JPH104078A - Single wafer immersion cleaning system - Google Patents
Single wafer immersion cleaning systemInfo
- Publication number
- JPH104078A JPH104078A JP17704996A JP17704996A JPH104078A JP H104078 A JPH104078 A JP H104078A JP 17704996 A JP17704996 A JP 17704996A JP 17704996 A JP17704996 A JP 17704996A JP H104078 A JPH104078 A JP H104078A
- Authority
- JP
- Japan
- Prior art keywords
- cleaning
- tank
- cleaning liquid
- single wafer
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ウエハを一枚毎洗
浄する枚葉型ウエハ浸漬洗浄装置に関する。より詳しく
は、例えば半導体ウエハ等のウエハを一枚毎に洗浄液に
浸漬し洗浄する枚葉型ウエハ浸漬洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single wafer immersion cleaning apparatus for cleaning wafers one by one. More specifically, the present invention relates to a single wafer immersion cleaning apparatus for cleaning a wafer such as a semiconductor wafer by immersing it in a cleaning liquid one by one.
【０００２】[0002]
【従来の技術】半導体製造プロセスにおいて、ウエハの
表面（ウエハ鏡面）の汚れを除去する洗浄が行われる。2. Description of the Related Art In a semiconductor manufacturing process, cleaning for removing dirt on the surface of a wafer (mirror surface of a wafer) is performed.
【０００３】ウエハの洗浄方法には、従来、複数枚のウ
エハをキャリアに保持しそのキャリアを洗浄液に浸漬し
洗浄するバッチ式ウエハ浸漬洗浄法と、ウエハをチャッ
クで支持しウエハを回転させ一枚毎にスプレーで洗浄液
を噴霧し洗浄する枚葉式ウエハスプレー洗浄法又はブラ
シで洗浄する枚葉式ウエハブラシ洗浄法等がある。Conventionally, a wafer cleaning method includes a batch-type wafer immersion cleaning method in which a plurality of wafers are held in a carrier and the carrier is immersed in a cleaning liquid for cleaning, or a wafer is supported by a chuck and the wafer is rotated to rotate one wafer. Each time, there is a single-wafer-type wafer spray cleaning method in which a cleaning liquid is sprayed and cleaned by a spray, or a single-wafer-type wafer brush cleaning method in which cleaning is performed with a brush.
【０００４】前者のバッチ式ウエハ浸漬洗浄法は、ウエ
ハの洗浄枚数の如何に拘わらず所定枚数の洗浄槽，搬送
設備，リンス槽（水槽）および乾燥設備が必要であり、
装置全体が大型化し、また使用洗浄液，純水，発生する
パーティクルを排除するための排気の面で無駄が多い。
即ち、数枚のウエハを洗浄する際にも、ウエハを所定枚
数保持するキャリアで保持し所定枚数処理可能な浸漬洗
浄装置を使用して洗浄するため、所定枚数分の洗浄液，
エネルギーを必要とする。一方、所定枚数のウエハを洗
浄処理しても、次の工程がウエハを一枚毎処理する枚葉
設備であれば、ウエハの洗浄処理後の待ち時間が長くな
ってその間に自然酸化膜の成長やパーティクル付着等の
問題が生じ易い。The former batch-type wafer immersion cleaning method requires a predetermined number of cleaning tanks, transfer equipment, rinsing tanks (water tanks), and drying equipment regardless of the number of wafers to be washed.
The whole apparatus becomes large, and there is much waste in terms of exhaustion for removing used cleaning liquid, pure water, and generated particles.
That is, even when cleaning several wafers, the cleaning liquid is held by a carrier holding a predetermined number of wafers and cleaned by using an immersion cleaning device capable of processing a predetermined number of wafers.
Requires energy. On the other hand, even if a predetermined number of wafers are cleaned, if the next step is a single-wafer facility that processes wafers one by one, the waiting time after the wafer cleaning process becomes longer, and during this time the growth of the natural oxide film occurs. And problems such as particle adhesion are likely to occur.
【０００５】後者の枚葉式ウエハスプレー洗浄法および
枚葉式ウエハブラシ洗浄法は、ウエハ等を回転させる回
転機構が必要であり、構造が複雑になる。また、構造が
複雑化することで、パーティクルの発生が多くなる。そ
れに、スプレー洗浄の場合、発生したパーティクルが洗
浄液に混入し易いため、一度使用した洗浄液を排水する
使い捨て方式となり、従って経済的に不利になる。The latter single wafer spray cleaning method and single wafer brush cleaning method require a rotating mechanism for rotating a wafer or the like, and the structure becomes complicated. In addition, the generation of particles increases due to the complicated structure. In addition, in the case of spray cleaning, the generated particles are easily mixed into the cleaning liquid, so that the cleaning liquid used once is a disposable method in which the cleaning liquid is drained, which is economically disadvantageous.
