JPH1112782A - Partial plating device - Google Patents
Partial plating deviceInfo
- Publication number
- JPH1112782A JPH1112782A JP16819297A JP16819297A JPH1112782A JP H1112782 A JPH1112782 A JP H1112782A JP 16819297 A JP16819297 A JP 16819297A JP 16819297 A JP16819297 A JP 16819297A JP H1112782 A JPH1112782 A JP H1112782A
- Authority
- JP
- Japan
- Prior art keywords
- mask
- plating
- plated
- hoop material
- current density
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はフープ材に形成した
高精細加工成形部のメッキ所要域にのみ可及的にメッキ
処理を施すことができるように改良した、部分メッキ装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a partial plating apparatus improved so that a plating process can be performed only on a required plating area of a high-definition molded portion formed on a hoop material.
【０００２】[0002]
【従来の技術】例えば、コネクタ端子のような舌片状の
接続端子の製造工程では、帯状のフープ材Ａに櫛歯状に
連続して形成した被メッキ部品に相当する接続端子母材
ａのメッキ所要域にのみ、電気的接触特性を向上させる
ための電極皮膜を、連続した部分メッキ処理にて形成す
る方法が用いられる。この部分メッキ処理には部分メッ
キ装置を用いる。2. Description of the Related Art For example, in a manufacturing process of a tongue-shaped connecting terminal such as a connector terminal, a connecting terminal base material a corresponding to a component to be plated, which is formed continuously in a comb-like shape on a band-shaped hoop material A, is formed. A method is used in which an electrode film for improving electrical contact characteristics is formed by continuous partial plating only in a required plating area. A partial plating apparatus is used for the partial plating.
【０００３】ところで、図４は従来の部分メッキ装置の
電解メッキ溶液槽内の要部を説明する斜視図である。図
４に示すように、この部分メッキ装置にあっては、例え
ば接続端子母材ａを櫛歯状に連続して形成したフープ材
Ａの両側に、該フープ材Ａを挟むようにマスクベルト
５，５が配設される。マスクベルト５，５は、可撓性を
有するゴム材あるいは塩化ビニール材などにて形成され
た帯状のものである。マスクベルト５，５のそれぞれ
は、対応する一対の駆動輪６，６によって無限ベルトと
して駆動される。FIG. 4 is a perspective view for explaining a main part in an electrolytic plating solution tank of a conventional partial plating apparatus. As shown in FIG. 4, in this partial plating apparatus, for example, a mask belt 5 is sandwiched on both sides of a hoop material A in which connection terminal base materials a are continuously formed in a comb tooth shape so as to sandwich the hoop material A. , 5 are provided. Each of the mask belts 5 and 5 is a belt-shaped member made of a flexible rubber material or vinyl chloride material. Each of the mask belts 5, 5 is driven as an endless belt by a pair of corresponding driving wheels 6, 6.
