JPH11103178A - Board holding structure in vehicle mounted electronic controller - Google Patents
Board holding structure in vehicle mounted electronic controllerInfo
- Publication number
- JPH11103178A JPH11103178A JP26236197A JP26236197A JPH11103178A JP H11103178 A JPH11103178 A JP H11103178A JP 26236197 A JP26236197 A JP 26236197A JP 26236197 A JP26236197 A JP 26236197A JP H11103178 A JPH11103178 A JP H11103178A
- Authority
- JP
- Japan
- Prior art keywords
- housing
- resin
- board
- substrate
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動車などの乗物
に搭載される電子制御装置筐体内部の基板を保持する基
板構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board structure for holding a board inside an electronic control unit housing mounted on a vehicle such as an automobile.
【０００２】[0002]
【従来の技術】例えば船舶などの乗物に搭載されるエン
ジン、トランスミッション、等々の電子制御に用いられ
る電子制御装置は、その設置部位に応じて、その内部に
まで防水性などが必要される場合がある。かかる制御装
置は、電子部品などの構成部品を搭載した基板をその筐
体内に固定し、防水性などのため、液状または流動体状
の樹脂を該筐体に充填してこれを硬化せしめ基板を包埋
して防水性を向上させている。2. Description of the Related Art An electronic control device used for electronic control of an engine, a transmission, and the like mounted on a vehicle such as a ship, for example, may require waterproofness or the like depending on the installation site. is there. Such a control device fixes a substrate on which components such as electronic components are mounted in its housing, and fills the housing with a liquid or fluid resin for water resistance or the like, cures the resin, and cures the substrate. Embedded to improve waterproofing.
【０００３】[0003]
【発明が解決しようとする課題】ところが、電子制御装
置の製造工程における樹脂充填工程において、筐体と基
板との間にできた気泡が抜けにくく、樹脂充填後の樹脂
中に残留することがあるので、この気泡を除去するため
の脱泡工程が必要となっている。樹脂中残留気泡のある
場合の脱泡工程のために、電子制御装置の製造工程数が
増加したり、さらには、筐体と制御基板の間隔を全体的
に増やして充填樹脂の流動性を良好にするために、完成
品が大型化する傾向にあった。However, in the resin filling step in the manufacturing process of the electronic control unit, bubbles formed between the housing and the substrate are difficult to escape and may remain in the resin after the resin filling. Therefore, a defoaming step for removing the air bubbles is required. Due to the defoaming step when there are residual bubbles in the resin, the number of manufacturing steps of the electronic control device increases, and furthermore, the space between the housing and the control board is increased overall to improve the flowability of the filled resin. Therefore, the size of the finished product tends to increase.
【０００４】本発明は、電子制御装置の筐体に液状また
は流動体状の樹脂を充填する際に、筐体と制御基板の間
に流動性樹脂を注入し易くするとともに制御基板裏面に
残留しがちな気泡を除去し易くすることを目的とする。According to the present invention, when a casing of an electronic control unit is filled with a liquid or fluid resin, a fluid resin is easily injected between the casing and the control board, and the resin is left on the rear face of the control board. It is intended to make it easy to remove air bubbles that tend to occur.
【０００５】[0005]
【課題を解決するための手段】本発明の乗物搭載用電子
制御装置内基板保持構造は、電子部品を搭載した基板
と、前記基板が通過可能な開口を有しかつ前記基板を保
持する筐体と、前記筐体内に充填されて前記基板を包埋
する硬化樹脂と、からなる基板保持構造であって、前記
基板は通気及び流動性樹脂の通過のための切欠き及び貫
通開口の少なくとも1つを有することを特徴とする。According to the present invention, there is provided a board holding structure in a vehicle-mounted electronic control device, comprising: a board on which electronic components are mounted; and a housing having an opening through which the board can pass and holding the board. And a cured resin filled in the housing to embed the substrate, wherein the substrate has at least one of a notch and a through-opening for ventilation and passage of a fluid resin. It is characterized by having.
