JPH10324755A - Resin impregnated substrate, its production, laminated sheet and its production - Google Patents
Resin impregnated substrate, its production, laminated sheet and its productionInfo
- Publication number
- JPH10324755A JPH10324755A JP9136988A JP13698897A JPH10324755A JP H10324755 A JPH10324755 A JP H10324755A JP 9136988 A JP9136988 A JP 9136988A JP 13698897 A JP13698897 A JP 13698897A JP H10324755 A JPH10324755 A JP H10324755A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- impregnated
- base material
- substrate
- organic solvent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、樹脂含浸基材及び
その製造方法、積層板及びその製造方法に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin-impregnated base material, a method for producing the same, a laminate and a method for producing the same.
【０００２】[0002]
【従来の技術】樹脂含浸基材は従来から、ガラス布や紙
などの基材にフェノール樹脂やエポキシ樹脂等の樹脂ワ
ニスを含浸させ、これを乾燥することによって製造され
ている。そしてこの樹脂含浸基材を複数枚重ねて加熱加
圧して積層成形することによって積層板を得ることがで
きるものである。2. Description of the Related Art Conventionally, a resin-impregnated base material has been manufactured by impregnating a base material such as glass cloth or paper with a resin varnish such as a phenol resin or an epoxy resin and drying the impregnated resin varnish. Then, a plurality of the resin-impregnated base materials are stacked and heated and pressed to form a laminate, whereby a laminate can be obtained.
【０００３】しかし樹脂含浸基材には気泡が残存してい
たり、樹脂ワニスの未含浸部が存在したりすることが多
く、積層成形に際して樹脂の流動性が悪くなって、積層
板にカスレが発生し、この結果、積層板は透明性が劣る
だけでなく、耐熱性や耐湿性にも劣ることになるもので
あった。このような積層板のカスレを防止するために、
樹脂含浸基材の樹脂含浸量を高めたり、流動性の大きい
樹脂を用いたりしているが、この場合には成形時に位置
ずれが発生し易くなって成形性が劣るという問題があっ
た。However, resin-impregnated base materials often have air bubbles remaining or unimpregnated portions of resin varnish, so that the flowability of the resin during lamination molding deteriorates, and the laminated plate is scummed. However, as a result, the laminate not only has poor transparency, but also has poor heat resistance and moisture resistance. In order to prevent such lamination of the laminate,
Although the resin impregnation amount of the resin-impregnated base material is increased or a resin having a high fluidity is used, in this case, there is a problem that misalignment easily occurs during molding and moldability is deteriorated.
【０００４】そこで、樹脂含浸基材の気泡の残存や樹脂
ワニスの未含浸をなくすために、加圧ロールや超音波を
用いて樹脂ワニスを含浸させることが試みられている
が、これらは効果が乏しく、また真空下で樹脂ワニスを
含浸させる方法も試みられているが、この方法では連続
化が難しいと共に装置が大型化して高価になるという問
題があった。[0004] In order to eliminate the residual air bubbles in the resin-impregnated base material and the non-impregnation of the resin varnish, attempts have been made to impregnate the resin varnish using a pressure roll or ultrasonic waves. Although a method of impregnating resin varnish under vacuum has been attempted, this method has problems that it is difficult to achieve continuity and the apparatus becomes large and expensive.
【０００５】一方、特公平６−８９１６１号公報には、
基材に減圧脱泡溶剤を予備含浸させ、次いで基材に樹脂
ワニスを含浸させた後、乾燥することによって樹脂含浸
基材を製造する方法が提供されている。この方法によれ
ば、基材に樹脂ワニスを含浸させる際に、基材中に予備
含浸されている溶剤と樹脂ワニスとが置換され、基材中
に樹脂ワニスを良好に浸透させることができるものであ
り、気泡の残存や樹脂ワニスの未含浸の少ない樹脂含浸
基材を得ることができる。On the other hand, Japanese Patent Publication No. 6-89161 discloses that
There is provided a method for producing a resin-impregnated substrate by pre-impregnating the substrate with a solvent under reduced pressure and then impregnating the substrate with a resin varnish, followed by drying. According to this method, when the substrate is impregnated with the resin varnish, the solvent preliminarily impregnated in the substrate is replaced with the resin varnish, and the resin varnish can be well penetrated into the substrate. Thus, it is possible to obtain a resin-impregnated base material having less residual air bubbles and less impregnation of the resin varnish.