【０００４】マスクベルト５，５のそれぞれは所定ピッ
チの透孔５０，…５０を備え、該ピッチはフープ材Ａに
形成した接続端子母材ａのピッチと等しくされる。従っ
て、マスクベルト５，５とフープ材Ａとの走行が同期し
ていれば、透孔５０，…５０は、それぞれの接続端子母
材ａ，…ａの同じ対応位置を電解メッキ溶液に晒すこと
ができることになり、接続端子母材ａの表面の電解メッ
キ溶液に晒されるメッキ所要域にのみメッキ処理を施す
ことが可能となって、部分メッキ処理がなされることに
なる。Each of the mask belts 5, 5 has through holes 50,... 50 of a predetermined pitch, and the pitch is made equal to the pitch of the connection terminal base material a formed in the hoop material A. Therefore, if the running of the mask belts 5, 5 and the hoop material A are synchronized, the through holes 50,... 50 expose the same corresponding positions of the respective connection terminal base materials a,. Therefore, it is possible to perform plating only on a required plating area exposed to the electrolytic plating solution on the surface of the connection terminal base material a, so that partial plating is performed.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、近時の
コネクタ端子などの被メッキ部品にあっては、端子間隔
の狭ピッチ化、形状の複雑化が進み、寸法要求精度の向
上、形状やメッキ所要域の異なる多品種のものにも対応
できる品種切り替え性の向上などが求められているもの
の、上述のような従来の部分メッキ装置は、接続端子母
材ａの表面中のメッキ所要域以外の部分に、マスクベル
ト５のようなマスクを直接接触させて覆って電解メッキ
溶液を接触させないようにするものであるので、マスク
の複雑化によるコストアップが避けられないとともに、
被メッキ部品を変形させてしまうことによる不良品が多
発し、品種切り替え性も悪く、近時の部分メッキ処理に
対する要求に対応することができないという問題点があ
った。However, with regard to components to be plated such as connector terminals in recent years, the pitch between terminals has become narrower and the shape has become more complicated, so that the accuracy of dimensional requirements has been improved, and the shape and plating requirements have been improved. Although there is a demand for an improvement in type changeability that can cope with various types with different areas, the conventional partial plating apparatus as described above is not suitable for a portion of the surface of the connection terminal base material a other than the required plating area. In addition, since a mask such as the mask belt 5 is brought into direct contact with and covered so as not to come into contact with the electrolytic plating solution, cost increase due to complication of the mask is inevitable.
Defective products often occur due to deformation of the parts to be plated, and the type changeability is poor, so that there has been a problem that it is not possible to meet recent demands for partial plating.
【０００６】本発明は上記の問題点を解決するために成
されたもので、その目的とするところは、フープ材に形
成した高精細加工成形部を変形させることなく、高精細
加工成形部のメッキ所要域にのみメッキ処理を施すこと
のできる、優れる部分メッキ装置を提供することにあ
る。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to form a high-definition molded part without deforming a high-definition molded part formed on a hoop material. An object of the present invention is to provide an excellent partial plating apparatus capable of performing a plating process only on a required plating area.
【０００７】[0007]
【課題を解決するための手段】本発明は上記の問題点を
解決するため、請求項１記載の発明にあっては、フープ
材に加工を施し形成した被メッキ部品のメッキ所要域に
連続してメッキ処理を施す部分メッキ装置において、前
記フープ材の電解メッキ溶液中の走行方向に沿って配設
して前記被メッキ部品のメッキ所要域の電流密度をメッ
キ不用域に比べて増加させる電流密度制御マスクと、該
電流密度制御マスクを着脱自在に固定するマスク固定部
とを設けたことを特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention is directed to the invention as defined in claim 1, wherein the hoop material is processed continuously in a required plating area of a component to be plated. In the partial plating apparatus for performing plating, the current density is increased along a traveling direction of the hoop material in the electrolytic plating solution so as to increase the current density in a required plating area of the component to be plated as compared with a plating unnecessary area. A control mask and a mask fixing portion for detachably fixing the current density control mask are provided.
【０００８】請求項２記載の発明にあっては、前記電流
密度制御マスクは、電気的絶縁材料からなり、断面略Ｕ
字型またはＬ字型の連続体としてある。According to the present invention, the current density control mask is made of an electrically insulating material and has a substantially U-shaped cross section.
It is in the shape of a letter or L-shape.
【０００９】[0009]
【発明の実施の形態】以下、本発明に係る部分メッキ装
置の一実施の形態を図１〜図３に基づいて詳細に説明す
る。図１は部分メッキ装置の電解メッキ溶液槽内の様子
を説明する断面斜視図、図２は部分メッキ装置の電解メ
ッキ溶液槽内の要部を説明する分解斜視図、図３は被メ
ッキ部品へのメッキの付き方を説明する側面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a partial plating apparatus according to the present invention will be described below in detail with reference to FIGS. FIG. 1 is a cross-sectional perspective view illustrating the inside of an electrolytic plating solution tank of a partial plating apparatus, FIG. 2 is an exploded perspective view illustrating a main part of the electrolytic plating solution tank of a partial plating apparatus, and FIG. It is a side view explaining how to apply plating.