【０００６】[0006]
【発明が解決しようとする課題】従って、従来のウエハ
洗浄方式では、ウエハの洗浄処理枚数に応じて適切に洗
浄することは不可能であり、その他の面でも満足できる
ものではなかった。Therefore, in the conventional wafer cleaning method, it is impossible to properly clean the wafer according to the number of wafers to be processed, and other aspects are not satisfactory.
【０００７】本発明は、上記従来技術の欠点に鑑みなさ
れたものであって、ウエハの洗浄処理枚数に応じて適切
に洗浄し、処理プロセスに即したレイアウトを可能に
し、装置の小型化を図り、使用洗浄液の無駄を無くし、
機械的機構を少なくし構造を簡単化するとともにパーテ
ィクルの発生を少なくし、さらには自然酸化膜の成長や
パーティクルの付着の少ない枚葉型ウエハ浸漬洗浄装置
の提供を目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks of the prior art, and has been made in consideration of the number of wafers to be cleaned and appropriately cleaned to enable a layout conforming to the processing process and to reduce the size of the apparatus. , Eliminate waste of used cleaning fluid,
It is an object of the present invention to provide a single wafer immersion cleaning apparatus which reduces mechanical mechanisms and simplifies the structure and reduces generation of particles, and furthermore, growth of a natural oxide film and little adhesion of particles.
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するた
め、本発明は、枚葉浸漬槽を、洗浄液を収容したウエハ
を一枚毎洗浄する洗浄槽と、該洗浄槽の外周に設けた上
部開口が洗浄槽の上部開口よりも高い位置にあって洗浄
槽からオーバフローした洗浄液を収容する外槽で構成
し、該枚葉浸漬槽を所定数配設したことを特徴する枚葉
型ウエハ浸漬洗浄装置を提供する。In order to achieve the above object, the present invention provides a single wafer immersion tank, a cleaning tank for cleaning each wafer containing a cleaning liquid, and an upper part provided on the outer periphery of the cleaning tank. Single-wafer immersion cleaning characterized in that an opening is located higher than the upper opening of the cleaning tank and an outer tank for containing a cleaning liquid overflowing from the cleaning tank is provided, and a predetermined number of the single-wafer immersion tanks are provided. Provide equipment.
【０００９】[0009]
【発明の実施の形態】好ましい実施の形態では、前記所
定数配設した各枚葉浸漬槽の洗浄槽の底部に洗浄液を供
給する洗浄液供給管を取り付け、該各洗浄液供給管を共
通の洗浄液供給ラインで連結し、各枚葉浸漬槽の外槽の
底部に洗浄液を排出する洗浄液排出管を取り付け、該各
洗浄液排出管を共通の洗浄液排出ラインで連結し、該共
通の洗浄液排出ラインと前記共通の洗浄液供給ラインと
を循環ラインで連結し、該循環ラインに洗浄液を循環さ
せる循環ポンプと濾過するフィルタとを設けたことを特
徴とする。In a preferred embodiment, a cleaning liquid supply pipe for supplying a cleaning liquid is attached to the bottom of the cleaning tank of each of the predetermined number of single wafer immersion tanks, and each cleaning liquid supply pipe is connected to a common cleaning liquid supply pipe. A cleaning liquid discharge pipe for discharging the cleaning liquid is attached to the bottom of the outer tank of each single wafer immersion tank, and the respective cleaning liquid discharge pipes are connected by a common cleaning liquid discharge line, and are connected to the common cleaning liquid discharge line. The cleaning liquid supply line is connected with a circulation line, and a circulation pump for circulating the cleaning liquid and a filter for filtering are provided in the circulation line.
【００１０】さらに好ましい実施の形態では、前記所定
数配設した枚葉浸漬槽群に隣接して純水を収容する１つ
のリンス槽を配設したことを特徴とする。In a further preferred embodiment, one rinsing tank for containing pure water is provided adjacent to the predetermined number of single wafer immersion tank groups.