【０００６】[0006]
【発明が解決しようとする課題】しかし、このように特
公平６−８９１６１号公報で提供される方法によれば、
基材への樹脂ワニスの含浸性が良好な樹脂含浸基材を得
ることができるが、現実には、季節的変動の要因などで
含浸性にばらつきがあり、気泡の残存や樹脂ワニスの未
含浸の少ない樹脂含浸基材を安定して製造することはで
きず、またそのため、カスレがなく、透明性、耐熱性、
耐湿性に優れた積層板を安定して製造することもできな
いものであった。However, according to the method disclosed in Japanese Patent Publication No. 6-89161,
Although it is possible to obtain a resin-impregnated base material with good resin varnish impregnating property on the base material, in reality, the impregnation property varies due to factors such as seasonal fluctuations, resulting in residual bubbles and unimpregnated resin varnish. It is not possible to stably produce a resin-impregnated base material having a small amount, and therefore, there is no blur, transparency, heat resistance,
It was also impossible to stably produce a laminate having excellent moisture resistance.
【０００７】本発明は上記の点に鑑みてなされたもので
あり、基材への樹脂の含浸性が良好な樹脂含浸基材を安
定して得ることができる樹脂含浸基材の製造方法を提供
すると共に、カスレがなく、透明性、耐熱性、耐湿性に
優れた積層板を安定して得ることができる積層板の製造
方法を提供することを目的とするものである。The present invention has been made in view of the above points, and provides a method for producing a resin-impregnated base material capable of stably obtaining a resin-impregnated base material having a good resin impregnation property to the base material. It is another object of the present invention to provide a method for manufacturing a laminated board which can stably obtain a laminated board which is excellent in transparency, heat resistance, and moisture resistance without causing blur.
【０００８】[0008]
【課題を解決するための手段】本発明の請求項１に係る
樹脂含浸基材の製造方法は、基材１に３０℃以上の有機
溶剤２を予備含浸させ、次いでこの基材１に樹脂ワニス
３を含浸させた後、乾燥することを特徴とするものであ
る。また本発明の請求項２に係る樹脂含浸基材は、基材
１に３０℃以上の有機溶剤２を予備含浸させ、次いでこ
の基材１に樹脂ワニス３を含浸させた後、乾燥すること
によって製造されるものである。According to a first aspect of the present invention, there is provided a method for producing a resin-impregnated base material, wherein the base material 1 is pre-impregnated with an organic solvent 2 at a temperature of 30 ° C. or higher. 3 is impregnated and then dried. The resin-impregnated base material according to claim 2 of the present invention is obtained by pre-impregnating the base material 1 with the organic solvent 2 at 30 ° C. or higher, then impregnating the base material 1 with the resin varnish 3, and then drying. It is manufactured.
【０００９】また本発明の請求項３に係る積層板の製造
方法は、基材１に３０℃以上の有機溶剤２を予備含浸さ
せ、次いでこの基材１に樹脂ワニス３を含浸させた後、
乾燥することによって製造した樹脂含浸基材を、所要枚
数積層成形することを特徴とするものである。また本発
明の請求項４に係る積層板は、基材１に３０℃以上の有
機溶剤２を予備含浸させ、次いでこの基材１に樹脂ワニ
ス３を含浸させた後、乾燥することによって製造した樹
脂含浸基材を、所要枚数積層成形したものである。In the method for producing a laminate according to claim 3 of the present invention, the base material 1 is pre-impregnated with an organic solvent 2 at 30 ° C. or higher, and then the base material 1 is impregnated with a resin varnish 3.