【０００６】[0006]
【発明の実施の形態】本発明の実施例を、図面を参照し
つつ説明する。図１は、中空の略直方体形状の制御装置
用の筐体１０内にて樹脂により包埋される略矩形の基板
の平面形状を示す。図１（ａ）は略中央に貫通開口ａを
有し四隅を斜めに直線で切断した切り欠き部１を有する
基板１１を、図１（ｂ）は略中央に貫通開口ａを有し内
部に曲率中心を有する曲線で四隅を切断した切り欠き部
２を有する基板１１を、図１（ｃ）は略中央に貫通開口
ａを有し外部に曲率中心を有する曲線で四隅を切断した
切り欠き部３を有する基板１１を、図１（ｄ）は略中央
付近に４つの貫通開口ａを有し四隅を斜めに直線で切断
した切り欠き部１を有する基板１１を、それぞれ示す。
なお、かかる切り欠き部は図１（ａ）に示すように筐体
１０内壁から基板１１までの間隙の平均距離Ｇより大な
る距離Ｌを有する部位であるので、直線や、円弧に限ら
れずどんな線で画定されたものでもよい。さらに、切り
欠き部は四隅にすべて設けることが好ましいが、流動性
樹脂の通気及び流動性樹脂の通過が十分であれば、基板
の１つの隅に設けたものでもよい。また、貫通開口の形
状も円形に限らず、多角形、矩形、楕円などの閉じた線
で画定されたものでもよい。貫通開口の個数および位置
も、１または４つに限定されず、基板中央でなくともよ
い。いずれも、制御基板形状を、搭載電子部品の形状及
び個数、並びに配線パターンに大きく影響することなく
画定することができる。筐体が直方体のほか、多面体で
も、基板全体形状をその１断面内の形状に輪郭をあわせ
て、所定のクリアランスすなわち間隙を保って、画定し
て、流動性樹脂中の気泡の通気及び流動性樹脂自体の通
過のために、上記の切欠き及び貫通開口の少なくとも1
つを形成すればよい。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a planar shape of a substantially rectangular substrate embedded in a resin in a hollow substantially rectangular parallelepiped control device housing 10. FIG. 1A shows a substrate 11 having a cut-out portion 1 having a through opening a substantially in the center and obliquely cutting the four corners in a straight line, and FIG. FIG. 1C shows a substrate 11 having cutouts 2 cut at four corners by a curve having a center of curvature, and FIG. 1C shows a cutout cut at four corners by a curve having a through opening a substantially at the center and having a center of curvature outside. 1 (d) shows a substrate 11 having four through openings a substantially in the vicinity of the center and having notches 1 obliquely cut at four corners.
In addition, as shown in FIG. 1A, the notch is a portion having a distance L larger than the average distance G of the gap from the inner wall of the housing 10 to the substrate 11, and is not limited to a straight line or an arc. It may be defined by a line. Further, it is preferable that the cutouts be provided at all four corners, but the cutouts may be provided at one corner of the substrate as long as the flow of the flowable resin and the passage of the flowable resin are sufficient. The shape of the through-opening is not limited to a circle, but may be a polygon, a rectangle, an ellipse, or other closed line. The number and positions of the through openings are not limited to one or four, and need not be at the center of the substrate. In any case, the control board shape can be defined without significantly affecting the shape and number of mounted electronic components and the wiring pattern. Even if the housing is a rectangular parallelepiped or a polyhedron, the entire shape of the substrate is contoured to the shape in one cross section, and a predetermined clearance, that is, a gap is maintained and defined. For the passage of the resin itself, at least one of the above notches and through openings
One may be formed.
【０００７】よって、上記同様の筐体１０内の基板にお
いて、図２（ａ）のように隅から略中央に伸びる切り欠
き部４を有する基板１１、図２（ｂ）のように流動性樹
脂の注入ノズル１３位置および流動方向１５を考慮した
スリット開口５を有する基板１１、とすることもでき、
図２（ｃ）のように基板隅でなく側縁に切り欠き部６を
有する基板１１とすることもできる。このように、基板
内部に貫通開口をそして周縁に切り欠き部を設けること
で樹脂注入性と脱泡性を向上させることができる。Therefore, in the same board 10 as above, a board 11 having a cutout 4 extending from a corner to a substantially center from a corner as shown in FIG. 2A, and a fluid resin as shown in FIG. Substrate 11 having a slit opening 5 in consideration of the position of the injection nozzle 13 and the flow direction 15 of
As shown in FIG. 2C, the substrate 11 may have the notch 6 at the side edge instead of the corner of the substrate. As described above, by providing the through-opening inside the substrate and providing the notch on the peripheral edge, the resin injecting property and the defoaming property can be improved.