【００１０】図１に示すように、この部分メッキ装置
は、例えば金メッキのための青化金溶液を入れる電解メ
ッキ溶液槽１を備える。電解メッキ溶液槽１は、内部
に、プラス電位を印加される不溶解電極１０，１０と、
電流密度制御マスクに相当するマスクブロック１１と、
該マスクブロック１１を着脱自在に固定するマスク固定
部１２，１２とを備える。As shown in FIG. 1, this partial plating apparatus is provided with an electrolytic plating solution tank 1 for storing, for example, a bluish gold solution for gold plating. The electrolytic plating solution tank 1 includes insoluble electrodes 10, 10 to which a positive potential is applied,
A mask block 11 corresponding to a current density control mask;
Mask fixing portions 12 and 12 for detachably fixing the mask block 11.
【００１１】なお、図１において、Ａは例えば銅板のフ
ープ材であり、フープ材Ａは、高精細な加工を施して成
形された櫛歯状に並ぶ被メッキ部品ａ，…ａを備え、マ
イナス電位を印加されながら、例えば矢印Ｐの方向に所
定速度で青化金溶液中を走行する。In FIG. 1, A is a hoop material made of, for example, a copper plate, and the hoop material A is provided with parts to be plated a,... The vehicle travels in the blue gold solution at a predetermined speed in the direction of arrow P, for example, while the potential is being applied.
【００１２】不溶解電極１０は板状のもので、フープ材
Ａからある程度の距離をおいてフープ材Ａと平行に両側
に配設される。マスクブロック１１は、電解メッキ溶液
に対して安定で且つ電気絶縁材料である丈夫な硬質塩化
ビニールなどにて成形されるもので、この実施の形態の
ものにあっては断面Ｌ字状の棒状のものとされている。
マスク固定部１２，１２は、マスクブロック１１と同様
に、電解メッキ溶液に対して安定で且つ電気絶縁材料で
ある丈夫な硬質塩化ビニールなどにて成形されるもの
で、この実施の形態のものにあってはそれぞれ断面矩形
の棒状のものとされている。The insoluble electrodes 10 are plate-shaped, and are arranged on both sides in parallel with the hoop material A at a certain distance from the hoop material A. The mask block 11 is made of durable hard vinyl chloride or the like, which is stable against an electroplating solution and is an electrically insulating material. In this embodiment, the mask block 11 has an L-shaped rod shape. It is assumed.
Similar to the mask block 11, the mask fixing portions 12, 12 are formed of a hard vinyl chloride or the like which is stable against an electrolytic plating solution and is an electric insulating material. Each of them has a rod shape with a rectangular cross section.
【００１３】このマスク固定部１２，１２は、電解メッ
キ溶液槽１の底部に、マスクブロック１１の幅寸法Ｗよ
りやや広い間隔を以ってフープ材Ａと平行にそれぞれ固
定されており、マスクブロック１１をマスク固定部１
２，１２の間の電解メッキ溶液槽１の底部に載置する
と、マスクブロック１１はフープ材Ａの略直下にフープ
材Ａと平行に位置するとともに、マスクブロック１１の
断面Ｌ字の縦辺の形成する立面１１ａが被メッキ部品
ａ，…ａの一方面に近接する。The mask fixing portions 12 and 12 are fixed to the bottom of the electrolytic plating solution tank 1 at intervals slightly wider than the width W of the mask block 11 and in parallel with the hoop material A, respectively. 11 is the mask fixing part 1
When the mask block 11 is placed on the bottom of the electrolytic plating solution tank 1 between the hoop material A and the hoop material A, the mask block 11 is positioned substantially directly below the hoop material A and parallel to the hoop material A. The upright surface 11a to be formed approaches one surface of the parts a,... A to be plated.