【００１１】さらに好ましい実施の形態では、前記所定
数配設した枚葉浸漬槽の相互間に純水を収容するリンス
槽を配設し、各リンス槽の底部に純水を供給する純水供
給管を取り付け、該各純水供給管を共通の純水供給ライ
ンで連結したことを特徴とする。In a further preferred embodiment, a rinsing tank for accommodating pure water is provided between the predetermined number of single wafer immersion tanks, and a pure water supply for supplying pure water to the bottom of each rinsing tank. A pipe is attached, and each of the pure water supply pipes is connected by a common pure water supply line.
【００１２】さらに好ましい実施の形態では、前記所定
数配設した枚葉浸漬槽を、洗浄液を収容したウエハを一
枚毎洗浄する洗浄槽を所定数配設した洗浄槽群と、該各
洗浄槽の外周に設けた上部開口が洗浄槽の上部開口より
も高い位置にあって各洗浄槽からオーバフローした洗浄
液を収容する共通の外槽で構成したことを特徴とする。In a further preferred embodiment, the predetermined number of single wafer immersion tanks are provided, a cleaning tank group provided with a predetermined number of cleaning tanks for cleaning each wafer containing a cleaning liquid, and each of the cleaning tanks. The upper opening provided on the outer periphery of the cleaning tank is located at a position higher than the upper opening of the cleaning tank, and is constituted by a common outer tank for storing the cleaning liquid overflowing from each cleaning tank.
【００１３】さらに好ましい実施の形態では、前記所定
数配設した枚葉浸漬槽群に隣接して純水を収容する１つ
のリンス槽を配設したことを特徴とする。In a further preferred embodiment, one rinsing tank for containing pure water is provided adjacent to the predetermined number of sheet immersion tank groups.
【００１４】[0014]
【実施例】図１は、本発明に係る枚葉型ウエハ浸漬洗浄
装置の一実施例で、図はその装置の概要図である。FIG. 1 is an embodiment of a single wafer type wafer immersion cleaning apparatus according to the present invention, and FIG. 1 is a schematic view of the apparatus.
【００１５】枚葉浸漬槽１は、洗浄槽２とその外周に設
けられた外槽３で構成されている。洗浄槽２は、洗浄液
Ｗを収容した縦長の矩形容器からなり、例えば半導体ウ
エハ等のウエハ４を一枚毎洗浄する。外槽３は、上部開
口３ａが洗浄槽２の上部開口２ａよりも高い位置にある
容器からなり、洗浄槽２からオーバフローした洗浄液Ｗ
を収容する。洗浄槽２と外槽３からなる枚葉浸漬槽１
は、ウエハ４の洗浄処理枚数に応じて水平横方向に一定
間隔を開けて所定数配設されている。The single wafer immersion tank 1 comprises a washing tank 2 and an outer tank 3 provided on the outer periphery thereof. The cleaning tank 2 is composed of a vertically long rectangular container containing a cleaning liquid W, and cleans one wafer 4 such as a semiconductor wafer one by one. The outer tank 3 is composed of a container whose upper opening 3a is located higher than the upper opening 2a of the cleaning tank 2, and the cleaning liquid W overflowing from the cleaning tank 2.
To accommodate. Single wafer immersion tank 1 consisting of washing tank 2 and outer tank 3
Are disposed at predetermined intervals in the horizontal horizontal direction according to the number of wafers 4 to be cleaned.
【００１６】前記各洗浄槽２の底部２ｂには洗浄液供給
管５が取り付けられ、各洗浄液供給管５には、共通の洗
浄液供給ライン７で連結され各洗浄槽２内に洗浄液Ｗが
供給される。一方、前記各外槽３の底部３ｂには洗浄液
排出管６が取り付けられ、各洗浄液排出管６には、共通
の洗浄液排出ライン８で連結され使用した洗浄液Ｗが排
出される。共通の洗浄液排出ライン８と共通の洗浄液供
給ライン７は、循環ライン９で連結され、その循環ライ
ン９には洗浄液Ｗを循環させる循環ポンプＰと洗浄液Ｗ
を濾過するフィルタＦが設けられている。A cleaning liquid supply pipe 5 is attached to the bottom 2b of each of the cleaning tanks 2. The cleaning liquid supply pipes 5 are connected by a common cleaning liquid supply line 7 to supply the cleaning liquid W into each of the cleaning tanks 2. . On the other hand, a cleaning liquid discharge pipe 6 is attached to the bottom 3b of each of the outer tanks 3, and the cleaning liquid W connected and used by the common cleaning liquid discharge line 8 is discharged to each cleaning liquid discharge pipe 6. The common cleaning liquid discharge line 8 and the common cleaning liquid supply line 7 are connected by a circulation line 9, and a circulation pump P for circulating the cleaning liquid W and a cleaning liquid W
Is provided.
