JPH1026833A - Tacky adhesive tape for removing resist, and method for removing resist - Google Patents
Tacky adhesive tape for removing resist, and method for removing resistInfo
- Publication number
- JPH1026833A JPH1026833A JP18188596A JP18188596A JPH1026833A JP H1026833 A JPH1026833 A JP H1026833A JP 18188596 A JP18188596 A JP 18188596A JP 18188596 A JP18188596 A JP 18188596A JP H1026833 A JPH1026833 A JP H1026833A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- sensitive adhesive
- resist
- adhesive tape
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Liquid Crystal (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体、液晶表示
パネルなどの精密電子部品の製造プロセスに適用され
る、レジスト除去用粘着テ―プとレジスト除去方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive tape for removing a resist and a method for removing the resist, which are applied to a manufacturing process of precision electronic parts such as a semiconductor and a liquid crystal display panel.
【０００２】[0002]
【従来の技術】ＬＳＩの高密度化、高集積化、また液晶
表示パネルの高密度化、大画面化が進むにつれ、半導体
ウエハやガラス基板に存在するレジストをいかに完全に
かつ効率的に除去するかが製品の歩留り、信頼性に影響
する。たとえば、半導体ウエハでは、回路パタ―ンの形
成時、成膜、レジスト塗布、露光、現像、エツチング、
レジスト除去、洗浄などの工程が繰り返される。回路パ
タ―ン面に存在する残存レジストは、つぎの回路形成時
に回路の断線やシヨ―トの原因となる。2. Description of the Related Art As LSI densities and integrations increase and liquid crystal display panels increase in density and screen size, resist existing on semiconductor wafers and glass substrates is completely and efficiently removed. Affects the product yield and reliability. For example, in the case of a semiconductor wafer, when forming a circuit pattern, film formation, resist coating, exposure, development, etching,
Steps such as resist removal and cleaning are repeated. The remaining resist existing on the circuit pattern surface causes a disconnection or a short circuit in the next circuit formation.
【０００３】このため、ＬＳＩの製造工程では、製造工
程内の清浄度のアツプ、レジスト除去技術、ウエハ洗浄
技術のレベルアツプに努めており、さまざまな技術が提
案され、実施されてきた。とくに、レジスト除去工程
は、ウエハ洗浄工程とともに、製品の歩留り、信頼性の
アツプのキ―ポイントである。これと同様のことが、液
晶表示パネルの製造工程やその他の精密電子部品の製造
工程など、主にフオトフアブリケ―シヨンに係わる分野
に言える。For this reason, in the LSI manufacturing process, efforts are being made to increase the level of cleanliness in the manufacturing process, resist removal technology, and wafer cleaning technology, and various technologies have been proposed and implemented. In particular, the resist removal step, together with the wafer cleaning step, is a key point for improving product yield and reliability. The same can be said for fields mainly related to photofabrication, such as a process for manufacturing a liquid crystal display panel and a process for manufacturing other precision electronic components.
【０００４】しかしながら、最近の技術開発に伴い、従
来の製造工程でのレジスト除去技術の問題点が顕在化し
ている。すなわち、レジスト除去工程では、ドライ洗浄
であるアツシヤ―（灰化処理装置）やレジスト除去液
（溶剤）を用いたウエツト洗浄による除去方式が一般的
であるが、アツシヤ―（ＵＶオゾン、Ｏ2 プラズマなど
による）を用いると、長時間を要したり、レジスト材中
の不純物イオンがウエハ表面に残存し、その後のイオン
注入工程でこの不純物がウエハ内部に注入されるおそれ
があつた。また、レジスト除去液を用いると、作業環境
を害したり、廃液の問題を生ずることもあり、さらにウ
エハから除去されたレジストのウエハへの再付着、乾燥
工程でのウエハ汚染の問題があつた。However, with the recent technical development, the problem of the resist removal technique in the conventional manufacturing process has become apparent. That is, in the resist removal process, a removal method by wet cleaning using an asher (ashing apparatus) which is dry cleaning or a resist removing liquid (solvent) is generally used, but the asher (UV ozone, O 2 plasma) is used. However, there is a risk that it takes a long time or that impurity ions in the resist material remain on the wafer surface, and that the impurities are implanted into the wafer in a subsequent ion implantation step. In addition, when a resist removing liquid is used, the working environment may be harmed, a problem of waste liquid may occur, and the resist removed from the wafer may be reattached to the wafer, and the wafer may be contaminated in a drying process.
【０００５】これらの問題点を解決するため、粘着テ―
プによるレジスト除去方法が提案されている。これは、
レジストが存在する物品上に支持フイルムと粘着剤層と
からなる粘着テ―プを貼り付け、レジストを粘着剤層面
に固着し一体化させたのち、剥離して、レジストを物品
上から除去するものである。この粘着テ―プによるレジ
スト除去方式には、アツシヤ―やレジスト除去液を用い
た従来方式のような問題点がなく、結果として、製品の
歩留りが向上する。In order to solve these problems, an adhesive tape is used.
There has been proposed a method of removing resist by using a mask. this is,
Adhesive tape consisting of a support film and an adhesive layer is stuck on the article where the resist is present, the resist is fixed to the adhesive layer surface and integrated, then peeled off and the resist is removed from the article It is. The resist removing method using the adhesive tape does not have the problems as in the conventional method using an ashes and a resist removing solution, and as a result, the product yield is improved.
【０００６】[0006]
【発明が解決しようとする課題】しかるに、粘着テ―プ
は、粘着剤層の保護のため、また取り扱い性を良くする
ため、通常、粘着剤層面にセパレ―タを貼り合わせるよ
うにしており、このセパレ―タには、剥離性などの面か
ら、ポリエステルフイルムなどにシリコ―ン、ワツクス
などで離型処理したものが多く使われている。However, in order to protect the pressure-sensitive adhesive layer and to improve the handleability, a pressure-sensitive adhesive tape is usually attached with a separator on the surface of the pressure-sensitive adhesive layer. For this separator, a polyester film or the like which has been release-treated with silicone, wax, or the like is often used in terms of releasability and the like.
【０００７】ところが、レジスト除去時上記のセパレ―
タを引き剥がしたときに、シリコ―ン、ワツクスなどの
離型処理剤が粘着剤層に移行、転写し、この粘着テ―プ
を半導体ウエハやガラス基板などの物品上に適用して、
物品上のレジストを固着除去しようとすると、上記の移
行、転写した離型処理剤が粘着剤層とレジストとの密着
性を妨げ、レジスト除去性を低下させる問題があつた。
また、上記の移行、転写した離型処理剤が物品上のレジ
ストが存在しない部分に付着して、この物品を汚染させ
るという問題もあり、これらのことが原因で製品の歩留
り、信頼性にいまひとつ劣るという難点があつた。However, when removing the resist, the above separation
When the tape is peeled off, a release agent such as silicone or wax is transferred to the adhesive layer and transferred, and the adhesive tape is applied to an article such as a semiconductor wafer or a glass substrate.
If the resist on the article is to be fixedly removed, the above-mentioned transferred and transferred release agent interferes with the adhesiveness between the pressure-sensitive adhesive layer and the resist, thereby deteriorating the resist removability.
In addition, there is also a problem that the transferred and transferred mold release agent adheres to a portion of the article where no resist is present, thereby contaminating the article, and these factors further reduce product yield and reliability. The disadvantage was that it was inferior.
【０００８】本発明は、上記の事情に照らし、半導体、
液晶表示パネルなどの精密電子部品の製造プロセスにお
けるレジスト除去工程において、これに適用する粘着テ
―プのセパレ―タに改良を加えて、セパレ―タに起因し
たレジスト除去性の低下の問題や物品の汚染といつた問
題を回避し、もつて精密電子部品からなる製品の歩留り
や信頼性を改善することを目的としている。[0008] In the light of the above circumstances, the present invention provides a semiconductor,
In the resist removal process in the manufacturing process of precision electronic components such as liquid crystal display panels, the adhesive tape separator used in this process was improved to reduce the resist removability caused by the separator and to improve the quality of the product. The purpose of the present invention is to avoid the problem of contamination and improve the yield and reliability of products made of precision electronic components.
【０００９】[0009]
【課題を解決するための手段】本発明者らは、上記の目
的に対して、鋭意検討した結果、レジスト除去用粘着テ
―プにおける粘着剤層面を保護するセパレ―タとして、
特定構成の粘着剤表面保護フイルムを用いたときに、こ
のフイルムに起因したレジスト除去性の低下や物品の汚
染といつた問題が回避され、これにより製品の歩留りや
信頼性が向上することを見い出し、本発明を完成する至
つた。Means for Solving the Problems The inventors of the present invention have conducted intensive studies on the above objects, and as a result, as a separator for protecting the surface of the pressure-sensitive adhesive layer in the pressure-sensitive adhesive tape for resist removal,
It was found that when a pressure-sensitive adhesive surface protective film of a specific composition was used, problems such as deterioration of resist removal properties and contamination of articles caused by this film were avoided, thereby improving product yield and reliability. Thus, the present invention has been completed.
【００１０】すなわち、本発明は、支持フイルム上に粘
着剤層を有し、この上にポリオレフイン系樹脂からなる
粘着剤表面保護フイルムがセパレ―タとして貼り合わさ
れていることを特徴とするレジスト除去用粘着テ―プ
（請求項１）と、半導体ウエハ、液晶表示パネルなどの
精密電子部品の製造プロセスにおけるレジストが存在す
る物品上に、上記構成のレジスト除去用粘着テ―プを粘
着剤表面保護フイルムを引き剥がして貼り付けたのち、
これを剥離することにより、上記レジストを上記粘着テ
―プの粘着剤層面に固着して除去することを特徴とする
レジスト除去方法（請求項８）に係るものである。That is, the present invention provides a method for removing a resist, comprising a pressure-sensitive adhesive layer on a supporting film, and a pressure-sensitive adhesive surface protective film made of a polyolefin resin adhered thereon as a separator. An adhesive tape (claim 1) and an adhesive tape for removing a resist having the above-described structure are placed on an article having a resist in a manufacturing process of a precision electronic component such as a semiconductor wafer or a liquid crystal display panel. After peeling off and pasting,
The resist removing method according to the present invention is characterized in that the resist is fixed to the surface of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive tape to remove the resist.
