JPH10284818A - Wiring board - Google Patents
Wiring boardInfo
- Publication number
- JPH10284818A JPH10284818A JP8639197A JP8639197A JPH10284818A JP H10284818 A JPH10284818 A JP H10284818A JP 8639197 A JP8639197 A JP 8639197A JP 8639197 A JP8639197 A JP 8639197A JP H10284818 A JPH10284818 A JP H10284818A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- wiring
- pattern
- connection
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29499—Shape or distribution of the fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、各種電子機器に使
用される配線基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board used for various electronic devices.
【０００２】[0002]
【従来の技術】従来の配線基板について、図７及び図８
を用いて説明する。2. Description of the Related Art FIGS. 7 and 8 show a conventional wiring board.
This will be described with reference to FIG.
【０００３】図７は従来の配線基板の断面図、図８は同
分解斜視図であり、同図において、１は絶縁フィルムの
下面に銀やカーボン等の導電粉と樹脂からなる複数の配
線パターン２が形成され、端部が接続部３となった上配
線基板、４は絶縁基板の上面に銅等からなる複数の配線
パターン５が形成され、端部が接続部６となった下配線
基板であり、上配線基板１の接続部３には導電性の導電
粒子７と絶縁性の樹脂８から形成された異方導電性接着
剤９が塗布されている。FIG. 7 is a cross-sectional view of a conventional wiring board, and FIG. 8 is an exploded perspective view of the same. In the drawing, reference numeral 1 denotes a plurality of wiring patterns made of a conductive powder such as silver or carbon and a resin on the lower surface of an insulating film. 2 is formed, and an upper wiring board having an end portion serving as a connection portion 3, and a lower wiring substrate 4 having a plurality of wiring patterns 5 made of copper or the like formed on the upper surface of an insulating substrate and having an end portion serving as a connection portion 6. The connection portion 3 of the upper wiring board 1 is coated with an anisotropic conductive adhesive 9 formed of conductive particles 7 and an insulating resin 8.
【０００４】この従来の配線基板の接続方法について説
明すると、図９に示すように、先ず、固定型１０に上配
線基板１と下配線基板４を、配線パターン２の接続部３
と配線パターン５の接続部６を対向させて載置し、次に
ヒータを有する可動型１１が下降して、上配線基板１を
介して異方導電性接着剤９を加熱加圧し、異方導電性接
着剤９の樹脂８を溶融させた後、可動型１１が離れる
と、異方導電性接着剤９が冷却されて硬化する。[0004] A description will be given of this conventional method of connecting wiring boards. First, as shown in FIG. 9, first, an upper wiring board 1 and a lower wiring board 4 are fixed to a fixed mold 10 by connecting portions 3 of a wiring pattern 2.
Then, the movable mold 11 having a heater is lowered, and the anisotropic conductive adhesive 9 is heated and pressurized via the upper wiring board 1, and the anisotropic conductive adhesive 9 is heated and pressurized. After the movable mold 11 is separated after the resin 8 of the conductive adhesive 9 is melted, the anisotropic conductive adhesive 9 is cooled and hardened.
【０００５】この結果、図７に示すように、溶融硬化し
た異方導電性接着剤９の樹脂８によって、上配線基板１
と下配線基板４が機械的に接着されると共に、導電粒子
７によって配線パターン２の接続部３と配線パターン５
の接続部６が電気的に接続されるものであった。As a result, as shown in FIG. 7, the upper wiring board 1
And the lower wiring board 4 are mechanically bonded, and the conductive particles 7 connect the connecting portion 3 of the wiring pattern 2 and the wiring pattern 5.
