JPH1032378A - Bonding printed wiring board - Google Patents
Bonding printed wiring boardInfo
- Publication number
- JPH1032378A JPH1032378A JP18366396A JP18366396A JPH1032378A JP H1032378 A JPH1032378 A JP H1032378A JP 18366396 A JP18366396 A JP 18366396A JP 18366396 A JP18366396 A JP 18366396A JP H1032378 A JPH1032378 A JP H1032378A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- plating
- content
- plating layer
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電気絶縁性基板の
表面に電気設計に基づく導体パターンを導電性材料で形
成し固着したボンディング用プリント配線板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board for bonding in which a conductive pattern based on electrical design is formed on a surface of an electrically insulating substrate with a conductive material and fixed.
【０００２】[0002]
【従来の技術】従来、ボンディング用プリント配線板
は、銅めっきでパターン形成後、Ｎｉめっきが施され、
次いで下記の２通りの方法で金めっきが行われている。2. Description of the Related Art Conventionally, a printed wiring board for bonding has been subjected to Ni plating after forming a pattern by copper plating.
Next, gold plating is performed by the following two methods.
【０００３】第１の方法は、Ｎｉめっき上に置換型熱無
電解金めっきをする方法である。この方法によれば、下
地に耐触性の強いＮｉめっきを用いると、上層にボンデ
ィングに必要な充分な厚さの置換金が得られない。一
方、下地に耐蝕性に弱いＮｉめっきを用いると、０．２
μｍ以上の厚さの上層の置換金が析出するが、置換金め
っき処理液の下地Ｎｉへの腐食が激しく進行するため、
腐食部でのボンディング不良が発生する。[0003] The first method is a method of performing substitutional electroless gold plating on Ni plating. According to this method, if Ni plating having strong contact resistance is used for the base, a replacement metal having a sufficient thickness required for bonding cannot be obtained in the upper layer. On the other hand, if Ni plating having low corrosion resistance is used for the base, 0.2
Displacement gold in the upper layer having a thickness of μm or more is deposited, but the corrosion of the displacement gold plating solution to the underlying Ni progresses violently.
Bonding failure at the corroded portion occurs.
【０００４】第２の方法は、Ｎｉめっき上に置換型無電
解金めっき後、還元型無電解金めっきする方法である。
この方法によれば、還元型無電解金めっき浴の充分な安
定性が得られないため、実験室的規模では製作が可能で
あっても実製造規模では不可能である。[0004] A second method is a method in which substitution-type electroless gold plating is performed on Ni plating, and then reduction-type electroless gold plating is performed.
According to this method, sufficient stability of the reduction-type electroless gold plating bath cannot be obtained, so that it can be manufactured on a laboratory scale but not on an actual manufacturing scale.
【０００５】そこで、下地にＮｉめっきを施した層の上
にボンディングに必要な充分な厚さの置換金の上層を有
するプリント配線板の出現が望まれている。[0005] Therefore, the emergence of a printed wiring board having an upper layer of a replacement metal having a sufficient thickness required for bonding on a layer having a base plated with Ni is desired.
【０００６】[0006]
【発明が解決しようとする課題】本発明は、ボンディン
グ性に優れた置換型金めっき層を有するプリント配線板
を提供することを目的としている。SUMMARY OF THE INVENTION An object of the present invention is to provide a printed wiring board having a substitutional gold plating layer having excellent bonding properties.
