JPH10281583A - Fluid heating or cooling apparatus - Google Patents
Fluid heating or cooling apparatusInfo
- Publication number
- JPH10281583A JPH10281583A JP8283297A JP8283297A JPH10281583A JP H10281583 A JPH10281583 A JP H10281583A JP 8283297 A JP8283297 A JP 8283297A JP 8283297 A JP8283297 A JP 8283297A JP H10281583 A JPH10281583 A JP H10281583A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- outer tube
- heater
- tube
- heater insertion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 title claims abstract description 12
- 238000001816 cooling Methods 0.000 title claims description 23
- 238000010438 heat treatment Methods 0.000 title claims description 21
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 20
- 239000002826 coolant Substances 0.000 claims abstract description 9
- 238000003780 insertion Methods 0.000 claims description 26
- 230000037431 insertion Effects 0.000 claims description 26
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 239000012809 cooling fluid Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 125000005843 halogen group Chemical group 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 26
- 150000002367 halogens Chemical class 0.000 abstract description 19
- 239000000498 cooling water Substances 0.000 abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 2
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 description 8
- 238000003860 storage Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 238000005192 partition Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- SWXQKHHHCFXQJF-UHFFFAOYSA-N azane;hydrogen peroxide Chemical compound [NH4+].[O-]O SWXQKHHHCFXQJF-UHFFFAOYSA-N 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- CABDFQZZWFMZOD-UHFFFAOYSA-N hydrogen peroxide;hydrochloride Chemical compound Cl.OO CABDFQZZWFMZOD-UHFFFAOYSA-N 0.000 description 1
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、流体を加熱および
冷却する装置に関する。The present invention relates to an apparatus for heating and cooling a fluid.
【０００２】[0002]
【従来の技術】半導体ウエハを洗浄するいわゆるＲＣＡ
洗浄工程においては、アンモニア過水による洗浄によっ
て有機物およびパーティクルが除去され、また、塩酸過
水による洗浄によって金属イオンが除去される。2. Description of the Related Art So-called RCA for cleaning semiconductor wafers
In the cleaning step, organic substances and particles are removed by washing with ammonia and hydrogen peroxide, and metal ions are removed by washing with hydrochloric acid and hydrogen peroxide.
【０００３】上記洗浄処理においては、洗浄用薬液であ
る上記アンモニア過水および塩酸過水を８０℃前後程度
まで加熱する必要がある。そこで、加熱源である管状の
ランプヒータを一端を閉止したヒータ挿入管に着脱自在
に挿入し、このヒータ管の周囲に形成した流通空間にお
いて上記洗浄薬液を流通させるようにした流体加熱装置
が実用されている。[0003] In the above-mentioned cleaning treatment, it is necessary to heat the above-mentioned cleaning solution such as aqueous ammonia and hydrogen peroxide to about 80 ° C. Therefore, a fluid heating device in which a tubular lamp heater as a heating source is detachably inserted into a heater insertion tube having one end closed, and the cleaning solution is allowed to flow in a flow space formed around the heater tube is practically used. Have been.
【０００４】[0004]
【発明が解決しようとする課題】上記ランプヒータは、
両端部をシールした管状の耐熱ガラス管内にフィラメン
トを配設した構造を有する。The above-mentioned lamp heater is
It has a structure in which a filament is disposed in a tubular heat-resistant glass tube having both ends sealed.
【０００５】上記ランプヒータのシール部には、一定以
上の高温下で変質する金属製部材が封入されているの
で、該ヒータの寿命を延ばすには、上記シール部を冷却
することが望ましい。[0005] Since a metal member which deteriorates at a certain high temperature or higher is sealed in the seal portion of the lamp heater, it is desirable to cool the seal portion in order to extend the life of the heater.
【０００６】特に、上記ヒータ挿入管の閉止端側に位置
したシール部は、その周辺が該挿入管の内面に包囲され
ているので高温になり易く、したがって、上記閉止端側
に位置したシール部を冷却することは、ランプヒータの
寿命を延ばす上で極めて重要となる。[0006] In particular, the seal portion located on the closed end side of the heater insertion tube is liable to become hot because the periphery thereof is surrounded by the inner surface of the insertion tube. Therefore, the seal portion located on the closed end side is provided. Is extremely important in extending the life of the lamp heater.