Are electrically connected.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら上記従来
の配線基板においては、上配線基板１と下配線基板４の
電気的接続が、粒子の大きさにばらつきのある導電粒子
７によって行われているため、小さな導電粒子７Ａの周
囲には樹脂８が介在して接続部３や接続部６との電気的
な接続が行われず、接続部３と接続部６に接した大きな
導電粒子７Ｂによってのみ電気的接続が行われており、
配線パターン２の接続部３と配線パターン５の接続部６
の電気的接続が不安定で、接続抵抗が大きくなることが
あるという課題があった。However, in the above-mentioned conventional wiring board, the electrical connection between the upper wiring board 1 and the lower wiring board 4 is made by the conductive particles 7 having a variable particle size. In addition, the resin 8 is interposed around the small conductive particles 7A to make no electrical connection with the connection portion 3 or the connection portion 6, and electrical connection is made only by the large conductive particles 7B in contact with the connection portion 3 and the connection portion 6. The connection has been made,
Connection 3 of wiring pattern 2 and connection 6 of wiring pattern 5
There is a problem that the electrical connection is unstable and the connection resistance may increase.
【０００７】本発明はこのような従来の課題を解決する
ものであり、電気的接続が確実で接続抵抗の安定した配
線基板を提供することを目的とするものである。An object of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a wiring board having a reliable electric connection and a stable connection resistance.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するため
に本発明の配線基板は、下面に接続部を有する配線パタ
ーンが形成され接続部に異方導電性接着剤が塗布された
上配線基板と、上面に接続部を有する配線パターンが形
成された下配線基板の、いずれか一方の接続部の上面に
所定の長さの導電パターンを形成し、この導電パターン
を介して上下の配線パターンの接続部を接続するように
構成したものである。In order to solve the above problems, a wiring board according to the present invention comprises an upper wiring board in which a wiring pattern having a connecting portion is formed on a lower surface and an anisotropic conductive adhesive is applied to the connecting portion. A conductive pattern of a predetermined length is formed on the upper surface of one of the connecting portions of the lower wiring substrate on which the wiring pattern having the connecting portion is formed on the upper surface, and the upper and lower wiring patterns are formed via the conductive pattern. It is configured to connect the connection parts.
【０００９】この本発明により、電気的接続が確実で接
続抵抗の安定した配線基板を得ることができる。According to the present invention, it is possible to obtain a wiring board having a reliable electric connection and a stable connection resistance.
【００１０】[0010]
【発明の実施の形態】本発明の請求項１に記載の発明
は、下面に接続部を有する複数の配線パターンが形成さ
れ接続部に異方導電性接着剤が塗布された上配線基板
と、上面に接続部を有する複数の配線パターンが形成さ
れた下配線基板の、いずれか一方の接続部の上面に所定
の長さの導電パターンを形成すると共に、上下配線基板
の接続部を加熱加圧によって接続した構成の配線基板と
したもので、導電パターンを介して異方導電性接着剤の
導電粒子と上下配線パターンの接続部の接続が行われる
ため、電気的接続が確実で接続抵抗の安定した配線基板
を得ることができるという作用を有する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is directed to an upper wiring board in which a plurality of wiring patterns each having a connection portion on a lower surface are formed, and an anisotropic conductive adhesive is applied to the connection portion. A conductive pattern of a predetermined length is formed on the upper surface of one of the connection portions of the lower wiring substrate on which a plurality of wiring patterns having connection portions on the upper surface are formed, and the connection portions of the upper and lower wiring substrates are heated and pressed. The connection between the conductive particles of the anisotropic conductive adhesive and the connection part of the upper and lower wiring patterns is made via the conductive pattern, so that the electrical connection is secure and the connection resistance is stable. It is possible to obtain a wiring board having a function as described above.
【００１１】請求項２に記載の発明は、請求項１記載の
発明において、導電パターンの巾を配線パターンの接続
部の巾よりも細くした構成のもので、配線パターンの接
続部の上面に導電パターンを形成する際に多少の位置ず
れが生じても、配線パターンの接続部の端部から導電パ
ターンの端部がはみ出すことがないため、隣接する配線
パターンの接続部との間隔が確保でき、配線パターンの
接続部間の充分な絶縁を保つことができると共に、配線
パターンの接続部への導電パターンの形成が容易となる
という作用を有する。According to a second aspect of the present invention, in the first aspect of the invention, the width of the conductive pattern is smaller than the width of the connection portion of the wiring pattern. Even if there is some misalignment when forming the pattern, since the end of the conductive pattern does not protrude from the end of the connection part of the wiring pattern, the interval between the connection parts of adjacent wiring patterns can be secured, This has an effect that sufficient insulation between the connection portions of the wiring pattern can be maintained, and formation of the conductive pattern on the connection portion of the wiring pattern becomes easy.