【００１１】さらに、本発明では、上記のレジスト除去
用粘着テ―プにおいて、粘着剤表面保護フイルムとし
て、臨界表面張力が３３dyne／cm以下である構成（請求
項２）、粘着剤表面に対する剥離力（ＪＩＳ Ｚ０２３
７，Ｚ１５２９に準ずる）が５〜１，０００ｇ／５０mm
幅である構成（請求項３）、フイルム中に含まれる熱劣
化防止剤と滑剤の合計量がポリオレフイン系樹脂１００
重量部あたり０．０１〜１重量部である構成（請求項
４）、ポリオレフイン系樹脂の熱変形温度（ＪＩＳＫ７
２０７に準ずる、荷重４．６Kgf ／cm2 ）が８０℃以上
である構成（請求項５）、帯電防止性能を有し、表面抵
抗率（ＡＳＴＭ Ｄ２５７に準ずる）が１×１０12Ω／
□以下である構成（請求項６）、平均表面粗さ〔Ｒａ〕
が２μｍ以下である構成（請求項７）を、好ましい態様
としている。Further, in the present invention, the pressure-sensitive adhesive tape for resist removal has a critical surface tension of 33 dyne / cm or less as the pressure-sensitive adhesive surface protection film, and a peeling force against the pressure-sensitive adhesive surface. (JIS Z023
7, Z1529) is 5 to 1,000 g / 50 mm
The width of the film (Claim 3), and the total amount of the thermal deterioration inhibitor and the lubricant contained in the film is 100%.
The composition is 0.01 to 1 part by weight per part by weight (Claim 4), and the heat distortion temperature of the polyolefin resin (JISK7)
207, a load of 4.6 kgf / cm 2 ) of 80 ° C. or more (Claim 5), antistatic performance, and a surface resistivity (according to ASTM D257) of 1 × 10 12 Ω /.
□ The following structure (Claim 6), average surface roughness [Ra]
Is 2 μm or less (claim 7) is a preferred embodiment.
【００１２】[0012]
【発明の実施の形態】図１は、本発明のレジスト除去用
粘着テ―プの一例を示したものである。１は粘着テ―プ
で、支持フイルム１１上に粘着剤層１２を設け、この上
にセパレ―タ１３を貼り合わせた構成となつている。FIG. 1 shows an example of an adhesive tape for removing a resist according to the present invention. Reference numeral 1 denotes an adhesive tape having an adhesive layer 12 provided on a support film 11 and a separator 13 attached thereto.
【００１３】支持フイルム１１は、ポリエステル、ポリ
カ―ボネ―ト、ポリエチレン、ポリプロピレン、エチレ
ン−プロピレン共重合体、エチレン−酢酸ビニル共重合
体、エチレン−エチルアクリレ―ト共重合体などのプラ
スチツクからなる厚さが１０〜１，０００μｍのフイル
ムが用いられる。The support film 11 has a thickness of a plastic such as polyester, polycarbonate, polyethylene, polypropylene, ethylene-propylene copolymer, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer and the like. However, a film having a thickness of 10 to 1,000 μm is used.
【００１４】粘着剤層１２は、アクリル樹脂、シリコ―
ン樹脂、フツ素樹脂、ゴム（天然ゴム、合成ゴム）など
の各種のポリマ―を主成分とした、常態下で粘着力、つ
まり感圧接着性を有するものであればよい。粘着剤層１
２の厚さは、適宜に決定してよいが、一般には５〜１０
０μｍとされる。The pressure-sensitive adhesive layer 12 is made of acrylic resin, silicone,
Any material may be used as long as it has an adhesive force under normal conditions, that is, a pressure-sensitive adhesiveness, which contains various polymers such as resin, fluorine resin, and rubber (natural rubber, synthetic rubber) as main components. Adhesive layer 1
The thickness of 2 may be appropriately determined, but is generally 5 to 10
0 μm.
【００１５】本発明では、粘着テ―プをレジストが存在
する物品上に貼り付け、レジストを粘着剤層面に固着し
たのち、このテ―プを剥離することで、レジストを除去
することを基本とする。したがつて、用いる粘着剤は、
貼り付け・レジスト固着時と、剥離時とに、それぞ
れ適した特性を有していることが望まれる。しかし、
ととで要求される特性は通常相反し、の段階では、
粘着剤はレジスト形状に馴染むように塑性変形しやす
く、かつ高粘着力であることが望まれ、一方、の段階
では、レジストを確実に固定するため粘着剤は硬く強靱
であり、かつレジストが存在する以外の部分に対し低粘
着力であることが望まれる。In the present invention, the adhesive tape is adhered on the article having the resist, the resist is fixed on the surface of the adhesive layer, and then the tape is peeled off to remove the resist. I do. Therefore, the adhesive used is
It is desired that the adhesive has appropriate characteristics at the time of attaching and fixing the resist and at the time of peeling. But,
The characteristics required by and are usually contradictory, and at the stage,
It is desirable that the adhesive be easily plastically deformed to conform to the resist shape and have high adhesive strength.On the other hand, at the stage, the adhesive is hard and tough to securely fix the resist, and the resist is present. It is desired that the adhesive has low adhesive strength to portions other than the portions to be formed.
【００１６】これを実現させるには、，の両段階で
バランスよく適合できるような特性を持つた粘着剤を選
択使用するのがよく、これには特性が比較的安定してい
るアクリル系樹脂を主成分とした粘着剤が好ましく用い
られる。この粘着剤の粘着力（対シリコンウエハ粘着
力、ＪＩＳ Ｚ−０２３７に準ずる）としては、通常、
１０〜５００ｇ／１０mm幅であるのがよい。In order to realize this, it is preferable to select and use a pressure-sensitive adhesive having characteristics such that it can be well-balanced in both stages. For this purpose, an acrylic resin having relatively stable characteristics is used. An adhesive containing a main component is preferably used. The adhesive strength of this adhesive (adhesive strength to silicon wafer, according to JIS Z-0237) is usually
The width is preferably 10 to 500 g / 10 mm.
【００１７】また、上記実現のため、，の両段階で
適合できるように両段階で特性が変化する粘着剤を選択
使用するのも好ましく、これには活性エネルギ―源の供
給により特性が変化する粘着剤が用いられる。活性エネ
ルギ―源としては、紫外線、赤外線（熱）、電子線、エ
ツクス線などに代表される電磁波、超音波などに代表さ
れる弾性波などがある。活性エネルギ―源の供給により
特性が変化する粘着剤としては、紫外線硬化性粘着剤、
電子線硬化性粘着剤、熱硬化性粘着剤、熱可塑性粘着剤
などがあり、それぞれを単独で用いても複数の粘着剤を
同時に用いてもよい。この粘着剤の前記同様の粘着力
は、活性エネルギ―源供給前（の段階）で３００〜
１，０００ｇ／１０mm幅、活性エネルギ―源供給後（
の段階）で１〜３００ｇ／１０mm幅であるのがよい。In order to realize the above, it is preferable to select and use an adhesive whose properties change in both steps so as to be compatible in both steps. In this case, the properties change by the supply of an active energy source. An adhesive is used. Examples of the active energy source include an electromagnetic wave represented by an ultraviolet ray, an infrared ray (heat), an electron beam, an ecx ray, and the like, and an elastic wave represented by an ultrasonic wave. Examples of the adhesive whose properties are changed by the supply of the active energy source include an ultraviolet curable adhesive,
There are an electron beam curable pressure-sensitive adhesive, a thermosetting pressure-sensitive adhesive, a thermoplastic pressure-sensitive adhesive, and the like, and each may be used alone or a plurality of pressure-sensitive adhesives may be used simultaneously. The same adhesive strength of this adhesive as described above is 300 to 300 before the active energy source is supplied.
1,000g / 10mm width, after supplying active energy source (
), The width is preferably 1 to 300 g / 10 mm.
【００１８】セパレ―タ１３としては、ポリオレフイン
系樹脂からなる粘着剤表面保護フイルムが用いられ、こ
のものは、材料組成の選択などにて、従来のポリエステ
ルフイルムのようにシリコ―ンやワツクスなどで離型処
理を施さなくとも、低い臨界表面張力を示すものが容易
に得られ、粘着剤表面に対する剥離力を所望程度に小さ
く設定できる。このため、この種のフイルムには、離型
処理剤に起因した粘着剤層とレジストとの密着性の低下
や物品汚染の問題は生じない。また、軟質ポリ塩化ビニ
ルからなるフイルムなどでは、フイルム中に含まれる多
量の可塑剤が粘着剤表面に移行して粘着剤層とレジスト
との密着性の低下や物品汚染の問題を起こしたり、ポリ
塩化ビニルから遊離した塩化水素による物品汚染の問題
もあるが、ポリオレフイン系樹脂にはかかる問題もな
い。As the separator 13, a pressure-sensitive adhesive surface protection film made of a polyolefin resin is used. This film is made of silicone or wax, like a conventional polyester film, depending on the material composition. A material having a low critical surface tension can be easily obtained without performing a release treatment, and the peeling force to the pressure-sensitive adhesive surface can be set to a desired small value. For this reason, this type of film does not suffer from the problems of reduced adhesion between the pressure-sensitive adhesive layer and the resist and contamination of articles caused by the release agent. Also, in the case of a film made of soft polyvinyl chloride, a large amount of plasticizer contained in the film migrates to the surface of the pressure-sensitive adhesive, causing a problem of reduced adhesion between the pressure-sensitive adhesive layer and the resist and contamination of articles, There is also a problem of article contamination due to hydrogen chloride liberated from vinyl chloride, but there is no such problem with polyolefin resin.