【０００７】本発明の目的は、かかる状況に鑑み、加熱
源であるランプヒータの端部を冷却することができる流
体加熱冷却装置を提供することにある。An object of the present invention is to provide a fluid heating / cooling apparatus capable of cooling an end portion of a lamp heater as a heating source in view of such a situation.
【０００８】[0008]
【課題を解決するための手段】本発明は、一端が閉止さ
れたヒータ挿入管と、前記ヒータ挿入管が内部を貫通
し、該ヒータ挿入管の外周面との間に被加熱冷却流体の
流通空間を画成する外管と、前記外管の外周囲に配設さ
れ、該外管の外面との間に少なくとも前記ヒータ挿入管
の閉止端が内部に露呈する態様で冷却媒体の流通空間を
画成するジャケットと、シングルエンド構造を有し、加
熱源として前記ヒータ挿入管に挿入される管状のランプ
ヒータと、を備え、前記外管に前記被加熱冷却流体の流
入口および流出口を設けると共に、前記ジャケットに前
記冷却媒体の流入口および流出口を設けたことを特徴と
している。SUMMARY OF THE INVENTION According to the present invention, there is provided a heater insertion pipe having one end closed, and the flow of a cooling fluid to be heated is provided between the heater insertion pipe and an outer peripheral surface of the heater insertion pipe. An outer tube that defines a space, and disposed around the outer tube, the cooling medium flow space between the outer surface of the outer tube and at least the closed end of the heater insertion tube is exposed inside. A jacket having a single end structure, a tubular lamp heater inserted into the heater insertion tube as a heating source, and an inlet and an outlet for the cooling fluid to be heated provided in the outer tube. In addition, an inlet and an outlet for the cooling medium are provided in the jacket.
【０００９】[0009]
【発明の実施の形態】図１は、本発明に係る流体加熱冷
却装置１０の一実施形態を示した縦断面図であり、ま
た、第２図および第３図は、それぞれ第１図のＡ矢視図
およびＢ矢視図である。FIG. 1 is a longitudinal sectional view showing an embodiment of a fluid heating / cooling apparatus 10 according to the present invention. FIGS. 2 and 3 are each a sectional view of FIG. It is the arrow view and the arrow B view.
【００１０】各図に示すように、この流体加熱冷却装置
１０は、ケーシング２０の内方に、一対のヒータ挿入管
３０、外管４０およびジャケット５０を配設した構成を
有する。As shown in the drawings, the fluid heating / cooling apparatus 10 has a configuration in which a pair of heater insertion pipes 30, an outer pipe 40, and a jacket 50 are provided inside a casing 20.
【００１１】上記各ヒータ挿入管３０は、透明石英ガラ
スで形成されており、外管４０の内部を前後方向に貫通
している。Each of the heater insertion tubes 30 is made of transparent quartz glass, and penetrates the inside of the outer tube 40 in the front-rear direction.
【００１２】外管４０は、石英ガラスからなり、前端お
よび後端にそれぞれ壁４１および４２を備えている。こ
の外管４０は、ヒータ挿入管３０の外周面との間に被加
熱冷却流体の流通空間４３を画成し、かつ、壁４１の上
部および下部に被加熱冷却流体の流入口４４および流出
口４５をそれぞれ設けてある。The outer tube 40 is made of quartz glass and has walls 41 and 42 at the front and rear ends, respectively. The outer pipe 40 defines a flow space 43 for the cooling fluid to be heated between the outer pipe 40 and the outer peripheral surface of the heater insertion pipe 30, and an inlet 44 and an outlet for the cooling fluid to be heated at the upper and lower portions of the wall 41. 45 are provided.