【００１２】請求項３に記載の発明は、請求項１または
２記載の発明において、上下配線基板の配線パターンの
接続部の巾を、一方を他方よりも細くした構成のもの
で、上配線基板と下配線基板を接続する際に上下の配線
パターンの接続部が多少ずれた状態で接続されても、一
方の配線パターンの接続部の端部から他方の配線パター
ンの接続部の端部がはみ出すことがないため、隣接する
配線パターンの接続部との間隔が確保でき、配線パター
ンの接続部間の充分な絶縁を保つことができると共に、
上配線基板と下配線基板の接続組立が容易となるという
作用を有する。According to a third aspect of the present invention, in the first or the second aspect of the present invention, the width of the connection portion of the wiring pattern of the upper and lower wiring boards is made narrower on one side than on the other. When the upper and lower wiring patterns are connected in a slightly shifted state when connecting the lower wiring board and the lower wiring board, the ends of the connecting parts of the other wiring pattern protrude from the ends of the connecting parts of one wiring pattern. Because there is no gap between the connection parts of the adjacent wiring pattern can be secured, sufficient insulation between the connection parts of the wiring pattern can be maintained,
This has the effect of facilitating the connection and assembly of the upper and lower wiring boards.
【００１３】以下、本発明の実施の形態について、図１
〜図６を用いて説明する。なお、従来の技術の項で説明
した構成と同一構成の部分には同一符号を付して、詳細
な説明を省略する。Hereinafter, an embodiment of the present invention will be described with reference to FIG.
This will be described with reference to FIG. The same components as those described in the section of the related art are denoted by the same reference numerals, and detailed description will be omitted.
【００１４】（実施の形態１）図１は本発明の第１の実
施の形態による配線基板の断面図、図２は同分解斜視図
であり、同図において、上配線基板１の下面には複数の
配線パターン２が形成され、下配線基板４の上面には複
数の配線パターン５が形成されると共に、上配線基板１
の接続部３には異方導電性接着剤９が塗布されているこ
とは従来の技術と同様であるが、下配線基板４の配線パ
ターン５の接続部６上面には、銀やカーボン等の導電粉
と樹脂からなる導電パターン１２が設けられている。(Embodiment 1) FIG. 1 is a sectional view of a wiring board according to a first embodiment of the present invention, and FIG. 2 is an exploded perspective view thereof. A plurality of wiring patterns 2 are formed, and a plurality of wiring patterns 5 are formed on the upper surface of the lower wiring substrate 4.
The connection portion 3 is coated with an anisotropic conductive adhesive 9 in the same manner as in the prior art, but the upper surface of the connection portion 6 of the wiring pattern 5 of the lower wiring board 4 is coated with silver or carbon. A conductive pattern 12 made of a conductive powder and a resin is provided.
【００１５】また、異方導電性接着剤９を加熱加圧し溶
融硬化させることによって、上配線基板１と下配線基板
４の機械的接着と、配線パターン２の接続部３と配線パ
ターン５の接続部６の電気的接続を行うことも従来の技
術と同様であるが、加熱加圧によって異方導電性接着剤
９が溶融硬化すると同時に、下配線基板４の接続部６の
上面に設けた導電パターン１２も溶融硬化を行う。Further, the anisotropic conductive adhesive 9 is heated and pressurized and melted and hardened, thereby mechanically bonding the upper wiring board 1 and the lower wiring board 4 and connecting the connecting portion 3 of the wiring pattern 2 to the wiring pattern 5. The electrical connection of the connection portion 6 is the same as that of the prior art. However, at the same time as the anisotropic conductive adhesive 9 is melt-hardened by heating and pressing, the conductive The pattern 12 is also melt-hardened.