A required number of resin-impregnated substrates produced by drying are laminated and molded. The laminate according to claim 4 of the present invention was manufactured by pre-impregnating the base material 1 with the organic solvent 2 at 30 ° C. or higher, then impregnating the base material 1 with the resin varnish 3, and then drying. A required number of resin-impregnated substrates are laminated and molded.
【００１０】[0010]
【発明の実施の形態】以下、発明の実施の形態を詳述す
る。本発明において基材１としては、ガラス布や紙など
任意のものを用いることができるものである。また本発
明において有機溶剤２としては、後述の樹脂ワニス３中
の有機溶剤と相溶性を有するものを用いるのが好まし
く、メチルアルコール、アセトン、メチルエチルケト
ン、メチルセロソルブ、１−メトキシ−２−プロパノー
ル、ジメチルホルムアミドなどを使用することができ
る。この有機溶剤２は溶剤槽１１の中で、３０℃以上、
好ましくは４０℃以上に温めておく。有機溶剤２の温度
の上限は特に制限されないが、実質的には有機溶剤２が
揮発する温度が上限となる。Embodiments of the present invention will be described below in detail. In the present invention, as the substrate 1, any material such as glass cloth or paper can be used. In the present invention, as the organic solvent 2, it is preferable to use one having compatibility with the organic solvent in the resin varnish 3 described later, and methyl alcohol, acetone, methyl ethyl ketone, methyl cellosolve, 1-methoxy-2-propanol, dimethyl Formamide and the like can be used. The organic solvent 2 is placed in a solvent tank 11 at a temperature of 30 ° C. or higher,
Preferably, it is warmed to 40 ° C. or higher. The upper limit of the temperature of the organic solvent 2 is not particularly limited, but the temperature at which the organic solvent 2 volatilizes is substantially the upper limit.
【００１１】そして、有機溶剤２が供給される溶剤槽１
１に長尺の基材１を連続して送りながら、有機溶剤２中
に基材１を浸漬させることによって、基材１に有機溶剤
２を含浸させることができる。基材１を有機溶剤中に３
〜５分間程度浸漬させることによって、基材１中に有機
溶剤２を十分に含浸させることが好ましい。ここで、有
機溶剤２の液温が３０℃以上であるため、有機溶剤２が
基材１のフィラメント内部に含浸し易くなっており、有
機溶剤２を基材１中にムラなく浸透させることができる
ものである。Then, a solvent tank 1 to which the organic solvent 2 is supplied.
The substrate 1 can be impregnated with the organic solvent 2 by immersing the substrate 1 in the organic solvent 2 while continuously feeding the long substrate 1 to the substrate 1. Substrate 1 in organic solvent 3
It is preferable that the organic solvent 2 is sufficiently impregnated in the substrate 1 by immersion for about 5 minutes. Here, since the liquid temperature of the organic solvent 2 is 30 ° C. or higher, the organic solvent 2 is easily impregnated inside the filament of the substrate 1, and the organic solvent 2 can be uniformly penetrated into the substrate 1. You can do it.
【００１２】また本発明において樹脂ワニス３として
は、フェノール樹脂、エポキシ樹脂、ポリイミド樹脂な
ど、積層板用の任意の熱硬化性樹脂を有機溶剤に溶解し
て調製したものを用いることができるものである。図１
の実施の形態では、接触法と浸漬法を併用して基材１に
樹脂ワニス３を含浸させるようにしてある、すなわち、
キスロール１２をその下部を樹脂ワニス３に浸漬して設
けた接触槽１３と、浸漬ロール１４を樹脂ワニス３に浸
漬して設けた浸漬槽１５とを用い、上記のように有機溶
剤２を含浸させた基材１を連続して送りながら、まず基
材１の片面をキスロール１２に接触させ、キスロール１
２によって基材１の片面に樹脂ワニス３を塗布して基材
１に片面から樹脂ワニス３を浸透させる。このような基
材１に片面から樹脂ワニス３を浸透させることによっ
て、基材１中の空気を他方の片面から追い出すことが容
易になる。次いで、基材１を浸漬ロール１４によって浸
漬槽１５の樹脂ワニス３中に１０〜６０秒間浸漬し、基
材１に樹脂ワニス３を含浸させた後、基材１を加圧ロー
ル１６に通して、余分な樹脂ワニス３と共に基材１中の
空気を絞り出す。なお樹脂ワニスを基材に含浸させる際
の樹脂ワニスの温度は２０〜３０℃程にしておく。In the present invention, the resin varnish 3 may be prepared by dissolving an arbitrary thermosetting resin for a laminate, such as a phenol resin, an epoxy resin, or a polyimide resin, in an organic solvent. is there. FIG.