【００１３】図４に示すように、外管４０は、円筒状に
形成され、その内部に隔壁４６を設けてある。図１に示
した流通空間４３は、この隔壁４６によって空間部４３
ａと空間部４３ｂに二分されており、上記各ヒータ挿入
管３０の一方は空間部４３ａに、他方は空間部４３ｂに
それぞれ位置している。なお、図１および後述の図５に
おいては、上記隔壁４６が省略されている。As shown in FIG. 4, the outer tube 40 is formed in a cylindrical shape, and has a partition wall 46 provided therein. The distribution space 43 shown in FIG.
a and a space 43b. One of the heater insertion tubes 30 is located in the space 43a, and the other is located in the space 43b. In FIG. 1 and FIG. 5 described later, the partition wall 46 is omitted.
【００１４】上記空間部４３ａおよび４３ｂは、それぞ
れ上記流入口４４および流出口４５に連通し、かつ、上
記隔壁４６の後端部に設けた穴４６ａを介して相互に連
通している。The spaces 43a and 43b communicate with the inflow port 44 and the outflow port 45, respectively, and communicate with each other via a hole 46a provided at the rear end of the partition wall 46.
【００１５】上記ジャケット５０は、ＳＵＳ等の耐腐蝕
性金属で形成されており、図５に示すように、後端に壁
５１を備えた円筒形状を有する。The jacket 50 is formed of a corrosion-resistant metal such as SUS, and has a cylindrical shape having a wall 51 at a rear end as shown in FIG.
【００１６】このジャケット５０は、前記外管４０の外
周囲に位置し、該外管４０の外面との間に冷却媒体であ
る冷却水の流通空間５２を画成している。そして、壁５
１の中央部に冷却液の導入口５３を設けるとともに、前
端部に位置した周壁に冷却水の流出口５４を設けてあ
る。The jacket 50 is located around the outer tube 40 and defines a space 52 for flowing cooling water as a cooling medium between the jacket 50 and the outer surface of the outer tube 40. And wall 5
A cooling liquid introduction port 53 is provided at the center of the cooling water supply device 1 and a cooling water outlet 54 is provided on a peripheral wall located at a front end.
【００１７】図６および同図のＣ−Ｃ断面図である図７
に示すように、上記ヒータ挿入管３０内にはランプヒー
タの１つであるハロゲンランプ６０が加熱源として挿入
されている。FIG. 6 and FIG. 7 which is a sectional view taken along the line C--C in FIG.
As shown in FIG. 1, a halogen lamp 60, which is one of lamp heaters, is inserted into the heater insertion tube 30 as a heating source.
【００１８】上記ハロゲンランプ６０は、隣接させた一
対の透明石英ガラス管６１と、これらのガラス管６１内
にそれぞれ配したフィラメント６２、各ガラス管６１の
一端部相互を連結するセラミックべース６３と、各ガラ
ス管６１の他端部相互を連結するセラミックべース６４
とを備えている。The halogen lamp 60 includes a pair of adjacent transparent quartz glass tubes 61, a filament 62 disposed in each of these glass tubes 61, and a ceramic base 63 connecting one end of each glass tube 61 to each other. And a ceramic base 64 connecting the other ends of the glass tubes 61 to each other.
And
【００１９】セラミックべース６３においては、上記各
フィラメント６２の端部相互が接続され、また、セラミ
ックべース６４からは、上記各フィラメント６２の他端
にそれぞれ接続されたリード線６５が導出されている。
つまり、このハロゲンランプ６０は、一端側から給電す
るシングルエンド構造を有する。In the ceramic base 63, the ends of the filaments 62 are connected to each other, and from the ceramic base 64, lead wires 65 connected to the other ends of the filaments 62 are led out. Have been.
That is, the halogen lamp 60 has a single-ended structure in which power is supplied from one end.
【００２０】上記石英ガラス管６１内には、ハロゲンガ
スが封入されている。したがって、上記各リード線６５
間に所定の電圧を印加すれば、いわゆるハロゲンサイク
ル作用によって長期間、安定に各フィラメント６２が発
光および発熱する。The quartz glass tube 61 is filled with a halogen gas. Therefore, each of the lead wires 65
If a predetermined voltage is applied in between, each filament 62 emits light and generates heat stably for a long period of time by the so-called halogen cycle action.