【００１７】従って、循環ポンプＰを駆動すると、フィ
ルタＦ側に洗浄液Ｗが流れて濾過され、浄化された洗浄
液Ｗが洗浄液供給ライン７および洗浄液供給管５を通し
て各洗浄槽２に供給され、その供給された洗浄液Ｗでウ
エハ４が洗浄される。洗浄に使われた洗浄液Ｗは、洗浄
槽２からオーバフローし外槽３に流れ、各洗浄液排出管
６，共通の洗浄液排出ライン８および循環ライン９を通
して循環ポンプＰに戻される。このようにして洗浄液Ｗ
は、循環される。上記洗浄液Ｗは、例えば、水にアンモ
ニアと過酸化水素水を加えたアンモニア過水等が用いら
れる。Therefore, when the circulation pump P is driven, the cleaning liquid W flows to the filter F side and is filtered, and the purified cleaning liquid W is supplied to each cleaning tank 2 through the cleaning liquid supply line 7 and the cleaning liquid supply pipe 5 and supplied. The cleaning liquid W is used to wash the wafer 4. The cleaning liquid W used for cleaning overflows from the cleaning tank 2, flows into the outer tank 3, and is returned to the circulation pump P through each cleaning liquid discharge pipe 6, the common cleaning liquid discharge line 8 and the circulation line 9. Thus, the cleaning liquid W
Is cycled. As the cleaning liquid W, for example, ammonia peroxide and the like obtained by adding ammonia and hydrogen peroxide to water are used.
【００１８】ウエハ４の洗浄は、上記装置の側部に、ウ
エハ４を収納したプラスチック又はテフロン（商品名）
からなる収納ボックスＢ（例えばキャリア）を備えて置
き、そのボックスＢからウエハ４を一枚毎取り出して、
ウエハ４の洗浄処理枚数に応じて所定数配設した各枚葉
浸漬槽１内にウエハ４をそれぞれ浸漬し洗浄を行う。こ
のようにすることによって、処理プロセスに即したレイ
アウトの下でウエハ４を適切に洗浄することができる。
ウエハ４は、洗浄後は水洗によるリンス処理を行う。The cleaning of the wafer 4 is performed by placing the plastic or Teflon (trade name) containing the wafer 4 on the side of the above apparatus.
A storage box B (e.g., a carrier) is provided, and the wafers 4 are taken out of the box B one by one.
The wafers 4 are immersed in the single-wafer immersion tanks 1 provided in a predetermined number according to the number of wafers to be cleaned, and are cleaned. In this manner, the wafer 4 can be appropriately cleaned under a layout suitable for the processing process.
After the cleaning, the wafer 4 is rinsed with water.
【００１９】ウエハ４の洗浄後のリンス（水洗）は、図
２，図３に示すように所定数配設した枚葉浸漬槽１に隣
接し配設したリンス槽（水槽）１０を用いて行う。Rinsing (water washing) of the wafer 4 after cleaning is performed by using a rinsing tank (water tank) 10 provided adjacent to the predetermined number of single wafer immersion tanks 1 provided as shown in FIGS. .
【００２０】図２は、所定数の枚葉浸漬槽１を配設した
枚葉浸漬槽１群に隣接させて純水Ｗａを収容するリンス
槽１０を配設した実施例である。FIG. 2 shows an embodiment in which a rinsing tank 10 for accommodating pure water Wa is provided adjacent to a group of single-wafer immersion tanks in which a predetermined number of single-wafer immersion tanks 1 are provided.
【００２１】リンス槽１０の底部１０ｂには、純水供給
管１１が取り付けられ、純水供給管１１を通して純水Ｗ
ａが槽内に供給される。各枚葉浸漬槽１の洗浄液Ｗで洗
浄されたウエハ４をリンス槽１０内に浸漬し水洗する。
その水洗に使われた純水Ｗａは、リンス槽１０の上部開
口１０ａからオーバフローし流れる。A pure water supply pipe 11 is attached to the bottom 10b of the rinsing tank 10, and pure water W is supplied through the pure water supply pipe 11.
a is supplied into the tank. The wafer 4 washed with the cleaning liquid W in each single-wafer dipping tank 1 is dipped in a rinsing tank 10 and washed with water.
The pure water Wa used for the washing overflows from the upper opening 10a of the rinsing tank 10 and flows.