【００１９】粘着剤表面保護フイルムに用いられるポリ
オレフイン系樹脂としては、ポリエチレン、ポリプロピ
レン、エチレン−プロピレン共重合体などのほか、エチ
レン−酢酸ビニル共重合体、エチレン−エチルアクリレ
―ト共重合体なども使用できる。このポリオレフイン系
樹脂からなる粘着剤表面保護フイルムの厚さは、任意に
決定してよいが、通常は２５〜１００μｍであるのがよ
い。As the polyolefin resin used for the surface protective film of the pressure-sensitive adhesive, polyethylene, polypropylene, ethylene-propylene copolymer and the like, as well as ethylene-vinyl acetate copolymer and ethylene-ethyl acrylate copolymer are used. it can. The thickness of the pressure-sensitive adhesive surface protective film made of the polyolefin resin may be arbitrarily determined, but is usually preferably 25 to 100 μm.
【００２０】粘着剤表面保護フイルムの臨界表面張力
は、接触角測定（水滴）により導き出される値として、
３３dyne／cm以下であるのがよく、とくに好ましくは３
０dyne／cm以下である。なお、ＪＩＳ Ｋ６７６８の濡
れ指数標準液による表面張力測定法では３０dyne／cm未
満は測定できないため、本発明では、上記の接触角測定
（水滴）による方法が採用される。また、上記の臨界表
面張力は、少なくとも粘着剤層１２の接触面側を対象と
しており、場合によつては、反対面側がこれとは異なる
臨界表面張力を有していてもよい。The critical surface tension of the pressure-sensitive adhesive surface protective film is defined as a value derived from a contact angle measurement (water droplet).
It is preferably 33 dyne / cm or less, particularly preferably 3 dyne / cm.
0 dyne / cm or less. In addition, since the surface tension measurement method using a wetting index standard solution of JIS K6768 cannot measure less than 30 dyne / cm, in the present invention, the method based on the above-described contact angle measurement (water droplet) is employed. Further, the above-mentioned critical surface tension is intended for at least the contact surface side of the pressure-sensitive adhesive layer 12, and in some cases, the opposite surface side may have a different critical surface tension.
【００２１】このような臨界表面張力を有することによ
り、アクリル樹脂系粘着剤などに対して、粘着剤表面に
対する剥離力（ＪＩＳ Ｚ０２３７，Ｚ１５２９に準ず
る）が５〜１，０００ｇ／５０mm幅、好ましくは１０〜
５００ｇ／５０mm幅の適度なものとなり、表面保護に必
要な剥離力を確保できるとともに、粘着テ―プの使用時
に容易に剥離できる剥離性も確保される。これに対し、
上記の剥離力が１，０００ｇ／５０mm幅より大きくなる
と、剥離性に問題を生じ、とくに機械による自動貼り付
けでは５００ｇ／５０mm幅を超えると貼り付けミスを生
じやすいので、５００ｇ／５０mm幅以下とするのが好ま
しい。また、上記の剥離力が５ｇ／５０mm幅未満となる
と、十分な粘着剤表面保護機能を果たさない。By having such a critical surface tension, a peeling force (according to JIS Z0237 and Z1529) on the surface of the pressure-sensitive adhesive against an acrylic resin-based pressure-sensitive adhesive is 5 to 1,000 g / 50 mm width, preferably. 10
It has a proper width of 500 g / 50 mm, and can secure a peeling force necessary for surface protection, and also secures a peeling property that can be easily peeled when an adhesive tape is used. In contrast,
If the above-mentioned peeling force is larger than 1,000 g / 50 mm width, there is a problem in peeling property. In particular, in the case of automatic pasting by a machine, when the width exceeds 500 g / 50 mm width, a pasting error easily occurs. Is preferred. On the other hand, if the above-mentioned peeling force is less than 5 g / 50 mm width, it will not fulfill a sufficient pressure-sensitive adhesive surface protection function.
【００２２】この粘着剤表面保護フイルムは、ポリオレ
フイン系樹脂を押出し機、カレンダ−などの成膜装置を
用いてフイルム状に加工することにより作製されるが、
フイルムの外観・寸法や機械物性の安定化、または生産
性の改善のために、ポリオレフイン系樹脂にさまざまな
添加剤が添加される。代表的な添加剤として、熱劣化防
止剤、滑剤、ブロツキング防止剤などがあり、中でも、
熱劣化防止剤と滑剤はフイルム状の加工に際し、必ず添
加されるものである。This pressure-sensitive adhesive surface protection film is produced by processing a polyolefin resin into a film shape using a film forming apparatus such as an extruder or a calendar.
Various additives are added to a polyolefin-based resin in order to stabilize the appearance / dimensions and mechanical properties of a film or to improve productivity. Typical additives include a thermal deterioration inhibitor, a lubricant, and an anti-blocking agent.
The thermal deterioration inhibitor and the lubricant are always added when the film is processed.
【００２３】この熱劣化防止剤としては、フエノ―ル
系、芳香族アミン系、有機イオウ系、有機リン系、金属
化合物系などがある。また、滑剤としては、高級脂肪族
アルコ―ル系、脂肪酸エステル系、脂肪酸アミド系など
がある。これらの熱劣化防止剤と滑剤は、その合計量
が、ポリオレフイン系樹脂１００重量部に対し、０．０
１〜１重量部、好ましくは０．０２〜０．５重量部であ
るのがよい。あまり多く用いすぎると、粘着剤層面への
移行により、この粘着剤層とレジストとの密着性が低下
したり、物品汚染の原因となつたりするため、好ましく
ない。Examples of the thermal deterioration inhibitor include phenol-based, aromatic amine-based, organic sulfur-based, organic phosphorus-based, and metal compound-based. Examples of the lubricant include higher aliphatic alcohols, fatty acid esters, and fatty acid amides. The total amount of these thermal deterioration inhibitor and lubricant is 0.0 to 100 parts by weight of the polyolefin resin.
The amount is preferably 1 to 1 part by weight, more preferably 0.02 to 0.5 part by weight. If too much is used, the transfer to the surface of the pressure-sensitive adhesive layer is not preferred because the adhesiveness between the pressure-sensitive adhesive layer and the resist is reduced or causes contamination of articles.
【００２４】このレジスト除去用粘着テ―プ１は、支持
フイルム１１のコロナ処理面に粘着剤溶液を塗工し、８
０〜９０℃程度の加熱によつて乾燥、架橋処理して、粘
着剤層１２を形成したのち、この上に上記構成のセパレ
―タ１３を貼り合わせるという、粘着テ―プ作製の常用
方式にて、作製できる。しかしながら、この方式は、加
熱工程中に粘着剤層面に異物が付着して、これがレジス
トとの密着性を損なつたり、物品表面に転着して汚染の
問題を生じやすい。The pressure-sensitive adhesive tape 1 for resist removal is prepared by applying a pressure-sensitive adhesive solution to the corona-treated surface of the support film 11 and applying
After drying and cross-linking by heating at about 0 to 90 ° C. to form the pressure-sensitive adhesive layer 12, the separator 13 having the above-mentioned structure is bonded on the pressure-sensitive adhesive layer 12. Can be made. However, in this method, a foreign matter adheres to the surface of the pressure-sensitive adhesive layer during the heating step, which impairs the adhesiveness with the resist or is easily transferred to the surface of the article to cause a problem of contamination.
【００２５】したがつて、上記の方式に代えて、セパレ
―タ１３を構成するポリオレフイン系樹脂からなる粘着
剤表面保護フイルムの上に、粘着剤溶液を塗工し、これ
を上記同様に乾燥、架橋処理して、粘着剤層１２を形成
したのち、この上に支持フイルム１１のコロナ処理面側
を貼り合わせるという方式を採用するのが望ましい。こ
れによると、粘着剤の塗工と同時に、粘着剤表面は完全
に密閉されるので、その後粘着剤表面に異物が付着する
おそれはない。ただし、この方式では、セパレ―タ１３
は、加熱工程に耐えうるものでなくてはならないため、
フイルム形成材料であるポリオレフイン系樹脂は、熱変
形温度（ＪＩＳ Ｋ７２０７に準ずる、荷重４．６Kgf
／cm2 ）が８０℃以上であることが望まれる。Therefore, instead of the above method, an adhesive solution is applied on an adhesive surface protective film made of a polyolefin resin constituting the separator 13 and dried in the same manner as described above. It is desirable to adopt a method of forming the pressure-sensitive adhesive layer 12 by cross-linking, and then bonding the corona-treated surface of the support film 11 thereon. According to this, since the surface of the pressure-sensitive adhesive is completely sealed at the same time as the application of the pressure-sensitive adhesive, there is no possibility that foreign matter will adhere to the surface of the pressure-sensitive adhesive thereafter. However, in this method, the separator 13
Must be able to withstand the heating process,
The polyolefin resin, which is a film forming material, has a heat deformation temperature (a load of 4.6 kgf according to JIS K7207).
/ Cm 2 ) is desired to be 80 ° C. or higher.