【００２１】ヒータ挿入管３０は、前端が開口するとと
もに、後端が外管４０の壁４２によって閉止されてい
る。したがって、ハロゲンランプ６０はヒータ挿入管３
０の前端から挿入され、そのセラミックべース６３が管
３０の閉止端に当接した段階でその挿入が終了する。こ
のハロゲンランプ６０には、例えば、３ＫＷのものが使
用される。The heater insertion tube 30 has a front end opened and a rear end closed by a wall 42 of the outer tube 40. Therefore, the halogen lamp 60 is connected to the heater insertion tube 3.
When the ceramic base 63 is brought into contact with the closed end of the tube 30, the insertion is completed. As the halogen lamp 60, for example, a 3KW lamp is used.
【００２２】図１に示すように、ジャケット５０は、そ
の前端に設けた外フランジ部５０ａがＯリング７０を介
して上記壁４１の周縁部４１ａに当接している。また、
外管４０の壁４１の前面には、断熱材８０およびＳＵＳ
製のプレート８１が重合配設されている図１に示すよう
に、外管４０の流入口４４と流出口４５間には、ポンプ
９０、薬液の貯槽９１およびフィルタ９２が介在され、
また、ジャケット５０の流入口５３は、電磁弁９３を介
して図示していない冷却水の供給源（例えば、水道）に
接続され、流出口５４は図示していない排水設備に接続
されている。As shown in FIG. 1, an outer flange portion 50a provided at the front end of the jacket 50 is in contact with a peripheral portion 41a of the wall 41 via an O-ring 70. Also,
On the front surface of the wall 41 of the outer tube 40, a heat insulating material 80 and SUS
As shown in FIG. 1, in which a plate 81 made of a polymer is disposed in an overlapping manner, a pump 90, a storage tank 91 for a chemical solution, and a filter 92 are interposed between the inlet 44 and the outlet 45 of the outer tube 40.
The inlet 53 of the jacket 50 is connected to a supply source (not shown) of cooling water (not shown) via an electromagnetic valve 93, and the outlet 54 is connected to a drainage unit not shown.
【００２３】貯槽９１内の薬液は、ポンプ９０の運転に
伴って、外管４０の流入口４４、図４の空間部４３ａ、
前記隔壁４６の穴４６ａおよび空間部４３ｂを通って外
管４０の流出口４５から流出し、その後、フィルタ９２
を通過して貯槽９１に戻される。The chemical in the storage tank 91 is supplied to the inlet 44 of the outer tube 40, the space 43a in FIG.
After flowing out of the outlet 45 of the outer tube 40 through the hole 46a and the space 43b of the partition wall 46, the filter 92
And is returned to the storage tank 91.
【００２４】一方、冷却水供給源から供給される冷却水
は、電磁弁９３、前記流入口５３および空間５２を通っ
て流出口５４から排出される。そして、上記空間５２を
流通する間に、外管４０内を流通する薬液を冷却する。On the other hand, the cooling water supplied from the cooling water supply source is discharged from the outlet 54 through the solenoid valve 93, the inlet 53 and the space 52. Then, while flowing through the space 52, the chemical liquid flowing through the outer tube 40 is cooled.
【００２５】貯槽９１には、温度センサ９４が設けられ
ているが、この温度センサ９４は、該貯槽９１内の薬液
の実際の温度を検出して、その検出信号をコントローラ
９５に加える。The storage tank 91 is provided with a temperature sensor 94. The temperature sensor 94 detects the actual temperature of the chemical solution in the storage tank 91, and applies a detection signal to the controller 95.
【００２６】そこで、コントローラ９５は、予設定され
た目標温度と上記薬液の実際の温度との偏差に基づき、
この偏差がなくなるように、つまり、貯槽９１内の薬液
の温度が上記目標温度が維持されるように、ハロゲンラ
ンプ６０への供給電力を制御する。Then, the controller 95 calculates the deviation between the preset target temperature and the actual temperature of the chemical solution,
The power supplied to the halogen lamp 60 is controlled so that the deviation is eliminated, that is, the temperature of the chemical in the storage tank 91 is maintained at the target temperature.