【００２２】図３は、所定数の枚葉浸漬槽１を配設した
各相互間に、純水Ｗａをそれぞれ収容した各リンス槽１
０を配設した実施例である。FIG. 3 shows each rinsing tank 1 containing pure water Wa between each of a plurality of single wafer immersion tanks 1 provided therein.
In this embodiment, 0 is provided.
【００２３】各リンス槽１０の底部１０ｂには、純水供
給管１１が取り付けられ、純水供給管１１には、共通の
純水供給ライン１２が連結されている。純水Ｗａは、純
水供給ライン１２および純水供給管１１を通してリンス
槽１０内に供給され、各枚葉浸漬槽１の洗浄液Ｗで洗浄
されたウエハ４が隣接している各リンス槽１０内に浸漬
され水洗される。その水洗に使われた純水Ｗａは、前記
同様に各リンス槽１０の上部開口１０ａからオーバフロ
ーし流れる。A pure water supply pipe 11 is attached to the bottom 10b of each rinsing tank 10, and a common pure water supply line 12 is connected to the pure water supply pipe 11. The pure water Wa is supplied through the pure water supply line 12 and the pure water supply pipe 11 into the rinsing tank 10, and the wafers 4 cleaned with the cleaning liquid W in each of the single wafer immersion tanks 1 are adjacent to the rinsing tank 10. And immersed in water. Pure water Wa used for the washing overflows and flows from the upper opening 10a of each rinsing tank 10 as described above.
【００２４】前記ウエハ４のボックスＢからの各枚葉浸
漬槽１の洗浄槽２への搬送および洗浄槽２からリンス槽
１０への搬送は、図４に示す搬送ロボットＡによって行
う。搬送ロボットＡによる搬送は、搬送ロボットＡのア
ーム１３に設けたチャック１４でウエハ４を保持しボッ
クスＢから各洗浄槽２に搬送し洗浄し、所定時間経過
後、リンス槽１０へ搬送し水洗を行う。The transfer of the wafer 4 from the box B to the cleaning tank 2 of the single wafer immersion tank 1 and the transfer from the cleaning tank 2 to the rinsing tank 10 are performed by a transfer robot A shown in FIG. In the transfer by the transfer robot A, the wafer 4 is held by the chuck 14 provided on the arm 13 of the transfer robot A, transferred from the box B to each of the cleaning tanks 2 and washed, and after a lapse of a predetermined time, transferred to the rinsing tank 10 and washed with water. Do.
【００２５】その後は、予め設定された処理工程に従
い、ウエハ４をリンス槽を備えたフッ酸槽１５，ＩＰＡ
乾燥槽１６に順次搬送し、フッ酸処理，水洗，イソプロ
ピルアルコールすなわちＩＰＡ乾燥処理し一連の処理を
完了する。Thereafter, the wafer 4 is transferred to a hydrofluoric acid bath 15 having a rinsing bath and an IPA according to a preset process.
The wafers are sequentially transported to the drying tank 16 and subjected to hydrofluoric acid treatment, water washing, and isopropyl alcohol, ie, IPA drying treatment, to complete a series of treatments.
【００２６】上記実施例は、ウエハ４を一枚毎に洗浄す
る洗浄槽２と外槽３で各枚葉洗浄槽１を構成したため、
枚葉洗浄槽１をウエハ４の洗浄枚数に応じて増減でき
る。また、ウエハ４の洗浄枚数に応じて枚葉洗浄槽１を
所定数配設すれば、ウエハ４の個々の洗浄時間の管理等
ができ、ウエハ４の洗浄枚数に応じて適切な洗浄が可能
となる。さらにウエハ４を一枚毎に洗浄する枚葉洗浄槽
１を独立した槽とするため、洗浄目的に応じた配置に設
けることができ、処理プロセスに即したレイアウトが可
能となって作業能率が向上するとともに装置の小型化が
図れる。In the above embodiment, the single-wafer cleaning tank 1 is constituted by the cleaning tank 2 for cleaning the wafers 4 one by one and the outer tank 3.
The number of single wafer cleaning tanks 1 can be increased or decreased according to the number of wafers 4 to be cleaned. In addition, if a predetermined number of single-wafer cleaning tanks 1 are arranged in accordance with the number of wafers 4 to be cleaned, it is possible to manage individual cleaning times of the wafers 4 and to perform appropriate cleaning in accordance with the number of wafers 4 to be cleaned. Become. Further, since the single-wafer cleaning tank 1 for cleaning the wafers 4 one by one is an independent tank, it can be provided in an arrangement corresponding to the purpose of cleaning, and can be laid out according to a processing process, thereby improving work efficiency. In addition, the size of the apparatus can be reduced.