【００２６】また、上記の方式を採用する場合でも、粘
着剤表面保護フイルムへの粘着剤溶液の塗工前に、上記
フイルムの塗工面側に異物が付着することもある。これ
を防ぐには、上記フイルムにあらかじめ帯電防止処理を
施して、浮遊粒子のフイルム表面への付着を可及的に防
ぐのが望ましい。帯電防止処理を施した上記フイルム
は、表面抵抗率（ＡＳＴＭ Ｄ２５７に準ずる）が１×
１０12Ω／□以下、好ましくは１×１０10Ω／□以下で
あるのがよい。ここで用いる帯電防止処理剤としては、
界面活性剤系、導電性有機物質系（カ―ボンブラツク、
有機半導体など）、金属系、金属酸化物系などが挙げら
れる。なお、帯電防止処理を施す面としては、汚染性を
配慮して、粘着剤表面保護フイルムの粘着剤層１２の接
触面とは反対側の面であるのが望ましい。Even when the above method is employed, foreign matter may adhere to the coated surface side of the film before applying the pressure-sensitive adhesive solution to the pressure-sensitive adhesive surface protection film. In order to prevent this, it is desirable to carry out an antistatic treatment on the film in advance to prevent adhesion of suspended particles to the film surface as much as possible. The film subjected to the antistatic treatment has a surface resistivity of 1 × (according to ASTM D257).
It is good to be 10 12 Ω / □ or less, preferably 1 × 10 10 Ω / □ or less. As the antistatic treatment agent used here,
Surfactant system, conductive organic material system (carbon black,
Organic semiconductor), metal-based, metal-oxide-based, and the like. The surface to be subjected to the antistatic treatment is desirably the surface on the opposite side to the contact surface of the pressure-sensitive adhesive layer 12 of the pressure-sensitive adhesive surface protective film in consideration of the contamination.
【００２７】このように作製されるレジスト除去用粘着
テ―プ１において、粘着剤層１２の表面粗さは、除去す
るべきレジストに対して十分に追従、密着させうるよう
に、レジストの厚さ（通常１〜５μｍ）以下であること
が必要である。したがつて、この粘着剤層１２の表面に
貼り合わされて、表面形状が粘着剤層１２にそのまま転
写されることとなるセパレ―タ１３としての粘着剤表面
保護フイルムは、上記同様の表面粗さに設定されている
のがよく、通常では平均表面粗さ〔Ｒａ〕が２μｍ以
下、好ましくは１μｍであるのが望ましい。The surface roughness of the pressure-sensitive adhesive layer 12 of the thus-prepared pressure-sensitive adhesive tape 1 is adjusted so as to sufficiently follow and adhere to the resist to be removed. (Usually 1 to 5 μm). Accordingly, the pressure-sensitive adhesive surface protection film as the separator 13 which is bonded to the surface of the pressure-sensitive adhesive layer 12 and whose surface shape is transferred to the pressure-sensitive adhesive layer 12 as it is, has the same surface roughness as described above. The average surface roughness [Ra] is usually 2 μm or less, preferably 1 μm.
【００２８】本発明において、上記構成の粘着テ―プ１
を、精密電子部品の製造プロセスにおけるレジスト除去
工程に適用する例として、たとえば、半導体ウエハ上に
存在するレジストを剥離除去する方法について、説明す
る。まず、粘着テ―プ１よりセパレ―タ１３を引き剥が
したうえで、図２に示すように、半導体ウエハ２の表面
２ａおよび／または裏面２ｂの全面にこの粘着テ―プ１
を貼り付けて、粘着剤層１２面を半導体ウエハ２上のレ
ジストパタ―ン３に対し十分に馴染ませる。これは、た
とえば、ハンドロ―ラ（図示せず）により押圧したの
ち、数分程度放置するといつた方法で行えばよい。In the present invention, the adhesive tape 1 having the above-mentioned structure is used.
For example, a method of removing and removing a resist present on a semiconductor wafer will be described as an example of applying the method to a resist removing step in a manufacturing process of a precision electronic component. First, after separating the separator 13 from the adhesive tape 1, as shown in FIG. 2, the adhesive tape 1 is applied to the entire surface 2 a and / or the back surface 2 b of the semiconductor wafer 2.
To make the surface of the pressure-sensitive adhesive layer 12 sufficiently conform to the resist pattern 3 on the semiconductor wafer 2. This may be performed by a method which is performed, for example, after pressing with a hand roller (not shown), and then leaving it for several minutes.
【００２９】このように貼り付けたのち、粘着テ―プ１
が硬化タイプのものであれば、加熱または光照射などに
より硬化させ、その後に、この粘着テ―プ１の端部より
剥離する、剥離操作を施すと、半導体ウエハ２上のレジ
ストパタ―ン３は、粘着剤層１２面に固着されたまま、
容易に剥離除去される。その際、粘着剤の糊残りやさら
に従来のようなセパレ―タ１３（の離型処理剤）に起因
したレジストに対する密着性の低下やウエハ汚染の問題
は起こらない。このため、半導体ウエハ２上のレジスト
パタ―ン３は、確実に剥離除去されるとともに、この剥
離除去に際し、半導体ウエハを汚染するといつた問題も
生じない。After sticking in this manner, adhesive tape 1
If is a curing type, the resist pattern 3 on the semiconductor wafer 2 is cured by heating or irradiating light, and then peeling off from the end of the adhesive tape 1. While being fixed to the surface of the pressure-sensitive adhesive layer 12,
It is easily peeled off. At this time, problems such as adhesive residue on the pressure-sensitive adhesive and deterioration in adhesion to the resist and wafer contamination due to the conventional separator (release agent) of the separator 13 do not occur. Therefore, the resist pattern 3 on the semiconductor wafer 2 is reliably peeled and removed, and there is no problem that the semiconductor wafer is contaminated during the peeling and removal.
【００３０】このようにレジストパタ―ンを完全に除去
でき、かつウエハ汚染の問題も生じないため、半導体ウ
エハの歩留りや信頼性が大幅に向上する。これは、液晶
表示パネルなどの他の精密電子部品の製造プロセスにお
けるレジスト除去工程に適用した場合でも、同じであ
り、上記と同様の効果が奏される。As described above, since the resist pattern can be completely removed and the problem of wafer contamination does not occur, the yield and reliability of the semiconductor wafer are greatly improved. This is the same even when the present invention is applied to a resist removing step in a manufacturing process of another precision electronic component such as a liquid crystal display panel, and the same effects as described above are exerted.
【００３１】[0031]
【実施例】つぎに、本発明の実施例を記載して、より具
体的に説明する。以下において、部とあるのは重量部を
意味するものとする。Next, an embodiment of the present invention will be described in more detail. In the following, “parts” means “parts by weight”.
【００３２】実施例１ 低密度ポリエチレン樹脂〔住友化学工業（株）製の商品
名「スミカセンＦ２０８−１」〕１００部に、フエノ―
ル系熱劣化防止剤０．０１部および脂肪酸エステル系滑
剤０．０１部を添加し、フラツトフイルム製造装置〔モ
ダンマシナリ―（株）製〕を用いて、押出温度２００
℃、引き取り速度４ｍ／分で成膜加工し、厚さ１００μ
ｍの粘着剤表面保護フイルムを作製した。Example 1 A low-density polyethylene resin (trade name "Sumikasen F208-1" manufactured by Sumitomo Chemical Co., Ltd.) was added to 100 parts of phenolic resin.
And 0.01 parts of a fatty acid ester-based lubricant was added thereto, and the extruding temperature was adjusted to 200 using a flat film manufacturing apparatus (made by Modern Machinery Co., Ltd.).
Film processing at a take-off speed of 4 m / min.
m of the pressure-sensitive adhesive surface protective film was prepared.
【００３３】このフイルムについて、用いた樹脂の種類
と熱変形温度（ＪＩＳ Ｋ７２０７に準ずる、荷重４．
６Kgf ／cm2 ）、添加剤量（樹脂１００部に対する熱劣
化防止剤と滑剤の合計の使用部数）とともに、フイルム
の臨界表面張力〔接触角測定（水滴）による方法、２３
℃，６０％ＲＨ〕、アクリル系粘着剤に対する剥離力
（万能引張試験機、ＪＩＳ Ｚ０２３７，Ｚ１５２９に
準ずる）、表面抵抗率（表面抵抗測定器、２３℃，６０
％ＲＨ）および平均表面粗さ（表面形状測定装置、低荷
重接触式）を調べた結果を、後記の表１に示した。With respect to this film, the kind of resin used and the heat distortion temperature (load: 3.
6 kgf / cm 2 ), the amount of additives (total number of parts of the thermal degradation inhibitor and the lubricant used per 100 parts of the resin), and the critical surface tension of the film [method by contact angle measurement (water droplet), 23
° C, 60% RH], peeling force against acrylic adhesive (universal tensile tester, according to JIS Z0237, Z1529), surface resistivity (surface resistance measuring instrument, 23 ° C, 60 ° C)
% RH) and average surface roughness (surface profile measuring device, low-load contact type) are shown in Table 1 below.
【００３４】つぎに、この粘着剤表面保護フイルムをセ
パレ―タとし、この上にアクリル系粘着剤の溶液を塗工
し、８０℃で５分間加熱架橋処理し、乾燥後、厚さが５
０μｍのポリエステルフイルムからなる支持フイルムの
コロナ処理面を貼り合わせることにより、厚さが２０μ
ｍの粘着剤層を有するレジスト除去用粘着テ―プを得
た。このテ―プのシリコンウエハ（ミラ―面）に対する
粘着力は、ＪＩＳ Ｚ−０２３７に準じて測定される１
８０度引き剥がし粘着力（常温、剥離速度３００mm／
分）で１００ｇ／１０mm幅であつた。Next, this pressure-sensitive adhesive surface protective film was used as a separator, and a solution of an acrylic pressure-sensitive adhesive was applied thereon, followed by heat crosslinking at 80 ° C. for 5 minutes.