【０００８】本実施例では、筐体と基板の基本的なクリ
アランスを変えずに、基板四隅の形状を斜めに切断する
ことで部分的にクリアランスを確保し、その部分から容
易に樹脂注入ができ、気泡が自ら抜けていくようにす
る。また、残留した気泡が最も抜けにくい基板中心に貫
通穴を設け、気泡を抜けやすくするとともに、目視で基
板中心付近の樹脂の状態を確認することができる。In this embodiment, without changing the basic clearance between the housing and the substrate, the four corners of the substrate are cut obliquely to partially secure the clearance, and the resin can be easily injected from that portion. , So that the bubbles can escape by themselves. In addition, a through hole is provided in the center of the substrate where the remaining air bubbles are least likely to escape, so that the air bubbles can easily escape, and the state of the resin near the center of the substrate can be visually checked.
【０００９】上記した切り欠きや貫通開口は、基板上の
回路配線パターンの存在しない部分すなわち配線パター
ンの非存在域に設けるのが望ましく、この場合、回路配
線パターンの設計も考慮すべきことは言うまでもない。
電子制御装置の組立方法の一例を説明する。まず、図３
に示すように、内部を清浄された筐体１０を用意する。
この筐体は内部基板への電気的接続用コネクタ等のため
壁部開口はすべて封止してある。次に、図４に示すよう
に、基板１１を、筐体の内壁下部の縁部に設けられた基
板用の保持部上に載置して、筐体底壁と略平行となるよ
うにして、保持部に基板をネジ締め等で固定する。It is desirable that the notch or the through-opening be provided in a portion of the substrate where no circuit wiring pattern exists, that is, in a region where no wiring pattern exists. In this case, it goes without saying that the design of the circuit wiring pattern should also be considered. No.
An example of an assembling method of the electronic control device will be described. First, FIG.
As shown in (1), a housing 10 whose inside is cleaned is prepared.
This housing has all the wall openings sealed for a connector for electrical connection to the internal substrate. Next, as shown in FIG. 4, the substrate 11 is placed on a substrate holding portion provided at the lower edge of the inner wall of the housing, and is substantially parallel to the bottom wall of the housing. Then, the substrate is fixed to the holder by screwing or the like.
【００１０】次に、図５に示すように、筐体１０を好ま
しくは水平状態に維持したままで合成樹脂注入装置のノ
ズル１３を筐体内壁角部の基板切欠き部１から筐体底部
近傍へ挿入して、流動状態の硬化可能合成樹脂２０、例
えばエポキシ樹脂を注入する。その後、図６に示すよう
に、基板１１が合成樹脂２０中に埋没するまで樹脂注入
が続けられる。この際、注入速度は流れが空気を巻き込
まない程度で行う。すなわち、ノズル先端は樹脂中に存
在させておくことが望ましいが、必ずしも樹脂中におく
必要はない。樹脂に閉じ込められた気泡３０は、貫通穴
ａや四隅切り欠き部１から逃げて浮遊する。Next, as shown in FIG. 5, while maintaining the casing 10 preferably in a horizontal state, the nozzle 13 of the synthetic resin injection device is moved from the substrate notch 1 at the corner of the inner wall of the casing to the vicinity of the bottom of the casing. And a flowable curable synthetic resin 20, such as an epoxy resin, is injected. Thereafter, as shown in FIG. 6, resin injection is continued until the substrate 11 is buried in the synthetic resin 20. At this time, the injection speed is set so that the flow does not involve air. That is, it is desirable that the tip of the nozzle be present in the resin, but it is not necessary that the tip be present in the resin. The air bubbles 30 trapped in the resin escape from the through holes a and the four corner cutouts 1 and float.