【００２７】すなわち、例えば、上記目標温度が４０℃
で、貯槽９１内の薬液が入れ替え等のために２０℃程度
まで低下したとすると、この場合、ハロゲンランプ６０
に加熱用の電力が供給されるので、前記加熱冷却装置１
０の流通空間４３を通過する薬液が加熱され、その結
果、貯槽９１内の薬液の温度が上記目標温度に向かって
速やかに上昇する。That is, for example, the target temperature is 40 ° C.
If the temperature of the chemical in the storage tank 91 drops to about 20 ° C. due to replacement or the like, in this case, the halogen lamp 60
Heating power is supplied to the heating and cooling device 1
The chemical solution passing through the zero circulation space 43 is heated, and as a result, the temperature of the chemical solution in the storage tank 91 rapidly rises toward the target temperature.
【００２８】上記供給電力は、薬液の温度が何等かの要
因で上記目標温度よりも上昇した場合に減少されるが、
もし、上記冷却水による薬液の冷却を行わない場合に
は、薬液の温度が目標温度まで降下するのにかなりの時
間を要することになる。The supply power is reduced when the temperature of the chemical solution rises above the target temperature for some reason.
If the chemical is not cooled by the cooling water, it takes a considerable time for the temperature of the chemical to drop to the target temperature.
【００２９】なぜなら、上記薬液の温度が室温に近い４
０℃程度の場合、該薬液の自然な熱放散が少ないことか
ら、ハロゲンランプ６０への供給電力を減少させても、
薬液の温度が速やかに低下しないからである。The reason is that the temperature of the chemical solution is close to room temperature.
In the case of about 0 ° C., since the natural heat dissipation of the chemical solution is small, even if the power supplied to the halogen lamp 60 is reduced,
This is because the temperature of the chemical does not drop quickly.
【００３０】しかし、薬液の冷却機能も有した上記加熱
冷却装置１０によれば、上記供給電力の減少に伴って薬
液の温度が目標温度まで速やかに降下される。つまり、
上記加熱冷却装置１０によれば、温度制御の応答性を高
めることができる。However, according to the heating / cooling device 10 also having a function of cooling the chemical, the temperature of the chemical is rapidly lowered to the target temperature as the power supplied decreases. That is,
According to the heating and cooling device 10, the responsiveness of the temperature control can be improved.
【００３１】なお、上記薬液が半導体製造プロセスで使
用される洗浄液である場合、サブミクロンのパーティク
ルを除去するために、この洗浄液にメガソニック帯域の
超音波を併用することがあるが、この場合、超音波エネ
ルギーが薬液中で消費されるので、この超音波の照射前
における薬液の温度が４０℃であるとすると、この薬液
の温度が４０℃よりも上昇することになる。つまり、上
記超音波の使用は、薬液の温度を上昇させる要因の１つ
になる。When the above-mentioned chemical is a cleaning liquid used in a semiconductor manufacturing process, megasonic band ultrasonic waves may be used in combination with the cleaning liquid in order to remove submicron particles. Since the ultrasonic energy is consumed in the chemical, if the temperature of the chemical before irradiation with the ultrasonic waves is 40 ° C., the temperature of the chemical will rise above 40 ° C. In other words, the use of the ultrasonic waves is one of the factors for increasing the temperature of the chemical solution.
【００３２】ところで、上記冷却水の流通空間５２に
は、図６に示すように、ヒータ挿入管３０の閉止端が露
呈しており、したがって、この閉止端側に位置したハロ
ゲンランプ６０の端部は、上記流通空間５２を通過する
冷却水によって冷却される。As shown in FIG. 6, a closed end of the heater insertion tube 30 is exposed in the cooling water flow space 52. Therefore, the end of the halogen lamp 60 located on the closed end side is exposed. Is cooled by the cooling water passing through the flow space 52.
【００３３】周知のように、ハロゲンランプ６０の寿命
を決定する要因には、フィラメントの溶断の他に、シー
ル部６６の故障がある。シール部には、モリブデン箔が
封入されているが、このモリブデン箔は高温下で酸化し
易いという性質を持つので、その温度を３５０℃以下に
することが望ましい。As is well known, factors that determine the life of the halogen lamp 60 include a failure of the sealing portion 66 in addition to the fusing of the filament. A molybdenum foil is sealed in the seal portion. Since the molybdenum foil has a property of being easily oxidized at a high temperature, the temperature is desirably 350 ° C. or less.