【００１６】この結果、図１に示すように、上配線基板
１と下配線基板４が溶融硬化した樹脂８によって機械的
に接着されると共に、配線パターン２の接続部３と配線
パターン５の接続部６との電気的接続が、大きな導電粒
子７Ｂばかりでなく、溶融硬化した導電パターン１２を
介して小さな導電粒子７Ａによっても行われる。As a result, as shown in FIG. 1, the upper wiring board 1 and the lower wiring board 4 are mechanically bonded by the melt-hardened resin 8, and the connection between the connection portion 3 of the wiring pattern 2 and the wiring pattern 5 is made. The electrical connection with the portion 6 is made not only by the large conductive particles 7B, but also by the small conductive particles 7A via the melt-cured conductive pattern 12.
【００１７】このように本実施の形態によれば、配線パ
ターン５の接続部６の上面に設けた導電パターン１２に
よって、大きな導電粒子７Ｂばかりでなく、小さな導電
粒子７Ａも導電パターン１２を介して配線パターン２の
接続部３と配線パターン５の接続部６との電気的接続を
行い、より多くの導電粒子によって接続部３と６が電気
的に接続されるため、電気的接続が確実で接続抵抗の安
定した配線基板を得ることができる。As described above, according to the present embodiment, not only large conductive particles 7B but also small conductive particles 7A are provided via conductive pattern 12 by conductive pattern 12 provided on upper surface of connection portion 6 of wiring pattern 5. Electrical connection is made between the connection portion 3 of the wiring pattern 2 and the connection portion 6 of the wiring pattern 5, and the connection portions 3 and 6 are electrically connected by more conductive particles. A wiring board with stable resistance can be obtained.
【００１８】なお、上記の説明では、導電パターン１２
を下配線基板４の接続部６の上面に設けた構成とした
が、図３に示すように、上配線基板１の接続部３を覆う
異方導電性接着剤９の上面に導電パターン１２を設けた
構成としても同様の効果が得られることは勿論である。In the above description, the conductive pattern 12
Is provided on the upper surface of the connection portion 6 of the lower wiring substrate 4, but as shown in FIG. 3, the conductive pattern 12 is formed on the upper surface of the anisotropic conductive adhesive 9 covering the connection portion 3 of the upper wiring substrate 1. It is a matter of course that a similar effect can be obtained even with the configuration provided.
【００１９】また、上配線基板１と下配線基板４の異方
導電性接着剤９によって接続する前の部品の状態で、搬
送や保管時の湿気やガス等から保護するため、配線パタ
ーン５の接続部６上面にカーボン層を形成することが一
般的に行われているが、この場合にも、配線パターン５
の接続部６を覆うカーボン層の上面に導電パターン１２
を設けることによって、配線パターン２の接続部３と配
線パターン５の接続部６との確実な電気的接続と安定し
た接続抵抗を得ることができる。Further, in the state of the parts before being connected by the anisotropic conductive adhesive 9 between the upper wiring board 1 and the lower wiring board 4, the wiring pattern 5 is protected in order to protect it from moisture and gas during transportation and storage. Although a carbon layer is generally formed on the upper surface of the connection portion 6, the wiring pattern 5 is also formed in this case.
The conductive pattern 12 is formed on the upper surface of the carbon layer covering the connection portion 6 of FIG.
Is provided, a reliable electrical connection between the connection portion 3 of the wiring pattern 2 and the connection portion 6 of the wiring pattern 5 and a stable connection resistance can be obtained.
【００２０】（実施の形態２）図４は本発明の第２の実
施の形態による配線基板の断面図であり、同図におい
て、下配線基板４の配線パターンの接続部６Ａ上面に設
けられた導電パターン１２Ａは、接続部６Ａよりも細い
巾に形成されている。(Embodiment 2) FIG. 4 is a cross-sectional view of a wiring board according to a second embodiment of the present invention. In FIG. 4, the wiring board is provided on the upper surface of the connection portion 6A of the wiring pattern of the lower wiring board 4. The conductive pattern 12A is formed to have a smaller width than the connecting portion 6A.