【０００７】[0007]
【課題を解決するための手段】本発明は、下記の通りも
のである。 （１）樹脂、セラミックまたは各種金属の絶縁基板の上
に下地層として銅箔または銅めっき層を有し、その上に
第１Ｎｉ−Ｐ層としてＰ含有率の高いＮｉ−Ｐめっき層
と、第２Ｎｉ−Ｐ層としてＰ含有率の低いＮｉ−Ｐめっ
き層と、さらに置換型無電解Ａｕめっき層とを設けたこ
とを特徴とする、ボンディング用プリント配線板。 （２）第１Ｎｉ−Ｐ層のＰ含有率が９〜１５重量％でめ
っき厚が０．５〜２０μｍ、第２Ｎｉ−Ｐ層のＰ含有率
が９重量％以下でめっき厚が０．５〜１０μｍ、前記第
１Ｎｉ−Ｐ層と第２Ｎｉ−Ｐ層のＰ含有率の差が２．５
重量％以上であり、置換型無電解Ａｕめっき層の厚さが
０．２〜１．５μｍであることを特徴とする前項（１）
に記載のボンディング用プリント配線板。Means for Solving the Problems The present invention is as follows. (1) A copper foil or copper plating layer as a base layer on an insulating substrate of resin, ceramic or various metals, and a Ni-P plating layer having a high P content as a first Ni-P layer thereon; (2) A printed wiring board for bonding, comprising a Ni-P plating layer having a low P content as a Ni-P layer and a substitutional electroless Au plating layer. (2) The first Ni-P layer has a P content of 9 to 15% by weight and a plating thickness of 0.5 to 20 μm, and the second Ni-P layer has a P content of 9% by weight or less and a plating thickness of 0.5 to 0.5%. 10 μm, the difference in P content between the first Ni-P layer and the second Ni-P layer is 2.5
(1) in which the thickness of the substitutional electroless Au plating layer is 0.2 to 1.5 μm.
3. The printed wiring board for bonding according to item 1.
【０００８】以下に、本発明を詳細に説明する。本発明
のプリント配線板は、配線板素材上の銅パターン上の全
面または必要部分に第１Ｎｉ−Ｐ層、第２Ｎｉ−Ｐ層お
よび置換金層が順次形成されていることを特徴としてい
る。この銅パターン、第１Ｎｉ−Ｐ層、第２Ｎｉ−Ｐ層
は、電解めっき法、無電解めっき法および蒸着法のいず
れの方法によっても良い。Hereinafter, the present invention will be described in detail. The printed wiring board of the present invention is characterized in that a first Ni-P layer, a second Ni-P layer, and a substitutional gold layer are sequentially formed on the entire surface or a necessary portion on a copper pattern on a wiring board material. The copper pattern, the first Ni-P layer, and the second Ni-P layer may be formed by any of an electrolytic plating method, an electroless plating method, and a vapor deposition method.
【０００９】本発明においてプリント配線板素材として
は、常用されている樹脂、セラミック、各種金属のいず
れも用いられる。In the present invention, as the printed wiring board material, any of commonly used resins, ceramics and various metals can be used.
【００１０】第１Ｎｉ−Ｐ層は、Ｐ含有量が９〜１５重
量％で耐食性の強いＮｉめっき層であり、Ａｕ置換めっ
き液による腐食反応が第２Ｎｉ−Ｐ層より下層に進行さ
せないように設定された層である。この層の厚さは０．
５〜２０μｍの範囲であり、０．５μｍ以下ではピンホ
ールが多くなって腐食反応のバリア層として機能しなく
なり、また２０μｍ以上では経済的でない。The first Ni-P layer is a Ni plating layer having a P content of 9 to 15% by weight and having high corrosion resistance, and is set so that the corrosion reaction by the Au-substituted plating solution does not proceed below the second Ni-P layer. Layer. The thickness of this layer is 0.
When the thickness is 0.5 μm or less, the number of pinholes increases and the layer does not function as a corrosion reaction barrier layer. When the thickness is 20 μm or more, it is not economical.
【００１１】第２Ｎｉ−Ｐ層は、Ｐ含有量が９重量％以
下であり、置換金がボンディングに必要な０．２μｍ以
上析出する耐食性の低いＮｉめっき層である。厚みは
０．５〜１０μｍが適正範囲である。０．５μｍ以下で
は置換Ａｕのめっき厚みが薄くなり、また１０μｍ以上
では耐食性の低いめっき層部分が厚くなってボンディン
グ性が劣化する。The second Ni—P layer is a Ni plating layer having a P content of 9% by weight or less and having a low corrosion resistance in which the substitute metal is deposited in an amount of 0.2 μm or more necessary for bonding. The appropriate thickness is 0.5 to 10 μm. If the thickness is 0.5 μm or less, the plating thickness of the substituted Au becomes thin.