In the embodiment of the present invention, the base material 1 is impregnated with the resin varnish 3 by using both the contact method and the dipping method.
The kiss roll 12 is impregnated with the organic solvent 2 as described above using a contact tank 13 provided with its lower part immersed in the resin varnish 3 and a immersion tank 15 provided with a immersion roll 14 immersed in the resin varnish 3. First, one side of the base material 1 is brought into contact with the kiss roll 12 while continuously feeding the
The resin varnish 3 is applied to one surface of the base material 1 by 2 to allow the resin varnish 3 to permeate the base material 1 from one surface. By infiltrating the resin varnish 3 into one side of the substrate 1, it is easy to expel air in the substrate 1 from the other side. Next, the substrate 1 is immersed in the resin varnish 3 of the immersion tank 15 by the immersion roll 14 for 10 to 60 seconds, and the substrate 1 is impregnated with the resin varnish 3. Then, the air in the substrate 1 is squeezed out together with the excess resin varnish 3. In addition, the temperature of the resin varnish when impregnating the base material with the resin varnish is set to about 20 to 30 ° C.
【００１３】このように、基材１に有機溶媒２を含浸さ
せた後に樹脂ワニス３を含浸させると、有機溶剤２と置
換するようにして樹脂ワニス３は基材１にスムースに浸
透する。有機溶剤２は基材１にムラなく含浸しているた
め、ここに更に樹脂ワニス３を含浸させることにより、
基材１に未含浸部分が生じることなく樹脂ワニス３を含
浸させることができるものである。As described above, when the resin varnish 3 is impregnated after the base material 1 is impregnated with the organic solvent 2, the resin varnish 3 permeates the base material 1 smoothly so as to replace the organic solvent 2. Since the organic solvent 2 is evenly impregnated into the base material 1, the resin varnish 3 is further impregnated therein,
The resin varnish 3 can be impregnated in the base material 1 without any unimpregnated portions.
【００１４】上記のように基材１に樹脂ワニス３を含浸
させた後、これを１５０〜１７０℃に加熱して乾燥する
ことによって、Ｂステージ状態の樹脂含浸基材を得るこ
とができる。このようにして得られる樹脂含浸基材を複
数枚重ね、積層成形することによって、積層板を製造す
ることができる。樹脂含浸基材には上記のような未含浸
部がないため、成形される積層板にはカスレが発生せ
ず、透明性、耐熱性、耐湿性に優れたものになる。積層
成形の手段としては、無圧積層成形、ダブルベルト積層
成形、マルチロール積層成形、引抜成形等のように連続
的に積層成形が行える方法を用いることができる。また
加熱加圧成形を行う場合は、昇温速度１〜５℃／分で１
７０℃以上の温度にし、１０〜５０ｋｇ／ｃｍ2 の圧力
を加えた条件下で行うことができ、この際の加熱加圧時
間は４０〜６０分間程である。積層板を成形する際、樹
脂含浸基材の両面あるいは片面に金属箔を重ねて積層成
形することによって、プリント配線板等に加工される金
属箔貼り積層板を製造することができる。After the substrate 1 is impregnated with the resin varnish 3 as described above, the resin varnish 3 is heated to 150 to 170 ° C. and dried to obtain a B-stage resin impregnated substrate. By laminating a plurality of the resin-impregnated base materials thus obtained and forming a laminate, a laminate can be manufactured. Since the resin-impregnated base material does not have the unimpregnated portion as described above, the laminated plate to be formed does not suffer from burrs and has excellent transparency, heat resistance, and moisture resistance. As a method of lamination molding, a method capable of continuously performing lamination molding such as pressureless lamination molding, double belt lamination molding, multi-roll lamination molding, pultrusion molding or the like can be used. In the case of performing heat and pressure molding, the heating rate is 1 to 5 ° C./min.
