JPH10242679A - Water cooling system cooling plate - Google Patents

Water cooling system cooling plate

Info

Publication number
JPH10242679A
JPH10242679A JP4798397A JP4798397A JPH10242679A JP H10242679 A JPH10242679 A JP H10242679A JP 4798397 A JP4798397 A JP 4798397A JP 4798397 A JP4798397 A JP 4798397A JP H10242679 A JPH10242679 A JP H10242679A
Authority
JP
Japan
Prior art keywords
cooling
plate
flow path
flow rate
cooling water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4798397A
Other languages
Japanese (ja)
Inventor
Minoru Sumiya
稔 住谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP4798397A priority Critical patent/JPH10242679A/en
Publication of JPH10242679A publication Critical patent/JPH10242679A/en
Withdrawn legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

PROBLEM TO BE SOLVED: To enable setting a temperature at a plurality of steps with one cooling plate, by installing a bypass flow path which is directly connected with an exist port from each branch part, and reducing the flow rate of cooling water flowing in a meander flow path in accordance with desired cooling capability of the respective regions sequentially from the upper stream side. SOLUTION: A cooling plate is divided into a region A and a region B, a branch plate 6 is arranged in the boundary part of them, and a bypass flow path 7 directly connected with an exit port 3 from the branch part is arranged. In a flow path from an inlet port 2 to the branch plate 6, cooling water whose amount is equal to the inlet flow rate flows. Behind the branch plate 6, the cooling water is divided into a meander flow path and the bypass flow path 7. When the distribution ratio of flow rate by the branch plate 6 is 1:1, cooling water whose flow rate is equal to a half inlet flow rate flows in both of the respective flow paths. In this case, the ratio of cooling capability can be arbitrarily set by taking arbitrary heat dissipating area ratio and flow rate distribution ratio. As a result, cooling operation corresponding to the number and the kind of equipments which need cooling is enabled.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は宇宙実験室等で用い
られる電気・電子機器冷却用の水冷式冷却プレートに関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a water-cooled cooling plate for cooling electric and electronic equipment used in a space laboratory or the like.

【0002】[0002]

【従来の技術】図3は、従来から通常用いられている水
冷式冷却プレート1の水平断面図である。図において、
2は入口ポート、3は出口ポート、5は仕切り板、4は
同仕切り板によって形成された冷却水流路である。仕切
り板は2枚の板の間を接続して設けられ、蛇行する冷却
水流路を形成している。冷却水は入口ポート2から入
り、出口ポート3へ出る。この冷却プレートは、水平に
設置し、その上に発熱性の機器を載置あるいは固定し
て、機器の冷却を図るために用いられるものである。
2. Description of the Related Art FIG. 3 is a horizontal sectional view of a water-cooled cooling plate 1 conventionally conventionally used. In the figure,
2 is an inlet port, 3 is an outlet port, 5 is a partition plate, and 4 is a cooling water flow path formed by the partition plate. The partition plate is provided by connecting the two plates, and forms a meandering cooling water flow path. Cooling water enters at inlet port 2 and exits at outlet port 3. This cooling plate is used to cool the equipment by placing it horizontally and mounting or fixing the heat-generating equipment thereon.

【0003】図4は上記冷却プレートを使用した冷却装
置の系統図である。図において、13は1次冷却水配
管、11は2次冷却水配管、12は上記両冷却水配管の
間に介装されている熱交換器、10は2次冷却水を送る
ためのポンプである。2次冷却水配管には前述の冷却プ
レート1が接続され、循環回路が形成されている。冷却
水プレート1の上には、発熱性の機器が載せられる。こ
の図には、発熱量の大きい機器8と、発熱量の小さい機
器9とを載せた例を示している。
FIG. 4 is a system diagram of a cooling device using the above-mentioned cooling plate. In the figure, 13 is a primary cooling water pipe, 11 is a secondary cooling water pipe, 12 is a heat exchanger interposed between the two cooling water pipes, and 10 is a pump for sending secondary cooling water. is there. The cooling plate 1 described above is connected to the secondary cooling water pipe to form a circulation circuit. On the cooling water plate 1, a heat-generating device is placed. This figure shows an example in which a device 8 having a large heat value and a device 9 having a small heat value are mounted.