By attaching the corona-treated surface of a support film made of a 0 μm polyester film to a thickness of 20 μm.
Thus, a pressure-sensitive adhesive tape for resist removal having a pressure-sensitive adhesive layer of m was obtained. The adhesive strength of this tape to a silicon wafer (mirror surface) is measured according to JIS Z-0237.
80 degree peeling adhesive strength (normal temperature, peeling speed 300mm /
Min) and the width was 100 g / 10 mm.
【００３５】なお、前記の表１に示すアクリル系粘着剤
に対する剥離力は、上記方法で作製した粘着テ―プを用
いて、その支持フイルム側を両面粘着テ―プによりフラ
ツトなステンレス板に固定し、１８０度方向にセパレ―
タを剥離する際の応力（剥離速度３００mm／分、サンプ
ル幅５０mm）を調べたものである。The peeling force against the acrylic pressure-sensitive adhesive shown in Table 1 was determined by fixing the supporting film side to a flat stainless steel plate with a double-sided pressure-sensitive adhesive tape using the pressure-sensitive adhesive tape prepared by the above method. Then separate in 180 degree direction
The stress (peeling speed 300 mm / min, sample width 50 mm) at the time of peeling the sample was examined.
【００３６】このようにして作製したレジスト除去用粘
着テ―プについて、半導体ウエハ上に存在するレジスト
の除去試験と、さらに半導体ウエハに対する汚染試験を
行つた。これらの試験結果は、後記の表２に示されると
おりであつた。なお、両試験は、以下の方法で行つたも
のである。With respect to the thus-prepared pressure-sensitive adhesive tape for resist removal, a test for removing the resist existing on the semiconductor wafer and a contamination test for the semiconductor wafer were performed. The results of these tests were as shown in Table 2 below. In addition, both tests were performed by the following methods.
【００３７】＜レジスト除去試験＞半導体ウエハ上に厚
さが１μｍのポジ型レジストを塗布し、イオン注入エネ
ルギ―８０ｋｅＶ、イオン注入濃度１×１０14ｉｏｎｓ
／cm2 でＰ+ イオン注入した。このウエハに粘着テ―プ
をセパレ―タ（粘着剤表面保護フイルム）を引き剥がし
ながら貼り付け、３分間放置したのち、剥離して、レジ
ストを除去した。レジスト除去面積からレジスト除去率
を計算した。なお、上記一連の作業は、クラス１０のク
リ―ンル―ム内（温度２３℃ 湿度６０％）で行つた。<Resist Removal Test> A positive resist having a thickness of 1 μm was applied on a semiconductor wafer, and the ion implantation energy was 80 keV and the ion implantation concentration was 1 × 10 14 ions.
/ Cm 2 was implanted with P + ions. An adhesive tape was adhered to the wafer while peeling off a separator (adhesive surface protection film), left for 3 minutes, and then peeled off to remove the resist. The resist removal rate was calculated from the resist removal area. The above series of operations were performed in a clean room of class 10 (temperature 23 ° C., humidity 60%).
【００３８】＜ウエハ汚染試験＞シリコンウエハのミラ
―面に、ハンドロ―ラを用いて、粘着テ―プをセパレ―
タ（粘着剤表面保護フイルム）を引き剥がしながら貼り
付け、３分間放置したのち、剥離した。レ―ザ―表面検
査装置を用いて、ミラ―面に付着している０．２μｍ以
上の大きさの異物数をカウントした。<Wafer Contamination Test> An adhesive tape was separated on a mirror surface of a silicon wafer using a hand roller.
The film was adhered while peeling off the adhesive (surface protective film for adhesive), left for 3 minutes, and then peeled off. The number of foreign substances having a size of 0.2 μm or more adhering to the mirror surface was counted using a laser surface inspection device.
【００３９】実施例２ 低密度ポリエチレン樹脂に代えて、ポリプロピレン樹脂
〔三井石油化学工業（株）製の商品名「ハイボ―ルＦ−
６００」〕を用いた以外は、実施例１と同様にして、厚
さが５０μｍの粘着剤表面保護フイルムを作製した。表
１に、用いた樹脂の種類と熱変形温度、添加剤量（樹脂
１００部に対する熱劣化防止剤と滑剤の合計の使用部
数）、フイルムの臨界表面張力、アクリル系粘着剤に対
する剥離力、表面抵抗率および平均表面粗さを前記同様
にして調べた結果を、示した。Example 2 Instead of the low-density polyethylene resin, a polypropylene resin [trade name of "HIBOL F-" manufactured by Mitsui Petrochemical Industries, Ltd.
600 ”], except that a pressure-sensitive adhesive surface protective film having a thickness of 50 μm was prepared in the same manner as in Example 1. Table 1 shows the type of resin used and the heat distortion temperature, the amount of additives (total number of parts used for the thermal deterioration inhibitor and the lubricant for 100 parts of the resin), the critical surface tension of the film, the peeling force for the acrylic adhesive, and the surface. The results of examining the resistivity and the average surface roughness in the same manner as described above are shown.
【００４０】この粘着剤表面保護フイルムをセパレ―タ
とした以外は、実施例１と同様にして、厚さが２０μｍ
の粘着剤層を有するレジスト除去用粘着テ―プを作製し
た。この粘着テ―プのシリコンウエハ（ミラ―面）に対
する粘着力は、実施例１と同じであつた。また、この粘
着テ―プについて、実施例１と同様にして、レジスト除
去試験とウエハ汚染試験を行つた結果は、表２に示され
るとおりであつた。The same procedure as in Example 1 was carried out except that this pressure-sensitive adhesive surface protective film was used as a separator, and the thickness was 20 μm.
A pressure-sensitive adhesive tape for resist removal having a pressure-sensitive adhesive layer was prepared. The adhesive strength of the adhesive tape to the silicon wafer (mirror surface) was the same as in Example 1. The results of the resist removal test and the wafer contamination test performed on this adhesive tape in the same manner as in Example 1 are as shown in Table 2.
【００４１】実施例３ 熱劣化防止剤の添加量を０．１部、滑剤の添加量を０．
２部に、それぞれ変更した以外は、実施例１と同様にし
て、厚さが５０μｍの粘着剤表面保護フイルムを作製し
た。表１に、用いた樹脂の種類と熱変形温度、添加剤量
（樹脂１００部に対する熱劣化防止剤と滑剤の合計の使
用部数）、フイルムの臨界表面張力、アクリル系粘着剤
に対する剥離力、表面抵抗率および平均表面粗さを前記
同様にして調べた結果を、示した。Example 3 The addition amount of the thermal deterioration inhibitor was 0.1 part, and the addition amount of the lubricant was 0.1 part.
A pressure-sensitive adhesive surface protective film having a thickness of 50 μm was prepared in the same manner as in Example 1 except that the two parts were changed. Table 1 shows the type of resin used and the heat distortion temperature, the amount of additives (total number of parts used for the thermal deterioration inhibitor and the lubricant for 100 parts of the resin), the critical surface tension of the film, the peeling force for the acrylic adhesive, and the surface. The results of examining the resistivity and the average surface roughness in the same manner as described above are shown.
【００４２】この粘着剤表面保護フイルムをセパレ―タ
とした以外は、実施例１と同様にして、厚さが２０μｍ
の粘着剤層を有するレジスト除去用粘着テ―プを作製し
た。この粘着テ―プのシリコンウエハ（ミラ―面）に対
する粘着力は、実施例１と同じであつた。また、この粘
着テ―プについて、実施例１と同様にして、レジスト除
去試験とウエハ汚染試験を行つた結果は、表２に示され
るとおりであつた。The same procedure as in Example 1 was carried out except that this pressure-sensitive adhesive surface protective film was used as a separator, and the thickness was 20 μm.
A pressure-sensitive adhesive tape for resist removal having a pressure-sensitive adhesive layer was prepared. The adhesive strength of the adhesive tape to the silicon wafer (mirror surface) was the same as in Example 1. The results of the resist removal test and the wafer contamination test performed on this adhesive tape in the same manner as in Example 1 are as shown in Table 2.
【００４３】実施例４ 低密度ポリエチレン樹脂として、住友化学工業（株）製
の商品名「スミカセンＦ４１０−１を用いた以外は、実
施例３と同様にして、厚さが５０μｍの粘着剤表面保護
フイルムを作製した。表１に、用いた樹脂の種類と熱変
形温度、添加剤量（樹脂１００部に対する熱劣化防止剤
と滑剤の合計の使用部数）、フイルムの臨界表面張力、
アクリル系粘着剤に対する剥離力、表面抵抗率および平
均表面粗さを前記同様にして調べた結果を、示した。Example 4 The surface protection of an adhesive having a thickness of 50 μm was carried out in the same manner as in Example 3 except that Sumikasen F410-1 (trade name, manufactured by Sumitomo Chemical Co., Ltd.) was used as the low-density polyethylene resin. Table 1 shows the type of resin used, the heat distortion temperature, the amount of additives (total number of parts of the thermal degradation inhibitor and the lubricant used per 100 parts of the resin), the critical surface tension of the film,
The results of examining the peel strength, surface resistivity, and average surface roughness of the acrylic pressure-sensitive adhesive in the same manner as described above are shown.
【００４４】この粘着剤表面保護フイルムをセパレ―タ
とした以外は、実施例１と同様にして、厚さが２０μｍ
の粘着剤層を有するレジスト除去用粘着テ―プを作製し
た。この粘着テ―プのシリコンウエハ（ミラ―面）に対
する粘着力は、実施例１と同じであつた。また、この粘
着テ―プについて、実施例１と同様にして、レジスト除
去試験とウエハ汚染試験を行つた結果は、表２に示され
るとおりであつた。The same procedure as in Example 1 was carried out except that the pressure-sensitive adhesive surface protective film was used as a separator, and the thickness was 20 μm.