It can be carried out under the condition of a temperature of 70 ° C. or higher and a pressure of 10 to 50 kg / cm 2 , and the heating and pressurizing time at this time is about 40 to 60 minutes. When a laminate is formed, a metal foil-laminated laminate that is processed into a printed wiring board or the like can be manufactured by stacking and laminating a metal foil on both sides or one side of a resin-impregnated base material.
【００１５】[0015]
【実施例】次に、本発明を実施例によって詳述する。 （実施例１） （１） 基材１としてＷＥＡ ７６２８ Ｓ２３６のガ
ラスクロス（日東紡績製、厚み０．１８ｍｍ）を用い、
有機溶剤２としてジメチルホルムアミド（ＤＭＦ）を用
い、また樹脂ワニス３として次の配合組成のものを用い
た。 ・テトラビスフェノールＡ型エポキシ樹脂 ８７．５ 重量部 ・クレゾールノボラック型樹脂 １２．５ 重量部 ・ジシアンジアミド ２．４ 重量部 ・２−エチル−４−メチルイミダゾール ０．０５ 重量部 ・ジメチルホルムアミド（溶剤） ２５ 重量部 （２） そしてまず、有機溶剤２を加熱して４５℃に保
ち、基材１を有機溶剤２に３分間浸漬して基材１に有機
溶剤２を含浸させた後、樹脂ワニス３を２５℃の温度に
保ち、基材１の片面に樹脂ワニス３をキスロール１２で
塗布して含浸させると共に、次いで基材１を樹脂ワニス
３に４０秒間浸漬して含浸させ、加圧ロール１６で余分
な樹脂ワニス３を絞った後、１６０℃の温度で５分間加
熱乾燥することによって、樹脂含有率４０〜４２％の樹
脂含浸基材を得た。 （３） 上記（２）のようにして得た樹脂含有基材を乾
燥機中で、１６５℃で１５分間加熱した後放冷した。そ
して、このものの表面を拡大鏡を用いて観察して、基材
１に対する樹脂ワニス３の含浸性の評価を樹脂未含浸に
よるガラスクロスの白化の量により行った。 （４） 両面に厚さ３５μｍの銅箔を貼り付けた厚さ
０．９ｍｍの内層材に信号回路を形成せずに黒化処理を
施したものを、（２）のようにして得た２枚の樹脂含浸
基材で挟み、更に厚さ１８μｍの２枚の銅箔で挟んだも
のを、昇温速度３℃／分で１７０℃以上の温度にし、３
０ｋｇ／ｃｍ2 の圧力を加えた条件下で６０分間加熱加
圧成形し、厚み１．４ｍｍの多層板を得た。 （５） 上記（４）のようにして得た多層板の表面の銅
箔を全面エッチング処理によって取り除いたものを目視
で観察して、多層板の成型性の評価をカスレによる白化
の発生位置及び発生量により行った。Next, the present invention will be described in detail with reference to examples. (Example 1) (1) WEA 7628 S236 glass cloth (manufactured by Nitto Boseki, thickness 0.18 mm) was used as the base material 1,
Dimethylformamide (DMF) was used as the organic solvent 2, and the resin varnish 3 having the following composition was used. -Tetrabisphenol A type epoxy resin 87.5 parts by weight-Cresol novolak type resin 12.5 parts by weight-Dicyandiamide 2.4 parts by weight-2-ethyl-4-methylimidazole 0.05 parts by weight-Dimethylformamide (solvent) 25 Part by weight (2) Then, first, the organic solvent 2 was heated and maintained at 45 ° C., and the base material 1 was immersed in the organic solvent 2 for 3 minutes to impregnate the base material 1 with the organic solvent 2. While maintaining the temperature at 25 ° C., the resin varnish 3 is applied to one surface of the base material 1 with a kiss roll 12 and impregnated, and then the base material 1 is immersed in the resin varnish 3 for 40 seconds to be impregnated. After squeezing the resin varnish 3, it was heated and dried at a temperature of 160 ° C. for 5 minutes to obtain a resin-impregnated base material having a resin content of 40 to 42%. (3) The resin-containing substrate obtained as in (2) above was heated in a dryer at 165 ° C. for 15 minutes and then allowed to cool. Then, the surface of the glass cloth was observed using a magnifying glass, and the impregnating property of the resin varnish 3 with respect to the base material 1 was evaluated based on the amount of whitening of the glass cloth due to no resin impregnation. (4) An inner layer material having a thickness of 0.9 mm with a copper foil having a thickness of 35 μm adhered to both surfaces and subjected to a blackening treatment without forming a signal circuit was obtained as in (2). A sheet sandwiched between two pieces of resin-impregnated base material and further sandwiched between two pieces of copper foil having a thickness of 18 μm is heated to a temperature of 170 ° C. or more at a rate of 3 ° C./min.