【００１１】筐体１０中のエポキシ樹脂が所定量に達し
た後注入を終了して、図７に示すように、所定時間以上
放置して，これを硬化させる。以上のようにして電子制
御装置が完成する。After the epoxy resin in the casing 10 reaches a predetermined amount, the injection is terminated, and as shown in FIG. 7, the epoxy resin is left for a predetermined time or more to cure. The electronic control device is completed as described above.
【００１２】[0012]
【発明の効果】本発明によれば、電子部品を搭載した基
板と、基板が通過可能な開口を有しかつ基板を保持する
筐体と、該筐体の内部を充填した硬化性樹脂と、からな
る電子制御装置の基板保持構造において、流動状態樹脂
の気泡の通気及び流動樹脂の通過のための切欠き部及び
貫通開口の少なくとも1つを基板に設けることを特徴と
するので、硬化した樹脂内に気泡が残留するおそれがな
くなり気泡残留による経年劣化が回避できると共に、脱
泡工程が削減され作業性が向上しコストダウンが達成さ
れる。According to the present invention, a substrate on which electronic components are mounted, a housing having an opening through which the substrate can pass and holding the substrate, a curable resin filling the interior of the housing, A substrate holding structure for an electronic control device, comprising: providing at least one of a cutout portion and a through opening for venting air bubbles of the fluidized resin and passing the fluidized resin on the substrate, so that the cured resin There is no danger of bubbles remaining inside, and aging due to the remaining bubbles can be avoided, and the defoaming step is reduced, workability is improved, and cost reduction is achieved.
【図１】 電子制御装置用の筐体とその制御基板の平面
図。FIG. 1 is a plan view of a housing for an electronic control device and a control board thereof.
【図２】 電子制御装置用の筐体とその制御基板の平面
図。FIG. 2 is a plan view of a housing for an electronic control device and a control board thereof.
【図３】 電子制御装置の組立工程中の筐体と制御基板
の断面図。FIG. 3 is a cross-sectional view of a housing and a control board during an assembly process of the electronic control device.
【図４】 電子制御装置の組立工程中の筐体と制御基板
の断面図。FIG. 4 is a sectional view of a housing and a control board during an assembly process of the electronic control device.
【図５】 電子制御装置の組立工程中の筐体と制御基板
の断面図。FIG. 5 is a sectional view of a housing and a control board during an assembly process of the electronic control device.
【図６】 電子制御装置の組立工程中の筐体と制御基板
の断面図。FIG. 6 is a sectional view of a housing and a control board during an assembly process of the electronic control device.
【図７】 電子制御装置の組立工程中の筐体と制御基板
の断面図。FIG. 7 is a cross-sectional view of a housing and a control board during an assembly process of the electronic control device.
ａ 貫通開口 １、２、３、４、６ 切り欠き部 ５ スリット開口 １０ 電子制御装置用の筐体 １１ 電子制御装置用の基板 １３ 流動性樹脂注入ノズル １５ 樹脂流動方向 ２０ 硬化可能合成樹脂 ３０ 気泡 a Through-opening 1, 2, 3, 4, 6 Notch 5 Slit opening 10 Housing for electronic control device 11 Substrate for electronic control device 13 Fluid resin injection nozzle 15 Resin flow direction 20 Curable synthetic resin 30 Bubbles
Claims (1)
通過可能な開口を有しかつ前記基板を保持する筐体と、
前記筐体内に充填されて前記基板を包埋する硬化樹脂
と、からなる基板保持構造であって、 前記基板は通気及び流動性樹脂の通過のための切欠き及
び貫通開口の少なくとも1つを有することを特徴とする
基板保持構造。A substrate having an electronic component mounted thereon, a housing having an opening through which the substrate can pass and holding the substrate;
A cured resin filled in the housing to embed the substrate, wherein the substrate has at least one of a cutout and a through-opening for ventilation and passage of the fluid resin. A substrate holding structure, characterized in that:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26236197A JPH11103178A (en) | 1997-09-26 | 1997-09-26 | Board holding structure in vehicle mounted electronic controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26236197A JPH11103178A (en) | 1997-09-26 | 1997-09-26 | Board holding structure in vehicle mounted electronic controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11103178A true JPH11103178A (en) | 1999-04-13 |