【００２７】また、キャリアを使用しない枚葉型である
ため、洗浄する枚数分の枚葉洗浄槽１を揃えておけば、
ウエハ４を必要な枚数だけ洗浄することができ、従来の
バッチ式ウエハ浸漬洗浄のように使用洗浄液，純水およ
び排気の面で無駄がない。また、ウエハ４を保持し回転
させる回転機構，軸受機構等がないから、構造が簡単に
なるとともに機械的機構が少なくなる。そのため、パー
ティクルの発生が少ない。それに、ウエハ４は必要な分
だけ洗浄処理するため、待ち時間がなく、従って自然酸
化膜の成長やパーティクルの付着等の問題がなく、洗浄
液も循環させて使用するため、無駄がなく経済的であ
る。Further, since it is a single-wafer type without using a carrier, if the single-wafer cleaning tanks 1 for the number of sheets to be cleaned are prepared,
The required number of wafers 4 can be cleaned, and there is no waste in terms of the used cleaning liquid, pure water, and exhaust air as in the conventional batch type wafer immersion cleaning. Further, since there is no rotating mechanism, bearing mechanism, etc. for holding and rotating the wafer 4, the structure is simplified and the number of mechanical mechanisms is reduced. Therefore, generation of particles is small. In addition, since the wafer 4 is cleaned only as much as necessary, there is no waiting time, so there is no problem such as growth of a natural oxide film or adhesion of particles, and since the cleaning liquid is circulated and used, there is no waste and economical. is there.
【００２８】図５は、本発明の枚葉型ウエハ浸漬洗浄装
置の他の実施例である。この実施例は、各洗浄槽２の外
槽３Ａを共通としたものである。即ち、所定数配設した
枚葉浸漬槽１を、ウエハ４を一枚毎処理する洗浄槽２を
所定数配設した洗浄槽２群と、各洗浄槽２の外周に設け
た上部開口３ａが洗浄槽２の上部開口２ａよりも高い位
置にあって各洗浄槽２からオーバフローした洗浄液Ｗを
収容する共通の外槽３Ａで構成したものである。この実
施例の枚葉型ウエハ浸漬洗浄装置は、外槽３Ａを各洗浄
槽２の共通の外槽としたため、装置の製作価格が安価に
なる。また、前記実施例と同様な作用効果が得られる。
なお、この実施例の場合には、リンス槽１０は、所定数
配設した枚葉浸漬槽１に隣接した１つの槽が設けられ
る。FIG. 5 shows another embodiment of the single wafer immersion cleaning apparatus of the present invention. In this embodiment, the outer tank 3A of each cleaning tank 2 is common. That is, a predetermined number of single-wafer immersion tanks 1 are provided, a plurality of cleaning tanks 2 are provided with a predetermined number of cleaning tanks 2 for processing wafers 4 one by one, and an upper opening 3 a provided on the outer periphery of each cleaning tank 2. The cleaning tank 2 includes a common outer tank 3 </ b> A that is higher than the upper opening 2 a and stores the cleaning liquid W overflowing from each of the cleaning tanks 2. In the single wafer immersion cleaning apparatus of this embodiment, the outer tank 3A is a common outer tank for each of the cleaning tanks 2, so that the manufacturing cost of the apparatus is reduced. Further, the same operation and effect as those of the above embodiment can be obtained.
In the case of this embodiment, the rinsing tank 10 is provided with one tank adjacent to the predetermined number of single wafer immersion tanks 1.
【００２９】[0029]
【発明の効果】以上説明したように本発明によれば、ウ
エハを一枚毎に洗浄する洗浄槽と外槽で各枚葉洗浄槽を
構成したため、枚葉洗浄槽をウエハの洗浄枚数に応じて
増減できる。また、ウエハの洗浄枚数に応じて枚葉洗浄
槽を所定数配設すれば、ウエハの個々の洗浄時間の管理
等ができ、ウエハの洗浄枚数に応じて適切な洗浄が可能
となる。そして、本発明は、ウエハを一枚毎に洗浄する
枚葉洗浄槽を独立した槽とするため、洗浄目的に応じた
配置に設けることができ、処理プロセスに即したレイア
ウトが可能となって作業能率が向上するとともに装置の
小型化が図れる。As described above, according to the present invention, each of the single-wafer cleaning tanks is constituted by the cleaning tank for cleaning the wafers one by one and the outer tank, so that the single-wafer cleaning tank can be used in accordance with the number of wafers to be cleaned. Can be increased or decreased. In addition, if a predetermined number of single wafer cleaning tanks are provided according to the number of wafers to be cleaned, it is possible to manage individual cleaning times of the wafers, and to perform appropriate cleaning according to the number of wafers to be cleaned. Further, according to the present invention, since the single wafer cleaning tank for cleaning the wafers one by one is an independent tank, it can be provided in an arrangement according to the purpose of cleaning, and the layout according to the processing process becomes possible. The efficiency can be improved and the size of the device can be reduced.