Heat and pressure molding was performed for 60 minutes under the condition of applying a pressure of 0 kg / cm 2 to obtain a multilayer board having a thickness of 1.4 mm. (5) The copper foil on the surface of the multilayer board obtained as in the above (4) was removed by etching on the entire surface and visually observed. It was performed according to the amount generated.
【００１６】（実施例２）実施例１の（３）において有
機溶剤２の温度を３３℃とした以外は、実施例１と同一
の条件で行った。 （比較例１）実施例１の（３）において有機溶剤２の温
度を２１℃とした以外は、実施例１と同一の条件で行っ
た。(Example 2) The procedure was performed under the same conditions as in Example 1 except that the temperature of the organic solvent 2 was changed to 33 ° C in (3) of Example 1. (Comparative Example 1) The procedure was performed under the same conditions as in Example 1 except that the temperature of the organic solvent 2 was changed to 21 ° C in (3) of Example 1.
【００１７】（比較例２）実施例１の（３）において有
機溶剤２の温度を１７℃とした以外は、実施例１と同一
の条件で行った。以上の実施例及び比較例において基材
の樹脂含浸含浸性及び多層板の成型性の評価を行った結
果を表１にまとめる。(Comparative Example 2) The procedure was carried out under the same conditions as in Example 1 except that the temperature of the organic solvent 2 was changed to 17 ° C in (3) of Example 1. Table 1 summarizes the results of evaluating the resin impregnation and impregnation of the base material and the moldability of the multilayer board in the above Examples and Comparative Examples.
【００１８】[0018]
【表１】 [Table 1]
【００１９】なお、樹脂含浸性の判定基準は、 １点：基材１のタテ・ヨコ糸の樹脂未含浸多（５０〜１
００％に未含浸あり）。 ２点：基材１のタテ・ヨコ糸の樹脂未含浸少（１〜５０
％に未含浸あり）。 ３点：基材１のタテ・ヨコ糸の交差点部分にのみ樹脂未
含浸発生多（交差点の５０〜１００％に未含浸あり）。 ４点：基材１のタテ・ヨコ糸の交差点部分にのみ樹脂未
含浸発生少（交差点の１〜５０％に未含浸あり）。 ５点：基材１に樹脂未含浸なし。 成型性の判定基準は １点：多層板の全面にカスレあり。 ２点：多層板の基材１のタテ糸またはヨコ糸の片方のみ
にカスレあり。 ３点：多層板の基材１のタテ・ヨコ糸の交差点部分にカ
スレあり。 ４点：多層板にカスレなし。 である。The criterion for determining the resin impregnating property is as follows: 1 point: Resin-impregnated poly (50-1)
00% unimpregnated). 2 points: low resin impregnation of the warp / weft of the substrate 1 (1 to 50
% Unimpregnated). 3 points: Resin non-impregnation occurs frequently only at the intersection of the warp and weft of the base material 1 (50-100% of the intersection has no impregnation). 4 points: Low resin non-impregnated only at the intersection of the warp and weft of the base material 1 (1 to 50% of the intersection has not been impregnated). 5 points: no resin impregnated in the substrate 1. Criterion for determination of moldability: 1 point: There is fuzz on the entire surface of the multilayer board. 2 points: Only one of the warp yarn or the weft yarn of the base material 1 of the multilayer board is frayed. 3 points: Scattering was found at the intersection of the warp and weft of the substrate 1 of the multilayer board. 4 points: There is no blur on the multilayer board. It is.