【0004】[0004]

【発明が解決しようとする課題】上記従来の冷却プレー
トを用いて発熱量の異る機器を冷却しようとする場合、
プレートの温度を、一方の機器に適した温度に設定する
と、他方の機器に適した温度とはならない。発熱量の大
きい機器に適した温度にすれば発熱量の小さい機器は冷
却し過ぎとなり、発熱量の小さい機器に適した温度にす
れば発熱量の大きい機器は冷却不足となる。冷却温度の
不適合によって、精密機器では機能しない場合や、誤動
作が生じる場合がある。特に宇宙実験室等の狭く、かつ
装置の重量増加が好まれない場所で使用する場合は、各
機器専用の冷却プレートを用意し、それぞれに温度コン
トロール装置を付加することは実施困難である。
In the case of using the above-mentioned conventional cooling plate to cool equipment having different heat values,
If the temperature of the plate is set to a temperature suitable for one device, it will not be a temperature suitable for the other device. If the temperature is set to a temperature suitable for a device generating a large amount of heat, the device generating a small amount of heat will be excessively cooled. If the temperature is set to a temperature suitable for a device generating a small amount of heat, the device generating a large amount of heat will be insufficiently cooled. Due to the mismatch of the cooling temperature, it may not function in a precision instrument or may malfunction. In particular, when the apparatus is used in a small space such as a space laboratory and it is not desired to increase the weight of the apparatus, it is difficult to prepare a cooling plate dedicated to each apparatus and add a temperature control apparatus to each apparatus.

【0005】本発明は上記従来技術の欠点を解消し、1
枚の冷却プレートで複数段階の温度に設定することので
きる冷却プレートを提供しようとするものである。
The present invention solves the above-mentioned disadvantages of the prior art, and
An object of the present invention is to provide a cooling plate that can be set at a plurality of temperatures with one cooling plate.

【0006】[0006]

【課題を解決するための手段】本発明は上記課題を解決
したものであって、2枚の板の間に蛇行する流路を形成
し、流路の一端に連なる入口ポートから流路の他端に連
なる出口ポートへ向けて冷却水を流し、上記の板の表面
に電気・電子機器等の発熱性機器を接触させて冷却する
水冷式冷却プレートにおいて、冷却対象機器の数及び接
触面積に応じて上記水冷式冷却プレートを複数の領域に
分け、その各領域の境界部の流路に分岐部を設けると共
に、同各分岐部から出口ポートへ直接接続するバイパス
流路を設け、上流側から順次各領域の所要冷却能力に応
じて蛇行流路を流れる冷却水の流量を減少させることを
特徴とする水冷式冷却プレートに関するものである。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and forms a meandering flow path between two plates, and connects an inlet port connected to one end of the flow path to the other end of the flow path. In a water-cooled cooling plate that cools water by flowing cooling water toward a series of outlet ports and contacting the surface of the plate with a heat-generating device such as an electric or electronic device, depending on the number of devices to be cooled and the contact area, The water-cooled cooling plate is divided into a plurality of regions, and a branch portion is provided in a flow passage at a boundary portion of each region, and a bypass flow passage is directly provided from each branch portion to an outlet port. The flow rate of the cooling water flowing through the meandering flow path is reduced according to the required cooling capacity of the water cooling type cooling plate.

【0007】[0007]

【発明の実施の形態】図1は本発明の実施の一形態に係
る水冷式冷却プレートの水平断面図である。本例は冷却
プレートを前後2段、図において領域Aと領域Bとに分
け、その境界部に分岐プレート6を設け、その分岐部か
ら出口ポート3に直接接続するバイパス流路7を設けた
ものである。上記以外の部分の構成は従来技術と同じで
ある。
FIG. 1 is a horizontal sectional view of a water-cooled cooling plate according to an embodiment of the present invention. In this example, the cooling plate is divided into two stages before and after, in the figure, a region A and a region B, a branch plate 6 is provided at a boundary portion thereof, and a bypass flow path 7 that is directly connected from the branch portion to the outlet port 3 is provided. It is. The configuration of other parts is the same as that of the related art.