A pressure-sensitive adhesive tape for resist removal having a pressure-sensitive adhesive layer was prepared. The adhesive strength of the adhesive tape to the silicon wafer (mirror surface) was the same as in Example 1. The results of the resist removal test and the wafer contamination test performed on this adhesive tape in the same manner as in Example 1 are as shown in Table 2.
【００４５】実施例５ ポリプロピレン樹脂として、三井石油化学工業（株）製
の商品名「ハイポ―ルＦ−６５０」を用いた以外は、実
施例２に同様にして、厚さが５０μｍの粘着剤表面保護
フイルムを作製した。表１に、用いた樹脂の種類と熱変
形温度、添加剤量（樹脂１００部に対する熱劣化防止剤
と滑剤の合計の使用部数）、フイルムの臨界表面張力、
アクリル系粘着剤に対する剥離力、表面抵抗率および平
均表面粗さを前記同様にして調べた結果を、示した。Example 5 A pressure-sensitive adhesive having a thickness of 50 μm was prepared in the same manner as in Example 2 except that the product name “HIPOL F-650” manufactured by Mitsui Petrochemical Industry Co., Ltd. was used as the polypropylene resin. A surface protection film was produced. Table 1 shows the type of resin used, the thermal deformation temperature, the amount of additives (total number of parts of the thermal degradation inhibitor and the lubricant used for 100 parts of the resin), the critical surface tension of the film,
The results of examining the peel strength, surface resistivity, and average surface roughness of the acrylic pressure-sensitive adhesive in the same manner as described above are shown.
【００４６】この粘着剤表面保護フイルムをセパレ―タ
とした以外は、実施例１と同様にして、厚さが２０μｍ
の粘着剤層を有するレジスト除去用粘着テ―プを作製し
た。この粘着テ―プのシリコンウエハ（ミラ―面）に対
する粘着力は、実施例１と同じであつた。また、この粘
着テ―プについて、実施例１と同様にして、レジスト除
去試験とウエハ汚染試験を行つた結果は、表２に示され
るとおりであつた。The same procedure as in Example 1 was carried out except that this pressure-sensitive adhesive surface protective film was used as a separator, and the thickness was 20 μm.
A pressure-sensitive adhesive tape for resist removal having a pressure-sensitive adhesive layer was prepared. The adhesive strength of the adhesive tape to the silicon wafer (mirror surface) was the same as in Example 1. The results of the resist removal test and the wafer contamination test performed on this adhesive tape in the same manner as in Example 1 are as shown in Table 2.
【００４７】実施例６ フイルムの成膜後に粘着剤を接触させるべき面とは反対
側の面に、界面活性剤系帯電防止剤を塗布した以外は、
実施例１と同様にして、粘着剤表面保護フイルムを作製
した。表１に、用いた樹脂の種類と熱変形温度、添加剤
量（樹脂１００部に対する熱劣化防止剤と滑剤の合計の
使用部数）、フイルムの臨界表面張力、アクリル系粘着
剤に対する剥離力、表面抵抗率および平均表面粗さを前
記同様にして調べた結果を、示した。Example 6 A surfactant-based antistatic agent was applied to the surface opposite to the surface to be contacted with the pressure-sensitive adhesive after the film was formed.
In the same manner as in Example 1, an adhesive surface protection film was produced. Table 1 shows the type of resin used and the heat distortion temperature, the amount of additives (total number of parts used for the thermal deterioration inhibitor and the lubricant for 100 parts of the resin), the critical surface tension of the film, the peeling force for the acrylic adhesive, and the surface. The results of examining the resistivity and the average surface roughness in the same manner as described above are shown.
【００４８】この粘着剤表面保護フイルムをセパレ―タ
とした以外は、実施例１と同様にして、厚さが２０μｍ
の粘着剤層を有するレジスト除去用粘着テ―プを作製し
た。この粘着テ―プのシリコンウエハ（ミラ―面）に対
する粘着力は、実施例１と同じであつた。また、この粘
着テ―プについて、実施例１と同様にして、レジスト除
去試験とウエハ汚染試験を行つた結果は、表２に示され
るとおりであつた。The same procedure as in Example 1 was repeated except that the pressure-sensitive adhesive surface protective film was used as a separator.
A pressure-sensitive adhesive tape for resist removal having a pressure-sensitive adhesive layer was prepared. The adhesive strength of the adhesive tape to the silicon wafer (mirror surface) was the same as in Example 1. The results of the resist removal test and the wafer contamination test performed on this adhesive tape in the same manner as in Example 1 are as shown in Table 2.
【００４９】比較例１ ポリ塩化ビニル樹脂１００部に、アジピン酸ポリエステ
ル系可塑剤３０部、エポキシ系可塑剤２部、Ｂａ／Ｚｎ
系熱劣化防止剤１部を、ミキシングロ―ルを用いて、１
８０℃で混練りし、これをカレンダ―成膜装置に投入し
て、厚さが８０μｍの粘着剤表面保護フイルムを作製し
た。表１に、用いた樹脂の種類と熱変形温度、添加剤量
（樹脂１００部に対する熱劣化防止剤と滑剤の合計の使
用部数）、フイルムの臨界表面張力、アクリル系粘着剤
に対する剥離力、表面抵抗率および平均表面粗さを前記
同様にして調べた結果を、示した。Comparative Example 1 100 parts of polyvinyl chloride resin, 30 parts of adipic acid polyester plasticizer, 2 parts of epoxy plasticizer, Ba / Zn
1 part of the system thermal deterioration inhibitor
The mixture was kneaded at 80 ° C., and the mixture was put into a calender film forming apparatus to prepare a pressure-sensitive adhesive surface protection film having a thickness of 80 μm. Table 1 shows the type of resin used and the heat distortion temperature, the amount of additives (total number of parts used for the thermal deterioration inhibitor and the lubricant for 100 parts of the resin), the critical surface tension of the film, the peeling force for the acrylic adhesive, and the surface. The results of examining the resistivity and the average surface roughness in the same manner as described above are shown.
【００５０】この粘着剤表面保護フイルムをセパレ―タ
とし、かつこのセパレ―タ上にアクリル系粘着剤の溶液
を塗工したのちの加熱条件を９０℃で５分間とした以外
は、実施例１と同様にして、厚さが２０μｍの粘着剤層
を有するレジスト除去用粘着テ―プを作製した。この粘
着テ―プのシリコンウエハ（ミラ―面）に対する粘着力
は、ＪＩＳ Ｚ−０２３７に準じて測定される１８０度
引き剥がし粘着力（常温、剥離速度３００mm／分）で７
０ｇ／１０mm幅であつた。また、この粘着テ―プについ
て、実施例１と同様にして、レジスト除去試験とウエハ
汚染試験を行つた結果は、表２に示されるとおりであつ
た。Example 1 was repeated except that this pressure-sensitive adhesive surface protective film was used as a separator, and the heating condition after applying an acrylic pressure-sensitive adhesive solution on the separator was 90 ° C. for 5 minutes. In the same manner as in the above, an adhesive tape for resist removal having an adhesive layer having a thickness of 20 μm was prepared. The adhesive strength of the adhesive tape to the silicon wafer (mirror surface) was determined as a 180 ° peel adhesive strength (normal temperature, peeling speed 300 mm / min) measured in accordance with JIS Z-0237.
The width was 0 g / 10 mm. The results of the resist removal test and the wafer contamination test performed on this adhesive tape in the same manner as in Example 1 are as shown in Table 2.
【００５１】比較例２ 厚さが５０μｍのポリエステルフイルムの片面にシリコ
―ン処理を施し、粘着剤表面保護フイルムとした。表１
に、このフイルムに用いた樹脂の種類と熱変形温度、添
加剤量（樹脂１００部に対する熱劣化防止剤と滑剤の合
計の使用部数）、フイルムの臨界表面張力（シリコ―ン
処理面）、アクリル系粘着剤に対する剥離力、表面抵抗
率および平均表面粗さを前記同様に調べた結果を、示し
た。Comparative Example 2 One side of a polyester film having a thickness of 50 μm was subjected to a silicone treatment to form a pressure-sensitive adhesive surface protective film. Table 1
In addition, the type and heat deformation temperature of the resin used for this film, the amount of additives (total number of parts used of the thermal deterioration inhibitor and the lubricant for 100 parts of resin), the critical surface tension of the film (silicon treated surface), acrylic The results of examining the peeling force, surface resistivity, and average surface roughness with respect to the pressure-sensitive adhesive in the same manner as described above are shown.
【００５２】この粘着剤表面保護フイルムをセパレ―タ
とし、そのシリコ―ン処理面にアクリル系粘着剤の溶液
を塗工し、以下実施例１と同様にして、厚さが２０μｍ
の粘着剤層を有するレジスト除去用粘着テ―プを作製し
た。この粘着テ―プのシリコンウエハ（ミラ―面）に対
する粘着力は、ＪＩＳ Ｚ−０２３７に準じて測定され
る１８０度引き剥がし粘着力（常温、剥離速度３００mm
／分）で９５ｇ／１０mm幅であつた。また、この粘着テ
―プにつき、実施例１と同様にして、レジスト除去試験
とウエハ汚染試験を行つた結果は、表２に示されるとお
りであつた。Using this pressure-sensitive adhesive surface protection film as a separator, a solution of an acrylic pressure-sensitive adhesive was applied to the silicone-treated surface, and the thickness was reduced to 20 μm in the same manner as in Example 1.