【００１４】この立面１１ａが被メッキ部品ａの一方面
に近接した状態における、プラス電位を印加される不溶
解電極１０，１０とマイナス電位を印加されるフープ材
Ａひいては被メッキ部品ａとの間で流れる電流の電流密
度は、図３の模式曲線ｂで示すように、立面１１ａに対
向する面では低密度になり立面１１ａに対向しない面で
は高密度になるので、立面１１ａに対向する面には殆ど
メッキは付着せずに、立面１１ａとは対向しない方の面
すなわち被メッキ部品ａのメッキ所要域に専らメッキは
付着する。When the vertical surface 11a is close to one surface of the component a to be plated, the undissolved electrodes 10, 10 to which a positive potential is applied and the hoop material A to which a negative potential is applied, and thus the component a to be plated are connected. As shown by a schematic curve b in FIG. 3, the current density of the current flowing between the lower surface and the higher surface is lower on the surface facing the vertical surface 11a, and is higher on the surface not facing the vertical surface 11a. The plating hardly adheres to the opposing surface, and the plating adheres exclusively to the surface that does not oppose the upright surface 11a, that is, the plating required area of the component a to be plated.
【００１５】また、マスクブロック１１は断面略Ｌ字状
にされているので、被メッキ部品ａがフープ材Ａに吊ら
れるかたちで順次通過させることができ、生産効率が向
上できる。勿論、被メッキ部品ａのメッキ所要域の位置
によっては、マスクブロックの形状は断面略Ｕ字状ある
いはＪ字状にされても良いことは言うまでもない。更
に、マスクブロックは、マスク固定部１２，１２の間に
嵌入するようにして電解メッキ溶液槽１の底面に載置す
るのみで位置決めがなされるので、品種の切り換えに合
わせてマスクブロックを素早く交換でき、工程切り換え
が迅速に行えて生産性の向上が図れる。Further, since the mask block 11 has a substantially L-shaped cross section, the parts a to be plated can be sequentially passed while being hung on the hoop material A, and the production efficiency can be improved. It goes without saying that the mask block may have a substantially U-shaped or J-shaped cross section depending on the position of the required plating area of the component a to be plated. Further, since the mask block is positioned only by being mounted on the bottom surface of the electrolytic plating solution tank 1 so as to fit between the mask fixing portions 12 and 12, the mask block is quickly replaced in accordance with the type change. As a result, process switching can be performed quickly, and productivity can be improved.
【００１６】[0016]
【発明の効果】請求項１記載の発明によれば、フープ材
の電解メッキ溶液中の走行方向に沿って電流密度制御マ
スクが配設してあり、被メッキ部品は、電流密度制御マ
スクからメッキ所要域にのみメッキ処理が施されるよう
な電気的な影響を受けながら、電流密度制御マスクの傍
らを連続的に順次通過することができるので、高精細加
工成形されたものであっても外力を受けることがないの
で変形することなく部分メッキが可能であるとともに、
電流密度制御マスクを着脱自在に固定するマスク固定部
が設けられているので、品種切り換えに合わせてマスク
ブロックを素早く交換でき、工程切り換えが迅速に行え
て生産性の向上が図れる、優れる部分メッキ装置を提供
できるという効果を奏する。According to the first aspect of the present invention, the current density control mask is provided along the running direction of the hoop material in the electrolytic plating solution. Because it can pass continuously beside the current density control mask while being affected by the electrical effect that plating is applied only to the required area, even if it is a high definition processed product Because it is not subject to deformation, partial plating is possible without deformation,
An excellent partial plating system that has a mask fixing part for detachably fixing the current density control mask, so that mask blocks can be quickly replaced according to product type switching, process switching can be performed quickly and productivity can be improved. Is provided.
【００１７】請求項２記載の発明によれば、請求項１記
載の発明の効果に加えて更に、電流密度制御マスクは電
気的絶縁材料からなり断面略Ｕ字型またはＬ字型にして
あるので、被メッキ部品のメッキ所要域の近傍となる部
分にフープ材の走行方向に沿ったスリットあるいは開口
溝を形成することで簡単に電流密度制御を行うことがで
き、且つ、フープ材に形成した被メッキ部品を順次連続
して部分メッキ処理できる、生産性の優れる、部分メッ
キ装置を提供できるという効果を奏する。According to the second aspect of the invention, in addition to the effect of the first aspect, the current density control mask is made of an electrically insulating material and has a substantially U-shaped or L-shaped cross section. By forming a slit or an opening groove along the running direction of the hoop material in a portion near the required plating area of the component to be plated, it is possible to easily control the current density, and also to form the coating on the hoop material. This has the effect of being able to provide a partial plating apparatus that is capable of sequentially and partially plating the plated parts and is excellent in productivity.