【0008】図2は上記の冷却プレートを用いた冷却装
置の系統図である。図において、冷却プレート1には分
岐プレート6の部分から分岐し出口ポート3に至るバイ
パス流路7が設けてある。冷却プレート1の上面は領域
Aと領域Bとに分けられ、領域Aには発熱量の大きい機
器が、領域Bには発熱量の小さい機器が載置してある。
上記以外の構成は従来技術と同じである。
FIG. 2 is a system diagram of a cooling device using the above-mentioned cooling plate. In the figure, the cooling plate 1 is provided with a bypass passage 7 that branches off from the branch plate 6 and reaches the outlet port 3. The upper surface of the cooling plate 1 is divided into a region A and a region B, and a device having a large amount of heat is mounted in the region A, and a device having a small amount of heat is mounted in the region B.
The configuration other than the above is the same as the conventional technology.

【0009】本冷却プレート(図1)では、入口ポート
2から分岐プレート6までの流路では入口流量と同量の
冷却水が流れる。分岐プレート6以降では冷却水は従来
通りの蛇行流路と、バイパス流路7に分れる。分岐プレ
ートによる流量配分比率が1対1であるとすれば、分岐
プレート以降の蛇行流路では入口流量の半分の流量、バ
イパス通路でも入口流量の半分の流量の冷却水が流れ
る。バイパス通路は短く、そこを流れる冷却水は実質的
に冷却作用に貢献することなく出口ポート3から排出さ
れるので、分岐プレート以降の領域Bを冷却する冷却水
の流量は半減していることになる。領域Aと領域Bとの
放熱面積が同じで、バイパスライン以外の構造が同じと
すれば、この冷却プレートの後半領域Bの冷却能力は前
半領域Aの冷却能力の1/2となり、半減する。これに
よって1枚の冷却プレートにおいて領域を分け冷却能力
に格差を設けることができる。
In the cooling plate (FIG. 1), the same amount of cooling water as the inlet flow rate flows in the flow path from the inlet port 2 to the branch plate 6. After the branch plate 6, the cooling water is divided into a conventional meandering flow path and a bypass flow path 7. Assuming that the flow distribution ratio of the branch plate is 1: 1, cooling water flows at half the inlet flow in the meandering flow path after the branch plate and at half the inlet flow in the bypass passage. Since the bypass passage is short and the cooling water flowing therethrough is discharged from the outlet port 3 without substantially contributing to the cooling operation, the flow rate of the cooling water for cooling the area B after the branch plate is reduced by half. Become. If the heat radiating area of the area A and the area B are the same and the structure other than the bypass line is the same, the cooling capacity of the latter half area B of the cooling plate is の of the cooling capacity of the first half area A, and is halved. As a result, it is possible to divide a region in one cooling plate and provide a difference in cooling capacity.

【0010】上述の例は両領域の放熱面積を同じとし、
分岐プレートにおける流量配分を1対1としたが、一般
的には任意の放熱面積比率、流量配分比率とすることに
よって冷却能力の比率を任意に設定することができる。
また、冷却領域の分割も上述の例は2分割としたが、設
置機器に応じて一般に3分割以上の複数分割ガ可能であ
る。これによって冷却を要する機器の数および種類に応
じた冷却を行うことができる。
In the above example, the heat radiation area of both regions is the same,
Although the flow rate distribution in the branch plate is set to one-to-one, the ratio of the cooling capacity can be arbitrarily set in general by setting an arbitrary heat radiation area ratio and a flow distribution ratio.
Although the cooling area is divided into two in the above-described example, a plurality of cooling areas can be generally divided into three or more depending on the equipment to be installed. This makes it possible to perform cooling according to the number and type of devices requiring cooling.

【0011】[0011]

【発明の効果】本発明の水冷式冷却プレートにおいて
は、冷却対象機器の数及び接触面積に応じて上記水冷式
冷却プレートを複数の領域に分け、その各領域の境界部
の流路に分岐部を設けると共に、同各分岐部から出口ポ
ートへ直接接続するバイパス流路を設け、上流側から順
次各領域の所要冷却能力に応じて蛇行流路を流れる冷却
水の流量を減少させるので、各機器に適した冷却が可能
となり、冷却し過ぎや、冷却不足による機器の誤動作や
機器が機能を発揮しないという事故が無くなる。
According to the water-cooled cooling plate of the present invention, the water-cooled cooling plate is divided into a plurality of regions in accordance with the number of devices to be cooled and the contact area, and a branch portion is formed in a flow path at a boundary between the regions. And a bypass flow path that is directly connected to the outlet port from each of the branch portions, and the flow rate of the cooling water flowing through the meandering flow path is sequentially reduced from the upstream side according to the required cooling capacity of each area. This makes it possible to perform cooling that is suitable for the system, and eliminates accidents such as excessive cooling, malfunction of equipment due to insufficient cooling, and malfunction of equipment.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の一形態に係る冷却プレートの水
平断面図。
FIG. 1 is a horizontal sectional view of a cooling plate according to an embodiment of the present invention.