【００３４】上記のように薬液を冷却するための冷却水
を利用してハロゲンランプ６０の端部を冷却する上記装
置１０によれば、この端部に位置したシール部６６が冷
却されるので、専用の冷却手段を設けることなく上記モ
リブデン箔の酸化を可及的に抑制すること、つまり、ハ
ロゲンランプ６０の寿命を延ばすことができる。According to the apparatus 10 for cooling the end of the halogen lamp 60 using the cooling water for cooling the chemical as described above, the seal 66 located at this end is cooled. Oxidation of the molybdenum foil can be suppressed as much as possible without providing a dedicated cooling means, that is, the life of the halogen lamp 60 can be extended.
【００３５】なお、リード線６５が導出された側のハロ
ゲンランプ６０の端部にもシール部６６が存在するが、
このシール部６６は、セラミックベース６４およびリー
ド線６５を介して放熱されるので、実用上、強制冷却し
なくても良い。A seal 66 is also provided at the end of the halogen lamp 60 on the side from which the lead wire 65 is led out.
Since the heat is radiated from the seal portion 66 through the ceramic base 64 and the lead wire 65, it is not necessary to perform forced cooling in practical use.
【００３６】しかし、ハロゲンランプ６０の寿命をより
延ばすためには、リード線６５が導出された側のシール
部６６を冷却することも有利であり、その場合、前記冷
却水の流通空間５２を該シール部６６の近傍まで延長す
れば良い。However, in order to further extend the life of the halogen lamp 60, it is also advantageous to cool the seal portion 66 on the side from which the lead wire 65 has been led out. What is necessary is just to extend to the vicinity of the seal part 66.
【００３７】図８は、内周面に螺旋状のガイド板５５を
突設したジャケット５０を示している。このガイド板５
５を備えたジャケット５０によって図１に示した外管４
０を覆えば、上記流通空間５２において外管４０の外周
面をガイド板５５が周回することになる。したがって、
前記冷却水の流入口５３から流入した冷却水は、ガイド
板５５で形成された螺旋状通路を通過し、その結果、外
管４０の外周囲に満遍なく冷却水が流通して冷却効率が
向上する。FIG. 8 shows a jacket 50 having a spiral guide plate 55 projecting from the inner peripheral surface. This guide plate 5
The outer tube 4 shown in FIG.
If 0 is covered, the guide plate 55 goes around the outer peripheral surface of the outer tube 40 in the flow space 52. Therefore,
The cooling water flowing from the cooling water inlet 53 passes through the spiral passage formed by the guide plate 55, and as a result, the cooling water flows evenly around the outer pipe 40, thereby improving the cooling efficiency. .
【００３８】図１に示す実施形態においては、外管４０
の壁４１の周縁部４１ａとジャケット５０のフランジ部
５０ａ間をＯリング７０によってシールしているが、図
９に示す実施形態では、上記周縁部４１ａとフランジ部
５０ａ間に管用シール材７１を介在させ、かつ、フラン
ジ部５０ａとプレート８０間にスペーサ７２を介在させ
てある。In the embodiment shown in FIG.
9 is sealed by an O-ring 70 between the peripheral portion 41a of the wall 41 and the flange portion 50a of the jacket 50. In the embodiment shown in FIG. 9, a pipe sealing material 71 is interposed between the peripheral portion 41a and the flange portion 50a. In addition, a spacer 72 is interposed between the flange portion 50a and the plate 80.
【００３９】上記のような態様で外管４０とジャケット
５０を接合すれば、外管４０の熱膨張の影響を受けな
い。また、互いに機械的強度の異なる上記周縁部４１ａ
とフランジ部５０ａが直接接触しないので、両者の締着
時に上記周縁部４１ａが破損する虞れもなくなる。If the outer tube 40 and the jacket 50 are joined in the manner described above, the outer tube 40 is not affected by the thermal expansion. Further, the peripheral portions 41a having different mechanical strengths from each other.