【図１】本発明に係る一実施の形態の部分メッキ装置の
電解メッキ溶液槽内の様子を説明する断面斜視図であ
る。FIG. 1 is a cross-sectional perspective view illustrating a state in an electrolytic plating solution tank of a partial plating apparatus according to an embodiment of the present invention.
【図２】上記部分メッキ装置の電解メッキ溶液槽内の要
部を説明する分解斜視図である。FIG. 2 is an exploded perspective view illustrating a main part in an electrolytic plating solution tank of the partial plating apparatus.
【図３】被メッキ部品へのメッキの付き方を説明する側
面図である。FIG. 3 is a side view for explaining how to apply plating to a component to be plated.
【図４】従来の部分メッキ装置の電解メッキ溶液槽内の
要部を説明する斜視図である。FIG. 4 is a perspective view illustrating a main part in an electrolytic plating solution tank of a conventional partial plating apparatus.
１１ 電流密度制御マスク １２ マスク固定部 Ａ フープ材 ａ 被メッキ部品 11 Current density control mask 12 Mask fixing part A Hoop material a Parts to be plated
───────────────────────────────────────────────────── フロントページの続き (72)発明者 水谷 和人 大阪府門真市大字門真1048番地松下電工株 式会社内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Kazuto Mizutani 1048 Kadoma Kadoma, Kadoma City, Osaka Inside Matsushita Electric Works, Ltd.
Claims (2)
部品のメッキ所要域に連続してメッキ処理を施す部分メ
ッキ装置において、前記フープ材の電解メッキ溶液中の
走行方向に沿って配設して前記被メッキ部品のメッキ所
要域の電流密度をメッキ不用域に比べて増加させる電流
密度制御マスクと、該電流密度制御マスクを着脱自在に
固定するマスク固定部とを設けたことを特徴とする部分
メッキ装置。In a partial plating apparatus for continuously plating a required area of a component to be plated formed by processing a hoop material, the partial hoop material is disposed along a running direction of the hoop material in an electrolytic plating solution. A current density control mask for increasing the current density in the required plating area of the component to be plated as compared with a plating unnecessary area, and a mask fixing portion for detachably fixing the current density control mask. Partial plating equipment.
材料からなり、断面略Ｕ字型またはＬ字型の連続体であ
る請求項１記載の部分メッキ装置。2. The partial plating apparatus according to claim 1, wherein the current density control mask is made of an electrically insulating material and is a continuous body having a substantially U-shaped or L-shaped cross section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16819297A JPH1112782A (en) | 1997-06-25 | 1997-06-25 | Partial plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16819297A JPH1112782A (en) | 1997-06-25 | 1997-06-25 | Partial plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1112782A true JPH1112782A (en) | 1999-01-19 |
Family
ID=15863500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16819297A Pending JPH1112782A (en) | 1997-06-25 | 1997-06-25 | Partial plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1112782A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6429975B1 (en) * | 1999-11-25 | 2002-08-06 | Minolta Co., Ltd. | Illumination optical system and projector using same |
| JP2013216937A (en) * | 2012-04-06 | 2013-10-24 | Jx Nippon Mining & Metals Corp | Spot plating device |
-
1997
- 1997-06-25 JP JP16819297A patent/JPH1112782A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6429975B1 (en) * | 1999-11-25 | 2002-08-06 | Minolta Co., Ltd. | Illumination optical system and projector using same |
| JP2013216937A (en) * | 2012-04-06 | 2013-10-24 | Jx Nippon Mining & Metals Corp | Spot plating device |
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