部材に残された突起電極
の転写痕の画像を処理することで、突起電極の転写状態
の良否判別が可能であることを特徴とする電子部品搭載
装置。An apparatus for positioning and mounting an electronic component having a protruding electrode on a wiring board, wherein the protruding electrode of the electronic component is provided on a transport path of the electronic component from an electronic component supply position to a mounting position on the wiring board. It has a transfer stage that transfers the electrical and mechanical connection of the electrode pads on the wiring board to the protruding electrodes. The connection member on the transfer stage that is captured using an optical system and a camera. An electronic component mounting apparatus characterized in that it is possible to determine the quality of the transfer state of the projection electrode by processing the image of the remaining transfer mark of the projection electrode. 【請求項２】 突起電極に転写するための転写ステージ
上に供給されている電子部品の突起電極と配線板上の電
極パッドの電気的かつ機械的な接続に共する接続部材
が、はんだペースト、または導電性接着剤、またはフラ
ックスであることを特徴とする請求項１の電子部品搭載
装置。2. A connection member for electrically and mechanically connecting a projecting electrode of an electronic component and an electrode pad on a wiring board, which is supplied on a transfer stage for transferring to a projecting electrode, comprises a solder paste, 2. The electronic component mounting device according to claim 1, wherein the device is a conductive adhesive or a flux. 【請求項３】 転写ステージ上の接続部材に残された突
起電極の転写痕の画像を取り込む光学系とカメラが、少
なくとも転写ステージの転写面よりも上方に固定されて
いることを特徴とする請求項１の電子部品搭載装置。3. An optical system for capturing an image of a transfer mark of a projection electrode left on a connecting member on a transfer stage and a camera are fixed at least above a transfer surface of the transfer stage. Item 6. The electronic component mounting device according to Item 1. 【請求項４】 転写ステージ上の接続部材に残された突
起電極の転写痕の画像を取り込む光学系とカメラが少な
くとも転写ステージの転写面よりも上方にあり電子部品
の搬送ヘッドと共に移動することを特徴とする請求項１
の電子部品搭載装置。4. An optical system for capturing an image of a transfer mark of a protruding electrode left on a connection member on a transfer stage and a camera at least above a transfer surface of the transfer stage and moving together with a transport head of an electronic component. Claim 1.
Electronic component mounting equipment.
JP29531697A 1997-10-28 1997-10-28 Electronic component mounting device Pending JPH11135572A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29531697A JPH11135572A (en) 1997-10-28 1997-10-28 Electronic component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29531697A JPH11135572A (en) 1997-10-28 1997-10-28 Electronic component mounting device

Publications (1)

Publication Number Publication Date
JPH11135572A true JPH11135572A (en) 1999-05-21

Family

ID=17819039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29531697A Pending JPH11135572A (en) 1997-10-28 1997-10-28 Electronic component mounting device

Country Status (1)

Country Link
JP (1) JPH11135572A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345543A (en) * 2000-05-31 2001-12-14 Sanyo Electric Co Ltd Flux transfer apparatus
WO2004084293A1 (en) * 2003-03-20 2004-09-30 Matsushita Electric Industrial Co. Ltd. Parts packaging device and parts packaging method
JP2007258398A (en) * 2006-03-23 2007-10-04 Hitachi High-Tech Instruments Co Ltd Electronic component attaching method, and electronic component attaching device
JP2008159845A (en) * 2006-12-25 2008-07-10 Matsushita Electric Ind Co Ltd Component mounting equipment and method
JP2009260105A (en) * 2008-04-18 2009-11-05 Panasonic Corp Paste transfer device, and paste transfer method
KR101340486B1 (en) * 2012-08-06 2013-12-12 한미반도체 주식회사 Flip chip bonding apparatus and controlling method thereof

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001345543A (en) * 2000-05-31 2001-12-14 Sanyo Electric Co Ltd Flux transfer apparatus
WO2004084293A1 (en) * 2003-03-20 2004-09-30 Matsushita Electric Industrial Co. Ltd. Parts packaging device and parts packaging method
US7353596B2 (en) 2003-03-20 2008-04-08 Matsushita Electric Industrial Co., Ltd. Component mounting method
US7797820B2 (en) 2003-03-20 2010-09-21 Panasonic Corporation Component mounting apparatus
JP2007258398A (en) * 2006-03-23 2007-10-04 Hitachi High-Tech Instruments Co Ltd Electronic component attaching method, and electronic component attaching device
JP4722741B2 (en) * 2006-03-23 2011-07-13 株式会社日立ハイテクインスツルメンツ Electronic component mounting method and electronic component mounting apparatus
JP2008159845A (en) * 2006-12-25 2008-07-10 Matsushita Electric Ind Co Ltd Component mounting equipment and method
JP4735532B2 (en) * 2006-12-25 2011-07-27 パナソニック株式会社 Component mounting apparatus and component mounting method
JP2009260105A (en) * 2008-04-18 2009-11-05 Panasonic Corp Paste transfer device, and paste transfer method
KR101340486B1 (en) * 2012-08-06 2013-12-12 한미반도체 주식회사 Flip chip bonding apparatus and controlling method thereof

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