And the flange portion 50a do not directly contact with each other, so that there is no possibility that the peripheral portion 41a is damaged when the two are fastened.
【００４０】なお、半導体製造プロセスで使用される上
記薬液としては、前記ＲＣＡ洗浄に用いられるアンモニ
ア過水、塩酸過水、窒化膜除去液であるリン酸、レジス
ト剥離液である硫酸過水等がある。しかし、上記装置
は、メッキ処理液等の他の分野での処理液の加熱冷却に
も適用可能である。The chemicals used in the semiconductor manufacturing process include ammonia-hydrogen peroxide, hydrochloric acid-hydrogen peroxide, phosphoric acid as a nitride film removing liquid, and sulfuric acid-hydrogen peroxide as a resist stripping liquid used in the RCA cleaning. is there. However, the above apparatus is also applicable to heating and cooling of a processing liquid in other fields such as a plating processing liquid.
【００４１】[0041]
【発明の効果】本発明によれば、流体を加熱および冷却
することができるので、流体の温度を室温に近い温度に
設定する場合に適用して好適である。また、被加熱冷却
流体を冷却するための冷却媒体を利用して加熱源である
管状のランプヒータの端部を冷却しているので、専用の
冷却手段を用いることなく、上記端部の温度上昇を抑制
してランプヒータの寿命を延ばすことができる。According to the present invention, since the fluid can be heated and cooled, it is suitably applied to a case where the temperature of the fluid is set to a temperature close to room temperature. In addition, since the end of the tubular lamp heater, which is a heating source, is cooled using a cooling medium for cooling the cooling fluid to be heated, the temperature of the end rises without using a dedicated cooling means. And the life of the lamp heater can be extended.
【図１】本発明の一実施形態を示した縦断面図。FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention.
【図２】図１のＡ矢視図。FIG. 2 is a view taken in the direction of arrow A in FIG. 1;
【図３】図１のＢ矢視図。FIG. 3 is a view taken in the direction of arrow B in FIG. 1;
【図４】外管の構造を示す部分破断斜視図。FIG. 4 is a partially broken perspective view showing the structure of an outer tube.
【図５】ジャケット、外管およびヒータ挿入管の位置関
係を示す破断斜視図。FIG. 5 is a cutaway perspective view showing a positional relationship among a jacket, an outer tube, and a heater insertion tube.
【図６】ハロゲンランプの構造の一例を示す断面図。FIG. 6 is a cross-sectional view illustrating an example of the structure of a halogen lamp.
【図７】図６のＣ−Ｃ断面図。FIG. 7 is a sectional view taken along line CC of FIG. 6;
【図８】ジャケットの他の構成例を示す斜視図。FIG. 8 is a perspective view showing another configuration example of the jacket.
【図９】ジャケットと外管の他の接合構造を示す縦断面
図。FIG. 9 is a longitudinal sectional view showing another joining structure of the jacket and the outer tube.
１０ 加熱冷却装置 ２０ ケーシング ３０ ヒータ挿入管 ４０ 外管 ４４ 流入口 ４５ 流出口 ４６ 隔壁 ５０ ジャケット ５３ 流入口 ５４ 流出口 ５５ ガイド板 ６０ ハロゲンランプ DESCRIPTION OF SYMBOLS 10 Heating / cooling device 20 Casing 30 Heater insertion pipe 40 Outer pipe 44 Inflow port 45 Outflow port 46 Partition wall 50 Jacket 53 Inflow port 54 Outflow port 55 Guide plate 60 Halogen lamp
Claims (3)
周面との間に被加熱冷却流体の流通空間を画成する外管
と、 前記外管の外周囲に配設され、該外管の外面との間に少
なくとも前記ヒータ挿入管の閉止端が内部に露呈する態
様で冷却媒体の流通空間を画成するジャケットと、 シングルエンド構造を有し、加熱源として前記ヒータ挿
入管に挿入される管状のランプヒータと、 を備え、前記外管に前記被加熱冷却流体の流入口および
流出口を設けると共に、前記ジャケットに前記冷却媒体
の流入口および流出口を設けたことを特徴とする流体加
熱冷却装置。A heater insertion pipe having one end closed; an outer pipe through which the heater insertion pipe penetrates and defining a flow space for a cooling fluid to be heated between the heater insertion pipe and an outer peripheral surface of the heater insertion pipe; A jacket disposed around the outer tube of the outer tube and defining a cooling medium flow space between the outer tube and an outer surface of the outer tube, wherein at least a closed end of the heater insertion tube is exposed inside; A tubular lamp heater which is inserted into the heater insertion tube as a heating source, wherein an inlet and an outlet for the cooling fluid to be heated are provided in the outer tube, and the cooling medium is provided in the jacket. A fluid heating / cooling device provided with an inflow port and an outflow port.