【００１２】[0012]
【実施例】以下に、本発明を実施例と比較例によりさら
に説明する。実施例１ 銅めっきまたはエッチングによりパターン形成された標
準的なエポキシ樹脂プリント配線板に、第１Ｎｉ−Ｐ層
として析出比Ｐ含有率１２〜１４％の無電解Ｎｉ−Ｐを
５〜７μｍ、および第２Ｎｉ−Ｐ層として析出比Ｐ含有
率５〜７％の無電解Ｎｉ−Ｐめっきを行った。次に、日
本高純度化学株式会社製のＩＭ−ＧＯＬＤ ＩＢおよび
ＩＭ−ＧＯＬＤ ＮＳとして一般に市販されている置換
型無電解金めっき液を用いて、厚み０．４０〜０．４５
μｍの金めっきを施した。The present invention will be further described below with reference to examples and comparative examples. Example 1 On a standard epoxy resin printed wiring board patterned by copper plating or etching, electroless Ni-P having a deposition ratio P content of 12 to 14% as a first Ni-P layer was 5 to 7 μm, and As a 2Ni-P layer, electroless Ni-P plating with a deposition ratio P content of 5 to 7% was performed. Next, using a substitution type electroless gold plating solution generally commercially available as IM-GOLD IB and IM-GOLD NS manufactured by Japan High-Purity Chemical Co., Ltd., a thickness of 0.40 to 0.45 was used.
μm gold plating was applied.
【００１３】上記プリント配線板の製品を１０個製作
し、ボンディング性評価試験に供した。評価試験は、ワ
イヤーボンディングマシンにて直径２５μｍの金線ワイ
ヤーを用いてピール強度を測定した。[0013] Ten products of the printed wiring board were manufactured and subjected to a bonding property evaluation test. In the evaluation test, the peel strength was measured using a gold wire having a diameter of 25 μm with a wire bonding machine.
【００１４】比較例として、第１Ｎｉ−Ｐ層がなく、そ
の他は実施例１と同様の条件でプリント配線板を１０個
製作し、ボンディング性評価試験に供した。As a comparative example, ten printed wiring boards were manufactured under the same conditions as in Example 1 except that the first Ni-P layer was not provided, and subjected to a bonding evaluation test.
【００１５】評価試験の結果、本発明例のものはピール
強度が７ｇ以上であり、ワイヤーの剥がれの発生はなか
った。一方、比較例のものはピール強度が３ｇ以下のも
のもあり、ワイヤーの剥がれの発生が見られた。As a result of the evaluation test, the sample of the present invention had a peel strength of 7 g or more, and no peeling of the wire occurred. On the other hand, some of the comparative examples had a peel strength of 3 g or less, and peeling of the wire was observed.
【００１６】実施例２ タングステンを主体とするメタライズ印刷された標準的
なセラミックパッケージに実施例１と同一の条件で、第
１Ｎｉ−Ｐ層、第２Ｎｉ−Ｐ層、およびＡｕめっきを施
し、製品を１０個製作した。それを試料として、実施例
１と同様のボンディング性評価試験に供した。 EXAMPLE 2 A standard Ni-P layer, a second Ni-P layer, and Au plating are applied to a standardized metallized ceramic package mainly made of tungsten under the same conditions as in Example 1, and the product is manufactured. 10 were produced. This was used as a sample and subjected to the same bonding property evaluation test as in Example 1.
【００１７】比較例として、第１Ｎｉ−Ｐ層がなく、そ
の他は実施例２と同様の条件でプリント配線板を１０個
製作し、ボンディング性評価試験に供した。As a comparative example, ten printed wiring boards were manufactured under the same conditions as in Example 2 except that there was no first Ni-P layer, and were subjected to a bonding property evaluation test.
【００１８】評価試験の結果、本発明例のものはピール
強度が８ｇ以上であり、ワイヤー剥がれの発生はなかっ
た。一方、比較例のものはピール強度が３ｇ以下のもの
もあり、ワイヤーの剥がれの発生が見られた。As a result of the evaluation test, those of the examples of the present invention had a peel strength of 8 g or more, and no peeling of the wire occurred. On the other hand, some of the comparative examples had a peel strength of 3 g or less, and peeling of the wire was observed.