【００２０】表１から判るように、基材１への予備含浸
に用いる有機溶剤２の温度を上昇させると、それに伴っ
て、基材１への樹脂ワニスの含浸性、及び多層板の成形
性が向上した。有機溶剤２の温度を３０℃以上にする
と、含浸性、成形性は共に著しく高くなり、多層板にカ
スレが見られなくなった。更に有機溶剤２の温度を４０
℃以上にすると、基材１への樹脂ワニス３の未含浸部分
及び多層板のカスレは共に全く確認されなかった。As can be seen from Table 1, when the temperature of the organic solvent 2 used for the pre-impregnation of the base material 1 is increased, the impregnation property of the resin varnish into the base material 1 and the moldability of the multilayer board are increased. Improved. When the temperature of the organic solvent 2 was set to 30 ° C. or higher, both the impregnation property and the moldability were remarkably increased, and no burrs were observed on the multilayer board. Further, the temperature of the organic solvent 2 is set to 40
When the temperature was higher than 0 ° C., neither the unimpregnated portion of the base material 1 with the resin varnish 3 nor the blurring of the multilayer board was observed at all.
【００２１】[0021]
【発明の効果】上記のように本発明の請求項１に記載の
樹脂含浸基材の製造方法は、基材に３０℃以上の有機溶
剤を予備含浸させ、次いでこの基材に樹脂ワニスを含浸
させた後、乾燥するようにしたので、予備含浸の際の基
材への有機溶媒の含浸性が良くなり、そのため基材への
樹脂の含浸性も良くなり、カスレのない樹脂含浸基材を
安定して得ることができるものである。As described above, in the method for producing a resin-impregnated base material according to the first aspect of the present invention, the base material is pre-impregnated with an organic solvent at 30 ° C. or higher, and then the base material is impregnated with a resin varnish. After that, since it was made to dry, the impregnation property of the organic solvent into the base material at the time of pre-impregnation was improved, and therefore, the impregnation property of the resin into the base material was also improved. It can be obtained stably.
【００２２】また本発明の請求項２に記載の樹脂含浸基
材は、基材に３０℃以上の有機溶剤を予備含浸させ、次
いでこの基材に樹脂ワニスを含浸させた後、乾燥する事
によって製造されたものであるので、予備含浸の際の基
材への有機溶媒の含浸性が良くなり、そのため基材への
樹脂の含浸性も良くなり、カスレのない樹脂含浸基材を
提供することができるものである。The resin-impregnated base material according to claim 2 of the present invention is obtained by pre-impregnating the base material with an organic solvent at 30 ° C. or higher, then impregnating the base material with a resin varnish, and then drying. Since it is manufactured, the impregnating property of the organic solvent into the base material during the pre-impregnation is improved, and therefore, the impregnating property of the resin into the base material is also improved. Can be done.
【００２３】また本発明の請求項３に記載の積層板の製
造方法は、基材に３０℃以上の有機溶剤を予備含浸さ
せ、次いでこの基材に樹脂ワニスを含浸させた後、乾燥
することによって樹脂含浸基材を調製し、この樹脂含浸
基材を所要枚数積層成形するようにしたので、カスレが
なく、透明性、耐熱性、耐湿性に優れた積層板を安定し
て得ることができるものである。According to a third aspect of the present invention, there is provided a method for manufacturing a laminate, comprising: preliminarily impregnating a base material with an organic solvent at 30 ° C. or higher, then impregnating the base material with a resin varnish, and then drying. The resin-impregnated base material is prepared by the method described above, and the required number of the resin-impregnated base materials are laminated and molded. Therefore, it is possible to stably obtain a laminate having excellent transparency, heat resistance, and moisture resistance without blurring. Things.