【００３０】また、キャリアを使用しない枚葉型である
ため、洗浄する枚数分の枚葉洗浄槽を揃えておくことに
よってウエハを使用洗浄液，純水および排気の面で無駄
がなく、またウエハを保持し回転させる回転機構，軸受
機構等がないことから、構造が簡単になるとともに機械
的機構が少ない。従って、パーティクルの発生も少な
い。加えて、本発明は、ウエハは必要な分だけ洗浄処理
するため、待ち時間がなく、従って自然酸化膜の成長や
パーティクルの付着等の問題がなく、洗浄液も循環させ
て使用するため、無駄がなく経済的である等の諸効果を
もたらす。Further, since the wafer is of a single-wafer type without using a carrier, the wafers can be cleaned by using a single-wafer cleaning tank for the number of wafers to be cleaned, so that there is no waste in terms of a cleaning solution, pure water and exhaust air, and the wafer can be cleaned. Since there is no rotating mechanism, bearing mechanism, etc. for holding and rotating, the structure is simplified and the number of mechanical mechanisms is small. Therefore, generation of particles is small. In addition, according to the present invention, since the wafer is cleaned only as much as necessary, there is no waiting time, so there is no problem such as growth of a natural oxide film or adhesion of particles, and since the cleaning liquid is circulated and used, there is no waste. It brings various effects such as economic efficiency.
【図１】 本発明に係る枚葉型ウエハ浸漬洗浄装置の一
実施例の概要図である。FIG. 1 is a schematic diagram of an embodiment of a single wafer immersion cleaning apparatus according to the present invention.
【図２】 本発明に係る枚葉型ウエハ浸漬洗浄装置のリ
ンス槽を備えた装置の概要図である。FIG. 2 is a schematic view of an apparatus provided with a rinsing tank of the single wafer immersion cleaning apparatus according to the present invention.
【図３】 本発明に係る枚葉型ウエハ浸漬洗浄装置のリ
ンス槽を備えた他の装置の概要図である。FIG. 3 is a schematic diagram of another apparatus provided with a rinsing tank of the single wafer immersion cleaning apparatus according to the present invention.
【図４】 ウエハを搬送ロボットで搬送する状態を示し
た斜視図である。FIG. 4 is a perspective view showing a state in which a wafer is transferred by a transfer robot.
【図５】 本発明に係る枚葉型ウエハ浸漬洗浄装置のリ
ンス槽を備えない他の実施例の概要図である。FIG. 5 is a schematic view of another embodiment of the single wafer type immersion cleaning apparatus according to the present invention which does not include a rinsing tank.
１：枚葉浸漬槽、２：洗浄槽、２ａ，３ａ：上部開口、
２ｂ，３ｂ，１０ｂ：底部、３，３Ａ：外槽、４：ウエ
ハ、５：洗浄液供給管、６：洗浄液排出管、７：洗浄液
供給ライン、８：洗浄液排出ライン、９：循環ライン、
１０：リンス槽、１１：純水供給管、１２：純水供給ラ
イン、Ｗ：洗浄液、Ｗａ：純水。1: Single wafer immersion tank, 2: Cleaning tank, 2a, 3a: Upper opening,
2b, 3b, 10b: bottom, 3, 3A: outer tank, 4: wafer, 5: cleaning liquid supply pipe, 6: cleaning liquid discharge pipe, 7: cleaning liquid supply line, 8: cleaning liquid discharge line, 9: circulation line,
10: rinse tank, 11: pure water supply pipe, 12: pure water supply line, W: cleaning liquid, Wa: pure water.
Claims (6)
を一枚毎洗浄する洗浄槽と、 該洗浄槽の外周に設けた上部開口が洗浄槽の上部開口よ
りも高い位置にあって洗浄槽からオーバフローした洗浄
液を収容する外槽で構成し、 該枚葉浸漬槽を所定数配設したことを特徴する枚葉型ウ
エハ浸漬洗浄装置。A cleaning tank for cleaning a wafer containing a cleaning liquid one by one; a top opening provided on an outer periphery of the cleaning tank being located at a position higher than an upper opening of the cleaning tank; A single wafer immersion cleaning apparatus comprising an outer tank for storing a cleaning solution overflowing from the tank, and a predetermined number of the single wafer immersion tanks are arranged.