【００２１】この図４（ａ）のように、配線パターンの
接続部６Ａよりも導電パターン１２Ａを細い巾に形成す
ることによって、配線パターンの接続部６Ａの上面に導
電パターン１２Ａを形成する際に、図４（ｂ）のように
接続部６Ａと導電パターン１２Ａに多少の位置ずれが生
じても、接続部６Ａの端部から導電パターン１２Ａの端
部がはみ出すことがないため、隣接する接続部６Ｂとの
間隔が確保でき、配線パターンの接続部間の充分な絶縁
を保つことができると共に、配線パターンの接続部６Ａ
への導電パターン１２Ａの形成が容易なものとなる。As shown in FIG. 4A, when the conductive pattern 12A is formed to have a width smaller than that of the connecting portion 6A of the wiring pattern, the conductive pattern 12A is formed on the upper surface of the connecting portion 6A of the wiring pattern. 4B, even if there is a slight displacement between the connecting portion 6A and the conductive pattern 12A, the end of the conductive pattern 12A does not protrude from the end of the connecting portion 6A. 6B can be secured, sufficient insulation between the connection portions of the wiring pattern can be maintained, and the connection portion 6A of the wiring pattern can be maintained.
This facilitates formation of the conductive pattern 12A.
【００２２】また、図５（ａ）に示すように、下配線基
板４の接続部６Ａ，６Ｂよりも上配線基板１の接続部３
Ａ，３Ｂを細い巾に形成することで、上配線基板１と下
配線基板４を接続する際に、図５（ｂ）のように接続部
３Ａ，３Ｂと接続部６Ａ，６Ｂが多少ずれた状態で接続
されても、接続部６Ａの端部から接続部３Ａの端部がは
み出すことがないため、隣接する接続部６Ｂとの間隔が
確保でき、配線パターンの接続部間の充分な絶縁を保つ
ことができると共に、上配線基板１と下配線基板４の接
続組立が容易なものとなる。As shown in FIG. 5A, the connecting portions 3 of the upper wiring board 1 are larger than the connecting portions 6A and 6B of the lower wiring board 4.
When the upper wiring board 1 and the lower wiring board 4 are connected to each other by forming the thinner portions A and 3B, the connecting portions 3A and 3B and the connecting portions 6A and 6B are slightly shifted as shown in FIG. 5B. Even if the connection is made in this state, the end of the connection portion 3A does not protrude from the end of the connection portion 6A, so that a space between adjacent connection portions 6B can be secured, and sufficient insulation between the connection portions of the wiring pattern can be ensured. In addition to this, the connection assembly between the upper wiring board 1 and the lower wiring board 4 can be easily performed.
【００２３】なお、配線パターンの接続部の巾や間隔に
応じて、図６（ａ）に示すように導電パターン１２Ｂを
接続部６に対して斜めに設けたり、或いは図６（ｂ）の
ように複数の導電パターン１２Ｃを設けたり、さらには
図６（ｃ）のように導電パターン１２Ｄを交差する形状
とすることによって、より電気的接続を確実にし接続抵
抗を安定させる導電パターンの形状の選択が可能とな
る。The conductive pattern 12B is provided obliquely with respect to the connecting portion 6 as shown in FIG. 6A, or as shown in FIG. By providing a plurality of conductive patterns 12C on the substrate or by crossing the conductive patterns 12D as shown in FIG. 6C, selection of the shape of the conductive pattern that ensures more electrical connection and stabilizes the connection resistance. Becomes possible.
【００２４】[0024]
【発明の効果】以上のように本発明によれば、電気的接
続が確実で接続抵抗の安定した配線基板を得ることがで
きるという有利な効果が得られる。As described above, according to the present invention, there is obtained an advantageous effect that it is possible to obtain a wiring board having a reliable electric connection and a stable connection resistance.