【００２４】また本発明の請求項４に記載の積層板は、
基材に３０℃以上の有機溶剤を予備含浸させ、次いでこ
の基材に樹脂ワニスを含浸させた後、乾燥することによ
って製造した樹脂含浸基材を所要枚数積層成形して製造
されたものであるので、カスレがなく、透明性、耐熱
性、耐湿性に優れた積層板を提供することができるもの
である。The laminate according to claim 4 of the present invention comprises:
The substrate is pre-impregnated with an organic solvent of 30 ° C. or higher, then impregnated with a resin varnish on the substrate, and then dried to form a required number of resin-impregnated substrates, which are laminated and molded. Therefore, it is possible to provide a laminated board which is free from blurring and excellent in transparency, heat resistance and moisture resistance.
【図１】本発明の実施の形態の一例の概略図である。FIG. 1 is a schematic diagram of an example of an embodiment of the present invention.
１ 基材 ２ 有機溶剤 ３ 樹脂ワニス 1 base material 2 organic solvent 3 resin varnish
Claims (4)
させ、次いでこの基材に樹脂ワニスを含浸させた後、乾
燥することを特徴とする樹脂含浸基材の製造方法。1. A method for producing a resin-impregnated substrate, comprising pre-impregnating the substrate with an organic solvent at 30 ° C. or higher, impregnating the substrate with a resin varnish, and drying.
させ、次いでこの基材に樹脂ワニスを含浸させた後、乾
燥することによって製造された樹脂含浸基材。2. A resin-impregnated substrate produced by pre-impregnating the substrate with an organic solvent at 30 ° C. or higher, then impregnating the substrate with a resin varnish, and drying.
させ、次いでこの基材に樹脂ワニスを含浸させた後、乾
燥することによって樹脂含浸基材を調製し、この樹脂含
浸基材を所要枚数重ねて積層成形することを特徴とする
積層板の製造方法。3. A base material is pre-impregnated with an organic solvent at 30 ° C. or higher, then impregnated with a resin varnish, and then dried to prepare a resin-impregnated base material. A method for manufacturing a laminated plate, comprising laminating a required number of sheets.
させ、次いでこの基材に樹脂ワニスを含浸させた後、乾
燥することによって製造した樹脂含浸基材を所要枚数積
層成形して得られた積層板。4. A base material is pre-impregnated with an organic solvent at 30 ° C. or higher, then impregnated with a resin varnish, and then dried to obtain a required number of resin-impregnated base materials. Laminated board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13698897A JP3362386B2 (en) | 1997-05-27 | 1997-05-27 | Resin-impregnated base material and method for producing the same, laminate and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13698897A JP3362386B2 (en) | 1997-05-27 | 1997-05-27 | Resin-impregnated base material and method for producing the same, laminate and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10324755A true JPH10324755A (en) | 1998-12-08 |
| JP3362386B2 JP3362386B2 (en) | 2003-01-07 |
Family
ID=15188163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13698897A Expired - Fee Related JP3362386B2 (en) | 1997-05-27 | 1997-05-27 | Resin-impregnated base material and method for producing the same, laminate and method for producing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3362386B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6555174B2 (en) | 2001-03-13 | 2003-04-29 | Sumitomo Bakelite Company Limited | Process for manufacturing prepreg |
| JPWO2016178400A1 (en) * | 2015-05-01 | 2018-02-22 | 日立化成株式会社 | FRP precursor manufacturing method and manufacturing apparatus thereof |
-
1997
- 1997-05-27 JP JP13698897A patent/JP3362386B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6555174B2 (en) | 2001-03-13 | 2003-04-29 | Sumitomo Bakelite Company Limited | Process for manufacturing prepreg |
| JPWO2016178400A1 (en) * | 2015-05-01 | 2018-02-22 | 日立化成株式会社 | FRP precursor manufacturing method and manufacturing apparatus thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3362386B2 (en) | 2003-01-07 |
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