槽の底部に洗浄液を供給する洗浄液供給管を取り付け、
該各洗浄液供給管を共通の洗浄液供給ラインで連結し、 各枚葉浸漬槽の外槽の底部に洗浄液を排出する洗浄液排
出管を取り付け、該各洗浄液排出管を共通の洗浄液排出
ラインで連結し、 該共通の洗浄液排出ラインと前記共通の洗浄液供給ライ
ンとを循環ラインで連結し、該循環ラインに洗浄液を循
環させる循環ポンプと濾過するフィルタとを設けたこと
を特徴とする請求項１に記載の枚葉型ウエハ浸漬洗浄装
置。2. A cleaning liquid supply pipe for supplying a cleaning liquid to a bottom of a cleaning tank of each of the predetermined number of single wafer immersion tanks,
Each of the cleaning liquid supply pipes is connected by a common cleaning liquid supply line, and a cleaning liquid discharge pipe for discharging the cleaning liquid is attached to the bottom of the outer tank of each single wafer immersion tank, and each of the cleaning liquid discharge pipes is connected by a common cleaning liquid discharge line. 2. The method according to claim 1, wherein the common cleaning liquid discharge line and the common cleaning liquid supply line are connected by a circulation line, and a circulation pump for circulating the cleaning liquid and a filter for filtering are provided in the circulation line. Single wafer immersion cleaning equipment.
して純水を収容する１つのリンス槽を配設したことを特
徴とする請求項１に記載の枚葉型ウエハ浸漬洗浄装置。3. The single wafer immersion cleaning according to claim 1, wherein one rinsing tank containing pure water is arranged adjacent to the predetermined number of single wafer immersion tank groups. apparatus.
に純水を収容するリンス槽を配設し、各リンス槽の底部
に純水を供給する純水供給管を取り付け、 該各純水供給管を共通の純水供給ラインで連結したこと
を特徴とする請求項１に記載の枚葉型ウエハ浸漬洗浄装
置。4. A rinsing tank for accommodating pure water is provided between the predetermined number of single wafer immersion tanks, and a pure water supply pipe for supplying pure water is attached to the bottom of each rinsing tank. 2. The single wafer immersion cleaning apparatus according to claim 1, wherein the pure water supply pipes are connected by a common pure water supply line.
液を収容したウエハを一枚毎洗浄する洗浄槽を所定数配
設した洗浄槽群と、 該各洗浄槽の外周に設けた上部開口が洗浄槽の上部開口
よりも高い位置にあって各洗浄槽からオーバフローした
洗浄液を収容する共通の外槽で構成したことを特徴とす
る請求項１に記載の枚葉型ウエハ浸漬洗浄装置。5. The cleaning apparatus according to claim 1, wherein the predetermined number of the single-wafer immersion tanks are provided on a periphery of each of the cleaning tanks provided with a predetermined number of cleaning tanks for cleaning the wafers containing the cleaning liquid one by one. 2. The single wafer immersion cleaning apparatus according to claim 1, wherein the upper opening is located at a position higher than the upper opening of the cleaning tank, and is constituted by a common outer tank containing a cleaning liquid overflowing from each cleaning tank. .
して純水を収容する１つのリンス槽を配設したことを特
徴とする請求項５に記載の枚葉型ウエハ浸漬洗浄装置。6. The single wafer immersion cleaning according to claim 5, wherein one rinsing tank containing pure water is arranged adjacent to the predetermined number of single wafer immersion tank groups. apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17704996A JPH104078A (en) | 1996-06-17 | 1996-06-17 | Single wafer immersion cleaning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17704996A JPH104078A (en) | 1996-06-17 | 1996-06-17 | Single wafer immersion cleaning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH104078A true JPH104078A (en) | 1998-01-06 |
Family
ID=16024251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17704996A Pending JPH104078A (en) | 1996-06-17 | 1996-06-17 | Single wafer immersion cleaning system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH104078A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7980255B2 (en) | 2001-11-02 | 2011-07-19 | Applied Materials, Inc. | Single wafer dryer and drying methods |
-
1996
- 1996-06-17 JP JP17704996A patent/JPH104078A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7980255B2 (en) | 2001-11-02 | 2011-07-19 | Applied Materials, Inc. | Single wafer dryer and drying methods |
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