空間において前記外管の外周面を周回する螺旋状のガイ
ド板を備え、このガイド板によって前記冷却媒体をガイ
ドするようにした請求項１に記載の流体加熱冷却装置。2. The cooling device according to claim 1, wherein the jacket includes a spiral guide plate orbiting the outer peripheral surface of the outer tube in a flow space of the cooling medium, and the cooling medium is guided by the guide plate. A fluid heating / cooling apparatus according to claim 1.
り、前記ヒータ挿入管は透明の石英ガラスからなる請求
項１に記載の流体加熱冷却装置。3. The fluid heating / cooling apparatus according to claim 1, wherein the lamp heater is a halogen lamp, and the heater insertion tube is made of transparent quartz glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08283297A JP3912840B2 (en) | 1997-04-01 | 1997-04-01 | Fluid heating and cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08283297A JP3912840B2 (en) | 1997-04-01 | 1997-04-01 | Fluid heating and cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10281583A true JPH10281583A (en) | 1998-10-23 |
| JP3912840B2 JP3912840B2 (en) | 2007-05-09 |
Family
ID=13785389
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08283297A Expired - Fee Related JP3912840B2 (en) | 1997-04-01 | 1997-04-01 | Fluid heating and cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3912840B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101255328B1 (en) * | 2012-03-13 | 2013-04-16 | 피셈주식회사 | Chemical temperature controlling apparatus for treating substrate |
| JP2014090078A (en) * | 2012-10-30 | 2014-05-15 | Tokyo Electron Ltd | Fluid heating device, method of controlling operation thereof, substrate processing system having fluid heating device and storage medium |
| JP2018179461A (en) * | 2017-04-20 | 2018-11-15 | 国立研究開発法人日本原子力研究開発機構 | Heat exchanger |
| US20210112628A1 (en) * | 2018-04-04 | 2021-04-15 | Kelk Ltd. | Fluid heating device |
| CN116364609A (en) * | 2023-04-18 | 2023-06-30 | 冠礼控制科技（上海）有限公司 | Suction device for semiconductor chemical solution |
-
1997
- 1997-04-01 JP JP08283297A patent/JP3912840B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101255328B1 (en) * | 2012-03-13 | 2013-04-16 | 피셈주식회사 | Chemical temperature controlling apparatus for treating substrate |
| JP2014090078A (en) * | 2012-10-30 | 2014-05-15 | Tokyo Electron Ltd | Fluid heating device, method of controlling operation thereof, substrate processing system having fluid heating device and storage medium |
| JP2018179461A (en) * | 2017-04-20 | 2018-11-15 | 国立研究開発法人日本原子力研究開発機構 | Heat exchanger |
| US20210112628A1 (en) * | 2018-04-04 | 2021-04-15 | Kelk Ltd. | Fluid heating device |
| US11985736B2 (en) * | 2018-04-04 | 2024-05-14 | Kelk Ltd. | Fluid heating device |
| CN116364609A (en) * | 2023-04-18 | 2023-06-30 | 冠礼控制科技（上海）有限公司 | Suction device for semiconductor chemical solution |
| CN116364609B (en) * | 2023-04-18 | 2024-03-22 | 冠礼控制科技（上海）有限公司 | Suction device for semiconductor chemical solution |
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| Publication number | Publication date |
|---|---|
| JP3912840B2 (en) | 2007-05-09 |
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