【００１９】[0019]
【発明の効果】本発明によれば、第２Ｎｉ−Ｐめっき層
が置換Ａｕの厚付けを可能にし、第１Ｎｉ−Ｐめっき層
が耐食バリヤー層となるため、優れたボンディング特性
が得られると共に、置換型無電解Ａｕを用いることが出
来るので経済性を有している。According to the present invention, the second Ni-P plating layer enables the replacement Au to be thickened, and the first Ni-P plating layer serves as a corrosion-resistant barrier layer, so that excellent bonding characteristics can be obtained. It is economical because substitution type electroless Au can be used.
Claims (2)
上に下地層として銅箔または銅めっき層を有し、その上
に第１Ｎｉ−Ｐ層としてＰ含有率の高いＮｉ−Ｐめっき
層と、第２Ｎｉ−Ｐ層としてＰ含有率の低いＮｉ−Ｐめ
っき層と、置換型無電解Ａｕめっき層とを設けたことを
特徴とする、ボンディング用プリント配線板。1. A Ni-P plating layer having a high P content as a first Ni-P layer having a copper foil or a copper plating layer as an underlayer on a resin, ceramic or metal insulating substrate; A printed wiring board for bonding, wherein a Ni-P plating layer having a low P content and a substitutional electroless Au plating layer are provided as a second Ni-P layer.
％でめっき厚が０．５〜２０μｍ、第２Ｎｉ−Ｐ層のＰ
含有率が９重量％以下でめっき厚が０．５〜１０μｍ、
前記第１Ｎｉ−Ｐ層と前記第２Ｎｉ−Ｐ層のＰ含有率の
差が２．５重量％以上であり、置換型無電解Ａｕめっき
層の厚さが０．２〜１．５μｍであることを特徴とする
請求項１に記載のボンディング用プリント配線板。2. The P content of the first Ni—P layer is 9 to 15% by weight, the plating thickness is 0.5 to 20 μm, and the P content of the second Ni—P layer is
The plating rate is 0.5 to 10 μm with a content of 9% by weight or less,
The difference in P content between the first Ni-P layer and the second Ni-P layer is 2.5% by weight or more, and the thickness of the substitutional electroless Au plating layer is 0.2 to 1.5 µm. The printed wiring board for bonding according to claim 1, wherein:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18366396A JPH1032378A (en) | 1996-07-12 | 1996-07-12 | Bonding printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18366396A JPH1032378A (en) | 1996-07-12 | 1996-07-12 | Bonding printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1032378A true JPH1032378A (en) | 1998-02-03 |
Family
ID=16139761
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18366396A Pending JPH1032378A (en) | 1996-07-12 | 1996-07-12 | Bonding printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1032378A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1357771A1 (en) * | 2001-10-02 | 2003-10-29 | Matsushita Electric Industrial Co., Ltd. | Electronic parts |
| JP2006147952A (en) * | 2004-11-22 | 2006-06-08 | Kyocera Corp | Semiconductor device and semiconductor device mount board |
| US7238432B2 (en) * | 2003-08-25 | 2007-07-03 | Dowa Mining Co., Ltd. | Metal member coated with metal layers |
| US8287992B2 (en) | 2009-03-09 | 2012-10-16 | Murata Manufacturing Co., Ltd. | Flexible board |
-
1996
- 1996-07-12 JP JP18366396A patent/JPH1032378A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1357771A1 (en) * | 2001-10-02 | 2003-10-29 | Matsushita Electric Industrial Co., Ltd. | Electronic parts |
| EP1357771A4 (en) * | 2001-10-02 | 2008-05-21 | Matsushita Electric Ind Co Ltd | Electronic parts |
| US7238432B2 (en) * | 2003-08-25 | 2007-07-03 | Dowa Mining Co., Ltd. | Metal member coated with metal layers |
| JP2006147952A (en) * | 2004-11-22 | 2006-06-08 | Kyocera Corp | Semiconductor device and semiconductor device mount board |
| US8287992B2 (en) | 2009-03-09 | 2012-10-16 | Murata Manufacturing Co., Ltd. | Flexible board |
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