A pressure-sensitive adhesive tape for resist removal having a pressure-sensitive adhesive layer was prepared. The adhesive strength of this adhesive tape to a silicon wafer (mirror surface) was measured by a 180 degree peeling adhesive strength (normal temperature, peeling speed 300 mm, measured according to JIS Z-0237).
/ Min) and a width of 95 g / 10 mm. In addition, a resist removal test and a wafer contamination test were performed on this adhesive tape in the same manner as in Example 1, and the results are as shown in Table 2.
【００５３】比較例３ 厚さが５０μｍのポリエステルフイルムを、これにシリ
コ―ン処理を施すことなく、そのまま粘着剤表面保護フ
イルムとした。表１に、このフイルムに用いた樹脂の種
類と熱変形温度、添加剤量（樹脂１００部に対する熱劣
化防止剤と滑剤の合計の使用部数）、フイルムの臨界表
面張力、表面抵抗率および平均表面粗さを前記同様にし
て調べた結果を、示した。Comparative Example 3 A polyester film having a thickness of 50 μm was directly used as a pressure-sensitive adhesive surface protective film without subjecting it to a silicone treatment. Table 1 shows the type and heat deformation temperature of the resin used for this film, the amount of additives (total number of parts of the thermal degradation inhibitor and the lubricant used for 100 parts of the resin), the critical surface tension of the film, the surface resistivity and the average surface. The results obtained by examining the roughness in the same manner as described above are shown.
【００５４】なお、この粘着剤表面保護フイルムについ
て、アクリル系粘着剤に対する剥離力の測定も行つた
が、フイルムの引き剥がし時に粘着テ―プ本体が破断し
てしまい、測定不能であつた。したがつて、この粘着剤
表面保護フイルムをセパレ―タとして、実施例１と同様
にして、厚さが２０μｍの粘着剤層を有するレジスト除
去用粘着テ―プを作製し、これを用いて実施例１と同様
にして、レジスト除去試験とウエハ汚染試験を行おうと
したが、上述のように、セパレ―タの引き剥がしが困難
のため、両試験を行うことはできなかつた。With respect to this pressure-sensitive adhesive surface protective film, the peeling force against the acrylic pressure-sensitive adhesive was also measured. However, when the film was peeled off, the pressure-sensitive adhesive tape itself was broken, and the measurement was impossible. Thus, using this pressure-sensitive adhesive surface protective film as a separator, a resist removing pressure-sensitive tape having a 20-μm-thick pressure-sensitive adhesive layer was prepared in the same manner as in Example 1 and used. A resist removal test and a wafer contamination test were attempted in the same manner as in Example 1. However, as described above, both tests could not be performed due to difficulty in peeling off the separator.
【００５５】 [0055]
【００５６】なお、上記の表１中、樹脂の種類を示す各
符号は以下のとおりである。 ＰＥ ： ポリエチレン樹脂 ＰＰ ： ポリプロピレン樹脂 ＰＥＴ ： ポリエチレンテレフタレ―ト樹脂 軟塩ビ ： 軟質ポリ塩化ビニル樹脂In addition, in Table 1 above, the respective symbols indicating the types of resin are as follows. PE: polyethylene resin PP: polypropylene resin PET: polyethylene terephthalate resin Soft PVC: soft polyvinyl chloride resin
【００５７】 [0057]
【００５８】上記の表１および表２より、本発明の実施
例１〜６の粘着テ―プによれば、セパレ―タである粘着
剤表面保護フイルムに起因した粘着剤層とレジストとの
密着性の低下がみられず、レジストを１００％の除去率
で除去でき、しかもその際のウエハ汚染の問題も少な
く、ウエハ上の異物数を大幅に低減できるものであるこ
とがわかる。このため、上記実施例１〜６の粘着テ―プ
を、実際にレジスト除去工程を含む半導体ウエハの製造
プロセスに適用し、最終的に得られた半導体デバイスの
歩留りを集計した結果、いずれの実施例も、比較例２の
粘着テ―プに比べて、より高い歩留りが得られることが
わかつた。From the above Tables 1 and 2, according to the pressure-sensitive adhesive tapes of Examples 1 to 6 of the present invention, the adhesion between the pressure-sensitive adhesive layer and the resist caused by the pressure-sensitive adhesive surface protective film, which is a separator. It can be seen that the resist can be removed at a removal rate of 100% without any deterioration in the properties, and the problem of wafer contamination at that time is small, and the number of foreign substances on the wafer can be greatly reduced. Therefore, the pressure-sensitive adhesive tapes of Examples 1 to 6 were actually applied to a semiconductor wafer manufacturing process including a resist removing step, and the yield of semiconductor devices finally obtained was counted. Also in the example, it was found that a higher yield was obtained as compared with the adhesive tape of Comparative Example 2.
【００５９】これに対し、軟質ポリ塩化ビニル樹脂から
なる粘着剤表面保護フイルムをセパレ―タとした比較例
１の粘着テ―プは、フイルム中の可塑剤などの添加物が
粘着剤層面に移行して、粘着剤層とレジストとの密着性
を損ない、レジスト除去性が低下し、またテ―プ剥離後
のウエハ表面の異物数が増加した。しかも、セパレ―タ
である上記フイルムの臨界表面張力が大きくて剥離力が
大きすぎ、機械による粘着テ―プの連続自動貼り付けを
行つた場合、上記フイルムが粘着剤層面から剥離しにく
く、貼り付けミスが頻発した。On the other hand, in the pressure-sensitive adhesive tape of Comparative Example 1 in which a pressure-sensitive adhesive surface protective film made of a soft polyvinyl chloride resin was used as a separator, an additive such as a plasticizer in the film migrated to the surface of the pressure-sensitive adhesive layer. As a result, the adhesion between the pressure-sensitive adhesive layer and the resist was impaired, the removability of the resist was reduced, and the number of foreign substances on the wafer surface after tape peeling increased. In addition, the critical surface tension of the film, which is a separator, is too large and the peeling force is too large. When continuous automatic application of the adhesive tape is performed by a machine, the film is hard to peel off from the surface of the adhesive layer. Frequent mistakes were made.
【００６０】また、セパレ―タとしてシリコ―ン処理を
施したポリエステルフイルムからなる粘着剤表面保護フ
イルムを用いた比較例２の粘着テ―プは、シリコ―ン処
理剤が粘着剤層面に移行して、粘着剤層とレジストとの
密着性を損ない、レジスト除去性が低下し、またテ―プ
剥離後のウエハ表面の異物数が増加した。なおまた、こ
の粘着テ―プを液晶ガラス基板の製造工程に適用したと
ころ、配向膜形成時、下地と配向膜との密着力が十分に
得られず、さらに配向膜のムラが生じて、要求される光
学特性を満たすことができなかつた。The pressure-sensitive adhesive tape of Comparative Example 2 using a pressure-sensitive adhesive surface protective film made of a silicone-treated polyester film as a separator, the silicone-treated agent migrated to the surface of the pressure-sensitive adhesive layer. As a result, the adhesion between the pressure-sensitive adhesive layer and the resist was impaired, the removability of the resist was reduced, and the number of foreign substances on the wafer surface after the tape was peeled increased. In addition, when this adhesive tape was applied to the manufacturing process of a liquid crystal glass substrate, when the alignment film was formed, the adhesion between the base and the alignment film was not sufficiently obtained, and the alignment film became uneven. The optical characteristics required can not be satisfied.
【００６１】なおまた、上記実施例１〜６の粘着テ―プ
では、セパレ―タとして用いるポリオレフイン系樹脂か
らなる粘着剤表面保護フイルムの臨界表面張力、剥離
力、添加剤量、熱変形温度、平均表面粗さ（実施例６の
粘着テ―プは、さらに表面抵抗率）をそれぞれ本文中に
記載した適切な範囲に設定しているが、これらの値が上
記範囲から逸脱してくると、レジスト除去率が低下した
り、ウエハ表面の異物数が増加する傾向がみられた。た
とえば、上記の添加剤量、つまり熱劣化防止剤と滑剤と
の合計量が多くなりすぎると、レジスト除去性が低下
し、またウエハ上の異物数も増大する傾向がみられた。In the pressure-sensitive adhesive tapes of Examples 1 to 6, the critical surface tension, the peeling force, the amount of additives, the heat deformation temperature, and the critical surface tension of the pressure-sensitive adhesive surface protection film made of a polyolefin resin used as a separator were measured. The average surface roughness (the surface resistivity of the pressure-sensitive adhesive tape of Example 6 is further set) is set to an appropriate range described in the text, but if these values deviate from the above ranges, There was a tendency that the resist removal rate decreased and the number of foreign substances on the wafer surface increased. For example, when the amount of the above additive, that is, the total amount of the thermal deterioration inhibitor and the lubricant, is too large, the resist removability tends to decrease, and the number of foreign substances on the wafer tends to increase.
【００６２】また、ポリオレフイン系樹脂の熱変形温度
が低すぎると、粘着剤塗工後の加熱工程を考慮して、粘
着剤の塗工を支持フイルム上に行い、この上に上記フイ
ルムをセパレ―タとして貼り合わせる必要があるが、こ
の場合、加熱工程中に粘着剤層面に浮遊粒子が付着し、
レジスト除去性が低下したり、ウエハ上の異物数が増加
する傾向があつた。また、上記フイルムの表面粗さを粗
くする（たとえば、ダルロ―ルによるエンボス加工で表
面粗さを３．５μｍとする）と、この表面状態が粘着剤
層面に転写され、厚さが１μｍのレジストの段差に粘着
剤層が十分に追従できず、レジスト除去性が低下してく
ることもわかつた。If the heat distortion temperature of the polyolefin resin is too low, the adhesive is applied on the support film in consideration of the heating step after the application of the adhesive, and the film is separated therefrom. In this case, suspended particles adhere to the adhesive layer surface during the heating process,
There was a tendency that the resist removal property was reduced and the number of foreign substances on the wafer was increased. When the surface roughness of the film is increased (for example, the surface roughness is set to 3.5 μm by embossing with a roll), this surface state is transferred to the surface of the pressure-sensitive adhesive layer, and a resist having a thickness of 1 μm is formed. It was also found that the pressure-sensitive adhesive layer could not sufficiently follow the step, and the removability of the resist deteriorated.