【図１】本発明の第１の実施の形態による配線基板の断
面図FIG. 1 is a sectional view of a wiring board according to a first embodiment of the present invention;
【図２】同分解斜視図FIG. 2 is an exploded perspective view of the same.
【図３】同接着前の断面図FIG. 3 is a cross-sectional view before the bonding.
【図４】本発明の第２の実施の形態による下配線基板の
断面図FIG. 4 is a sectional view of a lower wiring board according to a second embodiment of the present invention;
【図５】同配線基板の断面図FIG. 5 is a sectional view of the wiring board.
【図６】同下配線基板の斜視図FIG. 6 is a perspective view of the lower wiring board.
【図７】従来の配線基板の断面図FIG. 7 is a sectional view of a conventional wiring board.
【図８】同分解斜視図FIG. 8 is an exploded perspective view of the same.
【図９】同接着前の一部断面側面図FIG. 9 is a partial cross-sectional side view before the bonding.
１ 上配線基板 ２ 配線パターン ３，３Ａ，３Ｂ 接続部 ４ 下配線基板 ５ 配線パターン ６，６Ａ，６Ｂ 接続部 ７，７Ａ，７Ｂ 導電粒子 ８ 樹脂 ９ 異方導電性接着剤 １２，１２Ａ，１２Ｂ，１２Ｃ，１２Ｄ 導電パターン DESCRIPTION OF SYMBOLS 1 Upper wiring board 2 Wiring pattern 3, 3A, 3B connection part 4 Lower wiring board 5 Wiring pattern 6, 6A, 6B connection part 7, 7A, 7B Conductive particle 8 Resin 9 Anisotropic conductive adhesive 12, 12A, 12B, 12C, 12D conductive pattern
Claims (3)
ンが形成され接続部に異方導電性接着剤が塗布された上
配線基板と、上面に接続部を有する複数の配線パターン
が形成された下配線基板の、いずれか一方の接続部の上
面に所定の長さの導電パターンを形成すると共に、上下
配線基板の接続部を加熱加圧によって接続した配線基
板。1. An upper wiring substrate having a plurality of wiring patterns having connection portions formed on a lower surface and an anisotropic conductive adhesive applied to the connection portions, and a plurality of wiring patterns having connection portions formed on an upper surface. A wiring board in which a conductive pattern of a predetermined length is formed on the upper surface of one of the connecting parts of the lower wiring board, and the connecting parts of the upper and lower wiring boards are connected by heating and pressing.
部の巾よりも細くした請求項１記載の配線基板。2. The wiring board according to claim 1, wherein the width of the conductive pattern is smaller than the width of the connection part of the wiring pattern.
巾を、一方を他方よりも細くした請求項１または２記載
の配線基板。3. The wiring board according to claim 1, wherein the width of the connection portion of the wiring pattern of the upper and lower wiring boards is smaller at one side than at the other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8639197A JP3911759B2 (en) | 1997-04-04 | 1997-04-04 | Wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8639197A JP3911759B2 (en) | 1997-04-04 | 1997-04-04 | Wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10284818A true JPH10284818A (en) | 1998-10-23 |
| JP3911759B2 JP3911759B2 (en) | 2007-05-09 |
Family
ID=13885585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8639197A Expired - Fee Related JP3911759B2 (en) | 1997-04-04 | 1997-04-04 | Wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3911759B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002054843A1 (en) * | 2000-12-28 | 2002-07-11 | Matsushita Electric Industrial Co., Ltd. | Production method of circuit board module |
| JP2011233609A (en) * | 2010-04-26 | 2011-11-17 | Sumitomo Electric Printed Circuit Inc | Connection structure of flexible printed wiring board and electronic apparatus with the same |
| WO2016113971A1 (en) * | 2015-01-15 | 2016-07-21 | 大日本印刷株式会社 | Composite wiring board provided with a plurality of wiring boards connected via connecting members, connecting member manufacturing method, connecting member, and pressure sensor |
| JP2016136612A (en) * | 2015-01-15 | 2016-07-28 | 大日本印刷株式会社 | Composite wiring board provided with plural wiring boards connected via connecting member, manufacturing method of connecting member, connecting member, and pressure sensor |
-
1997
- 1997-04-04 JP JP8639197A patent/JP3911759B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002054843A1 (en) * | 2000-12-28 | 2002-07-11 | Matsushita Electric Industrial Co., Ltd. | Production method of circuit board module |