【図2】上記冷却プレートを使用した冷却装置の系統
図。
FIG. 2 is a system diagram of a cooling device using the cooling plate.

【図3】従来の冷却プレートの水平断面図。FIG. 3 is a horizontal sectional view of a conventional cooling plate.

【図4】従来の冷却プレートを使用した冷却装置の系統
図。
FIG. 4 is a system diagram of a cooling device using a conventional cooling plate.

【符号の説明】[Explanation of symbols]

1 冷却プレート 2 入口ポート 3 出口ポート 4 冷却水流路 5 仕切り板 6 分岐プレート 7 バイパス流路 8 発熱量が大きい機器 9 発熱量が小さい機器 10 ポンプ 11 2次冷却水配管 12 熱交換器 13 1次冷却水配管 DESCRIPTION OF SYMBOLS 1 Cooling plate 2 Inlet port 3 Outlet port 4 Cooling water channel 5 Partition plate 6 Branch plate 7 Bypass channel 8 Device with large calorific value 9 Device with small calorific value 10 Pump 11 Secondary cooling water pipe 12 Heat exchanger 13 Primary Cooling water piping

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 2枚の板の間に蛇行する流路を形成し、
流路の一端に連なる入口ポートから流路の他端に連なる
出口ポートへ向けて冷却水を流し、上記の板の表面に電
気・電子機器等の発熱性機器を接触させて冷却する水冷
式冷却プレートにおいて、冷却対象機器の数及び接触面
積に応じて上記水冷式冷却プレートを複数の領域に分
け、その各領域の境界部の流路に分岐部を設けると共
に、同各分岐部から出口ポートへ直接接続するバイパス
流路を設け、上流側から順次各領域の所要冷却能力に応
じて蛇行流路を流れる冷却水の流量を減少させることを
特徴とする水冷式冷却プレート。
1. A meandering channel is formed between two plates,
Water-cooling cooling, in which cooling water flows from an inlet port connected to one end of the flow path to an outlet port connected to the other end of the flow path, and a heat-generating device such as an electric or electronic device is brought into contact with the surface of the plate to cool the plate. In the plate, the water-cooled cooling plate is divided into a plurality of regions according to the number and the contact area of the devices to be cooled, and a branch portion is provided in a flow path at a boundary of each region, and from each branch portion to an outlet port. A water-cooled cooling plate, comprising: a bypass flow path for direct connection, wherein a flow rate of cooling water flowing through a meandering flow path is reduced in accordance with a required cooling capacity of each region sequentially from an upstream side.
JP4798397A 1997-03-03 1997-03-03 Water cooling system cooling plate Withdrawn JPH10242679A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4798397A JPH10242679A (en) 1997-03-03 1997-03-03 Water cooling system cooling plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4798397A JPH10242679A (en) 1997-03-03 1997-03-03 Water cooling system cooling plate

Publications (1)

Publication Number Publication Date
JPH10242679A true JPH10242679A (en) 1998-09-11

Family

ID=12790560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4798397A Withdrawn JPH10242679A (en) 1997-03-03 1997-03-03 Water cooling system cooling plate

Country Status (1)

Country Link
JP (1) JPH10242679A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005249258A (en) * 2004-03-03 2005-09-15 Mitsubishi Electric Corp Cooling system
CN105280347A (en) * 2015-10-16 2016-01-27 苏州腾冉电气设备股份有限公司 Reactor water-cooling plate with water inlet and outlet at two ends
JP2017092248A (en) * 2015-11-10 2017-05-25 三菱アルミニウム株式会社 heat sink

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005249258A (en) * 2004-03-03 2005-09-15 Mitsubishi Electric Corp Cooling system
CN105280347A (en) * 2015-10-16 2016-01-27 苏州腾冉电气设备股份有限公司 Reactor water-cooling plate with water inlet and outlet at two ends
JP2017092248A (en) * 2015-11-10 2017-05-25 三菱アルミニウム株式会社 heat sink

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Effective date: 20040511