【００６３】[0063]
【発明の効果】以上のように、本発明では、レジスト除
去用粘着テ―プの粘着剤表面保護フイルム（セパレ―
タ）を離型処理を施さないポリオレフイン系樹脂で構成
し、またとくにフイルムの臨界表面張力、剥離力、添加
剤量、熱変形温度、表面抵抗率、平均表面粗さをそれぞ
れ適切なものとしたことにより、半導体ウエハ、液晶表
示パネルなどの精密電子部品の製造プロセスにおけるレ
ジスト除去工程に適用されて、上記粘着剤表面保護フイ
ルムに起因した粘着剤層とレジストとの密着性の低下や
物品汚染の問題を生じることなく、物品上のレジストを
確実に除去でき、これにより製品の歩留りや信頼性を改
善することができる。As described above, according to the present invention, the pressure-sensitive adhesive surface protection film (separate film) of the pressure-sensitive adhesive tape for removing the resist is used.
(1) is composed of a polyolefin-based resin that has not been subjected to mold release treatment, and the critical surface tension, peeling force, amount of additives, heat deformation temperature, surface resistivity, and average surface roughness of the film are particularly appropriate. It is applied to the resist removal step in the manufacturing process of precision electronic components such as semiconductor wafers and liquid crystal display panels, thereby reducing the adhesion between the pressure-sensitive adhesive layer and the resist caused by the pressure-sensitive adhesive surface protection film and reducing the contamination of articles. The resist on the article can be surely removed without causing any problem, thereby improving the yield and reliability of the product.
【図１】本発明のレジスト除去用粘着テ―プの一例を示
す断面図である。FIG. 1 is a cross-sectional view showing one example of a resist-removing adhesive tape of the present invention.
【図２】本発明のレジスト除去用粘着テ―プを用いた半
導体ウエハ上のレジストの除去方法を示す断面図であ
る。FIG. 2 is a cross-sectional view showing a method of removing a resist on a semiconductor wafer using the resist-removing adhesive tape of the present invention.
１ 粘着テ―プ １１ 支持フイルム １２ 粘着剤層 １３ セパレ―タ（粘着剤表面保護フイルム） ２ 半導体ウエハ ３ レジストパタ―ン DESCRIPTION OF SYMBOLS 1 Adhesive tape 11 Support film 12 Adhesive layer 13 Separator (adhesive surface protection film) 2 Semiconductor wafer 3 Resist pattern
Claims (8)
上にポリオレフイン系樹脂からなる粘着剤表面保護フイ
ルムがセパレ―タとして貼り合わされていることを特徴
とするレジスト除去用粘着テ―プ。A pressure-sensitive adhesive tape for resist removal, comprising a pressure-sensitive adhesive layer on a support film, and a pressure-sensitive adhesive surface protection film made of a polyolefin resin adhered thereon as a separator. .
が３３dyne／cm以下である請求項１に記載のレジスト除
去用粘着テ―プ。2. The pressure-sensitive adhesive tape for resist removal according to claim 1, wherein the critical surface tension of the pressure-sensitive adhesive surface protective film is 33 dyne / cm or less.
対する剥離力（ＪＩＳ Ｚ０２３７，Ｚ１５２９に準ず
る）が５〜１，０００ｇ／５０mm幅である請求項１に記
載のレジスト除去用粘着テ―プ。3. The pressure-sensitive adhesive tape for resist removal according to claim 1, wherein the pressure-sensitive adhesive surface protective film has a peeling force (according to JIS Z0237, Z1529) on the pressure-sensitive adhesive surface of 5 to 1,000 g / 50 mm width.
化防止剤と滑剤の合計量がポリオレフイン系樹脂１００
重量部あたり０．０１〜１重量部である請求項１に記載
のレジスト除去用粘着テ―プ。4. The total amount of the thermal deterioration inhibitor and the lubricant contained in the pressure-sensitive adhesive surface protective film is 100% polyolefin resin.
2. The pressure-sensitive adhesive tape for removing a resist according to claim 1, wherein the amount is 0.01 to 1 part by weight per part by weight.
レフイン系樹脂の熱変形温度（ＪＩＳ Ｋ７２０７に準
ずる、荷重４．６Kgf ／cm2 ）が８０℃以上である請求
項１に記載のレジスト除去用粘着テ―プ。5. The pressure-sensitive adhesive tape for resist removal according to claim 1, wherein the polyolefin-based resin in the pressure-sensitive adhesive surface protective film has a heat deformation temperature (a load of 4.6 kgf / cm 2 according to JIS K7207) of 80 ° C. or more. H.
を有し、表面抵抗率（ＡＳＴＭ Ｄ２５７に準ずる）が
１×１０12Ω／□以下である請求項１に記載のレジスト
除去用粘着テ―プ。6. The pressure-sensitive adhesive tape for resist removal according to claim 1, wherein the pressure-sensitive adhesive surface protective film has an antistatic property and a surface resistivity (according to ASTM D257) of 1 × 10 12 Ω / □ or less. H.
〔Ｒａ〕が２μｍ以下である請求項１に記載のレジスト
除去用粘着テ―プ。7. The pressure-sensitive adhesive tape for removing a resist according to claim 1, wherein the pressure-sensitive adhesive surface protective film has an average surface roughness [Ra] of 2 μm or less.
密電子部品の製造プロセスにおけるレジストが存在する
物品上に、請求項１〜７のいずれかに記載のレジスト除
去用粘着テ―プを粘着剤表面保護フイルムを引き剥がし
て貼り付けたのち、これを剥離することにより、上記レ
ジストを上記粘着テ―プの粘着剤層面に固着して除去す
ることを特徴とするレジスト除去方法。8. The pressure-sensitive adhesive tape for removing a resist according to claim 1, wherein the pressure-sensitive adhesive tape according to any one of claims 1 to 7 is provided on an article having a resist in a manufacturing process of precision electronic components such as a semiconductor wafer and a liquid crystal display panel. A method for removing a resist, characterized in that the protective film is peeled off, adhered, and then peeled off, whereby the resist is fixed to and removed from the adhesive layer surface of the adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18188596A JPH1026833A (en) | 1996-07-11 | 1996-07-11 | Tacky adhesive tape for removing resist, and method for removing resist |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18188596A JPH1026833A (en) | 1996-07-11 | 1996-07-11 | Tacky adhesive tape for removing resist, and method for removing resist |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1026833A true JPH1026833A (en) | 1998-01-27 |
Family
ID=16108584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18188596A Pending JPH1026833A (en) | 1996-07-11 | 1996-07-11 | Tacky adhesive tape for removing resist, and method for removing resist |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1026833A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001064806A1 (en) * | 2000-03-03 | 2001-09-07 | Lintec Corporation | Pressure-sensitive adhesive sheet and covered structure |
| JP2002038111A (en) * | 2000-04-28 | 2002-02-06 | Lintec Corp | Adhesive sheet and adhesive body |
| US6507384B1 (en) | 1999-03-26 | 2003-01-14 | Seiko Epson Corporation | Flexible printed wiring board, electro-optical device, and electronic equipment |
| JP2004091546A (en) * | 2002-08-29 | 2004-03-25 | Lintec Corp | Adhesive member |
| JP2008117929A (en) * | 2006-11-02 | 2008-05-22 | Sekisui Chem Co Ltd | Adhesive tape for solder resist protection, its manufacturing method, and surface roughness control method of solder resist |
| JP2008231352A (en) * | 2007-03-23 | 2008-10-02 | Sumitomo Chemical Co Ltd | Pressure-sensitive adhesive film |
| WO2010026938A1 (en) * | 2008-09-08 | 2010-03-11 | 電気化学工業株式会社 | Semiconductor product manufacturing method |
-
1996
- 1996-07-11 JP JP18188596A patent/JPH1026833A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6507384B1 (en) | 1999-03-26 | 2003-01-14 | Seiko Epson Corporation | Flexible printed wiring board, electro-optical device, and electronic equipment |
| WO2001064806A1 (en) * | 2000-03-03 | 2001-09-07 | Lintec Corporation | Pressure-sensitive adhesive sheet and covered structure |
| US6827997B2 (en) | 2000-03-03 | 2004-12-07 | Lintec Corporation | Pressure-sensitive adhesive sheet and covered structure |
| JP5276244B2 (en) * | 2000-03-03 | 2013-08-28 | リンテック株式会社 | Sticking body |
| JP2002038111A (en) * | 2000-04-28 | 2002-02-06 | Lintec Corp | Adhesive sheet and adhesive body |
| JP2004091546A (en) * | 2002-08-29 | 2004-03-25 | Lintec Corp | Adhesive member |
| JP2008117929A (en) * | 2006-11-02 | 2008-05-22 | Sekisui Chem Co Ltd | Adhesive tape for solder resist protection, its manufacturing method, and surface roughness control method of solder resist |
| JP2008231352A (en) * | 2007-03-23 | 2008-10-02 | Sumitomo Chemical Co Ltd | Pressure-sensitive adhesive film |
| WO2010026938A1 (en) * | 2008-09-08 | 2010-03-11 | 電気化学工業株式会社 | Semiconductor product manufacturing method |
| JPWO2010026938A1 (en) * | 2008-09-08 | 2012-02-02 | 電気化学工業株式会社 | Manufacturing method of semiconductor products |
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