Family
ID=17374680
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26236197A Pending JPH11103178A (en) | 1997-09-26 | 1997-09-26 | Board holding structure in vehicle mounted electronic controller |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11103178A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006078255A (en) * | 2004-09-08 | 2006-03-23 | Yazaki Corp | Current sensor |
| JP2006328993A (en) * | 2005-05-24 | 2006-12-07 | Kokusan Denki Co Ltd | Waterproof electronic circuit unit |
| WO2007139129A1 (en) * | 2006-06-01 | 2007-12-06 | Panasonic Corporation | Brushless motor for washing machine and washing machine having the brushless motor mounted therein |
| JP2009222729A (en) * | 2009-07-09 | 2009-10-01 | Yazaki Corp | Current sensor |
| JP2009277881A (en) * | 2008-05-14 | 2009-11-26 | Shindengen Electric Mfg Co Ltd | Electronic apparatus, and method of manufacturing the same |
| JP2010056351A (en) * | 2008-08-29 | 2010-03-11 | Nippon Seiki Co Ltd | Electronic device |
| JP2012028218A (en) * | 2010-07-26 | 2012-02-09 | Panasonic Electric Works Co Ltd | Discharge lamp lighting-up device and lighting fixture equipped with the same |
| JP2012151223A (en) * | 2011-01-18 | 2012-08-09 | Shindengen Electric Mfg Co Ltd | Housing case, electronic component module, and electronic apparatus |
| JP2015061407A (en) * | 2013-09-19 | 2015-03-30 | 株式会社デンソー | Rotary electric machine for vehicle |
-
1997
- 1997-09-26 JP JP26236197A patent/JPH11103178A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006078255A (en) * | 2004-09-08 | 2006-03-23 | Yazaki Corp | Current sensor |
| JP2006328993A (en) * | 2005-05-24 | 2006-12-07 | Kokusan Denki Co Ltd | Waterproof electronic circuit unit |
| US8269380B2 (en) | 2006-06-01 | 2012-09-18 | Panasonic Corporation | Brushless motor for washing machine having stress reduction on sensor casing and washing machine having the brushless motor mounted therein |
| WO2007139129A1 (en) * | 2006-06-01 | 2007-12-06 | Panasonic Corporation | Brushless motor for washing machine and washing machine having the brushless motor mounted therein |
| EP2012572A1 (en) * | 2006-06-01 | 2009-01-07 | Panasonic Corporation | Brushless motor for washing machine and washing machine having the brushless motor mounted therein |
| EP2012572A4 (en) * | 2006-06-01 | 2015-04-29 | Panasonic Corp | Brushless motor for washing machine and washing machine having the brushless motor mounted therein |
| JP4821852B2 (en) * | 2006-06-01 | 2011-11-24 | パナソニック株式会社 | Brushless motor for washing machine and washing machine equipped with the same |
| JP2009277881A (en) * | 2008-05-14 | 2009-11-26 | Shindengen Electric Mfg Co Ltd | Electronic apparatus, and method of manufacturing the same |
| JP2010056351A (en) * | 2008-08-29 | 2010-03-11 | Nippon Seiki Co Ltd | Electronic device |
| JP2009222729A (en) * | 2009-07-09 | 2009-10-01 | Yazaki Corp | Current sensor |
| JP2012028218A (en) * | 2010-07-26 | 2012-02-09 | Panasonic Electric Works Co Ltd | Discharge lamp lighting-up device and lighting fixture equipped with the same |
| JP2012151223A (en) * | 2011-01-18 | 2012-08-09 | Shindengen Electric Mfg Co Ltd | Housing case, electronic component module, and electronic apparatus |
| JP2015061407A (en) * | 2013-09-19 | 2015-03-30 | 株式会社デンソー | Rotary electric machine for vehicle |
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