| US6942745B2 (en) | 2000-12-28 | 2005-09-13 | Matsushita Electric Industrial Co., Ltd. | Production method of circuit board module |
| JP2011233609A (en) * | 2010-04-26 | 2011-11-17 | Sumitomo Electric Printed Circuit Inc | Connection structure of flexible printed wiring board and electronic apparatus with the same |
| WO2016113971A1 (en) * | 2015-01-15 | 2016-07-21 | 大日本印刷株式会社 | Composite wiring board provided with a plurality of wiring boards connected via connecting members, connecting member manufacturing method, connecting member, and pressure sensor |
| JP2016136612A (en) * | 2015-01-15 | 2016-07-28 | 大日本印刷株式会社 | Composite wiring board provided with plural wiring boards connected via connecting member, manufacturing method of connecting member, connecting member, and pressure sensor |
| JP2016197751A (en) * | 2015-01-15 | 2016-11-24 | 大日本印刷株式会社 | Composite wiring board provided with plurality of wiring boards connected via connecting member, and connecting member |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3911759B2 (en) | 2007-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4815981A (en) | Flexible printed circuit board terminal structure | |
| JP3163592B2 (en) | Composite circuit board | |
| JPS6333320B2 (en) | ||
| KR100451924B1 (en) | Mounting structure for semiconductor chip, semiconductor device, and method of manufacturing semiconductor device | |
| US20010015286A1 (en) | Method of surface- mounting electronic components | |
| JP3042132B2 (en) | How to mount electrical components on circuit boards | |
| JPH10284818A (en) | Wiring board | |
| JPH08138773A (en) | Electrode portion structure of printed wiring board | |
| JP3134572B2 (en) | Injection molded printed circuit board wiring structure | |
| JP3227778B2 (en) | Conductive connection structure | |
| EP1018761A4 (en) | Semiconductor device and method of fabricating the same | |
| JPH10261852A (en) | Heat-sealed connector and flexible wiring board | |
| JPH058831B2 (en) | ||
| JPH10321987A (en) | Printed wiring board and manufacture thereof | |
| JPH09320662A (en) | Terminal structure of flexible printed board and its manufacture | |
| JPH0349415Y2 (en) | ||
| JP2954559B2 (en) | Wiring board electrode structure | |
| JP2566842Y2 (en) | Flexible printed circuit board connection device | |
| JPS6149499A (en) | Flexible multilayer circuit board | |
| KR0124209Y1 (en) | Multilay substrate | |
| JPS6029202Y2 (en) | Directional coupler line structure | |
| JPH05160559A (en) | Printed circuit board | |
| US6411518B1 (en) | High-density mounted device employing an adhesive sheet | |
| JPH10261853A (en) | Structure of substrate terminal, tape carrier package provided with it, and printed wiring board | |
| JPH05136532A (en) | Flexible wiring board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RD01 | Notification of change of attorney |
Effective date: 20050623 Free format text: JAPANESE INTERMEDIATE CODE: A7421 |
|
| A131 | Notification of reasons for refusal |
Effective date: 20060620 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060809 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Effective date: 20070109 Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Effective date: 20070122 Free format text: JAPANESE INTERMEDIATE CODE: A61 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 3 Free format text: PAYMENT UNTIL: 20100209 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 4 Free format text: PAYMENT UNTIL: 20110209 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 5 Free format text: PAYMENT UNTIL: 20120209 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130209 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 6 Free format text: PAYMENT UNTIL: 20130209 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 7 Free format text: PAYMENT UNTIL: 20140209 |
|
| LAPS | Cancellation because of no payment of annual fees |